KR20120006947A - Substrate inspection device and substrate inspection method - Google Patents

Abstract

PURPOSE: A substrate inspecting apparatus and a substrate inspecting method are provided to prevent the increment of a tact time for a substrate in order to acquire the image of inspected defects. CONSTITUTION: A substrate inspecting apparatus comprises a transfer unit, a defect detecting unit(121), and an image acquisition unit. The transfer unit transfers substrates in the first direction. The defect detecting unit detects defects on the substrate which is being transferred in the first direction. The image acquisition unit acquires the image of the defects detected by the defect detecting unit during transfer.

Description

Substrate inspection device and substrate inspection method {SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD}

The present invention relates to a substrate inspection apparatus and a substrate inspection method.

Conventionally, a flat panel such as a liquid crystal display (LCD), a plasma display panel (PDP), an organic electroluminescence (EL) display, or a surface-conduction electron-emitter display (SED) is used. Display) In the manufacture of various substrates such as a substrate, a semiconductor wafer, and a printed circuit board, in order to improve the yield, after each patterning process, patterning errors such as short-circuits, poor connection, and disconnection and pattern defects of wiring It is checked whether it exists. In such a board | substrate inspection, a defect in the surface of a board | substrate is first detected by a line scan camera, a CCD camera, etc. (defect detection inspection), and the enlarged image of the detected defect is acquired by a review camera, such as a CCD camera, after that. (Defective review).

[Patent Document 1] Japanese Patent Application Laid-Open No. 2000-9661

However, in the above prior art, since the defect is reviewed on the same substrate after the defect inspection on one substrate is completed, there is a problem that the time required for completing all the inspections becomes long. In addition, by limiting the review time of the defect, it is also possible to suppress an increase in the time required to complete the inspection. In this case, since the number of defects to be subjected to the defect review is substantially limited, detailed defect review cannot be performed. A problem arises.

Therefore, this invention is made | formed in view of said problem, and an object of this invention is to provide the board | substrate test | inspection apparatus and board | substrate test | inspection method which can perform detailed defect review, suppressing the increase of time required to complete | finish inspection.

In order to achieve such an object, the board | substrate inspection apparatus which concerns on this invention is a conveyance part which conveys a board | substrate to a 1st direction, the defect detection part which detects the defect in the said board | substrate conveying to a said 1st direction, and the said defect An image acquisition part for acquiring the image of the defect detected by the detection part during the said conveyance is provided, It is characterized by the above-mentioned.

Moreover, the board | substrate test | inspection method which concerns on this invention detects the defect in the 1st conveyance step which conveys a board | substrate to a 1st direction, and the defect in the said board | substrate conveying to the said 1st direction in the said 1st conveyance step. And an image acquisition step of acquiring an image of the defect detected in the defect detection step during the conveyance in the first conveyance step.

According to the present invention, in order to acquire an image of the detected defect in parallel with the defect detection on the substrate, more images of the defect are acquired without increasing the tact time for one substrate. It becomes possible. As a result, the board | substrate inspection apparatus and board | substrate inspection method which can examine a detailed defect can be realized, suppressing the increase of time required to complete | finish inspection.

BRIEF DESCRIPTION OF THE DRAWINGS The perspective view which shows schematic structure of the board | substrate inspection apparatus which concerns on one Embodiment.
It is a schematic diagram which shows an example of the relationship between the imaging range of the line scan camera in the embodiment, and the movable range of a review camera.
It is a schematic diagram which shows another example of the relationship between the imaging range of the line scan camera in the embodiment, and the movable range of a review camera.
4 is a perspective view showing a schematic configuration of the substrate inspection device shown in FIG. 1.
5 is a block diagram showing a schematic functional configuration of a substrate inspection device according to an embodiment.
6 is a flowchart for explaining a schematic flow of a substrate inspection operation according to the embodiment;
7 is a flowchart for explaining a schematic flow of a defect detection process according to the embodiment;
8 is a flowchart for explaining a schematic flow of a defect review process according to the embodiment;
9 is a flowchart for explaining a schematic flow of a recurring defect review process according to the embodiment;
10 is a perspective view showing another schematic configuration of a frame according to the embodiment;

EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing this invention is demonstrated in detail with drawing. In addition, in the following description, each drawing is only the figure which showed roughly the shape, the magnitude | size, and the positional relationship to the extent that the content of this invention can be understood, Therefore, this invention is the shape, the magnitude | size illustrated by each drawing. It is not limited only to, and positional relationships. In addition, in each figure, the part of hatching in a cross section is abbreviate | omitted for clarity of a structure. In addition, the numerical value illustrated in the following is only an appropriate example of this invention, Therefore, this invention is not limited to the numerical value illustrated.

EMBODIMENT OF THE INVENTION Hereinafter, the board | substrate inspection apparatus and board | substrate inspection method which concern on one Embodiment of this invention are demonstrated in detail using drawing. FIG. 1: is a perspective view which shows schematic structure of the board | substrate inspection apparatus which concerns on this embodiment.

As shown in FIG. 1, the board | substrate test | inspection apparatus 1 which concerns on this embodiment floats the board | substrate W which raises the board | substrate W by extracting air from the main body base 11 and the numerous holes formed in the board | substrate mounting surface. And the transfer stage 12 while maintaining the transfer stage 12 extending along the transfer direction of the substrate W (in the drawing, the X / -X direction) and the substrate W loaded on the floating stage 14. The frame 13 of the inspection part which extends the board | substrate conveyance unit 22 which conveys the board | substrate W, and the floating stage 14 by which the board | substrate W is conveyed in the direction (Y direction in drawing) perpendicular | vertical to a conveyance direction, and the frame 13 Line illumination 18 that illuminates the floating stage 14 in a long line shape in the Y direction from the inclined upper side and a frame shape that is movable to the frame 13 and is illuminated by the line illumination 18 in the vicinity of The area on the side opposite to the line illumination 18 One or more line scan cameras 15 for defect inspection imaging from the upper and lower sides, and one or more for review that are mounted on the frame 13 so as to be movable, and enlarge the image of the substrate W on the floating stage 14. A review camera 19 is provided. Among these, the floating stage 14, the conveyance stage 12, and the frame 13 are fixed to the main body base 11, for example. In addition, the line illumination 18 may be fixed to the main body base 11. As the main body base 11, a member having excellent seismic resistance, such as a marble block, a member having improved vibration resistance by providing a vibration damping unit, or the like can be used. In addition, the board | substrate inspection apparatus 1 may be accommodated in a clean room, for example.

The floating stage 14 is fixed to the main base 11 by, for example, a frame (not shown). In addition, in the board | substrate mounting surface of the floating stage 14, the countless hole connected to the blowing mechanism which is not shown in figure is formed, for example, and the board | substrate W mounted on the floating stage 14 is blown out by taking out air from this hole. It floats from the board | substrate mounting surface. However, the present invention is not limited thereto, and a plurality of rollers rotating in the conveying direction of the substrate W are provided, and the substrate W is damaged during substrate transportation, such as a configuration in which the substrate W is supported so as not to contact the floating stage 14. If it is the structure which can convey without making it possible, it can change variously.

The line illumination 18 used for the imaging of the line scan camera 15 for defect inspection is a light source formed by linearly arranging a line light source, a point light source in a line shape, or an elongated surface light source. The position and angle of this line illumination 18 are adjusted so that the arrangement surface of the optical axis of the illumination light reflected from the board | substrate W surface may include the optical axis of each line scan camera 15. As shown in FIG.

The frame 13 provided in parallel with the line illumination 18 is what is called a gantry. The frame 13 is provided with a scan camera stage 17 for holding one or more line scan cameras 15 arranged in a direction perpendicular to the transport direction of the substrate W (Y / -Y direction). Each line scan camera 15 has a camera lens capable of forming an image at the line sensor position of any of the line scan cameras 15 while varying the observation light reflected by the line illumination 18 on the substrate W at a predetermined magnification. (16) is provided.

In addition, each line scan camera 15 moves in the Y / -Y direction along the scan camera stage 17 independently of the other line scan cameras 15, for example, under control from a control unit (not shown). It is possible. This configuration enables the line scan camera 15 to image the substrate W passing under the frame 13 to every corner along the Y direction. Therefore, the scanning operation which conveys the board | substrate W to the X direction (or -X direction) using the board | substrate conveying unit 22, image | photographing the long strip | belt-shaped image pick-up area | region to every corner with the line scan camera 15 to every corner. By doing this, it is possible to image the whole substrate W. FIG. However, depending on the number of the line scan cameras 15, it may be comprised so that the whole board | substrate W may be imaged by performing a several times scanning operation. In this case, when one scan operation | movement is complete | finished, the line scan camera 15 moves to Y / -Y direction for one o'clock at the next scan operation.

On the other hand, the review camera 19 is comprised with a CCD camera, a CMOS camera, etc., for example. Each review camera 19 is provided in the barrel 20 provided with the objective lens which enables the coaxial fall-off illumination and the enlarged projection of the defect of the board | substrate W, and acquires the enlarged image of the defect made into a target. This barrel 20 is provided in the review camera stage 21 arranged on the opposite side to the scan camera stage 17 with the frame 13 interposed therebetween. The plurality of barrels 20 are held in the review camera stage 21 so as to be movable at high speed. The review camera stage 21 can move each barrel 20 at high speed in the Y / -Y direction independently of the other barrels 20 under the control of a controller (not shown).

Here, for example, as shown in FIG. 2, when the number of the line scan cameras 15 and the number of the review cameras 19 are the same, the first scanning range S1 and the two scans of the line scan cameras 15 are the same. What is necessary is just to design the range R1 which added the 1st imaging range S2 as the movable range of one review camera 19. FIG. 3, for example, when the number of the review cameras 19 is half of the number of the line scan cameras 15, the first scanning range Sa1 and 2 of the line scan cameras 15a. What is necessary is just to design the range R2 which combined the imaging range Sa2 of the scan-th, the imaging range Sb1 of the 1st scan of the line scan camera 15b, and the imaging range Sb2 of the 2nd scan, in the movable range of one review camera 19. . However, it is not limited to this, For example, you may comprise so that the imaging range of the review camera 19 can be moved to spare. As a result, for example, when imaging is performed near the end of the movable range of the review camera 19, a problem such as a part of the imaging area is not illuminated can be eliminated.

Subsequently, the conveyance of the board | substrate W carried in to the board | substrate inspection apparatus 1 is demonstrated in detail using drawing. 4 is a perspective view illustrating a schematic configuration of the substrate inspection apparatus illustrated in FIG. 1. As shown in FIG. 4, in the board | substrate test | inspection apparatus 1, when the board | substrate W is carried in to the floating stage 14, the board | substrate W is mechanically aligned to a prescribed position by the positioning mechanism not shown. The substrate W aligned at the prescribed position is held by the substrate transfer unit 22. Specifically, the board | substrate conveyance unit 22 is provided on the conveyance stage 12, the guide rail 223 extended along the board | substrate conveyance direction, and the drive source which are provided along the conveyance stage 12, and are not shown in figure. The traveling belt 221 and the traveling section 222 which are fixed to the conveying belt 221 and which travel along the guide rail 223 by the circulation of the conveying belt 221, and the traveling section 222 ), And a holding unit 224 holding the substrate W. The holding part 224 has, for example, one or more suction pads 225 connected to an exhaust pump not shown. The substrate W is attracted to the suction pad 225 by the exhaust by the exhaust pump. As a result, the substrate W is held by the holding portion 224. However, in addition to this, the holding part 224 can be changed in various ways, such as a structure which grips the edge part of the board | substrate W. FIG.

When the board | substrate conveyance unit 22 moves to an X / -X direction by circulation of the conveyance belt 221, the board | substrate W hold | maintained by the board | substrate conveyance unit 22 is conveyed in a X / -X direction. At this time, since the board | substrate W has floated from the floating stage 14 by air, it can prevent that the board | substrate W is damaged by the contact with the floating stage 14, etc.

Next, the drive mechanism which operates the board | substrate inspection apparatus 1 is demonstrated in detail using drawing. 5 is a block diagram showing a schematic functional configuration of the substrate inspection apparatus according to the present embodiment. As shown in FIG. 5, the board | substrate test | inspection apparatus 1 is a control part 101 which controls the operation | movement of the board | substrate test | inspection apparatus 1, and the floating stage drive part which drives the floating stage 14 to float the board | substrate W. FIG. 114, the board | substrate carrying-in detection part 131 which detects that the board | substrate W was carried in on the floating stage 14 from the outside, and when the board | substrate W was carried to the floating stage 14, the board | substrate W was mechanically located in a prescribed position. The position of the mechanical alignment drive part 132 to align, the conveyance drive part 112 which moves on the floating stage 14 to the X / -X direction, holding the board | substrate W, and the position of the board | substrate W on the floating stage 14 are substantially real. The substrate position detection unit 133 to detect at time, the line illumination driver 118 for driving the line illumination 18 to illuminate the imaging area of the line scan camera 15, and the line scan camera 15 for driving the substrate Acquire image of W every line A line scan camera driver 115 and a review camera driver 119 which drives the review camera 19 to acquire an enlarged image of a defect in the substrate W are provided.

In addition, the substrate inspection apparatus 1 includes an input unit 102 through which a user inputs various settings and instructions, a storage unit 103 for appropriately storing various programs and parameters, acquired image data, and the like, and acquisition / memory. A display unit 104 for displaying the image and various information, a communication unit 105 for controlling communication with the outside, and a defect detection unit for detecting an image of a defect included in the image captured by the line scan camera 15 ( 121 and a defect coordinate specifying unit 122 specifying a position (defect coordinate) on the substrate W of the defect detected by the defect detecting unit 121. In addition, the board | substrate carrying-in detection part 131 detects whether the board | substrate W was carried in based on the signal from the not-shown sensor provided in the board | substrate carrying in of the floating stage 14. The mechanism alignment drive part 132 drives positioning mechanisms, such as a pin and a roller provided in the board | substrate delivery opening vicinity of the floating stage 14, and positions the board | substrate W to a prescribed position.

Subsequently, the operation | movement at the time of the board | substrate inspection of the board | substrate inspection apparatus 1 is demonstrated in detail using drawing. In addition, in the board | substrate test | inspection operation which concerns on this embodiment, the case where the defect detection process which detects the defect of the board | substrate W and the defect review process which acquires the image of the detected defect at the time of at least the initial scanning operation is performed as an example is taken as an example. Holding If the scan operation after the second time is executed, the defect detection process may or may not be omitted during the scan operation after the second time.

6 is a flowchart for explaining a schematic flow of the substrate inspection operation according to the present embodiment. In the following description, however, attention is paid to the operation of the control unit 101 shown in FIG. 5. As shown in FIG. 6, in the substrate inspection operation, the control unit 101 first determines whether or not the substrate W has been carried on the floating stage 14 from the outside by the substrate loading detection unit 131. (Step S101). In addition, at this time, the control part 101 waits for the board | substrate W to carry in in the state which driven the floating stage 114, ie, the air was blown out from the hole of the floating stage 14 (No of step S101). ").

When the substrate W is loaded onto the floating stage 14 (YES in step S101), the control unit 101 drives the substrate W by driving the positioning mechanism (not shown) through the mechanical alignment driving unit 132. By mechanically aligning to the prescribed position in (14) (step S102), and then driving the substrate conveyance unit 22 via the conveyance drive part 112, the board | substrate W which is in a prescribed position is predetermined board | substrate holding position. It holds in the board | substrate conveyance unit 22 which moved to (step S103).

Next, the control part 101 starts the operation | movement which moves the board | substrate W to constant X direction by starting operation | movement which drives the conveyance drive part 112 to move the board | substrate conveyance unit 22 at constant speed in an X direction ( Step S104). Subsequently, the control part 101 is based on the position of the board | substrate W input from the board | substrate position detection part 133 at any time, and the imaging area (scan area | region) of the line scan camera 15 located upstream in the conveyance path | route of the board | substrate W. Wait until the substrate W reaches (NO in step S105). When the substrate W reaches the scan area (YES in step S105), the control unit 101 first starts a defect detection process for detecting a defect in the substrate W (step S106), and then proceeds to the defect detection process. The defect review process of acquiring an enlarged image of the detected defect is started (step S107).

Next, the control part 101 determines whether the reverse scanning operation was requested | required in the defect review process or recurring defect review process mentioned later (step S108). In addition, reverse scanning operation | movement is conveying to the -X direction, for example, when conveying the board | substrate W to the X direction, and conveying to the X direction, when conveying to the -X direction, on the contrary.

When the reverse scanning operation is requested as a result of the determination in step S108 (YES in step S108), the control unit 101 drives the conveyance drive unit 112 so that the conveyance direction of the substrate W is inverted, and thereby the substrate conveyance unit 22. ) Is started at a constant speed (step S109). Subsequently, the control unit 101 starts a defect review process (repeated defect review process) for the remaining defects that are not reviewed (step S110), and then returns to step S108.

On the other hand, when the reverse scanning operation is not requested as a result of the determination in step S108 (NO in step S108), the control unit 101 determines whether or not the scanning operation on the substrate W is finished (step S111). If it is not finished (NO in step S111), the flow returns to step S108. On the other hand, when the scan operation is finished (YES in step S111), the present operation ends.

Next, the defect detection process which concerns on this embodiment is demonstrated in detail using drawing. 7 is a flowchart for explaining a schematic flow of a defect detection process according to the present embodiment. As shown in FIG. 7, in the defect detection process, the control unit 101 first acquires an image of the substrate W for one line by imaging the substrate W passing through the scan area with the line scan camera 15. (Step S121). An image for one line is a band generated by connecting a plurality of images captured at one time to each other by simultaneously driving a plurality of line scan cameras 15 arranged in a direction perpendicular to the conveyance direction of the substrate W. It is an image of a shape.

Next, the control part 101 inputs the image of one line input through the line scan camera drive part 115 to the defect detection part 121, and analyzes an image (step S122), and is contained in the image of one line. Detect defects Subsequently, the control unit 101 determines whether or not a defect is detected in step S122 (step S123), and when a defect is detected (YES in step S123), the position on the substrate W of the detected defect is determined. (Defect coordinates) is specified in the defect coordinate specifying unit 122 (step S124), and the defect coordinates for the specified one line are output (step S125). In addition, the output destination of defect coordinates is the control part 101, for example. On the other hand, when no defect is detected in step S122 (NO in step S123), the control unit 101 proceeds to step S126. In addition, the position (defect coordinate) of the defect in the board | substrate W is a position (coordinate) of the board | substrate W on the floating stage 14, and the floating stage (in the imaging area of the individual line scan camera 15, for example). It can calculate from the position (coordinate) on 14), and the position (coordinate) of the defect contained in the image picked up by each line scan camera 15. FIG.

In step S126, the control unit 101 waits until the substrate W moves in the X direction for one line (NO in step S126). When the substrate W is moved in the X direction for one line (YES in step S126), the control unit 101 determines whether or not scanning has been completed for all the lines with respect to the substrate W, that is, the defect of the entire substrate W is determined. It is determined whether the detection and the specification of the defect coordinates have been completed (step S127), and if it is not finished (NO in step S127), the control unit 101 returns to step S121 to execute the subsequent operation. do. On the other hand, when the scan for all the lines is finished (YES in step S127), the control unit 101 ends the present defect detection process.

Subsequently, the defect review processing according to the present embodiment will be described in detail with reference to the drawings. 8 is a flowchart for explaining a schematic flow of a defect review process according to the present embodiment. As shown in FIG. 8, in the defect review process, the control unit 101 firstly determines whether or not defect coordinates for one line are input from the defect coordinate specifying unit 122 in the defect detection process shown in FIG. 7. (Step S141), and if it is input (YES in step S141), the defect coordinates for this one line are stored, for example, in the storage unit 103 or the like (step S142), and then the process goes to step S143. To fulfill. On the other hand, when the defect coordinates for one line are not input, that is, when the defects are not included in the image for one line in the defect detection process shown in Fig. 7 (NO in step S141), the control unit ( 101), the flow advances to step S143.

In step S143, the control unit 101 stores information on the order of review, the amount of movement of the review camera 19 at the time of review, the movement timing, and the like, for all the defects whose defect coordinates are stored in the storage unit 103 or the like. A review schedule to be included is created (step S143). In addition, creation of a review schedule is mentioned later. The created review schedule is temporarily stored, for example, in the storage unit 103 or the like.

Subsequently, the control unit 101 determines whether there is a defect that cannot be reviewed, that is, cannot be captured by any of the review cameras 19, as a result of the scheduling in step S143 (step S144). As a result of this determination, if there is a defect that cannot be reviewed (YES in step S144), the control unit 101 identifies a defect to be reviewed based on a predetermined priority among the defects in which the defect coordinates are stored. It selects (step S145). The predetermined priority may be based on, for example, the size of the defect and the positional relationship between the defect and the wiring. In addition, the defect coordinate which was not selected is stored separately, for example in the memory | storage part 103 grade | etc.,.

Subsequently, the control unit 101 recreates the review schedule for the defect selected in step S145 (step S146), and then proceeds to step S147. On the other hand, when there is no defect which cannot be reviewed as a result of the determination of step S144 (NO in step S144), the control unit 101 proceeds to step S147 as it is. The review schedule previously stored in the storage unit 103 or the like is updated, for example, by the review schedule rewritten in step S146.

In step S147, the control unit 101 drives the review camera driver 119 based on the review schedule stored in the storage unit 103 or the like, so that the review camera 19 acquires an enlarged image of the defect targeted for review. do. In addition, the enlarged image of the acquired defect is stored in the memory | storage part 103 etc. with defect coordinates, for example.

Thereafter, the control unit 101 determines whether or not the defect review processing for the substrate W has ended (step S148), and if not finished (NO in step S148), returns to step S141 and then returns. Run the action. On the other hand, when the defect review operation is completed (YES in step S148), the controller 101 determines whether there is a defect that could not be reviewed, that is, whether or not there is a defect that cannot be reviewed in step S144. If it is determined (step S149) and there is a defect that cannot be reviewed (YES in step S149), a request for a reverse scan operation (repeated defect review processing) is generated (step S150), and the present defect is thereafter. The review process ends. The reverse scan operation request is stored at, for example, a predetermined address such as the storage unit 103. In addition, when there is no defect which could not be reviewed as a result of the determination of step S149 (NO in step S149), the control part 101 complete | finishes this defect review process as it is.

9 is a flowchart explaining the outline flow of the recurring defect review process which concerns on this embodiment. As shown in FIG. 9, in the recurring defect review process, the control unit 101 first creates a review schedule for defects that remain unreviewed among the detected defects (step S161). The created review schedule is stored, for example, in the storage unit 103 or the like as described above.

Subsequently, the control unit 101 determines whether or not a defect that cannot be reviewed exists as a result of the scheduling of Step S161 (step S162), and if a defect that cannot be reviewed exists (YES in step S162). ), A defect to be reviewed is selected based on a predetermined priority among the unselected defects (step S163), and the review schedule is recreated for the selected defects (step S164), and then step S165. Go to On the other hand, when there is no defect which cannot be reviewed as a result of the determination of step S162 (NO in step S162), the control unit 101 proceeds to step S165 as it is. The review schedule stored in the storage unit 103 or the like is updated by the rewritten review schedule as described above. In addition, the defect coordinate which was not selected also in step S163 is stored separately, for example in the memory | storage part 103 etc. like the above-mentioned.

In step S165, the control unit 101 drives the review camera drive unit 119 based on the review schedule stored in the storage unit 103 or the like, so that the review camera 19 acquires an enlarged image of the defect targeted for review. do.

Thereafter, the control unit 101 determines whether there is a defect that cannot be reviewed, that is, whether or not it is determined that there is a defect that cannot be reviewed in step S162 (step S166), and there is a defect that cannot be reviewed. If (YES in step S166), a request for a reverse scan operation (repeated defect review process) is generated again (step S167), and the present repeat defect review process is terminated after that. In addition, when there is no defect which could not be reviewed as a result of the determination of step S166 (NO in step S166), the control part 101 complete | finishes the repetitive defect review process which it saw as it is.

By operating as mentioned above, the board | substrate test | inspection operation including the defect-detection process which detects the defect which exists in the board | substrate W, and the defect review process (including the recurring defect review process) which acquires the enlarged image of the detected defect is performed. . In addition, the defect detection method which concerns on this invention among the above operations is achieved by including at least the conveyance step of step S104, the defect detection step of step S106, and the image acquisition step of step S107.

Next, the creation (including rewriting) of the review schedule in the present embodiment will be described in detail. Here, the moving speed (the moving speed to the X direction of the board | substrate W) of the board | substrate conveying unit 22 to the X direction is Gs, and the moving speed to the Y direction of the review camera 19 is Gr, and the review camera 19 When the moving distance is Yr and the moving time when the review camera 19 moves the moving distance Yr is Tr, the moving time Tr is expressed by the following expression (1).

In addition, when the time until the review camera 19 stops at a desired position and the imaging of a target defect is completed is set to Tα, the time Td required for acquiring an enlarged image for one defect is as follows. It is represented by Equation 2.

For this reason, the distance dXr which the board | substrate conveyance unit 22 moves to an X direction during the defect review process regarding one defect is represented by following formula (3).

Here, if the length of the substrate W in the X direction is Wx, the number of defects (acquired number of defect images) Img which one review camera 19 can capture while scanning one line with the line scan camera 15 is And the following equation (4).

Therefore, the total number of defect images that can be acquired by the review camera 19 as a whole while scanning one line with the line scan camera 15 is determined by the number of defect images Img obtainable in the above expression (4). It is the number multiplied by the number.

However, since the board | substrate conveyance unit 22 moves distance dXr during processing of one defect, when there are two defects which should be imaged by one review camera 19, the space | interval of these X directions If it is less than or equal to dXr, imaging of any defect is substantially impossible. Therefore, in this embodiment, in order to give priority to the defect review process for a more serious defect, priority is set according to the degree with respect to a defect, and a review schedule is made so that more serious defect may be reviewed preferentially according to this priority. Write.

For example, while the board | substrate W is moving from the imaging area (scan area) of the line scan camera 15 to the imaging area of the review camera 19, it is a defect which should be imaged by the one review camera 19 as a defect. Assume that Df1, Df2, Df3, Df4 and Df5 are detected in the order detected by the detection process. Here, a defect having a large size is regarded as a defect having a high priority, and the relationship between the defect sizes is Df3> Df2> Df4> Df1> Df5, and the distance between the defects in the X direction and the distance dXr of two defects before and after the detection order. If the relationship is | Df1-Df2 | <dXr, | Df2-Df3 |> dXr, | Df3-Df4 | <dXr, and | Df4-Df5 |> dXr, respectively, the defect Df3 is based on this priority. It is always a defect of a review object. Here, the defects which are separated from the defect Df3 by the distance dXr or more in the X direction are two of the defects Df2 and Df5. For this reason, in this case, there are three defects to be reviewed, that is, defects Df2, Df3, and Df5.

Therefore, about this case, in this embodiment, the review camera 19 is moved to a Y direction until the information which reviews a defect in order of Df2-> Df3-> Df5, and the defect Df3 is reviewed after defect Df2. A review schedule is generated that includes information of the amount of movement to move the review camera 19 in the Y direction until the amount of movement and the defect Df3 is reviewed next.

Further, as in the case described above, when all defects cannot be reviewed in one scan operation, i.e., when there are defects detected by the defect detection process but not yet subject to review and still remain, in this embodiment, As described above, a recurring defect review process is performed which targets the remaining defect as a review target (for example, see FIG. 9). For example, in the recurring defect review process executed during the scan operation in which the substrate W moves from the review camera 19 side to the line scan camera 15 side during the second and subsequent scan operations, the defect detection process was executed in parallel. Even if the defect detected by the defect detection process cannot be performed during the same scan operation, the defect review process cannot be performed. In such a case, instead of simply moving the substrate W from the review camera 19 side to the line scan camera 15 side, by repeatedly performing a defect review process, more substrates can be suppressed while increasing the processing time for one substrate. It becomes possible to make a defect into a review object. In addition, in the recurring defect review process, you may perform the operation which raises the conveyance speed of the board | substrate W in the period in which a defect is not contained in the imageable range of the review camera 19. FIG.

As described above, according to the present embodiment, since the defect review processing for acquiring an image of the detected defect is performed in parallel with the defect detection processing for the substrate W, the tact time for one substrate W is increased. It is possible to acquire more images of a defect, without letting it happen.

In addition, the apparatus structure of the board | substrate inspection apparatus 1 mentioned above is only an example, and is not limited to it. For example, in this embodiment, although the floating conveyance system which conveys the board | substrate W while air-lifting is mentioned as an example, it is not limited to this, For example, as mentioned above, several rollers (free roller etc.) arranged in the conveyance area | region are mentioned. You may deform | transform variously, such as the roller conveyance system which conveys, supporting the board | substrate W. As shown in FIG. In addition, in this embodiment, although the case of holding and conveying one side of the end parallel to the conveyance direction of the board | substrate was mentioned as the example, it is not limited to this, The case of holding and conveying both, the center part of the board | substrate W, etc. are hold | maintained. Various deformation | transformation, such as the case of conveyance by carrying out, are possible.

In addition, in the above-mentioned embodiment, although the line scan camera 15 and the review camera 19 were provided in one frame 13, it is not limited to this, and each separates the floating stage 14 perpendicularly to a conveyance direction, respectively. You may install in the frame of each. In addition, in this embodiment, although the image pickup area | region of the whole line scan camera 15 was illuminated with one line illumination 18, it is not limited to this, Even if individual illumination is provided in each of the line scan cameras 15, do. In this case, since the lighting can be configured to move together with the movement of the line scan camera 15, it becomes possible to suppress the power consumption of each lighting. Moreover, the structure which installed the line scan camera 15 in the barrel with coaxial fall illumination may be sufficient.

In addition, although the case where the line scan camera 15 and the review camera 19 do not move to the conveyance direction (X / -X direction) of the board | substrate W was mentioned as the example in this embodiment, it is not limited to this. For example, as shown in FIG. 10, each review camera 19 may be provided in the expansion-contraction stage 201 which can protrude in the X / -X direction. In this case, the expansion and contraction stage 201 moves the review camera 19 in the X / -X direction as necessary during the review of a defect, for example, under the control of the control unit 101 shown in FIG. 5. This makes it possible to review two defects closer to each other in the X direction during one scan operation, thereby making the tact time for the entire defect shorter. In addition, it is possible to greatly increase the magnified image of the acquired defect.

In addition, the said embodiment and its modified example are only the examples for implementing this invention, This invention is not limited to these, It is within the scope of this invention to make various modifications according to specifications, etc., and of this invention It is apparent from the above description that other various embodiments are possible within the scope. For example, it is a matter of course that the modifications appropriately exemplified for each embodiment can also be applied to the other embodiments.

1: substrate inspection device
11: body base
12: conveying stage
13: frame
14: injury stage
15: line scan camera
16: camera lens
17: Scan Camera Stage
18: line lights
19: Review Camera
20: barrel
21: Review Camera Stage
22: substrate transfer unit
101: control unit
102: input unit
103: memory
104: display unit
105: communication unit
112: conveying drive unit
114: floating stage drive unit
115: line scan camera driver
118: line light drive unit
119: review camera driver
121: defect detection unit
122: defect coordinate specifying unit
131: substrate import detection unit
132: mechanical alignment drive unit
133: substrate position detection unit
201: expansion stage
221 convey belt
222: driving unit
223: guide rail
224: holding part
225: Suction Pad
S1, S2, Sa1, Sa2, Sb1, Sb2: imaging range
R1, R2: range
W: substrate

Claims (9)

A conveying unit for conveying the substrate in the first direction,
A defect detector which detects a defect in the substrate being conveyed in the first direction;
An image acquisition unit for acquiring an image of a defect detected by the defect detection unit during the transfer;
Substrate inspection apparatus comprising a. The method of claim 1,
And a defect selecting unit that selects a target defect among the defects detected by the defect detecting unit,
The said image acquisition part acquires the image of the defect selected by the said defect selection part during the said conveyance, The board | substrate inspection apparatus characterized by the above-mentioned. The method of claim 2,
The image acquisition unit includes an imaging unit movable in a direction perpendicular to the first direction,
The defect selecting unit selects the target defect based on the moving speed of the image pickup unit and the transfer speed of the substrate by the transfer unit so that the highest ranked defect is among the ranked defects. Board inspection device. The method of claim 3,
The said imaging part is movable in parallel with respect to the said 1st direction, The board | substrate inspection apparatus characterized by the above-mentioned. The method of claim 2,
And a ranking unit for ranking the defects detected by the defect detection unit,
And the defect selecting unit selects the target defect based on the ranking by the ranking unit. The method of claim 2,
The transfer unit, if there is a defect that was not subjected to the target by the defect selection unit, back convey the substrate in a second direction opposite to the first direction,
The said image acquisition part acquires the image of the defect which did not become the said object during conveyance to the said 2nd direction, The board | substrate inspection apparatus characterized by the above-mentioned. A first conveyance step of conveying the substrate in the first direction,
A defect detection step of detecting a defect in the substrate being conveyed in the first direction in the first conveyance step;
An image acquisition step of acquiring an image of a defect detected in the defect detection step during the conveyance in the first conveyance step.
Substrate inspection method comprising a. The method of claim 7, wherein
A ranking step of ranking the defects detected in the defect detection step;
A defect selection step of selecting a defect to be targeted based on the ranking by the ranking step among the defects detected in the defect detection step.
More,
The said image acquisition step acquires the image of the defect selected by the said defect selection step during the conveyance in the said 1st conveyance step, The board | substrate inspection method characterized by the above-mentioned. The method of claim 8,
A second conveyance step for carrying back the substrate in a second direction opposite to the first direction when there is a defect that is not an object in the defect selecting step;
The said image acquisition step acquires the image of the defect which did not become the said object during conveyance of the said board | substrate to the said 2nd direction in the said 2nd conveyance step, The board | substrate inspection method characterized by the above-mentioned.

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