CN102170754B - Method for manufacturing circuit board with superouter fitting - Google Patents
Method for manufacturing circuit board with superouter fitting Download PDFInfo
- Publication number
- CN102170754B CN102170754B CN 201010114988 CN201010114988A CN102170754B CN 102170754 B CN102170754 B CN 102170754B CN 201010114988 CN201010114988 CN 201010114988 CN 201010114988 A CN201010114988 A CN 201010114988A CN 102170754 B CN102170754 B CN 102170754B
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- Prior art keywords
- circuit board
- accessory
- external form
- panel
- motherboard
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Abstract
The invention provides a method for manufacturing a circuit board with a superouter fitting, which comprises the following steps of: providing a mother board of a circuit board and manufacturing and forming a plurality of circuit board units on the mother board of the circuit board; forming a plurality of slots penetrating through the mother board of the circuit board on the mother board of the circuit board, wherein each circuit board unit is adjacent to at least one slot; providing a fitting mother board for forming the superouter fitting and adhering the fitting mother board to at least one part of area of the circuit board units and covering each slot; and simultaneously cutting the mother board of the circuit board and the fitting mother board to obtain a plurality of mutually-separated circuit boards.
Description
Technical field
The present invention relates to circuit board technology, particularly a kind of manufacture method with circuit board of super external form accessory.
Background technology
Along with the develop rapidly of electronic industry, seem more and more important as the manufacturing technology of the circuit board of electronic product basic building block.Circuit board generally by copper-clad base plate through cut, the series of process such as boring, etching, exposure, development, pressing, moulding is made.Specifically can consult the people such as C.H.Steer at Proceedingsof the IEEE, " Dielectric characterization ofprinted circuit board substrates " literary composition that Vol.39, No.2 delivered in (in August, 2002).
At present, when the making of circuit board, be generally a plurality of circuit board units with same structure and function are set type on a larger circuit board panel.After circuit board making is finished, again should a plurality of circuit board units on the circuit board panel cutting and separating, thereby obtain single circuit board unit.And, in order to satisfy the specific structure of circuit board and assembling requirement, follow-up also can be at this single circuit board unit various accessories of fitting.For example, at a certain regional applying gum of single circuit board unit so that circuit board group is filled in the electronic product; Perhaps a certain regional applying reinforced sheet of single circuit board unit with reinforcement should the zone intensity; Perhaps at a certain regional applying steel disc of single circuit board unit to shield this regional electromagnetic interference.For ease of circuit board unit follow-up assembling and positioning requirements, the accessories such as this gum, reinforced sheet or steel disc have the outstanding structure on the border that exceeds single circuit board unit, and such accessory is referred to as super external form accessory.Such super external form accessory is fitted with single circuit board unit behind excision forming usually more one by one, thereby so that the applying speed of accessory is slower, the production efficiency of circuit board with super external form accessory is lower.
Therefore, be necessary to provide a kind of applying speed of accelerating super external form accessory, promote the manufacture method of circuit board of the production efficiency of the circuit board with super external form accessory.
Summary of the invention
The below will illustrate a kind of manufacture method with circuit board of super external form accessory with specific embodiment.
A kind of manufacture method with circuit board of super external form accessory, it may further comprise the steps:
Circuit board panel is provided, and makes a plurality of circuit board units of formation in this circuit board panel;
Form a plurality of groovings hole of running through this circuit board panel in circuit board panel, wherein, each circuit board unit and at least one grooving hole are adjacent;
Be provided for forming the accessory motherboard of super external form accessory, and this accessory motherboard is conformed at least a portion zone of these a plurality of circuit board units and covers in each grooving hole;
This circuit board panel and this accessory motherboard are cut simultaneously, to obtain a plurality of circuit boards that are separated from each other, wherein, each circuit board has a circuit board unit and is fitted in and one surpasses the external form accessory on this circuit board unit, and this super external form accessory has the outstanding structure on the border that exceeds this circuit board unit.
With respect to prior art, the manufacture method of the circuit board with super external form accessory of the technical program, it is by forming the grooving hole adjacent with circuit board unit in circuit board panel, with the whole at least a portion zone that is fitted in a plurality of circuit board units of accessory motherboard, and in subsequent process, this circuit board panel and this accessory motherboard are cut simultaneously, thereby obtain a plurality of circuit boards that are separated from each other, since this manufacture method need not with circuit board unit and super external form accessory respectively cutting and separating fit one by one again, thereby accelerated the applying speed of super external form accessory, greatly promoted the production efficiency of the circuit board with super external form accessory.
Description of drawings
Fig. 1 is the manufacture method flow chart of the circuit board with super external form accessory that provides of the technical program embodiment.
Fig. 2 is the circuit board panel that adopts of the method for Fig. 1 and the structural representation that is formed at a plurality of circuit board units on the circuit board panel.
Fig. 3 is that Fig. 2 is along the cutaway view of III-III direction.
Fig. 4 is formed with grooving pore structure schematic diagram in circuit board panel in the method for Fig. 1.
Fig. 5 is the structural representation that in the method for Fig. 1 the accessory motherboard is conformed to the subregion of a plurality of circuit board units.
Fig. 6 is the schematic diagram that cutting forms circuit board in the method for Fig. 1.
The main element symbol description
Grooving hole 14
Super external form accessory 32
Embodiment
Be described in further detail below in conjunction with the manufacture method of drawings and Examples to the circuit board of the super external form accessory of having of the technical program.
See also Fig. 1, the technical program embodiment provides a kind of manufacture method with circuit board of super external form accessory, and it may further comprise the steps:
See also Fig. 2-3, circuit board panel 10 has relative first surface 101 and second surface 102.Particularly, can make a plurality of circuit board units 20 of formation in this circuit board panel 10 by series of process flow processs such as boring, etching, exposure, development, pressing, moulding.Each circuit board unit 20 has relative first surface 201 and second 202.In the present embodiment, the first surface 201 of this circuit board unit 20 is coplanar with the first surface 101 of circuit board panel 10, and second 202 second surface 102 with circuit board panel 10 of this circuit board unit 20 is coplanar.These a plurality of circuit board units 20 successively parallel arrangement on this circuit board panel 10.Certainly, these a plurality of circuit board units 20 also can be matrix form and are arranged on this circuit board panel 10.In addition, the first surface 201 of this circuit board unit 20 can protrude the first surface 101 of this circuit board panel 10; Second 202 second surface 102 that also can protrude this circuit board panel 10 of this circuit board unit 20.
See also Fig. 4, in the present embodiment, at a plurality of predeterminable areas 12 of these circuit board panel 10 definition.Each predeterminable area 12 respectively with an end adjacency of a circuit board unit 20.Utilize the methods such as punching or laser cutting to form a grooving hole 14 running through this circuit board panel 10 at each predeterminable area 12.The first surface 101 and second surface 102 of this circuit board panel 10 run through in this grooving hole 14.At this, each circuit board unit 20 and a grooving hole 14 are adjacent, and an end of this grooving hole 14 circuit board unit 20 corresponding with this is adjacent.Certainly, according to the difference of designing requirement, the optional position of the circuit board unit 20 that this each grooving hole 14 also can be corresponding with this is adjacent, and for example this each grooving hole 14 can be adjacent with the centre position of a corresponding circuit board unit 20.
In addition, each circuit board unit 20 also can be adjacent with two or more groovings hole 14.For example, when each circuit board unit 20 and two grooving holes 14 were adjacent, these two the grooving holes 14 respectively two ends of a circuit board unit 20 corresponding with this were adjacent; Perhaps grooving hole 14 is adjacent with an end of a corresponding circuit board unit 20, and another grooving hole 14 is adjacent with the centre position of a corresponding circuit board unit 20.
See also Fig. 5-6, be provided for forming the accessory motherboard 30 of super external form accessory 32.This accessory motherboard 30 is conformed at least a portion zone of these a plurality of circuit board units 20.This accessory motherboard 30 covers in each grooving hole 14.Particularly, this accessory motherboard 30 fits with the first surface 201 of these a plurality of circuit board units 20.Certainly, according to location and the assembling demand of reality, the accessory motherboard 30 of also can also fitting second 202 of these a plurality of circuit board units 20.
In different application scenarios, this accessory motherboard 30 can be different materials.For example, this accessory motherboard 30 can be for circuit board unit 20 is pasted the gum that is assembled to electronic product; It perhaps is the reinforced sheet that is used for a certain specific region intensity of reinforcement circuit board unit 20; Perhaps be steel plate or other electromagnetic shielding metallic plate of avoiding being subject to outside electromagnetic interference that is used for a certain specific region of screened circuit plate unit 20; Perhaps be the electromagnetic wave that is used for the specific wavelength that absorbing circuit plate unit 20 produces in the course of the work and the suction waveguide hot glue with heat conduction function, etc.
See also Fig. 6, utilize the cutter sweeps such as punching mould or laser cutting machine, this circuit board panel 10 is cut simultaneously with this accessory motherboard 30, to obtain a plurality of circuit boards that are separated from each other 100.Wherein, each circuit board 100 comprises a circuit board unit 20 and is fitted in and one surpasses external form accessory 32 on this circuit board unit 20.Should have the outstanding structure 324 on the border that exceeds this circuit board unit 20 by super external form accessory 32.
When circuit board panel 10 and accessory motherboard 30 are cut simultaneously, make each the outstanding structure 324 that need to cut be positioned at the inside of the corresponding orthographic projection of grooving hole 14 on circuit board panel 10 in the orthographic projection on the circuit board panel 10, so that cut the outstanding structure 324 adhesion circuit board panel 10 that obtain.That is, each outstanding structure 324 area of section of being parallel to the first surface 101 of circuit board panel 10 is parallel to the area of section of the first surface 101 of circuit board panel 10 less than a grooving hole 14 of correspondence.
Particularly, when utilizing the punching mould (not shown) to cut, projection corresponding to grooving hole 14 can be set in the lower bolster (not shown) of punching mould, do not need this moment circuit board panel 10 upsets, the cope match-plate pattern (not shown) of accessory motherboard 30 with punching mould fitted, utilize the breasting of the projection of this bed die to form the above-mentioned outstanding structure 324 that needs cutting to cut off.In addition, also circuit board panel 10 can be turned over turnback, the lower bolster of punching mould need not to arrange the projection corresponding to grooving hole 14 at this moment, accessory motherboard 30 fits with the lower bolster (not shown) of punching mould, just can effectively cut off when the cope match-plate pattern (not shown) is punched down to form the above-mentioned outstanding structure 324 that needs cutting.Certainly, when using laser cutting machine to cut, this circuit board panel 10 is overturn and is not overturn and all can.
The super external form accessory 32 that forms after the cutting comprises body 322 and these body 322 outstanding outstanding structures 324 that form certainly.Being somebody's turn to do the body 322 of super external form accessory 32 and the first surface 201 of circuit board unit 20 fits.Should give prominence to structure 324 outer outstanding to circuit board unit 20 from this body 322.Should outstanding structure 324 can be used for the location, perhaps in assembling process, conveniently tear the diaphragm on super external form accessory 32 top layers to paste circuit board 100 and electronic product fixing.
The cross sectional shape that should give prominence to structure 324 can require to set according to concrete location and assembling.In the present embodiment, the cross sectional shape of this outstanding structure 324 is apart from shape.Certainly, the cross sectional shape of this outstanding structure 324 can also be square, triangle, semicircle, half elliptic etc.Usually, to be parallel to the cross sectional shape of first surface 101 of circuit board panel 10 identical with cross sectional shape that should outstanding structure 324 in this grooving hole 14.At this, the cross sectional shape that this grooving hole 14 is parallel to the first surface 101 of circuit board panel 10 also is apart from shape.
Be understandable that, according to the actual operation requirements of circuit board 100, the body 322 of this super external form accessory 32 also can cover in the whole first surface 201 of its corresponding circuit board unit 20.
With respect to prior art, the manufacture method of the circuit board with super external form accessory of the technical program, it is by forming the grooving hole adjacent with circuit board unit in circuit board panel, with the whole at least a portion zone that is fitted in a plurality of circuit board units of accessory motherboard, and in subsequent process, this circuit board panel and this accessory motherboard are cut simultaneously, thereby obtain a plurality of circuit boards that are separated from each other, since this manufacture method need not with circuit board unit and super external form accessory respectively cutting and separating fit one by one again, thereby accelerated the applying speed of super external form accessory, greatly promoted the production efficiency of the circuit board with super external form accessory.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion according to the technical conceive of the technical program, and all these change the protection range that all should belong to the technical program claim with distortion.
Claims (9)
1. manufacture method with circuit board of super external form accessory, it may further comprise the steps:
Circuit board panel is provided, and makes a plurality of circuit board units of formation in this circuit board panel;
Form a plurality of groovings hole of running through this circuit board panel in circuit board panel, wherein, each circuit board unit and at least one grooving hole are adjacent;
Be provided for forming the accessory motherboard of super external form accessory, and this accessory motherboard is conformed at least a portion zone of these a plurality of circuit board units and covers in each grooving hole;
This circuit board panel and this accessory motherboard are cut simultaneously, to obtain a plurality of circuit boards that are separated from each other, wherein, each circuit board has a circuit board unit and is fitted in and one surpasses the external form accessory on this circuit board unit, should have the outstanding structure on the border that exceeds this circuit board unit by super external form accessory, when this circuit board panel and this accessory motherboard are cut simultaneously, make each the outstanding structure that need to cut be positioned at the inside of the corresponding orthographic projection of grooving hole on circuit board panel in the orthographic projection on the circuit board panel, so that cut the outstanding structure adhesion circuit board panel that obtains.
2. the manufacture method with circuit board of super external form accessory as claimed in claim 1, it is characterized in that, this circuit board panel has relative first surface and second surface, each circuit board unit has relative first surface and second, the first surface of this circuit board unit and the first surface of circuit board panel are coplanar, and second second surface with circuit board panel of this circuit board unit is coplanar.
3. the manufacture method with circuit board of super external form accessory as claimed in claim 1, it is characterized in that, each circuit board unit has relative first surface and second, should super external form accessory comprise body and certainly this body outstanding form should give prominence to structure, the body of this super external form accessory and the first surface of circuit board unit fit.
4. the manufacture method with circuit board of super external form accessory as claimed in claim 1, it is characterized in that, when circuit board panel formation runs through a plurality of groovings hole of this circuit board panel, first at a plurality of predeterminable areas of this circuit board panel definition, wherein each predeterminable area respectively with an end adjacency of a circuit board unit; Recycling punching or laser cutting method form a grooving hole running through this circuit board panel at each predeterminable area.
5. the manufacture method with circuit board of super external form accessory as claimed in claim 1, it is characterized in that, when this circuit board panel and this accessory motherboard are cut simultaneously, utilize punching mould or laser cutting machine corresponding to each circuit board unit this circuit board panel and this accessory motherboard to be cut simultaneously.
6. the manufacture method with circuit board of super external form accessory as claimed in claim 5, it is characterized in that, when utilizing punching mould to cut, in the lower bolster setting of the punching mould projection corresponding to the grooving hole, the cope match-plate pattern of accessory motherboard and punching mould is fitted, utilize the breasting of the projection of this bed die should give prominence to structure to cut off to form.
7. the manufacture method with circuit board of super external form accessory as claimed in claim 5, it is characterized in that, when utilizing punching mould to cut, the lower bolster of accessory motherboard and punching mould is fitted, utilizing cope match-plate pattern to be punched down to cut off formation should outstanding structure.
8. the manufacture method with circuit board of super external form accessory as claimed in claim 1, it is characterized in that, this circuit board panel has relative first surface and second surface, and the cross sectional shape of first surface that this grooving hole is parallel to circuit board panel is identical with cross sectional shape that should outstanding structure.
9. the manufacture method with circuit board of super external form accessory as claimed in claim 1 is characterized in that, this accessory motherboard is gum, reinforced sheet, suction waveguide hot glue or electromagnetic shielding metallic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010114988 CN102170754B (en) | 2010-02-26 | 2010-02-26 | Method for manufacturing circuit board with superouter fitting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010114988 CN102170754B (en) | 2010-02-26 | 2010-02-26 | Method for manufacturing circuit board with superouter fitting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102170754A CN102170754A (en) | 2011-08-31 |
| CN102170754B true CN102170754B (en) | 2013-03-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010114988 Expired - Fee Related CN102170754B (en) | 2010-02-26 | 2010-02-26 | Method for manufacturing circuit board with superouter fitting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102170754B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103167745B (en) * | 2011-12-09 | 2015-09-30 | 富葵精密组件(深圳)有限公司 | The manufacture method of connecting sheet circuit board and connecting sheet circuit board |
| CN109635467B (en) * | 2018-12-18 | 2020-12-04 | 深圳市华星光电半导体显示技术有限公司 | Method for acquiring cutting rate of printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1413074A (en) * | 2001-10-16 | 2003-04-23 | 旭贸股份有限公司 | Method for recovering printed circuit board by utilizing stepped adhesion structure |
| CN2824504Y (en) * | 2005-07-15 | 2006-10-04 | 田弘 | Chip circuitboard connected with main circuitboard by plugging part |
| CN1993016A (en) * | 2005-12-26 | 2007-07-04 | 宏达国际电子股份有限公司 | Composition board aligning structure and method thereof |
-
2010
- 2010-02-26 CN CN 201010114988 patent/CN102170754B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1413074A (en) * | 2001-10-16 | 2003-04-23 | 旭贸股份有限公司 | Method for recovering printed circuit board by utilizing stepped adhesion structure |
| CN2824504Y (en) * | 2005-07-15 | 2006-10-04 | 田弘 | Chip circuitboard connected with main circuitboard by plugging part |
| CN1993016A (en) * | 2005-12-26 | 2007-07-04 | 宏达国际电子股份有限公司 | Composition board aligning structure and method thereof |
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| Publication number | Publication date |
|---|---|
| CN102170754A (en) | 2011-08-31 |
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| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent for invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
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Granted publication date: 20130306 Termination date: 20150226 |
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| EXPY | Termination of patent right or utility model |