CN103770156B - PCB deboost stamping forming device and method - Google Patents
PCB deboost stamping forming device and method Download PDFInfo
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- CN103770156B CN103770156B CN201410050064.2A CN201410050064A CN103770156B CN 103770156 B CN103770156 B CN 103770156B CN 201410050064 A CN201410050064 A CN 201410050064A CN 103770156 B CN103770156 B CN 103770156B
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000013461 design Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000003754 machining Methods 0.000 abstract description 4
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 206010017076 Fracture Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
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Abstract
The invention discloses a PCB deboost stamping forming device and method. The device comprises an upper mold and a lower mold with an elastic mechanism. The method comprises the following steps: a set of PCB deboost stamping forming device is designed according to demands, through the closing of the upper mold and the lower mold of the PCB deboost stamping forming device, a small PCS adopting an inner groove structure of each single-function plate in connected PCBs is stamped to the hollow position of the PCB deboost stamping forming device, the elastic mechanism below the hollow position acts, the small PCS adopting the inner groove structure of each single-function plate stamped through a metal base plate is jacked back to a corresponding empty position of the corresponding connected PCB, and is fixed in the empty position, so as to accomplish connecting forming of the PCB. Compared with the conventional PCB forming procedure, the method has the advantages that a V-CUT procedure is eliminated, the production efficiency of the PCB is improved, the machining cost is lowered, and the machining quality of the PCB is improved, and high practicability is achieved.
Description
Technical field
The present invention relates to pcb board process technology, particularly relate to a kind of pcb board and return power stamping shaped device and method.
Background technology
Along with the development of advanced information society, in information industry, PCB is an indispensable mainstay.The electronic equipment that almost we can see all be unable to do without it, little of electronic watch, calculator, general-purpose computer, large to computer, communication electronic device, Aeronautics and Astronautics, military issue weapons system etc., as long as there are the electronic devices and components such as integrated circuit, between them, electric interconnection all will use PCB.The mechanical support that PCB provides the various electronic devices and components such as integrated circuit to fix assembling, realize wiring and electrical connection or electric insulation between the various electronic devices and components such as integrated circuit, required electrical characteristic is provided.
The shaping object of pcb board is to allow plank meet specification required by client, otiose for periphery frame must be removed, if this plate is shipment in flakes, a procedure need be carried out again toward contact, namely also need be V-CUT in relevant position, with facilitate client before assembling or after, easily connecting piece PCB plate can be broken into PCS, i.e. monolithic feature board, and final utilization.
In traditional PCB industry, what molding procedure used is generally hydraulic pressure or mechanical press, and mould is public backform.This kind of shaping production model for the larger-size plank of PCS still than better suited, but the plate that PCS size is relatively little is then seemed and does not so adapt to, first Design of Dies difficulty increases, it is secondary fractures into little PCS to use, V-CUT cutter number must be increased, seriously constrain production efficiency, exacerbate the unnecessary consumption of V-CUT cutter, and improve production cost.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, there is provided a kind of and effectively can improve pcb board production efficiency, reduce cost of human resources, reduce machining tool cost, effectively can improve the pcb board of pcb board crudy and return power stamping shaped device and method, it is relative to traditional pcb board molding procedure, eliminate V-CUT operation, no matter for the larger-size plank of PCS or the less plank of PCS size, all applicable, practical.
The object of the invention is to be achieved through the following technical solutions: pcb board returns power stamping shaped device, it comprises top mould and below mould, top mould comprises lastics plate, core rod and core rod gusset plate, lastics plate, core rod and core rod gusset plate are fixed as a whole, below mould is the die of band hollow out, be provided with elastic mechanism below the hollow out of below mould, elastic mechanism be placed with metallic gasket, fix with base plate below elastic mechanism.
Concrete, the face that top mould is corresponding with below mould is provided with projection.
Concrete, elastic mechanism comprises elastic force offset plate and spring assembly.
Concrete, below mould upper surface is provided with the locating dowel corresponding with top mould lower surface lead to the hole site.
Pcb board returns power stamping forming method, and it comprises the steps:
S1: design a set of pcb board as required and return power stamping shaped device;
S2: utilize the pcb board made to return power stamping shaped device, carry out stamping process to pcb board shape, its processing procedure comprises following sub-step:
S21: return the closed of mould and below mould above power stamping shaped device by pcb board, by the little PCS of inner trough structure of single feature board each in connecting piece PCB plate, be flushed to the hollow out position that pcb board returns power stamping shaped device;
S22: the little PCS of inner trough structure of the single feature board be rushed out is pushed up go back to the corresponding room of connecting piece PCB plate by the elastic mechanism below hollow out position by metallic gasket, and is fixed on this empty place;
S3: complete pcb board shaping in flakes.
Design as required described in step S1 and a set ofly return power stamping shaped device with pcb board, it also includes following sub-step:
S11: the top mould and the below mould that make mould;
S12: below mould is needing the position being washed into little PCS, according to the shape size hollow out of PCS;
S13: at below mould hollow part mounting spring or the reasonable elastic plate glue of elasticity, spring or elastic plate glue is placed one piece of metallic gasket large with hollow part etc.;
S14: complete.
The invention has the beneficial effects as follows:
(1) design a kind of new shaped device, elastic returning is good, and top mould and below mould are respectively equipped with corresponding through hole and cylinder, mould and below mould between do not produce translation, good forming effect above ensureing when pressing;
(2) directly stamping process is done to connecting piece PCB plate, after stamping process, without the need to remaking V-CUT, on traditional moulding process, eliminating V-CUT operation, substantially increasing production efficiency;
(3) without the need to carrying out V-CUT operation again, the corresponding cost of human resources of V-CUT operation is saved, and in addition, without the need to using V-CUT blade, has saved machining tool cost;
(4) eliminate V-CUT operation, avoid the series of problems that V-CUT operation is brought, as inclined in V, residual thick difference etc., effectively ensure that the processing quality of pcb board;
(5) no matter eliminate V-CUT operation, be for the larger-size plank of PCS or the less plank of PCS size, all applicable, practical.
Accompanying drawing explanation
Fig. 1 is the structural representation that the present invention returns power stamping shaped device;
Fig. 2 is forming method flow chart of the present invention;
In figure, 1-base plate, mould below 2-, 3-elastic mechanism, 4-core rod girth member, 5-lastics plate, 6-core rod.
Detailed description of the invention
Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail, but protection scope of the present invention is not limited to the following stated.
As shown in Figure 1, pcb board returns power stamping shaped device, it comprises top mould and below mould 2, top mould comprises lastics plate 5, core rod 6 and core rod gusset plate 4, lastics plate 5, core rod 6 and core rod gusset plate 4 are fixed as a whole, and below mould 2 is the die of band hollow out, is provided with elastic mechanism 3 below the hollow out of below mould 2, elastic mechanism 3 is placed with metallic gasket, fixes with base plate 1 below elastic mechanism 3.
Concrete, the face that top mould is corresponding with below mould 2 is provided with projection.
Concrete, elastic mechanism 3 comprises elastic force offset plate and spring assembly, and spring assembly and elastic force offset plate return to rapidly former horizontal level after ensureing that metallic gasket is subject to punching press energetically.
Concrete, below mould 2 upper surface is provided with the locating dowel corresponding with top mould lower surface lead to the hole site, mould and below mould between does not produce translation, good forming effect above ensureing when pressing.
As shown in Figure 2, pcb board returns power stamping forming method, and it comprises the steps:
S1: design a set of pcb board as required and return power stamping shaped device;
S2: utilize the pcb board made to return power stamping shaped device, carry out stamping process to pcb board shape, its processing procedure comprises following sub-step:
S21: return the closed of mould and below mould above power stamping shaped device by pcb board, by the little PCS of inner trough structure of single feature board each in connecting piece PCB plate, be flushed to the hollow out position that pcb board returns power stamping shaped device;
S22: the little PCS of inner trough structure of the single feature board be rushed out is pushed up go back to the corresponding room of connecting piece PCB plate by the elastic mechanism below hollow out position by metallic gasket, and is fixed on this empty place;
S3: complete pcb board shaping in flakes.
Design as required described in step S1 and a set ofly return power stamping shaped device with pcb board, it also includes following sub-step:
S11: the top mould and the below mould that make mould;
S12: below mould is needing the position being washed into little PCS, according to the shape size hollow out of PCS;
S13: at below mould hollow part mounting spring or the reasonable elastic plate glue of elasticity, spring or elastic plate glue is placed one piece of metallic gasket large with hollow part etc.;
S14: complete.
Claims (6)
1.PCB plate returns power stamping shaped device, it is characterized in that: it comprises top mould and below mould (2), top mould comprises lastics plate (5), core rod (6) and core rod gusset plate (4), lastics plate (5), core rod (6) and core rod gusset plate (4) are fixing as a whole, below mould (2) is the die of band hollow out, the below of below mould (2) hollow out is provided with elastic mechanism (3), and (3) are placed with metallic gasket to elastic mechanism, and elastic mechanism (3) below is fixed with base plate (1).
2. pcb board according to claim 1 returns power stamping shaped device, it is characterized in that: the face that described top mould is corresponding with below mould (2) is provided with projection.
3. pcb board according to claim 1 returns power stamping shaped device, it is characterized in that: described elastic mechanism (3) comprises elastic force offset plate and spring assembly.
4. pcb board according to claim 1 returns power stamping shaped device, it is characterized in that: described below mould (2) upper surface is provided with the locating dowel corresponding with top mould lower surface lead to the hole site.
5.PCB plate returns power stamping forming method, it is characterized in that: it comprises the steps:
S1: design a set of pcb board as required and return power stamping shaped device;
S2: utilize the pcb board made to return power stamping shaped device, carry out stamping process to pcb board shape, its processing procedure comprises following sub-step:
S21: return the closed of mould and below mould (2) above power stamping shaped device by pcb board, by the little PCS of inner trough structure of single feature board each in connecting piece PCB plate, be flushed to the hollow out position that pcb board returns power stamping shaped device;
S22: the little PCS of inner trough structure of the single feature board be rushed out is pushed up go back to the corresponding room of connecting piece PCB plate by the elastic mechanism (3) below hollow out position by metallic gasket, and is fixed on this empty place;
S3: complete pcb board shaping in flakes.
6. pcb board according to claim 5 returns power stamping forming method, it is characterized in that: design as required described in step S1 and a set ofly return power stamping shaped device with pcb board, it also includes following sub-step:
S11: the top mould and the below mould (2) that make mould;
S12: below mould (2) is needing the position being washed into little PCS, according to the shape size hollow out of PCS;
S13: at below mould (2) hollow part mounting spring or the reasonable elastic plate glue of elasticity, spring or elastic plate glue is placed one piece of metallic gasket large with hollow part etc.;
S14: complete.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410050064.2A CN103770156B (en) | 2014-02-13 | 2014-02-13 | PCB deboost stamping forming device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410050064.2A CN103770156B (en) | 2014-02-13 | 2014-02-13 | PCB deboost stamping forming device and method |
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| CN103770156A CN103770156A (en) | 2014-05-07 |
| CN103770156B true CN103770156B (en) | 2015-07-15 |
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| CN201410050064.2A Active CN103770156B (en) | 2014-02-13 | 2014-02-13 | PCB deboost stamping forming device and method |
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| CN106851995A (en) * | 2017-04-10 | 2017-06-13 | 昆山苏杭电路板有限公司 | The high-accuracy multi-joint removable processing method for filling unit printed board |
| CN109392247A (en) * | 2018-10-16 | 2019-02-26 | 江苏迪飞达电子有限公司 | A kind of manufacture craft of curved surface aluminum substrate |
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| CN203680427U (en) * | 2014-02-13 | 2014-07-02 | 遂宁市广天电子有限公司 | Reverse stamping and forming device for PCB |
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| JP4189104B2 (en) * | 1999-11-02 | 2008-12-03 | 日立ビアメカニクス株式会社 | Processing method and processing apparatus using pressure foot |
| JP4367828B2 (en) * | 2002-12-18 | 2009-11-18 | 日立ビアメカニクス株式会社 | Drilling machine |
| JP2011079083A (en) * | 2009-10-06 | 2011-04-21 | Sharp Corp | Machining device, manufacturing device, and sheet processing method |
| KR20120009116A (en) * | 2010-07-22 | 2012-02-01 | 삼성전기주식회사 | mold apparatus and method for separating substrate using the same |
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| CN203680427U (en) * | 2014-02-13 | 2014-07-02 | 遂宁市广天电子有限公司 | Reverse stamping and forming device for PCB |
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Denomination of invention: PCB deboost stamping forming device and method Effective date of registration: 20190313 Granted publication date: 20150715 Pledgee: Suining rural commercial bank Limited by Share Ltd Pledgor: Wesky (Suining) Electronics Co., Ltd. Registration number: 2019510000026 |
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Denomination of invention: Device and method for stamping PCB with return die Effective date of registration: 20201217 Granted publication date: 20150715 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2020510000113 |
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Date of cancellation: 20211124 Granted publication date: 20150715 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2020510000113 |
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Denomination of invention: PCB board return force die forming device and method Effective date of registration: 20211129 Granted publication date: 20150715 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2021980013515 |
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Date of cancellation: 20220329 Granted publication date: 20150715 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2021980013515 |
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Denomination of invention: PCB board return force die punching forming device and method Effective date of registration: 20220331 Granted publication date: 20150715 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2022980003697 |