CN220591251U - Stamping die of bending type semiconductor connecting sheet - Google Patents
Stamping die of bending type semiconductor connecting sheet Download PDFInfo
- Publication number
- CN220591251U CN220591251U CN202322150907.3U CN202322150907U CN220591251U CN 220591251 U CN220591251 U CN 220591251U CN 202322150907 U CN202322150907 U CN 202322150907U CN 220591251 U CN220591251 U CN 220591251U
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- stamping die
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- cylinder
- mould
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 238000005452 bending Methods 0.000 title claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000013016 damping Methods 0.000 claims description 15
- 238000009434 installation Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 238000004080 punching Methods 0.000 abstract description 4
- 230000008859 change Effects 0.000 abstract description 3
- 210000001503 joint Anatomy 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000007493 shaping process Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model discloses a stamping die for a bent semiconductor connecting sheet, which comprises a base, wherein the upper end of the base is provided with a bottom die, the outer wall surface of the bottom die is provided with a model groove, and both sides of the model groove are provided with positioning grooves; this stamping die of bending type semiconductor connection piece, through the setting of material board, the locating pin, branch, the roof, the cylinder, the mounting piece, fixing bolt and last mould, the cooperation is used between material board and the die block, when stamping die work's in-process, drive the material board through the cylinder and go up the mould and punch a hole, the model groove of seting up on the die block of material board bottom just can assist the mould to play auxiliary shaping's effect to the shape of the required connection piece when material board punching press, and fixing bolt and mounting piece's setting can be with go up the butt joint installation between mould and the cylinder, also can change the mould, thereby change into the mould of going up of different shapes, be used for punching press the connection piece of different shapes.
Description
Technical Field
The utility model relates to the technical field related to semiconductor connecting sheets, in particular to a stamping die for a bent semiconductor connecting sheet.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting the semiconductor, the importance of the semiconductor is very huge from the viewpoint of technology or economic development, and most of electronic products such as a core unit in a computer, a mobile phone or a digital recorder are very closely related with the semiconductor, so that a connecting sheet is needed to be used when the semiconductor is connected, the connecting sheet is a part of a splicing installation type, and therefore, a stamping die is needed to be used in the process of processing the connecting sheet, and the stamping die is a special process equipment for processing a metal or nonmetal material into a part or a semi-finished product, namely, a cold stamping die, and the stamping is a pressure processing method for separating or plastically deforming the material by using a die arranged on a press at room temperature.
In the Chinese patent publication No. 215845228U, a stamping die for processing connecting sheets comprises an upper die seat, a lower die seat, an upper die and a lower die, wherein an installation groove is arranged below the upper die seat, the upper die is arranged in the installation groove, the lower surface of the upper die is fixedly connected with a stamping head, and the upper surface of the lower die seat is provided with a fixed groove.
Disclosure of Invention
The utility model aims to provide a stamping die for a bent semiconductor connecting sheet, which is used for solving the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a stamping die of bent semiconductor connection piece, includes the base, the upper end of base is provided with the die block, the model groove has been seted up to the outer wall surface of die block, the both sides of model groove all are provided with the constant head tank, the upper end of constant head tank is provided with the material board, the inner wall swing joint of constant head tank has the locating pin, the upper end of die block all is connected with branch, the other end of branch is provided with the roof, the upper end of roof is provided with the cylinder, the one end fixed mounting of cylinder has the mounting piece, one side of mounting piece runs through there is fixing bolt, fixing bolt's one end is connected with the mould.
Preferably, both sides of the base are fixed with fixing pieces, and one side of each fixing piece is penetrated by a screw rod.
Preferably, the base and the fixing piece are arranged in an integrated structure, and the fixing piece is movably connected with the screw rod.
Preferably, the upper end of base is installed the bottom plate, the upper end of bottom plate all is provided with the damping reset rod.
Preferably, the bottom die is provided with a damping structure through a damping reset rod and a base, and the damping reset rods are distributed on the bottom die at equal intervals.
Preferably, positioning grooves are formed in two sides of the model groove, positioning pins are movably connected with the inner walls of the positioning grooves to form a positioning structure, and the positioning grooves and the positioning pins are matched for use.
Preferably, the upper die is in threaded connection with the cylinder through a fixing bolt and a mounting plate, and the fixing bolt is symmetrically arranged with the central axis of the mounting plate.
Compared with the prior art, the utility model has the beneficial effects that:
1. this stamping die of bending type semiconductor connection piece, through the setting of material board, the locating pin, branch, the roof, the cylinder, the mounting piece, fixing bolt and last mould, the cooperation is used between material board and the die block, in the in-process of stamping die work, when the mould is gone up in the drive of stamping die, the model groove of seting up on the die block of material board bottom just can assist the mould to play auxiliary shaping's effect to the shape of required connection piece when the material board punching press, and the setting of fixing bolt and mounting piece can be with going up the butt joint installation between mould and the cylinder, also can change the last mould to the last mould of different shapes is changed, be used for punching press the connection piece of different shapes.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of the connection between the upper die and the cylinder;
FIG. 3 is a schematic view of the positioning of a sheet of material according to the present utility model;
FIG. 4 is a schematic view of a shock absorbing mechanism according to the present utility model;
fig. 5 is an enlarged view of the structure of fig. 2 a in accordance with the present utility model.
In the figure: 1. a base; 2. a fixing piece; 3. a screw; 4. a bottom plate; 5. damping reset lever; 6. a bottom die; 7. a model groove; 8. a positioning groove; 9. a sheet of material; 10. a positioning pin; 11. a support rod; 12. a top plate; 13. a cylinder; 14. a mounting piece; 15. a fixing bolt; 16. and (5) upper die.
Description of the embodiments
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the present utility model provides the following technical solutions: the utility model provides a stamping die of bending type semiconductor connection piece, the on-line screen storage device comprises a base 1, the upper end of base 1 is provided with die block 6, die block 7 has been seted up to the outer wall surface of die block 6, the both sides of die block 7 all are provided with constant head tank 8, the upper end of constant head tank 8 is provided with material board 9, the inner wall swing joint of constant head tank 8 has locating pin 10, the upper end of die block 6 all is connected with branch 11, the other end of branch 11 is provided with roof 12, the upper end of roof 12 is provided with cylinder 13, the one end fixed mounting of cylinder 13 has mounting piece 14, one side of mounting piece 14 runs through there is fixing bolt 15, the one end of fixing bolt 15 is connected with mould 16.
In this embodiment, the fixing pieces 2 are fixed on two sides of the base 1, the screw 3 penetrates through one side of the fixing piece 2, and the die can be stably arranged through the base 1.
In this embodiment, the base 1 and the fixing piece 2 are arranged in an integrated structure, the fixing piece 2 is movably connected with the screw 3, and the base 1 and the working table surface can be fixed through the arrangement of the fixing piece 2 and the screw 3, so that the overall installation stability of the die is further improved.
In this embodiment, the bottom plate 4 is installed to the upper end of base 1, and the upper end of bottom plate 4 all is provided with damping reset rod 5, can assist in carrying out the butt joint installation between damping reset rod 5 and the base 1 through the setting of bottom plate 4.
In the embodiment, the bottom die 6 forms a damping structure through the damping reset rods 5 and the base 1, the damping reset rods 5 are distributed on the bottom die 6 at equal intervals, and vibration generated in the stamping process of the stamping die can be damped through the damping reset rods 5.
In this embodiment, the two sides of the mold groove 7 are both provided with positioning grooves 8 and positioning pins 10 movably connected with the inner walls of the positioning grooves 8 to form a positioning structure, the positioning grooves 8 and the positioning pins 10 are matched for use, and the material plate 9 and the bottom mold 6 can be limited and aligned by matching the positioning grooves 8 and the positioning pins 10, so that the subsequent upper mold 16 is convenient for stamping.
In this embodiment, the upper die 16 is in threaded connection with the cylinder 13 through the fixing bolt 15 and the mounting plate 14, the fixing bolt 15 is symmetrically arranged with the central axis of the mounting plate 14, and the upper die 16 and the cylinder 13 can be detached and replaced through the arrangement of the fixing bolt 15.
Working principle: firstly, placing the whole stamping die at a designated position, switching on an external power supply of the die, fixing a base 1 between a screw 3 and a workbench, after the base 1 is fixed, mounting a bottom die 6 at the upper end of the base 1, limiting and fixing a material plate 9 between a locating pin 10 and the bottom die 6, butt-mounting an upper die 16 between a fixing bolt 15 and a cylinder 13, after the upper die 16 and the bottom die 6 are mounted, opening a switch of the cylinder 13, enabling the cylinder 13 to drive the upper die 16 to stamp the material plate 9, in the stamping process, enabling a model groove 7 formed on the outer wall surface of the bottom die 6 to assist the upper die 16 to be in a specific shape of a connecting sheet at the stamping position, and then closing a switch of the cylinder 13 after the connecting sheet is stamped, wherein the model of the cylinder 13 is as follows: SC125, the use of a stamping die for bent semiconductor bond pads is thus completed.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A stamping die of a bending type semiconductor connecting sheet is characterized in that: including base (1), the upper end of base (1) is provided with die block (6), die block (7) have been seted up on the outer wall surface of die block (6), the both sides of die block (7) all are provided with constant head tank (8), the upper end of constant head tank (8) is provided with material board (9), the inner wall swing joint of constant head tank (8) has locating pin (10), the upper end of die block (6) all is connected with branch (11), the other end of branch (11) is provided with roof (12), the upper end of roof (12) is provided with cylinder (13), one end fixed mounting of cylinder (13) has mounting plate (14), one side of mounting plate (14) is run through there is fixing bolt (15), the one end of fixing bolt (15) is connected with mould (16).
2. The stamping die for the bent semiconductor connecting sheet according to claim 1, wherein fixing sheets (2) are fixed on two sides of the base (1), and a screw (3) penetrates through one side of each fixing sheet (2).
3. The stamping die for the bent semiconductor connecting sheet according to claim 1, wherein the base (1) and the fixing sheet (2) are arranged in an integrated structure, and the fixing sheet (2) is movably connected with the screw rod (3).
4. The stamping die of the bent semiconductor connecting sheet according to claim 1, wherein a bottom plate (4) is installed at the upper end of the base (1), and damping reset rods (5) are arranged at the upper ends of the bottom plate (4).
5. Stamping die for bent semiconductor connecting pieces according to claim 1, characterized in that the bottom die (6) forms a damping structure between the damping reset rods (5) and the base (1), and the damping reset rods (5) are distributed on the bottom die (6) at equal intervals.
6. The stamping die of the bent semiconductor connecting sheet according to claim 1, wherein positioning grooves (8) are formed on two sides of the model groove (7) and positioning pins (10) are movably connected with the inner walls of the positioning grooves (8) to form a positioning structure, and the positioning grooves (8) and the positioning pins (10) are matched for use.
7. Stamping die for bent semiconductor connecting pieces according to claim 1, characterized in that the upper die (16) is connected with the cylinder (13) through a fixing bolt (15) and a mounting piece (14), and the fixing bolt (15) is symmetrically arranged with the central axis of the mounting piece (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322150907.3U CN220591251U (en) | 2023-08-10 | 2023-08-10 | Stamping die of bending type semiconductor connecting sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322150907.3U CN220591251U (en) | 2023-08-10 | 2023-08-10 | Stamping die of bending type semiconductor connecting sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220591251U true CN220591251U (en) | 2024-03-15 |
Family
ID=90176164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322150907.3U Active CN220591251U (en) | 2023-08-10 | 2023-08-10 | Stamping die of bending type semiconductor connecting sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220591251U (en) |
-
2023
- 2023-08-10 CN CN202322150907.3U patent/CN220591251U/en active Active
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