TW201206274A - Mold apparatus and method for separating substrate using the same - Google Patents

Mold apparatus and method for separating substrate using the same Download PDF

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Publication number
TW201206274A
TW201206274A TW99138704A TW99138704A TW201206274A TW 201206274 A TW201206274 A TW 201206274A TW 99138704 A TW99138704 A TW 99138704A TW 99138704 A TW99138704 A TW 99138704A TW 201206274 A TW201206274 A TW 201206274A
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Taiwan
Prior art keywords
cutting
outer casing
cutting tool
panel
mold apparatus
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TW99138704A
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Chinese (zh)
Inventor
Sun-Uk Hwang
Young-Hwan Shin
Byoung-Chan Kim
Jin-Seok Lee
Kyoung-Ro Yoon
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Samsung Electro Mech
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Publication of TW201206274A publication Critical patent/TW201206274A/en

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  • Engineering & Computer Science (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Mechanical Engineering (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

The present invention provides a mold apparatus and a method for separating a substrate using the same. The mold apparatus includes a housing, a supporting member for supporting and fixing the panel by being provided in the housing, a cutting member to cut the panel along a strip line of the panel placed on the supporting member by being provided on a top of the housing and a driving member to drive the cutting member, wherein the cutting member includes a cutter to cut the strip line and a plurality of core blocks to mount the cutter on the housing and to form a structure corresponding a gap between the housing and the cutter by being combined with each other.

Description

201206274 1 VY fVOjrt\ 六、發明說明: 【相關申請案之交互參照資料】 本申請案主張2010年7月22曰向韓國智慧財產局提出申請 之韓國專利申請案號10-2010-0070956之優先權,其揭露内容係於 此併入作參考。 【發明所屬之技術領域】 本發明是有關於一種模具設備及使用其之用以分離 基板之方法,且特別是有關於一種能為各種模型之基板執 行一剝離製程之模具設備,以及使用其之用以分離基板之 方法。 【先前技術】 一種習知之印刷電路板之製程包含一剝離製程,用以 藉由切割一母板來製造複數個單元薄板,以製造一印刷電 路板。剝離製程係藉由使用一種習知之預定的模呈 執行。模具設備包含一模具外殼具有一用以支撐面板之支 撐台’-設置於模具外殼中之切割構件以及一用以驅動切 割構件之驅動構件。切割構件包含一銑刀(r〇uter Mt)。 這種構造之模具設備可藉由驅動驅動構件來製造單 元薄板’俾能在岐被切至切台後,使銑刀沿著面板 之剝離線來切割面板。 【發明内容】 因此’為了克服上述問題而提出本發明,且本發明之 201206274201206274 1 VY fVOjrt\ VI. Description of invention: [Reciprocal reference material for related applications] This application claims the priority of Korean Patent Application No. 10-2010-0070956 filed with the Korea Intellectual Property Office on July 22, 2010. The disclosure is hereby incorporated by reference. BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a mold apparatus and a method for separating the same using the same, and more particularly to a mold apparatus capable of performing a peeling process for substrates of various models, and using the same A method for separating a substrate. [Prior Art] A conventional printed circuit board process includes a lift-off process for fabricating a plurality of unit sheets by cutting a mother board to produce a printed circuit board. The stripping process is performed by using a conventional predetermined pattern. The mold apparatus includes a mold housing having a support table for supporting the panel - a cutting member disposed in the mold housing and a driving member for driving the cutting member. The cutting member comprises a milling cutter (r〇uter Mt). The mold apparatus of this configuration can manufacture a unit sheet by driving the driving member, and can cut the panel along the peeling line of the panel after the crucible is cut to the cutting table. SUMMARY OF THE INVENTION Therefore, the present invention has been made in order to overcome the above problems, and the present invention 201206274

TW7083PA 一個目的係提供一種模具設備,其能對應於各種模型之基 板執行一剝離製程。 本發明之另一目的係提供一種基板切割方法,其能執 行一對應於各種模型之基板之剝離製程。 依據本發明之第一方面,提出一種模具設備,用以執 行一剝離製程,用以藉由切割一面板來製造多個單元薄 板,模具設備包含一外殼、一支撐構件、一切割構件以及 一驅動構件。支撐構件用以藉由被設置於外殼中來支撐並 固定面板。切割構件用以沿著藉由設置於外殼之一頂部上 而被置於支撐構件上之面板之一剝離線來切割面板。驅動 構件用以驅動切割構件。切割構件包含:一切割刀具,用 以切割剝離線;及複數個核心區塊,用以安裝切割刀具於 外殼上,並用以藉由彼此結合來形成一構造,此構造對應 於一在外殼與切割刀具之間的間隙。 依據本發明之實施例,此些核心區塊藉由被連接至外 殼來導引切割刀具之上下移動。 依據本發明之實施例,外殼包含一底部構造、一頂部 構造以及一導引構件。底部構造用以支撐支撐構件。頂部 構造於底部構造之一頂部上面對底部構造。導引構件用以 於底部構造上藉由被連接至底部構造與頂部構造,來分別 導引頂部構造之上下移動。核心區塊連接切割刀具至頂部 構造。 依據本發明之實施例,切割構件包含一支撐板及一剝 離器。支撐板藉由插入此些核心區塊而安裝於外殼上。剝 離器凸出地形成於支撐板之一下表面上,俾能對應至剝離 4 201206274 1 vr /v/oji γλ. 線。 依據本發明之實施例,剝離線具有一長方形環狀,且 剝離器係沿著支撐板之一周邊形成,以具有一對應於長方 形環狀之形狀。 依據本發明之第二方面,提出一種用以切割一基板之 方法。一用以製造複數個單元薄板之剝離製程係藉由一外 殼、一支撐構件及一切割構件而執行。支撐構件用以藉由 被設置於外殼之一底部中來支撐並固定一面板。切割構件 用以沿著藉由被設置於外殼之一頂部上而被置於支撐構 件之面板之一剝離線,來切割面板。此方法包含以下步 驟:準備一切割刀具於一對應於一個別剝離線之之環部構 造,以製造各單元薄板;結合複數個核心區塊,俾能形成 對應於一在切割刀具與一模具外殼之間的間隙之形狀;藉 由插入此些核心區塊來安裝切割刀具於模具外殼上;以及 藉由驅動切割刀具上下移動而沿著剝離線來切割面板。 依據本發明之實施例,用以切割基板之方法更包含以 下步驟:當此些單元薄板之一模具改變時,準備一新的切 割刀具以配合改變之模具;再結合此些核心區塊,俾能形 成一對應於一在外殼與新的切割刀具之間的間隙之形 狀;以及藉由插入此些再結合的核心區塊來安裝新的切割 刀具於外殼上。 為了對本發明之上述及其他方面有更佳的暸解,下文 特舉較佳實施例,並配合所附圖式,作詳細說明如下: 【實施方式】 201206274 ’One purpose of the TW7083PA is to provide a mold apparatus that performs a stripping process corresponding to the substrates of various models. Another object of the present invention is to provide a substrate cutting method capable of performing a peeling process of a substrate corresponding to various models. According to a first aspect of the present invention, a mold apparatus is provided for performing a peeling process for manufacturing a plurality of unit sheets by cutting a panel, the mold apparatus comprising a casing, a support member, a cutting member and a drive member. The support member is for supporting and fixing the panel by being disposed in the outer casing. The cutting member is for cutting the panel along a stripping line of one of the panels placed on the support member by being placed on top of one of the outer casings. A drive member is used to drive the cutting member. The cutting member comprises: a cutting tool for cutting the stripping line; and a plurality of core blocks for mounting the cutting tool on the outer casing, and for forming a structure by combining with each other, the configuration corresponding to the outer casing and the cutting The gap between the tools. In accordance with an embodiment of the present invention, such core blocks direct the cutting tool to move up and down by being coupled to the outer casing. In accordance with an embodiment of the present invention, the outer casing includes a bottom configuration, a top configuration, and a guide member. The bottom is configured to support the support member. The top is constructed on top of one of the bottom configurations and above the bottom. The guide members are used to guide the bottom structure up and down, respectively, by being coupled to the bottom and top configurations. The core block connects the cutting tool to the top construction. According to an embodiment of the invention, the cutting member comprises a support plate and a stripper. The support plate is mounted to the housing by inserting such core blocks. The stripper is convexly formed on one of the lower surfaces of the support plate, and the tantalum can correspond to the peeling 4 201206274 1 vr /v/oji γλ. According to an embodiment of the present invention, the peeling wire has a rectangular ring shape, and the stripper is formed along one periphery of the support plate to have a shape corresponding to the rectangular ring shape. According to a second aspect of the invention, a method for cutting a substrate is presented. A stripping process for fabricating a plurality of unit sheets is performed by an outer casing, a support member, and a cutting member. The support member is for supporting and fixing a panel by being disposed in a bottom of one of the outer casings. The cutting member is for cutting the panel along a stripping line that is placed on one of the panels of the support member by being placed on top of one of the outer casings. The method comprises the steps of: preparing a cutting tool in a ring structure corresponding to a different stripping line to manufacture each unit sheet; combining a plurality of core blocks, the crucible can be formed corresponding to a cutting tool and a mold shell The shape of the gap between the two; the cutting tool is mounted on the mold casing by inserting the core blocks; and the panel is cut along the peeling line by driving the cutting tool up and down. According to an embodiment of the invention, the method for cutting a substrate further comprises the steps of: preparing a new cutting tool to match the changed mold when one of the unit sheets is changed; and combining the core blocks, A shape corresponding to a gap between the outer casing and the new cutting tool can be formed; and a new cutting tool can be mounted on the outer casing by inserting the recombined core blocks. In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below in detail with reference to the accompanying drawings, in which: FIG.

TW7083PA 以下用以達成本發明之優點、特徵與方法,將在參 考以下附圖所作的依據本發明之實施例作詳細說明時而 得以更顯清楚。然而,本發明係並未受限於說明於以下之 實施例’但將以各種不同的形狀與修改例被實現。本發明 之實施例可能被提供以使本發明之揭露内容完整化,並向 熟悉f發明之範嘴之技藝者報告。遍及本發明說明書之整 體内容之相同的參考數字表示相同的元件。 使用於此之專門用語,係只用以說明特定實㈣㈣ 意欲受限於實施示範例。如於此所使用的,單數形式 「-」'「-個」以及「此」係亦意欲包含複數的形式,除 非上下文另外清楚地表示。吾人將更進一步理解到’專門 用浯「包含」及/或「包括」,當使用於本說明書中時,指 定指定特徵、錄、步驟、操作、元件及/或經件之存在, 但並未妨礙一個或多個其他特徵、整數、步驟、操作 件、組件及/或其群組之存在或添加。 以下’將詳細說明依據本發明之實施例之模具設備以 及使用其之用以分離基板之方法。 、 第1圖係、為顯示依才康本發明之一實施例之一模具言凡 備之剖面圖。第2圖係為顯示第i圖之一切割構件之構、生 之平面視圖。第3圖係為顯示第2圖之切割構件之一切二 刀具之立體圖,而第4圖顯示待被依據本發明之 : 模具設備製造之面板。 參見第1至4圖,依據本發明之模具設備1〇〇可執行 用以將預定的基板切割成為多個單元基板之製程。舉例^ 言,模具設備100可執行一剝離製程,用以切割—母板1〇 6 201206274 1 fl I VU_»1 ΓΎ 成為複數個單元薄板12,以便製造一印刷電路板。因此, 待被模具設備100製造之面板10,如第4圖所示,可能一 薄板包含複數個單元薄板12。於面板10中,可提供複數 條剝離線14,用以藉由模具設備100將面板10切割成為 複數個單元薄板12。模具設備100可藉由切割此些剝離線 14而從面板10製造出此些單元薄板12。 模具設備100可包含一外殼110、一支撐構件120、 一切割構件130及一驅動構件140。另一方面,於第1圖 中,顯示出被置於支撐構件120之面板10係由降下模具 設備100之切割構件130所切割。 外殼110可能一種用以支撐與裝設模具設備100之組 件之構造。外殼110可包含一用以支撐此支撐構件120之 底部構造112,以及一用以支撐切割構件130之頂部構造 114。頂部構造114可被配置成於底部構造112之一頂部 上面對底部構造112。此外,頂部構造114可被提供成可 於頂部構造114之底部構造112上進行上下移動。外殼110 可更包含一導引構件116,用以導引頂部構造114之上下 移動。導引構件116可分別連接至底部構造112與頂部構 造114,而頂部構造114可沿著導引構件116上下垂直移 動。 支撐構件120可被固定地裝設於外殼110之底部構造 112上。支撐構件120可能一支撐台,用以在剝離製程期 間支撐並固定面板10。為此,支撐構件120可包含一支撐 表面及一導引板。面板係位於支撐表面上。導引板用以導 引面板10至支撐表面。於此,支撐構件120可被建構以 201206274TW7083PA The advantages, features and methods of the present invention will become more apparent from the following detailed description of embodiments of the invention. However, the present invention is not limited to the embodiments described hereinafter but will be implemented in various shapes and modifications. Embodiments of the present invention may be provided to complete the disclosure of the present invention and to report to those skilled in the art. The same reference numerals are used throughout the specification to refer to the same elements. The specific terms used herein are used merely to describe the specific (4) (4) intended to be limited by the implementation examples. As used herein, the singular forms "-", "-" and "the" are also intended to include the plural, unless the context clearly indicates otherwise. We will further understand that 'special use', 'including' and/or 'including', when used in this specification, specifies the existence of specified features, records, steps, operations, components and/or components, but does not The presence or addition of one or more other features, integers, steps, operations, components, and/or groups thereof is impeded. Hereinafter, a mold apparatus according to an embodiment of the present invention and a method for separating the same using the same will be described in detail. Fig. 1 is a cross-sectional view showing a mold of one of the embodiments of the invention. Fig. 2 is a plan view showing the structure of a cutting member of the first drawing. Fig. 3 is a perspective view showing all the two cutters of the cutting member of Fig. 2, and Fig. 4 shows a panel to be manufactured according to the present invention: a mold apparatus. Referring to Figures 1 to 4, a mold apparatus 1 according to the present invention can perform a process for cutting a predetermined substrate into a plurality of unit substrates. For example, the mold apparatus 100 can perform a peeling process for cutting - the mother board 1 〇 6 201206274 1 fl I VU_»1 ΓΎ becomes a plurality of unit sheets 12 to manufacture a printed circuit board. Therefore, the panel 10 to be manufactured by the mold apparatus 100, as shown in Fig. 4, may include a plurality of unit sheets 12 as a thin sheet. In the panel 10, a plurality of stripping lines 14 are provided for cutting the panel 10 into a plurality of unit sheets 12 by the mold apparatus 100. The mold apparatus 100 can manufacture the unit sheets 12 from the panel 10 by cutting the stripping lines 14. The mold apparatus 100 can include a housing 110, a support member 120, a cutting member 130, and a drive member 140. On the other hand, in Fig. 1, it is shown that the panel 10 placed on the support member 120 is cut by the cutting member 130 of the lower mold apparatus 100. The outer casing 110 may be of a construction for supporting and assembling the components of the mold apparatus 100. The outer casing 110 can include a bottom configuration 112 for supporting the support member 120 and a top configuration 114 for supporting the cutting member 130. The top configuration 114 can be configured to be on top of one of the bottom configurations 112 to the top configuration 112. Additionally, the top configuration 114 can be provided to move up and down on the bottom configuration 112 of the top configuration 114. The outer casing 110 can further include a guide member 116 for guiding the top structure 114 to move up and down. The guide members 116 can be coupled to the bottom configuration 112 and the top configuration 114, respectively, and the top configuration 114 can be moved vertically up and down along the guide members 116. The support member 120 can be fixedly mounted to the bottom structure 112 of the outer casing 110. The support member 120 may be a support table for supporting and securing the panel 10 during the stripping process. To this end, the support member 120 can include a support surface and a guide plate. The panel is located on the support surface. A guide plate is used to guide the panel 10 to the support surface. Here, the support member 120 can be constructed to 201206274

TW7083PA 水平地移動裝載至支撐表面上之面板1〇0為此,支撐構件 120可具有一能移動面板10之輸送機(未顯示)。因此,輸 送機可將置於支撐構件120之支撐表面之面板1〇可沿著 一方向水平地移動。 切割構件130可已是一種用以切割面板之構造。切割 構件130可被設置於外殼no中,俾能配置於支撐構件12〇 之頂部部分。於此,可提供切割構件13〇以於外殼11〇中 上下移動。舉例而言,外殼110之頂部構造114係沿著導 引構件116上下移動;又,切割構件130可藉由外殼110 之上下移動而與頂部子構造114 一起上下移動。因此,切 割構件130可藉由允許用以在剝離製程期間驅動頂部構造 114之驅動構件14〇,而與外殼11〇之頂部構造丨14 一起 上下移動。 切割構件130可包含複數個核心區塊132及一切割刀 具134。此些核心區塊132可被建構以圍繞切割刀具134。 此些核心區塊132係由具有彼此相異的形狀之區塊所構 成,並可被提供以藉由彼此結合,而形成一對應於在切割 刀具134與外殼110之間的間隙之形狀之形狀。亦即,此 些核心區塊132係由各種形狀之區塊所構成,而一操作員 可結合此些核心區塊132,俾能變成對應於在外殼11{)與 切割刀具134之間之空間之形狀。於此情況下,藉由結合 此些核心區塊132至切割刀具134 ,切割構件130可被使 用作為待安裝於設置於外殼11〇中之切割構件13〇之一安 裝空間上之媒介。 切割刀具134可包含一支樓板134a以及一設置於支 8 201206274 1 w /\j〇jr/\ 撐板134a上之剝離器l34b。支撐板I34a可已是一種設置 於外殼110中而被此些核心區塊132圍繞之構造。剝離器 134b可以是/種用以沿著剝離線14切割面板10之構造。 為此,剝離H 134b可具有一種到末端較銳利之形狀。於 剝離器134b之末端,可設置用以有效切割面板10之複數 個切割鋸齒。 於此,刺離器134b可具有對應於一條剝離線14之形 狀,俾能一次切割對應於母一個單元薄板12之剝離線14。 舉例而言,面板10之單元薄板12具有一近似矩形形狀, 而剝離線14町具有一種圍繞每一個單元薄板12之形狀, 用以分別地切割單元薄板12。因此,一條圍繞每一個單元 薄板12之剝離線14可具有一長方形環狀。在剝離製程期 間,可建構剎離器134b以在一個對應於上述長方形環狀 之個別剝離蟓Η之剝離製程期間製造一個單元薄板12。 上述構造之模具設備1〇〇可依據一種待說明於下之 方法執行剝離製程。 首先,玎準備對應於待被剝離之面板1 〇之切割刀具 =4 °舉例而言,在面板10中,言免置有圍繞每-個單元薄 長方形環狀之個別的剝離線14,刀具⑼ 11,、有對應於個別的剝離線14之形狀。 11〇。H備t切割刀具134可將切割刀具134安裝於外殼 裝於外二:言上設有剝,獅之支撐板1348可被安 枝心區输 於此時,支撐板134&可藉由插入此些 ‘刀二5 32而被安裝於外殼110。尤其,上面安裝有切 σ,、34之外殼11〇之安裝空間可被控制成幾乎大於各 201206274The TW7083PA horizontally moves the panel loaded onto the support surface. To this end, the support member 120 can have a conveyor (not shown) that can move the panel 10. Therefore, the conveyor can move the panel 1A placed on the support surface of the support member 120 horizontally in one direction. The cutting member 130 can already be a configuration for cutting a panel. The cutting member 130 may be disposed in the outer casing no, and the crucible may be disposed at a top portion of the support member 12''. Here, the cutting member 13 is provided to move up and down in the casing 11A. For example, the top configuration 114 of the outer casing 110 is moved up and down along the guide member 116; again, the cutting member 130 can be moved up and down with the top substructure 114 by the upper and lower movement of the outer casing 110. Thus, the cutting member 130 can be moved up and down with the top structure 丨 14 of the outer casing 11 by allowing the drive member 14 用以 to drive the top structure 114 during the stripping process. The cutting member 130 can include a plurality of core blocks 132 and a cutting tool 134. Such core blocks 132 can be constructed to surround the cutting tool 134. The core blocks 132 are formed of blocks having shapes different from each other, and may be provided to be combined with each other to form a shape corresponding to the shape of the gap between the cutting blade 134 and the outer casing 110. . That is, the core blocks 132 are composed of blocks of various shapes, and an operator can combine the core blocks 132 to become corresponding to the space between the outer casing 11{) and the cutting tool 134. The shape. In this case, by combining the core blocks 132 to the cutting tool 134, the cutting member 130 can be used as a medium to be mounted on one of the mounting members of the cutting member 13A provided in the casing 11A. The cutting tool 134 can include a floor 134a and a stripper l34b disposed on the branch 8 201206274 1 w /\j〇jr/\ struts 134a. The support plate I34a may be constructed to be disposed in the outer casing 110 and surrounded by the core blocks 132. The stripper 134b can be of a configuration for cutting the panel 10 along the strip line 14. To this end, the peeling H 134b may have a sharper shape to the end. At the end of the stripper 134b, a plurality of cutting serrations for effectively cutting the panel 10 can be provided. Here, the lancet 134b may have a shape corresponding to one stripping line 14, which can cut the stripping line 14 corresponding to one unit sheet 12 of the mother at a time. For example, the unit sheet 12 of the panel 10 has an approximately rectangular shape, and the peeling line 14 has a shape surrounding each of the unit sheets 12 for cutting the unit sheets 12, respectively. Therefore, a strip line 14 surrounding each of the unit sheets 12 may have a rectangular ring shape. During the stripping process, the brake 134b can be constructed to produce a unit sheet 12 during a stripping process corresponding to the individual strips of the rectangular ring. The above-described mold apparatus 1 can perform the peeling process in accordance with a method to be described below. First, 玎 prepare the cutting tool corresponding to the panel 1 to be peeled off = 4 °. For example, in the panel 10, the individual stripping lines 14 around the thin rectangular ring of each unit are omitted, and the cutter (9) 11, there is a shape corresponding to the individual stripping lines 14. 11〇. The H-reading cutter 134 can be mounted on the outer casing of the cutting tool 134: the strip is provided with stripping, the support plate 1348 of the lion can be transported by the center of the branch, and the support plate 134& can be inserted by this The knife 2 5 32 is mounted to the outer casing 110. In particular, the mounting space on which the outer casing 11 is mounted with the cut σ, 34 can be controlled to be almost larger than each 201206274

TW7083PA 種型式之剝離器,俾能順應剝離器之各種尺寸與形狀。因 此,為了安裝選擇之切割刀具134於外殼11〇上俾能藉由 外殼110之頂部子構造114來上下移動被選擇之切割刀具 134,可提供用以於一在外殼11〇與切割刀具134之間的 空間安裝切割刀具134於外殼上之構造。因此,操作員結 合此些核心區塊132且匹配間隙之形狀,以便使切割刀具 134設置於外殼中而沒有間隙存在於切割刀具134與外殼 110之間。切割刀具134可藉由插入組合之核心區塊132 而被安裝於外殼110。於此時’此些核心區塊132可在它 們並未阻塞切割刀具之上下移動之條件下,將支樓板134a 結合至外殼110。 於此’雖然附圖並未詳細顯示,但是一種連接此些核 心區塊132至外殼11 〇之方法可藉由使用各種耦接法而被 實施。舉例而言,藉由使用強迫插入法、螺栓/螺帽輕接 法、銷輕接法及設有預定的箝制手段之方法,$連接此些 核心區塊132與外殼11〇。 如果上述模具設備100係在對應於待製造之面板1〇 之切割刀具134被組合於外殼110上時被建構,則上述的 剝離製程可被被執行。首先,面板10可被裝載的至支撐 構件120上。被置於支撐構件120上之面板1〇係被支撐 於支撐構件12〇’而驅動構件14〇可藉由移動切割構件130 至向下方向來切割面板10。於此,如上述說明所示,因為 切割刀具134之剝離器134b係被建構成對應於一條剝離 線14 ’所以一個設置於面板10中之單元薄板12可經由切 割刀具134之一個剝離製程而被製造出。 201206274 a vv / voji r\ 藉由經由重複地執行上述剝離製程以切割面板1〇, 可製造出此些單元薄板12。此些被製造出的單元薄板12 可被運送至一位置,於此將執行下述製程。 在將來’如果單元薄板12之形狀改變,則上述構造 之模具設備1〇〇可藉由改變切割刀具134成為應付單元= 板12之剝離製程之新的切割刀具,來執行剝離製程。於 此時,因為新的切割刀具具有不同的構造,所以為了安裝 新的切割刀具於外殼110上,可再結合此些核心區塊13^ 因此,藉由插入再結合之核心區塊132 ,剝離製程可藉由 安裝新的切割刀具於外殼110上而執行。 曰 如上所述,模具設備100包含一外殼11〇、一支撐構 件120、一切割構件13〇及一驅動構件14〇。支撐構件 用以支樓一面板10。切割構件130用以沿著面板1〇之一 剝離線14切割面板10。驅動構件14〇用以驅動切割構件 130 ’其令切割構件13〇可包含—㈣刀具134及複數個 核心區塊132。切割刀具134對應於單元剝離線14,用以 製造面板1G之單元薄板12。此些核心區塊132用以提供 切割刀具134於外殼110中。於此,核心區塊132可改變 其組合,俾能對應至在外殼11G與切割刀具134之間的間 隙之形狀,其依據切割刀具134之構造被改變。因此,雖 然待製造之印刷電路板之模具被改變,但是本發明之模且 設備100可藉由改變切割刀具成為新的切割刀具並結合此 些核心區塊132作為對應於之間隙在改變之新的切割刀具 與外殼110之間之構造’來執行剥離製程,藉以為 式之基板執行剝離製程。 201206274The TW7083PA is a stripper that conforms to the various sizes and shapes of the stripper. Thus, in order to mount the selected cutting tool 134 on the outer casing 11, the selected cutting tool 134 can be moved up and down by the top substructure 114 of the outer casing 110, which can be provided for use in the outer casing 11 and the cutting tool 134. The space between the mounting cutters 134 is mounted on the outer casing. Accordingly, the operator incorporates the core blocks 132 and matches the shape of the gap so that the cutting tool 134 is disposed in the outer casing without gaps between the cutting tool 134 and the outer casing 110. The cutting tool 134 can be mounted to the housing 110 by inserting the combined core block 132. At this point, the core blocks 132 can bond the floor slab 134a to the outer casing 110 under conditions in which they do not block the upper and lower cutting tools. Here, although the drawings are not shown in detail, a method of connecting the core blocks 132 to the casing 11 can be implemented by using various coupling methods. For example, the core block 132 and the outer casing 11 are connected by a forced insertion method, a bolt/nut light connection method, a pin light connection method, and a predetermined clamping method. If the above-described mold apparatus 100 is constructed when the cutting tool 134 corresponding to the panel 1 to be manufactured is assembled on the outer casing 110, the above-described peeling process can be performed. First, the panel 10 can be loaded onto the support member 120. The panel 1 placed on the support member 120 is supported by the support member 12'' and the drive member 14'' can be cut by moving the cutting member 130 to the downward direction. Here, as shown in the above description, since the stripper 134b of the cutting blade 134 is constructed to correspond to one stripping line 14', a unit sheet 12 disposed in the panel 10 can be removed by a peeling process of the cutting blade 134. Made out. 201206274 a vv / voji r\ These unit sheets 12 can be manufactured by repeatedly performing the above-described peeling process to cut the panel 1〇. The manufactured unit sheets 12 can be transported to a position where the following process will be performed. In the future, if the shape of the unit sheet 12 is changed, the above-described mold apparatus 1 can perform the peeling process by changing the cutting tool 134 into a new cutting tool for the peeling process of the unit = board 12. At this time, since the new cutting tool has a different configuration, in order to install a new cutting tool on the outer casing 110, the core blocks 13 can be recombined. Therefore, by inserting the recombined core block 132, the stripping is performed. The process can be performed by installing a new cutting tool on the outer casing 110.曰 As described above, the mold apparatus 100 includes a housing 11〇, a support member 120, a cutting member 13〇, and a driving member 14〇. The support member is used to support a panel 10 . The cutting member 130 is used to cut the panel 10 along one of the stripping lines 14 of the panel 1〇. The drive member 14 is configured to drive the cutting member 130' such that the cutting member 13A can include - (4) a cutter 134 and a plurality of core blocks 132. The cutting tool 134 corresponds to the unit peeling line 14 for manufacturing the unit sheet 12 of the panel 1G. Such core blocks 132 are used to provide cutting tool 134 in housing 110. Here, the core block 132 can change its combination to correspond to the shape of the gap between the outer casing 11G and the cutting tool 134, which is changed depending on the configuration of the cutting tool 134. Therefore, although the mold of the printed circuit board to be manufactured is changed, the mold and apparatus 100 of the present invention can be changed into a new cutting tool by changing the cutting tool and combined with the core blocks 132 as a gap corresponding to the change. The structure between the cutting tool and the outer casing 110 is used to perform the stripping process, whereby the substrate is subjected to a stripping process. 201206274

TW7083PA 又’藉由提供具有對應於個別的剝離線丨4之剝離器 134b之切割刀具134以切割每一個單元薄板12,依據本 發明之模具設備100可被建構以一次製造〆個單元薄板 12。於此情況下,相較於剝離製程係藉由經由銑刀而沿著 剝離線14而執行切割或使用習知之棒式構造之剝離器來 執行之剝離製程之情況而言,可縮短剝離製程時間。因 此’本發明之模具設備100可縮短印刷電路板之製程時間。 綜上所述,雖然本發明已以較佳實施例揭露如上,然 其並非用以限定本發明。本發明所屬技術領域中具有通常 知識者’在不脫離本發明之精神和範圍内,當可作各種之 更動與潤飾。因此’本發明之保護範圍當視後附之申請專 利範圍所界定者為準。 【圖式簡單說明】 第1圖係為顯示依據本發明之一實施例之一模具設 備之剖面圖; 第2圖係為顯示第1圖之一切割構件之構造之平面視 圖, 第3圖係為顯示第2圖之切割構件之一切割刀具之立 體圖;以及 第4圖顯示待被依據本發明之實施例之模具設備製 造之面板。 【主要元件符號說明】 10 :面板/母板 12 201206274 ιττ/ γλ. 12 :單元薄板 14 :剝離線 100 :模具設備 110 :外殼 112 :底部構造 114 :頂部子構造/頂部構造 116 :導引構件 120 :支撐構件 130 :切割構件 132 :核心區塊 134 :切割刀具 134a :支撐板 134b :剝離器 140 :驅動構件 13TW7083PA Further, by providing a cutting blade 134 having a stripper 134b corresponding to an individual stripping wire 4, each of the unit sheets 12 is cut, and the mold apparatus 100 according to the present invention can be constructed to fabricate the unit sheets 12 at a time. In this case, the peeling process time can be shortened as compared with the case where the peeling process is performed by cutting along the peeling line 14 via a milling cutter or a peeling process performed using a conventional bar-type stripper. . Therefore, the mold apparatus 100 of the present invention can shorten the processing time of the printed circuit board. In the above, the present invention has been disclosed in the above preferred embodiments, but it is not intended to limit the present invention. It will be apparent to those skilled in the art that the present invention can be modified and modified without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a mold apparatus according to an embodiment of the present invention; and FIG. 2 is a plan view showing a structure of a cutting member of FIG. 1, FIG. A perspective view of a cutting tool for displaying one of the cutting members of Fig. 2; and Fig. 4 shows a panel to be manufactured by a mold apparatus according to an embodiment of the present invention. [Main component symbol description] 10: panel/motherboard 12 201206274 ιττ/ γλ. 12: unit thin plate 14: peeling line 100: mold apparatus 110: outer casing 112: bottom structure 114: top substructure/top construction 116: guiding member 120: support member 130: cutting member 132: core block 134: cutting blade 134a: support plate 134b: stripper 140: drive member 13

Claims (1)

201206274 TW7083PA 七、申請專利範圍: 1. 一種模具設備,用以執行一剝離製程,用以藉由 切割一面板來製造複數個單元薄板,該模具設備包含: 一外殼; 一支撐構件,用以藉由被設置於該外殼中來支撐並固 定該面板; 一切割構件,用以沿著藉由設置於該外殼之一頂部上 而被置於該支撐構件上之該面板之一剝離線來切割該面 板;以及 一驅動構件,用以驅動該切割構件, 其中該切割構件包含: 一切割刀具,用以切割該剝離線;及 複數個核心區塊,用以安裝該切割刀具於該外殼上, 並用以藉由彼此結合來形成一構造,該構造對應於一在該 外殼與該切割刀具之間的間隙。 2. 如申請專利範圍第1項所述之模具設備,其中該 些核心區塊藉由被連接至該外殼來導引該切割刀具之上 下移動。 3. 如申請專利範圍第1項所述之模具設備,其中該 外殼包含: 一底部構造,用以支撐該支撐構件; 一頂部構造,於該底部構造之一頂部上面對該底部構 造;以及 一導引構件,用以於該底部構造上藉由被連接至該底 部構造與該頂部構造,來分別導引該頂部構造之上下移 201206274 ·* * τ f w άλα 動, 其中該些核心區塊連接該切割刀具至該頂部構造。 4·如申請專利範圍第1項所述之模具設備,其中該 切割構件包含: 一支撐板,藉由插入該些核心區塊而安裝於該外殼 上;以及 一剝離器,凸出地形成於該支撐板之一下表面上俾 能對應至該剝離線。 5.如申請專利範圍第4項所述之模具設備,其中: 該剝離線具有一長方形環狀;且 該剝離器係沿著該支撑板之一周邊形成,以具有 應於該長方形環狀之形狀。 一種用以切割一基板之方法,其中一用以 = : = ί之剝離製程係藉由-外殼、-支樓構件及--二 ==撐構件用以藉由被設置於該外殼之 被设置於該外殼之—頂部上而被置於二者藉由 板之一剝離線,來切判爷面柘#…支按構件之該面 準備㈣丨该方法包含以下步驟·· 準備一切割刀具於—對應於一 造,以製造各該單元薄板; m線之構 結合複數個核心區塊,俾 具與一模具外殼之間的間隙之形狀成對應於一在該切割刀 外殼上 = 及入該些核心區塊來安裝該切割刀具於該模具 藉由驅動該切割刀具上 動而沿著該剝離線來切 15 201206274 TW7083PA 割該面板。 7.如申請專利範圍第6項所述之方法,更包含以下 步驟: 當該些單元薄板之一模具改變時,準備一新的切割刀 具以配合該改變之模具; 再結合該些核心區塊,俾能形成一對應於一在該外殼 與該新的切割刀具之間的間隙之形狀;以及 藉由插入該些再結合的核心區塊來安裝該新的切割 刀具於該外殼上。201206274 TW7083PA VII. Patent Application Range: 1. A mold apparatus for performing a stripping process for manufacturing a plurality of unit sheets by cutting a panel, the mold apparatus comprising: a casing; a supporting member for borrowing Supporting and fixing the panel by being disposed in the outer casing; a cutting member for cutting the strip along a stripping line of the panel placed on the support member by being disposed on a top of the outer casing a driving member for driving the cutting member, wherein the cutting member comprises: a cutting tool for cutting the peeling line; and a plurality of core blocks for mounting the cutting tool on the outer casing, and A configuration is formed by combining with each other, the configuration corresponding to a gap between the outer casing and the cutting tool. 2. The mold apparatus of claim 1, wherein the core blocks guide the cutting tool to move up and down by being coupled to the outer casing. 3. The mold apparatus of claim 1, wherein the outer casing comprises: a bottom structure for supporting the support member; a top structure configured to the bottom portion on top of one of the bottom structures; a guiding member for guiding the top structure to move downwards 201206274 ·* * τ fw άλα, wherein the core blocks are respectively connected to the bottom structure and the top structure The cutting tool is attached to the top configuration. 4. The mold apparatus of claim 1, wherein the cutting member comprises: a support plate mounted on the outer casing by inserting the core blocks; and a stripper formed convexly The lower surface of one of the support plates can correspond to the peeling line. 5. The mold apparatus according to claim 4, wherein: the peeling wire has a rectangular ring shape; and the stripper is formed along a periphery of the support plate to have a rectangular ring shape shape. A method for cutting a substrate, wherein a stripping process for =:= ί is provided by the outer casing, the branch member, and the second== support member by being disposed on the outer casing On the top of the outer casing, the two are separated by a stripping line of the board to cut the surface of the panel. The preparation of the surface is carried out. (4) The method includes the following steps: preparing a cutting tool - corresponding to a manufacturing to manufacture each of the unit sheets; the m-wire structure is combined with a plurality of core blocks, and the gap between the cookware and a mold shell is shaped to correspond to a cutting blade housing The core blocks are used to mount the cutting tool on the mold to cut the panel along the stripping line by driving the cutting tool to move 15 201206274 TW7083PA. 7. The method of claim 6, further comprising the steps of: preparing a new cutting tool to match the changed mold when one of the unit sheets is changed; and combining the core blocks And forming a shape corresponding to a gap between the outer casing and the new cutting tool; and mounting the new cutting tool on the outer casing by inserting the recombined core blocks.
TW99138704A 2010-07-22 2010-11-10 Mold apparatus and method for separating substrate using the same TW201206274A (en)

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TWI618616B (en) * 2012-11-01 2018-03-21 信越化學工業股份有限公司 Rectangular mold-forming substrate

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CN103770156B (en) * 2014-02-13 2015-07-15 遂宁市广天电子有限公司 PCB deboost stamping forming device and method
CN109366614A (en) * 2018-12-21 2019-02-22 隆扬电子(昆山)有限公司 The die cut jig of conductive foam item
CN109366613A (en) * 2018-12-21 2019-02-22 隆扬电子(昆山)有限公司 Conductive foam die cut method

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US2313801A (en) * 1941-12-03 1943-03-16 Kenneth W Carll Cutting die
JPH074795B2 (en) * 1989-08-31 1995-01-25 株式会社精工舎 Punching device
JP2574393Y2 (en) * 1992-09-04 1998-06-11 株式会社ケンウッド Printed circuit board splitter
JPH08141999A (en) * 1994-11-17 1996-06-04 Daisou Kk Punch die
JP2011016218A (en) * 2009-06-09 2011-01-27 Frontier:Kk Cutting apparatus

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Publication number Priority date Publication date Assignee Title
TWI618616B (en) * 2012-11-01 2018-03-21 信越化學工業股份有限公司 Rectangular mold-forming substrate

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