JP2012021852A - Substrate inspection device and substrate inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate inspection device allowing a detailed defect review inspection to be performed while inhibiting increase in time required for complete inspection.SOLUTION: A substrate inspection device 1 comprises: a substrate conveyance unit 22 that conveys a substrate W in an X direction; a line scan camera 15, a line scan camera driving part 115, a defect detection part 121, and a control part 101 for detecting a defect in the substrate W in transit in the X direction; and a review camera 19, a review camera driving part 119, and a control unit 101 for obtaining an image of the detected defect during the transit.

Description

  The present invention relates to a substrate inspection apparatus and a substrate inspection method.

  Conventionally, a liquid crystal display (LCD), a plasma display panel (PDP), an organic EL (Electro Luminescence) display, a surface-electric electron-emitting device display (SED: Surface-conduction Electro-Plate (Electro-Emitter Electro-Plate), etc.) Display) In the manufacture of various substrates such as substrates, semiconductor wafers, and printed circuit boards, in order to improve the yield, after each patterning process, patterning errors such as wiring short-circuits, connection failures, disconnections, and pattern failures are successively generated. It is checked whether it exists. In such substrate inspection, first, defects on the substrate surface are detected by a line scan camera or CCD camera (defect detection inspection), and then an enlarged image of the detected defect is acquired by a review camera such as a CCD camera. (Defect review inspection)

JP 2000-9661 A

  However, in the above-described prior art, since the defect review inspection is performed on the substrate after the defect inspection on one substrate is completed, there is a problem that the time required to complete all the inspections becomes redundant. It is also possible to limit the time required for inspection completion by limiting the time for defect review inspection, but in this case, the number of defects subject to defect review inspection is substantially limited. Therefore, there arises a problem that detailed defect review inspection cannot be performed.

  Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a substrate inspection apparatus and a substrate inspection method capable of performing a detailed defect review inspection while suppressing an increase in time required for completion of the inspection. And

  In order to achieve this object, a substrate inspection apparatus according to the present invention includes a transport unit that transports a substrate in a first direction, a defect detection unit that detects a defect in the substrate being transported in the first direction, and the defect Image acquisition means for acquiring an image of the defect detected by the detection means during the conveyance.

  The substrate inspection method according to the present invention includes a first transport step for transporting a substrate in a first direction, and a defect detection step for detecting a defect in the substrate being transported in the first direction in the first transport step, Image acquisition means for acquiring an image of the defect detected in the defect detection step during the conveyance in the first conveyance step.

  According to the present invention, in order to acquire the image of the detected defect in parallel with the defect detection for the substrate, it is possible to acquire more defect images without increasing the tact time for one substrate. It becomes possible. As a result, it is possible to realize a substrate inspection apparatus and a substrate inspection method capable of performing a detailed defect review inspection while suppressing an increase in time required to complete the inspection.

FIG. 1 is a perspective view showing a schematic configuration of a substrate inspection apparatus according to an embodiment of the present invention. FIG. 2 is a schematic diagram showing an example of the relationship between the imaging range of the line scan camera and the movable range of the review camera in the present embodiment. FIG. 3 is a schematic diagram illustrating another example of the relationship between the imaging range of the line scan camera and the movable range of the review camera in the present embodiment. FIG. 4 is a top view showing a schematic configuration of the substrate inspection apparatus shown in FIG. FIG. 5 is a block diagram showing a schematic functional configuration of the substrate inspection apparatus according to the present embodiment. FIG. 6 is a flowchart showing a schematic flow of the substrate inspection operation according to the present embodiment. FIG. 7 is a flowchart showing a schematic flow of the defect detection processing according to the present embodiment. FIG. 8 is a flowchart showing a schematic flow of defect review processing according to the present embodiment. FIG. 9 is a flowchart showing a schematic flow of the return defect review process according to the present embodiment. FIG. 10 is a top view showing another schematic configuration of the portal frame according to the present embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. In the following description, each drawing only schematically shows the shape, size, and positional relationship to the extent that the contents of the present invention can be understood. Therefore, the present invention is illustrated in each drawing. It is not limited to only the shape, size, and positional relationship. Moreover, in each figure, a part of hatching in a cross section is abbreviate | omitted for clarification of a structure. Furthermore, the numerical values exemplified below are merely preferred examples of the present invention, and therefore the present invention is not limited to the illustrated numerical values.

  Hereinafter, a substrate inspection apparatus and a substrate inspection method according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of a substrate inspection apparatus according to the present embodiment.

  As shown in FIG. 1, the substrate inspection apparatus 1 according to the present embodiment includes a main body base 11, a floating stage 14 that floats the substrate W by blowing air from countless holes provided on the substrate mounting surface, The substrate W is moved by moving the transfer stage 12 while holding the transfer stage 12 extending along the transfer direction of the substrate W (X / −X direction in the drawing) and the substrate W loaded on the floating stage 14. A substrate transport unit 22 for transporting the substrate, a portal frame 13 straddling the floating stage 14 to which the substrate W is transported in a direction perpendicular to the transport direction (Y direction in the drawing), and the floating stage 14 in the vicinity of the portal frame 13 A line illumination 18 that illuminates the light source in a line shape that is long in the Y direction from above, and a line-shaped region that is movably provided on the portal frame 13 and is illuminated by the line illumination 18 is opposite to the line illumination 18. One or more line scan cameras 15 for defect inspection imaged obliquely from above and one or more for review inspections that are provided movably on the portal frame 13 and enlarge the image of the substrate W on the floating stage 14 The review camera 19 is provided. Among these, for example, the levitation stage 14, the transfer stage 12, and the portal frame 13 are fixed to the main body base 11. Further, the line illumination 18 may be fixed to the main body base 11. For the main body base 11, a member having excellent earthquake resistance, such as a marble block, or a member having improved earthquake resistance performance by including a vibration damping portion can be used. In addition, the board | substrate inspection apparatus 1 may be accommodated in a clean room, for example.

  The levitation stage 14 is fixed to the main body base 11 by a frame (not shown), for example. The substrate mounting surface of the levitation stage 14 is provided with, for example, countless holes connected to a blower mechanism (not shown), and the air is blown out from the holes to be mounted on the levitation stage 14. The substrate W is in a state of floating from the substrate placement surface. However, the present invention is not limited to this, and a plurality of rollers that rotate in the conveyance direction of the substrate W are provided, and the substrate W is supported so that the substrate W does not come into contact with the floating stage 14. Various modifications can be made as long as they can be configured.

  The line illumination 18 used for imaging by the line scan camera 15 for defect inspection is a line light source, a light source in which point light sources are arranged in a line, a long thin surface light source, or the like. The position and angle of the line illumination 18 are adjusted so that the arrangement plane of the optical axes of the illumination light reflected from the surface of the substrate W includes the optical axes of the line scan cameras 15.

  The portal frame 13 provided in parallel with the line illumination 18 is a so-called gantry stage. The portal frame 13 is provided with a scan camera stage 17 that holds one or more line scan cameras 15 arranged in a direction (Y / −Y direction) perpendicular to the transport direction of the substrate W. Each line scan camera 15 is provided with a camera lens 16 capable of forming an image at a line sensor position of any line scan camera 15 while changing the observation light reflected on the substrate W by the line illumination 18 at a predetermined magnification. It has been.

  Each line scan camera 15 can move in the Y / −Y direction along the scan camera stage 17 independently of other line scan cameras 15 under the control of a control unit (not shown), for example. It is. This configuration enables the line scan camera 15 to image the substrate W passing under the portal frame 13 without any defects along the Y direction. Accordingly, by performing a scanning operation for transporting the substrate W in the X direction (or −X direction) using the substrate transport unit 22 while capturing the entire belt-shaped imaging region long in the Y direction with the line scan camera 15, the substrate It is possible to image the entire W. However, depending on the number of line scan cameras 15, the entire substrate W may be imaged by performing the scan operation a plurality of times. In this case, when one scan operation is completed, the line scan camera 15 moves in the Y / −Y direction by one field of view during the next scan operation.

  On the other hand, the review camera 19 is composed of, for example, a CCD camera or a CMOS camera. Each review camera 19 is provided in a lens barrel 20 including an objective lens that enables coaxial epi-illumination and enlarged projection of defects on the substrate W, and acquires an enlarged image of the target defect. The lens barrel 20 is provided on a review camera stage 21 disposed on the opposite side of the scan camera stage 17 with the portal stage 13 interposed therebetween. The plurality of lens barrels 20 are held on the review camera stage 21 so as to be movable at high speed. The review camera stage 21 can move each lens barrel 20 at high speed in the Y / −Y direction independently of the other lens barrels 20 under the control of a control unit (not shown).

  Here, for example, as shown in FIG. 2, when the number of line scan cameras 15 and the number of review cameras 19 are the same, the imaging range S1 of the first scan and the imaging range S2 of the second scan of the line scan camera 15 are used. It is preferable that the range R1 combined with is designed as a movable range of one review camera 19. As shown in FIG. 3, for example, when the number of review cameras 19 is half of the number of line scan cameras 15, the first scan imaging range Sa1 and the second scan imaging range Sa2 of the line scan camera 15a, and A range R2 that combines the imaging range Sb1 of the first scan and the imaging range Sb2 of the second scan of the line scan camera 15b may be designed as a movable range of one review camera 19. However, the present invention is not limited to this. For example, the review camera 19 may be configured to be able to move excessively for the imaging range. Thereby, for example, when an image is captured near the end of the movable range of the review camera 19, it is possible to eliminate the occurrence of a problem such as a part of the imaging region not being illuminated.

  Subsequently, the conveyance of the substrate W carried into the substrate inspection apparatus 1 will be described in detail with reference to the drawings. FIG. 4 is a top view showing a schematic configuration of the substrate inspection apparatus shown in FIG. As shown in FIG. 4, in the substrate inspection apparatus 1, when the substrate W is carried onto the levitation stage 14, the substrate W is mechanically aligned at a specified position by a positioning mechanism (not shown). The substrate W aligned at the specified position is held by the substrate transport unit 22. Specifically, the substrate transport unit 22 is provided on the transport stage 12, is provided along the transport stage 12 with guide rails 223 extending along the substrate transport direction, and is circulated by a driving source (not shown). A transport belt 221; a travel unit 222 that is fixed to the transport belt 221 and travels along the guide rail 223 by circulation of the transport belt 221; and a holding unit 224 that is fixed to the travel unit 222 and holds the substrate W. Prepare. The holding unit 224 includes one or more suction pads 225 connected to, for example, an exhaust pump (not shown). The substrate W is sucked into the suction pad 225 by the exhaust by the exhaust pump. As a result, the substrate W is held by the holding unit 224. However, in addition to this, various modifications such as a configuration in which the holding unit 224 grips the end of the substrate W can be made.

  When the substrate transport unit 22 moves in the X / −X direction by circulation of the transport belt 221, the substrate W held by the substrate transport unit 22 is transported in the X / −X direction. At this time, since the substrate W is lifted from the levitation stage 14 by air, the substrate W can be prevented from being damaged due to contact with the levitation stage 14 or the like.

  Next, a drive mechanism for operating the substrate inspection apparatus 1 will be described in detail with reference to the drawings. FIG. 5 is a block diagram showing a schematic functional configuration of the substrate inspection apparatus according to the present embodiment. As shown in FIG. 5, the substrate inspection apparatus 1 includes a control unit 101 that controls the operation of the entire substrate inspection apparatus 1, a levitation stage driving unit 114 that drives the levitation stage 14 to levitate the substrate W, and levitates from the outside. A substrate carry-in detection unit 131 that detects that the substrate W has been loaded onto the stage 14; and a mechanical alignment drive unit 132 that mechanically aligns the substrate W at a specified position when the substrate W is loaded into the levitation stage 14. , A transport driving unit 112 that moves the levitation stage 14 in the X / −X direction while holding the substrate W, a substrate position detection unit 133 that detects the position of the substrate W on the levitation stage 14 in substantially real time, and line illumination. The line illumination driving unit 118 that illuminates the imaging area of the line scan camera 15 by driving 18, and the image of the substrate W by driving the line scan camera 15. Comprising a line scan camera driver 115 to retrieve per emissions, the review camera driver 119 that acquires a magnified image of the defects in the substrate W by driving the review camera 19, a.

  The board inspection apparatus 1 also includes an input unit 102 for a user to input various settings and instructions, a storage unit 103 for appropriately storing various programs and parameters, acquired image data, and the like, and an acquired / stored image. And a display unit 104 that displays various information, a communication unit 105 that controls communication with the outside, a defect detection unit 121 that detects an image of a defect included in an image captured by the line scan camera 15, and a defect detection unit A defect coordinate specifying unit 122 that specifies the position (defect coordinates) of the defect detected in 121 on the substrate W. The substrate carry-in detection unit 131 detects whether or not the substrate W has been loaded based on a signal from a sensor (not shown) provided at the substrate carry-in port of the levitation stage 14. The mechanical alignment driving unit 132 drives a positioning mechanism such as a pin or a roller provided in the vicinity of the substrate carry-in port of the levitation stage 14 to position the substrate W at a specified position.

  Next, the operation of the substrate inspection apparatus 1 during substrate inspection will be described in detail with reference to the drawings. In the substrate inspection operation according to the present embodiment, at least during the first scan operation, a defect detection process for detecting a defect on the substrate W and a defect review process for acquiring an image of the detected defect are performed in parallel. Take the case of doing as an example. If the second and subsequent scan operations are executed, the defect detection process may or may not be omitted in the second and subsequent scan operations.

  FIG. 6 is a flowchart showing a schematic flow of the substrate inspection operation according to the present embodiment. However, in the following description, attention is paid to the operation of the control unit 101 shown in FIG. As shown in FIG. 6, in the substrate inspection operation, the control unit 101 first determines whether or not the substrate W has been loaded onto the floating stage 14 from the outside by the substrate carry-in detection unit 131 (step S <b> 101). At this time, the control unit 101 waits for the substrate W to be carried in a state where the levitation stage 114 is driven, that is, in a state where air is blown out from the hole of the levitation stage 14 (No in step S104).

  When the substrate W is loaded onto the levitation stage 14 (Yes in step S101), the control unit 101 drives a positioning mechanism (not shown) via the mechanical alignment driving unit 131, so that the substrate W is placed on the levitation stage 14. Substrate transport in which the substrate W at the defined position is moved to a predetermined substrate holding position by mechanically aligning to the defined position (step S102), and then driving the substrate transport unit 22 via the transport drive unit 112. The unit 22 holds it (step S103).

  Next, the control unit 101 starts the operation of moving the substrate W in the X direction at a constant speed by driving the transport driving unit 112 and starting the operation of moving the substrate transport unit 22 in the X direction at a constant speed. (Step S104). Subsequently, based on the position of the substrate W that is input as needed from the substrate position detection unit 133, the control unit 101 places the substrate W on the imaging region (scan region) of the line scan camera 15 positioned upstream in the transport path of the substrate W. Is waited for (No in step S105). When the substrate W reaches the scan area (Yes in step S105), the control unit 101 first starts a defect detection process for detecting a defect in the substrate W (step S106), and subsequently detected in the defect detection process. Defect review processing for acquiring an enlarged image of the defect is started (step S107).

  Next, the control unit 101 determines whether or not a return scan operation is requested in a defect review process or a return defect review process to be described later (step S108). The folding scan operation is, for example, when the substrate W is transported in the X direction, transporting in the −X direction, and conversely, when transporting in the −X direction, the substrate W is transported in the X direction. That is.

  As a result of the determination in step S108, when a turn-back scanning operation is requested (Yes in step S108), the control unit 101 drives the transport driving unit 112 so that the transport direction of the substrate W is reversed, and the substrate transport unit 22 Starts moving at a constant speed (step S109). Subsequently, the control unit 101 starts defect review processing (returned defect review processing) for the remaining defects that have not been reviewed (step S110), and then returns to step S108.

  On the other hand, if the result of determination in step S108 is that a return scanning operation is not requested (No in step S108), the control unit 101 determines whether the scanning operation on the substrate W has been completed (step S111). If not completed (No in step S111), the process returns to step S108. On the other hand, when the scanning operation is finished (Yes in step S111), this operation is finished.

  Subsequently, the defect detection processing according to the present embodiment will be described in detail with reference to the drawings. FIG. 7 is a flowchart showing a schematic flow of the defect detection processing according to the present embodiment. As illustrated in FIG. 7, in the defect detection process, the control unit 101 first acquires an image of the substrate W for one line by capturing an image of the substrate W passing through the scan region with the line scan camera 15. (Step S121). Note that an image for one line is generated by connecting a plurality of images captured at one time by driving a plurality of line scan cameras 15 arranged in a direction perpendicular to the conveyance direction of the substrate W substantially simultaneously. It is a striped image.

  Next, the control unit 101 inputs the image for one line input via the line scan camera driving unit 115 to the defect detection unit 121 and performs image analysis (step S122), thereby converting the image for one line into an image for one line. Detect the included defects. Subsequently, the control unit 101 determines whether or not a defect is detected in step S122 (step S123). If a defect is detected (Yes in step S123), the position of the detected defect on the substrate W is determined. (Defect coordinates) are specified by the defect coordinate specifying unit 122 (step S124), and the specified defect coordinates for one line are output (step S125). The defect coordinate output destination is, for example, the control unit 101. On the other hand, when no defect is detected in step S122 (No in step S123), the control unit 101 proceeds to step S126. The positions (defect coordinates) of the defect on the substrate W are, for example, the positions (coordinates) of the substrate W on the floating stage 14 and the positions (coordinates) of the miscellaneous image area of each line scan camera 15 on the floating stage 14. ) And the position (coordinates) of the defect included in the image captured by each line scan camera 15.

  In step S126, the control unit 101 stands by until the substrate W moves in the X direction by one line (No in step S126). When the substrate W moves in the X direction by one line (Yes in step S126), the control unit 101 determines whether or not the scanning has been completed for all the lines with respect to the substrate W, that is, the defect detection for the entire substrate W and the defect coordinates. It is determined whether or not the identification has been completed (step S127). If the identification has not been completed (Yes in step S127), the control unit 101 returns to step S121 and executes the subsequent operations. On the other hand, when the scan for all the lines has been completed (Yes in step S127), the control unit 101 ends the defect detection process.

  Next, the defect review process according to the present embodiment will be described in detail with reference to the drawings. FIG. 8 is a flowchart showing a schematic flow of defect review processing according to the present embodiment. As shown in FIG. 8, in the defect review process, the control unit 101 first determines whether or not one line of defect coordinates is input from the defect coordinate specifying unit 122 in the defect detection process shown in FIG. If input (S141: Yes in step S141), the defect coordinates for one line are stored in, for example, the storage unit 103 (step S142), and then the process proceeds to step S143. On the other hand, when defect coordinates for one line are not input, that is, when a defect is not included in the image for one line in the defect detection processing shown in FIG. 7 (No in step S141), the control unit 101. Proceeds to step S143.

  In step S143, the control unit 101 displays information such as the order of review, the amount of movement of the review camera 19 at the time of review, and the movement timing for all the defects whose defect coordinates are stored in the storage unit 103 or the like. A review schedule including it is created (step S143). The creation of the review schedule will be described later. The created review schedule is temporarily stored in the storage unit 103 or the like, for example.

  Subsequently, the control unit 101 determines whether there is a defect that cannot be reviewed as a result of the scheduling in step S143, that is, cannot be imaged by any of the review cameras 19 (step S144). If there is a defect that cannot be reviewed as a result of this determination (Yes in step S144), the control unit 101 selects a defect to be reviewed based on a predetermined priority among the defects in which the defect coordinates are stored ( Step S145). The predetermined priority order may be based on, for example, the size of the defect or the positional relationship between the defect and the wiring. In addition, defect coordinates that are not selected are separately stored, for example, in the storage unit 103 or the like.

  Subsequently, the control unit 101 re-creates a review schedule for the defect selected in step S145 (step S146), and then proceeds to step S147. On the other hand, as a result of the determination in step S144, when there is no defect that cannot be reviewed (No in step S144), the control unit 101 proceeds to step S147 as it is. Note that the review schedule previously stored in the storage unit 103 or the like is updated by, for example, the review schedule recreated in step S146.

  In step S147, the control unit 101 drives the review camera driving unit 119 based on the review schedule stored in the storage unit 103 and the like, and acquires an enlarged image of the defect to be reviewed by the review camera 19. The acquired enlarged image of the defect is stored in the storage unit 103 and the like together with the defect coordinates, for example.

  Thereafter, the control unit 101 determines whether or not the defect review process for the substrate W has been completed (step S148). If the process has not been completed (No in step S148), the control unit 101 returns to step S141 and performs the subsequent operations. Execute. On the other hand, when the defect review operation has been completed (Yes in step S148), the control unit 101 determines whether there is a defect that cannot be reviewed, that is, whether or not there is a defect that cannot be reviewed in step S144. If it is determined (step S149) and there is a defect that could not be reviewed (Yes in step S149), a request for return scan operation (return defect review process) is generated (step S150), and then this defect review process is terminated. To do. The return scanning operation request is stored at a predetermined address in the storage unit 103, for example. If there is no defect that could not be reviewed as a result of the determination in step S149 (No in step S149), the control unit 101 ends the defect review process as it is.

  FIG. 9 is a flowchart showing a schematic flow of the return defect review process according to the present embodiment. As shown in FIG. 9, in the return defect review process, the control unit 101 first creates a review schedule for the detected defects that remain without being reviewed (step S161). The created review schedule is stored in the storage unit 103, for example, as described above.

  Subsequently, the control unit 101 determines whether there is a defect that cannot be reviewed as a result of the scheduling in step S161 (step S162). If there is a defect that cannot be reviewed (Yes in step S162), the control unit 101 has not been selected. Of the defects, defects to be reviewed are selected based on a predetermined priority (step S163), a review schedule is re-created for the selected defects (step S164), and then the process proceeds to step S165. . On the other hand, as a result of the determination in step S162, if there is no defect that cannot be reviewed (No in step S162), the control unit 101 proceeds to step S165 as it is. In addition, the review schedule memorize | stored in the memory | storage part 103 grade | etc., Is updated by the re-created review schedule like the above. Also, the defect coordinates not selected in step S163 are separately stored in, for example, the storage unit 103 or the like as described above.

  In step S165, the control unit 101 drives the review camera driving unit 119 based on the review schedule stored in the storage unit 103 and the like, and acquires an enlarged image of the defect to be reviewed by the review camera 19.

  Thereafter, the control unit 101 determines whether or not there is a defect that cannot be reviewed, that is, whether or not there is a defect that cannot be reviewed in step S162 (step S166). In step S166, a request for a second return scanning operation (return defect review process) is generated (step S167), and then the present return defect review process ends. If there is no defect that could not be reviewed as a result of the determination in step S149 (No in step S166), the control unit 101 ends the return-fault defect review process as it is.

  Substrate inspection including defect detection processing for detecting defects present on the substrate W and defect review processing (including folded defect review processing) for acquiring an enlarged image of the detected defects by operating as described above. The action is executed.

Next, creation of a review schedule (including recreation) in the present embodiment will be described in detail. Here, the moving speed of the substrate transport unit 22 in the X direction (moving speed of the substrate W in the X direction) is Gs, the moving speed of the review camera 19 in the Y direction is Gr, and the movable distance of the review camera 19 is Yr. If the moving time when the review camera 19 moves the movable distance Yr is Tr, the moving time Tr is expressed by the following equation (1).
Tr = Yr / Gr (1)

Further, when the time from when the review camera 19 stops at the target position until the imaging of the target defect is completed is Tα, the time Td required to acquire an enlarged image of one defect is expressed by the following formula ( 2).
Td = Tr + Tα (2)

For this reason, the distance dXr that the substrate transport unit 22 moves in the X direction during the defect review process for one defect is expressed by the following equation (3).
dXr = Gr × Td (3)

Here, assuming that the length of the substrate W in the X direction is Wx, the number of defects that can be captured by one review camera 19 while the line scan camera 15 scans one line (the number of defect images that can be acquired). Img is represented by the following formula (4).
Img = Wx / dXr (4)

  Therefore, the total number of defect images that can be acquired by the entire review camera 19 while the line scan camera 15 scans one line is equal to the number of defect images Img that can be acquired by the above equation (4). Is the number multiplied by.

  However, since the substrate transport unit 22 moves the distance dXr while processing one defect, when there are two defects to be imaged by one review camera 19, the interval in the X direction is equal to or less than dXr. And any defect cannot be imaged substantially. Therefore, in this embodiment, in order to prioritize defect review processing for more serious defects, priorities are set according to the degree of defects, and more serious defects are prioritized according to the priorities. Create a review schedule to be reviewed.

  For example, while the substrate W moves from the imaging area (scan area) of the line scan camera 15 to the imaging area of the review camera 19, the defects to be imaged by one review camera 19 are detected in the order detected by the defect detection process. Assume that Df1, Df2, Df3, Df4, and Df5 are detected. Here, a defect having a large size is regarded as a defect having a high priority, and the relationship between the defect sizes is Df3> Df2> Df4> Df1> Df5, and the relationship between the distance in the X direction and the distance dXr between the two defects that follow in the detection order Are | Df1-Df2 | <dXr, | Df2-Df3 |> dXr, | Df3-Df4 | <dXr, and | Df4-Df5 |> dXr, the defect Df3 must be based on this priority. It becomes a defect to be reviewed. Here, there are two defects Df2 and Df5 which are separated from the defect Df3 by a distance dXr or more in the X direction. Therefore, in this case, there are three defects to be reviewed, that is, defects Df2, Df3, and Df5.

  Therefore, for this case, in the present embodiment, information for reviewing defects in the order of Df2 → Df3 → Df5 and the review camera 19 is moved in the Y direction until the defect Df3 is reviewed next to the defect Df2. A review schedule including the amount of movement to be performed and information on the amount of movement to move the review camera 19 in the Y direction before the defect Df5 is reviewed next to the defect Df3 is generated.

  Also, if all the defects cannot be reviewed by a single scan operation, as in the case described above, that is, if there are defects that have been detected by the defect detection process but are not yet reviewed, this implementation In this form, as described above, the return defect review process is performed with the remaining defect as a review target (see, for example, FIG. 9). For example, in the return defect review process executed during the scan operation in which the substrate W moves from the review camera 19 side to the line scan camera 15 side in the second and subsequent scan operations, even if the defect detection process is executed in parallel, The defect review process cannot be performed during the same scan operation on the defect detected by the defect detection process. In such a case, the substrate W is not simply moved from the review camera 19 side to the line scan camera 15 side, but by performing a return defect review process, more processing time is suppressed while suppressing an increase in processing time for one substrate. Defects can be reviewed. In the return defect review process, an operation for increasing the transport speed of the substrate W may be performed during a period in which no defect is included in the imaging range of the review camera 19.

  As described above, according to the present embodiment, the defect review process for acquiring the image of the detected defect is executed in parallel with the defect detection process for the substrate W. More defect images can be acquired without increasing the tact time.

  The apparatus configuration of the substrate inspection apparatus 1 described above is merely an example, and the present invention is not limited thereto. For example, in the present embodiment, the levitation transport method for transporting the substrate W while floating with air is taken as an example. However, the present invention is not limited to this. For example, as described above, a plurality of arrays arranged in the transport region are provided. Various modifications may be made such as a roller conveyance method in which the substrate W is conveyed while being supported by a roller (such as a free roller). In the present embodiment, the case where one of the ends parallel to the transport direction of the substrate W is held and transported is described as an example. However, the present invention is not limited to this. Various modifications can be made, for example, when holding and transporting the central portion of the substrate W or the like.

  Further, in the above-described embodiment, the line scan camera 15 and the review camera 19 are provided in one portal frame 13, but the present invention is not limited to this, and separate gates straddling the floating stage 14 perpendicularly to the transport direction. Each may be provided on the mold frame. In the present embodiment, the entire imaging region of the plurality of line scan cameras 15 is illuminated by one line illumination 18, but the present invention is not limited to this, and each line scan camera 15 may be provided with individual illumination. . In this case, since the illumination can be configured to move together with the movement of the line scan camera 15, it is possible to suppress the power consumption of each illumination. Further, the line scan camera 15 may be provided in a lens barrel with coaxial epi-illumination.

  Furthermore, although the case where the line scan camera 15 and the review camera 19 do not move in the transport direction (X / −X direction) of the substrate W has been described as an example in the present embodiment, the present invention is not limited to this. For example, as shown in FIG. 10, each review camera 19 may be provided on a telescopic stage 201 that can project in the X / −X direction. In this case, the telescopic stage 201 moves the review camera 19 in the X / −X direction as necessary when reviewing defects under the control of the control unit 101 shown in FIG. 5, for example. This makes it possible to review two defects that are closer together in the X direction during a single scanning operation, so that the tact time for the entire defect can be further shortened. In addition, it is possible to greatly increase the enlarged images of defects that can be acquired.

  In addition, the above-described embodiment and its modifications are merely examples for carrying out the present invention, and the present invention is not limited to these, and various modifications according to specifications and the like are within the scope of the present invention. Furthermore, it is obvious from the above description that various other embodiments are possible within the scope of the present invention. For example, it is needless to say that the modification examples illustrated as appropriate for each embodiment can be applied to other embodiments.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 11 Main body base 12 Transfer stage 13 Portal frame 14 Levitation stage 15 Line scan camera 16 Camera lens 17 Scan camera stage 18 Line illumination 19 Review camera 20 Lens barrel 21 Review camera stage 22 Substrate transfer stage 101 Control part 102 Input Unit 103 Storage unit 104 Display unit 105 Communication unit 112 Transport drive unit 114 Floating stage drive unit 115 Line scan camera drive unit 118 Line illumination drive unit 119 Review camera drive unit 121 Defect detection unit 122 Defect coordinate specification unit 131 Substrate carry-in detection unit 132 Mechanical alignment driving unit 133 Substrate position detecting unit 201 Telescopic stage 221 Conveying belt 222 Traveling unit 223 Guide rail 224 Holding unit 225 Suction pad S1, S2, Sa , Sa2, Sb1, Sb2 imaging range R1, R2 range W substrate

Claims (9)

Conveying means for conveying the substrate in the first direction;
Defect detection means for detecting defects in the substrate being conveyed in the first direction;
An image acquisition means for acquiring an image of the defect detected by the defect detection means during the conveyance;
A board inspection apparatus comprising: A defect selection means for selecting a target defect among the defects detected by the defect detection means;
The substrate inspection apparatus according to claim 1, wherein the image acquisition unit acquires an image of a defect selected by the defect selection unit during the conveyance. The image acquisition means includes an imaging means that is movable in a direction perpendicular to the first direction,
The defect selecting unit is configured to detect the defect based on the moving speed of the imaging unit and the transport speed of the substrate by the transport unit so that the highest-ranked defect among the ranked defects is the target. The substrate inspection apparatus according to claim 2, wherein:   The substrate inspection apparatus according to claim 3, wherein the imaging unit is movable in parallel to the first direction. And further comprising a ranking means for ranking the defects detected by the defect detection means,
The substrate inspection apparatus according to claim 2, wherein the defect selection unit selects the target defect based on the ranking by the ranking unit. When there is a defect that is not targeted by the defect selection unit, the transport unit folds the substrate in a second direction opposite to the first direction and transports the substrate,
The substrate inspection apparatus according to claim 2, wherein the image acquisition unit acquires an image of a defect that is not the target during conveyance in the second direction. A first transport step for transporting the substrate in the first direction;
A defect detection step of detecting defects in the substrate being transferred in the first direction in the first transfer step;
Image acquisition means for acquiring an image of the defect detected in the defect detection step during the conveyance in the first conveyance step;
A substrate inspection method comprising: A ranking step of ranking the defects detected in the defect detection step;
A defect selection step of selecting a target defect based on the ranking by the ranking step among the defects detected in the defect detection step;
Further including
The substrate inspection method according to claim 7, wherein the image acquiring step acquires an image of the defect selected by the defect selecting step during the transfer in the first transfer step. When there is a defect that is not targeted in the defect selection step, the method further includes a second transport step of folding and transporting the substrate in a second direction opposite to the first direction,
9. The substrate inspection method according to claim 8, wherein the image acquiring step acquires an image of a defect that is not the target during the transporting of the substrate in the second direction in the second transporting step.

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