TW201143079A - Memory element and store method - Google Patents

Memory element and store method Download PDF

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Publication number
TW201143079A
TW201143079A TW100103409A TW100103409A TW201143079A TW 201143079 A TW201143079 A TW 201143079A TW 100103409 A TW100103409 A TW 100103409A TW 100103409 A TW100103409 A TW 100103409A TW 201143079 A TW201143079 A TW 201143079A
Authority
TW
Taiwan
Prior art keywords
layer
free
resistance
portions
insulating layer
Prior art date
Application number
TW100103409A
Other languages
English (en)
Chinese (zh)
Inventor
Yukio Kikuchi
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW201143079A publication Critical patent/TW201143079A/zh

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1675Writing or programming circuits or methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B99/00Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
TW100103409A 2010-01-29 2011-01-28 Memory element and store method TW201143079A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010019246 2010-01-29

Publications (1)

Publication Number Publication Date
TW201143079A true TW201143079A (en) 2011-12-01

Family

ID=44319346

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100103409A TW201143079A (en) 2010-01-29 2011-01-28 Memory element and store method

Country Status (4)

Country Link
JP (1) JP5197856B2 (ja)
KR (1) KR101455483B1 (ja)
TW (1) TW201143079A (ja)
WO (1) WO2011093363A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110268515A (zh) * 2018-01-12 2019-09-20 Tdk株式会社 磁壁移动型磁记录元件及磁记录阵列

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108666339B (zh) * 2017-03-28 2020-11-13 中芯国际集成电路制造(上海)有限公司 磁性随机存储器及其存储单元的制造方法
US20230060680A1 (en) * 2020-03-26 2023-03-02 Nippon Telegraph And Telephone Corporation Materials exhibiting transport properties specific to weyl fermions and magnetresistance devices based on such materials

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2879349B1 (fr) * 2004-12-15 2007-05-11 Thales Sa Dispositif a electronique de spin a commande par deplacement de parois induit par un courant de porteurs polarises en spin
JP2006287081A (ja) * 2005-04-04 2006-10-19 Fuji Electric Holdings Co Ltd スピン注入磁区移動素子およびこれを用いた装置
JP2007201059A (ja) * 2006-01-25 2007-08-09 Toshiba Corp 磁気素子、磁気記録装置及び書き込み方法
KR101168285B1 (ko) * 2006-12-29 2012-07-30 삼성전자주식회사 자구벽 이동을 이용한 정보 저장 장치 및 그 제조방법
US8040724B2 (en) * 2007-08-03 2011-10-18 Nec Corporation Magnetic domain wall random access memory

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110268515A (zh) * 2018-01-12 2019-09-20 Tdk株式会社 磁壁移动型磁记录元件及磁记录阵列
CN110268515B (zh) * 2018-01-12 2023-10-17 Tdk株式会社 磁壁移动型磁记录元件及磁记录阵列

Also Published As

Publication number Publication date
KR101455483B1 (ko) 2014-10-27
JP5197856B2 (ja) 2013-05-15
WO2011093363A1 (ja) 2011-08-04
JPWO2011093363A1 (ja) 2013-06-06
KR20120109598A (ko) 2012-10-08

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