TW201134609A - Device for processing outer periphery of disk-like workpiece - Google Patents

Device for processing outer periphery of disk-like workpiece Download PDF

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Publication number
TW201134609A
TW201134609A TW100106317A TW100106317A TW201134609A TW 201134609 A TW201134609 A TW 201134609A TW 100106317 A TW100106317 A TW 100106317A TW 100106317 A TW100106317 A TW 100106317A TW 201134609 A TW201134609 A TW 201134609A
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TW
Taiwan
Prior art keywords
workpiece
grinding wheel
chamfering grinding
outer peripheral
chamfering
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Application number
TW100106317A
Other languages
Chinese (zh)
Inventor
Takuya Ishida
Takadai Kamita
Original Assignee
Nakamura Tome Precision Ind
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Publication of TW201134609A publication Critical patent/TW201134609A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B24B9/107Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for glass plates while they are turning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0076Other grinding machines or devices grinding machines comprising two or more grinding tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/10Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The present invention provides a device for processing the outer periphery of a disk-like workpiece made of rigid brittle material. The invented device can prevent the formation of chippings on angles between a chamfer face and the surface/back of the workpiece. When a grinding disk is worn out, a high precision of shape of processing on the workpiece can be ensured by adjusting the relative position between the grinding disk and the workpiece. The invented device includes an upper chamfer grinding disk for performing chamfer processing on the upper outer peripheral angle of a workpiece kept horizontally on a workpiece fastener, and a lower chamfer grinding disk for performing chamfer processing on the lower outer peripheral angle of the workpiece. The upper chamfer grinding disk and the lower chamfer grinding disk are circular-shaped grinding disk using the outer periphery thereof for sliding and polishing the upper outer peripheral angle and the lower outer peripheral angle of workpiece, and contacting one place of the upper outer peripheral angle of workpiece and one place of the lower outer peripheral angle of workpiece. The upper chamfer grinding disk and the lower chamfer grinding disk are driven to rotate from the inner side of workpiece towards the outer side of workpiece in the sliding friction direction. The upper chamfer grinding disk and the lower chamfer grinding disk are assembled at positions capable of being independently adjusted in the diameter direction of workpiece.

Description

201134609 六、發明說明: 【發明所屬之技術領域】 本發明涉及一種作爲硬碟(Hard Disk Drive; HDD)的儲 存介質,並以玻璃或陶瓷等硬質脆性材料構成的碟片(圓板 狀工件)的外周加工裝置。 【先前技術】 爲了實現高儲存密度和穩定的高速旋轉,必須要求作 爲貢訊儲存面的碟片的表、背面具有極高的面精度,且碟 :的外周部的加工亦須要求其加工精度。以往,係通過兩 次磨削加工(研磨(lapping))和精加卫研磨(抛光_刚叫) 來加工碟片的表、背面,並通過外周磨削和倒角來加工碟 片的外周冑。一般加工順序爲’於進行表、背面的第欠 磨削後,進行外周部的磨削和倒角,然後再進行表、背面 的第二次磨削和精加.工研磨。 凊參見圖12所示,圓板狀工件(碟片}1的外周角(表、 :面與外周面之間的稜線)的倒角加工係採用砂輪6進行。 =力:工的工件1水平地保持在錯直方向的旋轉工件勒” 軸二繞該工件轴11的軸心旋轉,且使裝配於與該工件 二:的旋轉砂輪轴61上的砂輪6旋轉,通過將工件1 而對工二入於砂輪6的外周面所形成的梯形槽65中,從 、、兄下&的上外周角和T外周角同時進行㈣,在該情 况下’凊配合參見® 13所示,砂 在4 的滑動摩擦方向為箭頭d所指的…件1的倒角面16 線方向,在現有技術之倒角加工;向工件叫 表、祛二4 7 件1的倒角面16盥 面17之間的角(棱線)18會產生的微米左右的碎屬 201134609 州PP_ 7碎屑必須通過前述的第二次磨削被除去。 、爲了提问工件1的生産率與降低生產成本,期望能縮 減工:1的加η序’例如:將磨削加卫縮減爲—道工序。 如果能夠省略第二次磨削加工而在倒角加工後馬上進行精 加工研磨,則能大幅地縮減工 什丨的加工工序。此外,現 有技術之砂輪6必須同時對工株ή m — 件的上、下周角進行加工, 因此存在者加工負荷大的問題’且…必須是以金剛石 磨料電沈積於金4基體上的高硬度砂輪,又當砂輪6磨損 時,需要及時進行秒輪6的更換。 【發明内容】 本發明正是爲了解決前述問題而作出的,其可防止工 件1的倒角面16與表、背面17之間的角18産生碎屑,從 而能夠省略倒角加工後的第二次磨削加工,且倒角砂輪 3a、3b的加工負荷小,换田丨、,* 員了 J &用以普通磨料結合而成的一般砂 輪:可’又通過調㈣角砂輪3a、3b與工件,的相對位置 便月b使工件1維持面精度的加工报灿&也杂 砂輪的加工形狀而無需頻繁更換倒角 本發明涉及的圓板狀工件之外周加工裝置具備: 工件軸’該工件軸以軸心處於轨古 处於金0直方向的方式設置;工件 保持器12,該卫件保持器12設於社件軸的上端並水平地 保持要加工的圓板狀工件1;上㈣砂輪^和用於驅動該 上倒角砂輪3a旋轉的上倒角砂輪馬達32a,該上倒角砂輪 33對該工件1的上外周角進行倒角;以及下倒角砂輪3b 和用於驅動該下倒角砂輪讣旋轉的下倒角砂輪馬達32b, 該下倒角砂輪3b對該工件彳的下外周角進行甸角。 4 201134609BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disk (a disk-shaped workpiece) which is a storage medium of a hard disk drive (HDD) and is made of a hard brittle material such as glass or ceramic. Peripheral processing device. [Prior Art] In order to achieve high storage density and stable high-speed rotation, it is required that the surface and the back surface of the disc as the storage surface of the Gongxun have extremely high surface precision, and the processing of the outer peripheral portion of the disc must also require machining accuracy. . In the past, the surface and back of the disc were processed by two grinding processes (lapping) and fine grinding (polishing_gangming), and the outer circumference of the disc was machined by peripheral grinding and chamfering. . In general, the processing sequence is 'after grinding the surface and back grinding, and then grinding and chamfering the outer peripheral portion, and then performing the second grinding and finishing grinding on the front and back surfaces. Referring to Fig. 12, the chamfering process of the outer peripheral angle of the disk-shaped workpiece (the disc}: the ridge line between the surface and the outer peripheral surface) is performed by the grinding wheel 6. = force: the workpiece 1 level The rotating workpiece held in the wrong direction is rotated about the axis of the workpiece shaft 11, and the grinding wheel 6 mounted on the rotating grinding wheel shaft 61 of the workpiece 2 is rotated, and the workpiece 1 is machined. In the trapezoidal groove 65 formed by the outer peripheral surface of the grinding wheel 6, the upper outer peripheral angle and the outer peripheral angle of the lower and lower sides of the grinding wheel are simultaneously performed (4). In this case, the '凊 fit is shown in ® 13 and the sand is The direction of sliding friction of 4 is the direction of the line 16 of the chamfered surface of the piece 1 which is indicated by the arrow d, and is chamfered in the prior art; the workpiece is called the table, and the chamfered surface 16 of the piece of the workpiece is 16 The inter-angle (ridge line) 18 will produce a micron-sized fragment of 201134609. The state PP_7 debris must be removed by the second grinding described above. In order to ask the productivity of the workpiece 1 and reduce the production cost, it is expected to be reduced. Work: 1 plus n order 'for example: reduce the grinding and grinding to the - process. If you can omit the second The secondary grinding process and the finishing grinding immediately after the chamfering process can greatly reduce the processing steps of the work. Moreover, the prior art grinding wheel 6 must simultaneously face the upper and lower circumferences of the workpiece. Processing, so there is a problem of large processing load 'and... must be a high-hardness grinding wheel that is electrodeposited on a gold 4 substrate by a diamond abrasive, and when the grinding wheel 6 is worn, it is necessary to replace the second wheel 6 in time. The present invention has been made to solve the aforementioned problems, which can prevent the chamfering of the chamfered surface 16 of the workpiece 1 and the angle 18 between the front and back surfaces 17, thereby eliminating the second grinding after chamfering. Machining, and the processing load of the chamfering grinding wheels 3a, 3b is small, changing the field 丨, * member J & general grinding wheel combined with ordinary abrasive: can be adjusted by (four) angle grinding wheel 3a, 3b and workpiece, The relative position of the month b allows the workpiece 1 to maintain the surface accuracy of the processing and the machining shape of the grinding wheel without frequent replacement of the chamfer. The outer peripheral processing device of the disk-shaped workpiece according to the present invention includes: a workpiece axis 'the workpiece axis The workpiece holder 12 is disposed in the manner that the axis is in the straight direction of the gold 0; the workpiece holder 12 is disposed at the upper end of the social axis and horizontally holds the disk-shaped workpiece 1 to be processed; the upper (four) grinding wheel And an upper chamfering grinding wheel motor 32a for driving the rotation of the upper chamfering grinding wheel 3a, the upper chamfering grinding wheel 33 chamfering the upper outer peripheral angle of the workpiece 1, and the lower chamfering grinding wheel 3b and for driving the lower The chamfering grinding wheel rotates the lower chamfering grinding wheel motor 32b, and the lower chamfering grinding wheel 3b makes the lower outer peripheral angle of the workpiece 进行 a corner. 4 201134609

上、下倒角砂輪3a、3b是用A 件1的上外汽自%下冰Η Λ 、外周面一處滑動摩擦工 j丄:>τ周角和下外周角的 角石少。 冉的圓板形砂輪,所述上、下倒 角石/輪3a、3b與工件j的 匕蛀結l 卜周角一處a和下外周角一處 b接觸。上倒角砂輪3 ^ 轉中心益,“ 轉中〜轴和下倒角砂輪3b的旋 轉中〜軸沿水平方向設置,並 相斟认― < 於工件1的上方和下方且 ③工件1的外周向外側偏移。 倒角砂輪馬達32a、32b , .,,S1 & [動倒角砂輪3a、3b旋轉’ 側的匕方6砂f 3a、3b的旋轉方向爲從卫件1的内側朝向外 内=外:上倒角砂輪33和下倒角妙…工件1的 =:外側滑動摩擦…的上外周角和下外周角,從 而對所述外周角進行倒角加工。 Μ角從 本發明的圓板狀工件之外 加工工#仟之外周加工裝置進-步具備用於 刀工工件1的外周面的外周 a、b的連線正交的工件彳㈣":該外周砂輪5配置於與 砂輪5的外周m 從延伸線上,並且使該外周 周面一處與工件1接觸,藉此緊湊地槿要 能同時或者連續地對工件i進行外/^M地構成裝置’ 進仃外周面加工和倒角加工。 件·!的表Γ外周加工裝置中,倒角砂輪33、36沿著工 的倒角面;6 7朝向外周面15的方向滑動摩擦工… = 1,Γ同時地對工件1的上外周角和下外周角 面16之間的角18產…件1的表、背面17與倒角 ^ _ 生碎屑’’通過抑制碎屑的産生,萨热 切第二次磨削加 ^ 從而能夠大幅地縮減工序並大怦她 “工件1整體的加工時間。 斤並大巾田地 進倒角砂輪3a、3b分別僅在工件1的外周角-處 進仃μ動摩擦,故倒角砂輪3 處 刀口工員何小,採用以 201134609 普通磨料結合而成的一般砂輪即可,又當倒' / 輪 3a、3b 磨損時’通過調整倒角砂輪3a、3_位置,便能__ 要求的加工精度而無需頻繁地更換砂輪a、3 低加工成本。 q此此夠降 【實施方式】The upper and lower chamfering grinding wheels 3a, 3b are made of the upper outer steam of the A piece 1 from the lower hail Λ, and the outer peripheral surface is a sliding friction j丄: > the angle of the τ and the lower outer angle are less. In the circular disc-shaped grinding wheel, the upper and lower chamfering stones/wheels 3a, 3b are in contact with a knot l of the workpiece j at a circumferential angle a and a lower outer peripheral corner b. The upper chamfering grinding wheel 3 ^ turns to the center, "the rotation of the middle shaft and the lower chamfering grinding wheel 3b is set in the horizontal direction, and the phase is recognized" < above and below the workpiece 1 and 3 workpiece 1 The outer circumference is offset to the outside. The chamfering grinding wheel motors 32a, 32b, .,, S1 & [the rotating chamfering grinding wheels 3a, 3b are rotated on the side of the side 6 sands f 3a, 3b in the direction of rotation from the inside of the guard 1 Toward the outer inside = outer: the upper chamfering grinding wheel 33 and the lower chamfering angle... the upper outer peripheral angle and the lower outer peripheral angle of the workpiece 1 =: outer sliding friction ..., thereby chamfering the outer peripheral angle. In addition, the outer peripheral processing device of the invention has a workpiece orthogonal to the outer circumferences a and b of the outer peripheral surface of the cutter workpiece 1 (four) ": the outer peripheral grinding wheel 5 is disposed in The outer circumference m of the grinding wheel 5 is extended from the line, and the peripheral surface of the outer circumference is brought into contact with the workpiece 1, whereby the outer peripheral surface of the workpiece i can be formed in a compact manner simultaneously or continuously. Machining and chamfering. In the case of the outer peripheral processing device, the chamfering grinding wheels 33 and 36 are poured along the work. Angle surface; 6 7 sliding friction in the direction of the outer peripheral surface 15 = 1, Γ simultaneously at the angle 18 between the upper outer peripheral angle of the workpiece 1 and the lower outer peripheral corner surface 16 ... the table 1 and the back surface 17 of the workpiece 1 Angle ^ _ raw debris '' by suppressing the generation of debris, Sacher cut the second grinding plus ^ so that the process can be greatly reduced and the "processing time of the workpiece 1 as a whole." Jin and the large towel field into the chamfering grinding wheel 3a, 3b respectively only in the outer peripheral angle of the workpiece 1 - 仃μ dynamic friction, so the chamfering grinding wheel 3 at the knife-edge worker He Xiao, using the general grinding wheel combined with 201134609 ordinary abrasive material However, when the '/wheels 3a, 3b are worn out', by adjusting the position of the chamfering grinding wheel 3a, 3_, the required machining accuracy can be achieved without frequent replacement of the grinding wheels a, 3 with low machining costs. q This is enough to drop [Embodiment]

請參見圖1所示,本發明係提供作爲加工物件的圓板 狀工件1受到負壓而被吸附並保持在工件保持器UReferring to Fig. 1, the present invention provides a disk-shaped workpiece 1 as a workpiece to be adsorbed and held in a workpiece holder U under a negative pressure.

工件保持器12設置於錯直方向的卫件轴(圖中未示)的: 端,该工件轴被軸支撑於圓筒形的保持器底座1Q 器底座10立起設置於基座20上(如圓5所示):爲中 空軸而具有中空孔,通過該中 牛軸爲中 τ二孔向工件保持器12#仏哄 附工件1的負壓,工件軸由主舳I、# ζ供^吸 汁神由主軸馬達驅動從而 200rpm)旋轉,且工件彳貫穿 '(〜 乃T ’U札,s亥加工奘 對該中心孔的孔壁面進行加裝置具備 η周砂輪7,工件俚姓。。 12的工件吸附面形成爲環形以避 呆“ 輪厂相互干涉,該加工裝置亦對了插入的内周砂 加工的外周砂輪5。 丨具備對工件1的外周面進行 爲說明方便,以X、γ、7 和移動方向進行說明,其中ζ /標系對本發明的配置 * . ^ & 、 方向爲工件軸的軸向,gP款 直方向。在圖1、2、6'7、8、1〇月“ + Π即敍 , 及11中標示有直角坐庐 以及對工件1進行磨削的各砂 再丄4, 間的位置關係。 5、7與工件Ί之 上倒角砂輪3a和下倒角砂輪3 指的方向旋轉,即倒角砂輪3 %箭頭R所 側滑動摩擦工的外周角,_二^ =朝:: 6 201134609 倒角砂輪3a、3b從工 滑動摩擦工件,的柄a 、表、背® 17朝向外周面15 的傾斜朝下部位滑動摩二:上倒:砂輪33利用其外周面 仏利用其外周面的傾斜朝上1的上外周角’下倒角砂輪 角,當工件1的倒角面二工件1的下外周 度時,倒角砂輪心^ 表、背面17的角度爲45 爲45度。 '月動摩擦工件1的外周面傾斜角度 圖1至9所示為本發 3a κ, 月第一實轭例,其中上倒角砂輕 畫^扣在丫方向的連線為直線X。(如圖2所 不)’該直線X。穿過工件 ^ ix ^ . r 、。上倒角砂輪3a的倒角衫 ^和/倒角砂輪⑪的倒角砂輪軸沿X方向設置,並位於 移通:二方和下方且相對於該工件1的外周向外側偏 =通過支#倒角砂輪㈣砂輪座24a、24b(㈣5所示: 方向朝向工件1中心移動來實施倒角砂輪3a、3b的切 =進給,通過支射以砂輪軸的砂輪座24a、24_向與切 向相反的γ方向移動’從而使倒角砂輪&、3b的切深 進給退回(退避)。 外周9輪5的外周砂輪轴和内周砂輪7的内周砂輪麵 與工件軸相互平行’内、外周砂輪7、5對工件!的切深方 向爲X方向。外周砂輪5通過朝向與外周砂輪$的切深方 向相反的X方向移動從而退開,内周砂輪7通過朝向與内 周砂輪7的切深方向相反的χ方向移動後,沿2方向朝向 上方移動從而退開。 當倒角砂輪3a、 會減小,倒角砂輪3a 3b磨損時,倒角砂輪3a、3b的直徑 、3b磨損所引起的加工誤差能夠通過 201134609 將倒角砂輪心补於丫方向進行移動來修正,雖會造成工 件1的倒角面16的角度產生微小誤差,在該誤差為被容許 的範圍内’無需設置使倒角砂輪3a、3“z方向移動的機 構’而在必須嚴格維持㈣面16的角度時,則必須使 砂輪3a、3b可獨立地沿z方向移動以修 度誤差。 J用 圖5至7所示為修正倒角砂輪心加磨損所 工誤差的機械結構,該機械在基座2Q的表面設有由相互平 订的二根軌道構成的X方向引導件41,第一進給座2 配成被該X方向引導件4彳 裝 能自由地移動和定位,該第 :!的兩根軌道所引導而 的面上m 座21朝向保持器底座1〇 的面h置有z方向第—料件仏 件42裝配有第二進 、 万句第弓I導 自由地移動和定位。臂2二給座22可沿Z方向 保持器底座10的上方延仲從/第二進給座22的上方朝向 方向朝下的方式裝:有二臂27的末端以轉子軸沿2 達52,料田 驅動外周砂輪5的外周砂輪馬 成爲外^^輪馬達52是内置(bU丨丨Μη)馬達,其轉子輕 成爲外周砂輪轴,兮冰闲r| ±λ Μ卜周汐輪軸的下端固定有外周砂輪5。The workpiece holder 12 is disposed at the end of the guard shaft (not shown) in the wrong direction, and the workpiece shaft is supported by the cylindrical holder base 1Q. The base 10 is erected on the base 20 ( As shown by the circle 5), there is a hollow hole for the hollow shaft, and the negative pressure of the workpiece 1 is attached to the workpiece holder 12# by the middle τ two holes, and the workpiece axis is supplied by the main 舳I, # ζ ^Sucking juice is driven by the spindle motor to rotate at 200 rpm), and the workpiece 彳 passes through '(~ is T'U 扎, shai processing 进行 The hole wall surface of the center hole is provided with an η-period grinding wheel 7, the workpiece last name. The workpiece suction surface of 12 is formed into a ring shape to avoid the "wheel factory mutual interference. The processing device also applies to the peripheral grinding wheel 5 for inserting the inner circumference sand. The 丨 has the outer peripheral surface of the workpiece 1 for convenience of explanation, X, γ, 7 and direction of movement are described, where ζ / standard system is configured for the present invention * ^ & direction is the axial direction of the workpiece axis, gP straight direction. In Figures 1, 2, 6'7, 8, 1 〇月“+ Π即叙, and 11 are marked with right-angled squats and sands for grinding the workpiece 1 again, 4 The positional relationship between the 5, 7 and the workpiece Ί above the chamfering grinding wheel 3a and the lower chamfering grinding wheel 3, that is, the chamfering grinding wheel 3% of the arrow R side sliding friction of the outer peripheral angle, _ two ^ = toward :: 6 201134609 The chamfering grinding wheels 3a, 3b slide from the workpiece a, the table, and the backrest 17 toward the lower portion of the outer peripheral surface 15 by sliding the workpiece 2: upside down: the grinding wheel 33 utilizes its outer peripheral surface The angle of the outer peripheral surface is inclined upwards toward the upper outer peripheral angle of the upper one. When the chamfered surface of the workpiece 1 is the lower outer circumference of the workpiece 1, the angle of the chamfering wheel center and the back surface 17 is 45 degrees 45 degrees. The angle of inclination of the outer peripheral surface of the lunar friction workpiece 1 is shown in Figs. 1 to 9 as the first real yoke of the hair 3a κ, in which the upper chamfered sand is drawn in a straight line X in the 丫 direction. As shown in Fig. 2, 'the straight line X. Through the workpiece ^ ix ^ . r , the chamfering shirt of the upper chamfering grinding wheel 3a and the chamfering grinding wheel of the chamfering grinding wheel 11 are arranged along the X direction and are located Pass: two sides and below and opposite to the outer circumference of the workpiece 1 = through the branch # chamfering wheel (four) wheel holders 24a, 24b ((4) 5: direction toward the workpiece 1 The heart moves to perform the cutting/feeding of the chamfering grinding wheels 3a, 3b, and the grinding wheel seats 24a, 24_ of the grinding wheel shaft are moved to the γ direction opposite to the tangential direction by the branching, thereby cutting the chamfering grinding wheels & The deep feed is retracted (retracted). The outer peripheral grinding wheel shaft of the outer 9 wheels 5 and the inner circumferential grinding wheel surface of the inner circumferential grinding wheel 7 are parallel to the workpiece axis. The inner and outer grinding wheels 7 and 5 are in the X direction with respect to the depth of the workpiece! The outer peripheral grinding wheel 5 is retracted by moving in the X direction opposite to the depth of cut of the outer peripheral grinding wheel $, and the inner peripheral grinding wheel 7 is moved upward in the direction of the depth of the inner peripheral grinding wheel 7 in the direction opposite to the depth of cut of the inner peripheral grinding wheel 7, and then moved upward in the two directions. Thereby retreating. When the chamfering grinding wheel 3a is reduced and the chamfering grinding wheel 3a 3b is worn, the machining error caused by the diameter of the chamfering grinding wheels 3a, 3b and the wear of 3b can be corrected by moving the chamfering grinding wheel core in the 丫 direction by 201134609. Although a slight error occurs in the angle of the chamfered surface 16 of the workpiece 1, within the allowable range, 'the mechanism for moving the chamfering grinding wheels 3a, 3 in the z direction is not required', and the (four) surface must be strictly maintained. At an angle of 16 , the grinding wheels 3a, 3b must be independently moved in the z direction to compensate for the error. J. Figures 5 to 7 show the mechanical structure of the chamfering wheel wheel plus the wear error. The surface of the base 2Q is provided with an X-direction guide 41 composed of two tracks which are mutually aligned, and the first feed base 2 is configured to be freely movable and positioned by the X-direction guide 4, the first: The surface of the m-seat 21 guided by the two rails facing the holder base 1 is placed in the z-direction, and the material member 42 is equipped with a second movement, and the second guide is freely movable. Positioning. The arm 2 2 seat 22 can be above the Z-direction holder base 10 The secondary/second feed seat 22 is mounted upwardly in a downward direction: the end of the two arms 27 is rotated by 2 to 52 with the rotor shaft, and the outer peripheral grinding wheel of the outer peripheral grinding wheel 5 is driven by the feed field to become the outer motor 52. It is a built-in (bU丨丨Μη) motor, and its rotor is lightly turned into a peripheral grinding wheel shaft, and the outer peripheral grinding wheel 5 is fixed at the lower end of the wheel.

方二:t給座22朝向保持器底座10的面上設置有Υ 方向引導件43,沿哕γ 士丄 又直,Y 座…、23b,該方向引導件43裝配有兩第三進給 Y方向引導件43 了刀別早獨地沿 23a、23b朝向保 移動和定位,且在各第三進給座 導件44a、44bn/ 1G的面上設置有Z方向第二引 地移動和定位的方;^方有向第二引導件W以自由 飞裝配有兩砂輪座24a、24b。 8 201134609 x方向的方式襞 其中一砂輪座24a上,以轉子軸朝向 配有用於驅動上倒角砂輪3a旋轉的上倒角砂輪馬達s2a 而另-砂輪座24b上以轉子轴朝向X方向的方式裝配有用 於驅動下倒角砂輪3b旋轉的下倒角砂輪馬達3仏,倒角砂 輪馬達32a、32b是轉速爲5000〜l5〇〇〇rpm的内置馬達\ 其轉子軸成爲倒角砂輪軸,該倒角砂輪轴的末端固定有倒 角砂輪3a、3b » 沿該x方向引導件41裝配有第四進給座25,該第四 進給座25由該X方向引導件41於圖中右側的兩根轨道所 引導而能自由地移動和定位’在第四進給座25朝向保持器 底座1〇的面上設置有z方向第三引導件46,沿該z方向 第三引導件46以自由地移動和定位的方式裝配有第五進給 座26。f 28從第五進給座26的上方朝向保持器底座二 的上方延伸,在該臂28时端以轉子轴沿ZS向朝下的方 式裝配有用於驅動内周砂輪7旋轉的内周砂輪馬達U,談 内周砂輪馬達72是内置馬達,其轉子軸成爲^ 該内周砂輪㈣下端固定有内周砂輪7。 沿著引導件 f2m23b、25、26w24a、24b6^ 疋位機構採用的是在精度和可靠性方面優選的如下機構. 將各進給庙91 〇〇 μ 「恢@ · 引導件…42:43 ^ ^ 8 4b、46平行设置的進給絲桿, 所控Γ/服馬達驅動所述進給絲桿,制服馬達由控制器 '此移動定位機構為現有技術且被廣泛應用於工作 馒餓中,故不再詳加描述。 201134609 接下來’對如上所述的機械的動作進行說明:將要加 工的工件1置於工件保持器12上,通過向工件保持器12 供給負壓而將該工件1吸附保持於工件保持器12上,在置 入或移出工件1時,通過控制第五進給座26朝向上方移動 而使内周砂輪7退開,通過控制第三進給座23a、23b在γ 方向朝向相互遠離的方向移動而使倒角砂輪3a、3b退開, 通過控制第一進給座21在X方向朝向離開保持器底座 的方向移動而使外周砂輪5退開。 件1的磨削加工在工件軸旋轉時進行 丄 ^ I I I 处 轉的狀態下’通過控制第—進給座方向上朝向保持 器底座1 0的方向移動,使外周砂輪5對工件】的外周面饬 進行磨削加卫,通過控制第三進給座23a、23b在γ方向相 向並朝工件1中心移動’使倒角砂輪3a、3b同時對工^ 的上外周角和下外周角進行倒角加工,通過控制第四進认 座“於X方向上朝向保持器底座1〇的方向移動和控制; 五進給座26下降’使内周砂輪7對工件1的中心孔的孔壁 面進行磨削加工。於工件1 从土从 Ί^Λ 件1加工結束後,係控制工件軸停 ^疋轉’控制砂輪3a、3b、5、7退開,解除工件伴 對工件!的吸附保持,並以搬送裝置將工件 朝向離開第一進給S 21 @方向移出。 。方向 當倒角砂輪3a、3b磨損而使其直 倒角面16的加工精度會连也μ法 ^工件1的 角砂輪3a、3b的進刀量(丫方:,該誤差能夠通過調整倒 過調整倒角砂輪以、二方^ 面Μ的角产還是會产,移動量來進行修正,倒角 的角度還疋會產生少許誤差,對該倒角面Μ的角度 201134609 誤差進行修正時,通過第= 地乐—進給座23於γ大 座24a、24b於z方向移動在%, 、 。移動和砂輪 乃门移動來進行修正,由於 輪3 a、3 b係獨立地裝西?於楚_ 下倒角砂 也裒配於第二進給座23 24a、24b上,因此能夠 23b和砂輪座 3b的磨損。 刀別獨立地修正上、下倒角砂輪3a、 削時欲=…的外周角倒角和…的外周面磨 削時如圖2所不,將倒角砂輪心加與 面磨 成可同時接觸於工件1;而如果欲在工件;的;心 束後再進行倒角加卫時,如圖8所示,將倒角砂輪3a、^ 與外周砂輪5裝配成在外周砂輪5遠離工^時使倒角砂 輪以、补移動到位於工件1的直徑兩端的位置。 為得到較佳的倒角效果,可採用如圖9所示的多功能 砂輪3,該多功能砂輪3的外周面形成爲由圓筒面35㈣ 圓筒面35兩側的圓錐面34、36構成的淺梯形研磨面,並 以圓錐面34作絲磨砂輪,㈣筒面%作爲半精磨砂輪, 以圓錐面36作爲精磨砂輪’通過第一進給座21的移動和 第三進給座23a、23b的微少移動,如圖9的⑷—⑻—⑷ 所示地使多功能砂輪3的圓錐面34、圓筒面%和圓錐面 36依序滑動摩擦工件1 ’藉此’能夠按照粗磨、半精磨和 精磨的工序進行倒角加工。 圖1 0及11所為本發明第二實施例,對於與第—實施 例相同的部件以相同標號表示。倒角砂輪3a、3b與第一實 施例同樣地裝配於由倒角砂輪馬達32a、32b驅動旋轉的倒 角砂輪軸31 a、31 b上’惟倒角砂輪軸3 ] a、3 ] b的配置形 態與第一實施例不同。 201134609 、第二實施例中的上倒角砂輪3a和下倒角砂輪3b設置 成在相對於γ方向的直線心偏移相等角度的位置且對工件 1的上外周角和下外周角進行磨削,該直線X。穿過工件中 心0 ’即,工件,接觸於上倒角砂輪3a的位置a與工件中 心〇的連線為a0,工件i接觸於下倒角砂輪3b的位置匕 與工件中心Ο的連線為b0,連線a〇與輯⑽所形成的 夹角^的二等分線位於直線X。上,夾角α爲不大於9〇度 的小角度’然而為利於倒角砂輪馬達32a、咖以及砂輪座 24的設置’較佳的夾角α爲度。 上倒角砂輪3 a的倒角石少於站q 1 Q $ 月石y輪軸31a和下倒角砂輪3b的 倒角砂輪軸31b位於卫…的上方和下方且相對於該工件, 的外周向外側偏移,並且沿與連線a。、b。正交的水平方向 設置’用於驅動倒角砂輪軸31a、31b旋轉的上倒角砂輪馬 達323和下倒角砂輪馬達32b配置於同一砂輪座24上,倒 角砂輪3a、3b是以其外周面從工件,的内側朝向外側滑動 摩擦工件1的上外周角和下外周肖,即倒角砂輪3a、3b朝 向圖11的箭頭R所指的方向旋轉。 砂輪座24以沿Z方向自由地移動和定位的方式設置在 第一橫向進給座29上,該第-橫向進給座29以沿γ方向 自由地移動和定位的方式裝配於基座2〇上,通過控制第一 橫向進給座29沿丫方向朝向工件1移動,使倒角砂輪3a、 如的外周面同時接觸工件1的上外周角和下外周角。 倒角◊輪3a、3b磨損所引起的加工誤差可通過調整第 -橫向進給座29的Y方向的進給量來進行修正,倒角砂輪 3a、3b磨損所引起工件】的倒角面16的角度誤差可通過 12 201134609 砂輪座24於2方向移動來進行修正。 外周石y輪5配置於工件1設置有倒角砂輪3 反側,外周砂輪5裳 - 、3 b的相 向進,.,°座3 〇可在基座2 〇上沿Y方向自由地移J第二横 外周砂輪5對於工件 動和定位, 杆1的切冰方向爲γ方向, 角砂輪3a、3b和外月^ ς μ s 通過所述倒 的外周面磨削和倒I力 置’能夠同時進行工件] 5對於工Μ的作用力可獲得平衡A a 3b和外周砂輪 本發明係利用倒角砂輪3a、3 滑動摩擦工件!的“,A 從件1内側朝向外側 的倒角面16與表Γ 倒角,能夠抑制在工件1 省略以往的第、a 7之間的角18產生碎屑,故能夠 外門面力磨削加工,而以一次磨削加工、倒角和 和卜=加工、精加工研磨,此三道工序進行…的磨削 研磨,從而大幅地縮減加工工序。 【圖式簡單說明】 圖1係本發明之各砂輪與工件之前視圖。 圖2係本發明之各砂輪與工件之俯視圖。 圖3係工件倒角後之局部前視圖。 圖4係工件倒角後之局部俯視圖。 圖5係本發明之立體外觀圖。 圖6係本發明之前視圖。 圖7係本發明之俯視圖。 圖8係本發明之各石少輪與工件之另-酉己置俯視圖。 圖9(a)(b)(c)係本發明之多功能砂輪之三道工序示意 13 201134609 圖1 〇係本發明之各砂輪與工件之另一實施例俯視圓。 圖11係本發明之各砂輪與工件之另一實施例前視圖。 圖1 2係現有技術之倒角加工裝置主要結構之側視圖。 圖1 3係利用現有技術之倒角加工裝置進行倒角後之工 件之局部俯視圖。 【主要元件符號說明】 1工件 1 〇保持器底座 1 2工件保持器 15外周面 16倒角面 17表、背面 18角 2 0基座 21第一進給座 22第二進給座 23a、23b第三進給座 24、24a、24b 砂輪座 25第四進給座 26第五進給座 27 、 28 臂 29第一橫向進給座 30第二橫向進給座 3多功能倒角砂輪 3a上倒角砂輪 14 201134609 3 b下倒角砂輪 31a ' 31b倒角砂輪軸 32a上倒角砂輪馬達 32b下倒角砂輪馬達 35圓筒面 34、36 圓錐面 41 X方向引導件 42 Z方向第一引導件 43 Y方向引導件 44a、44b Z方向第二引導件 46 Z方向第三引導件 5外周砂輪 52外周砂輪馬達 7内周砂輪 7 2内周砂輪馬達 a工件接觸於上倒角砂輪的位置 b工件接觸於下倒角砂輪的位置 〇工件中心 d倒角砂輪的滑動摩擦方向 R倒角砂輪的旋轉方向 15Side two: t The surface of the seat 22 facing the holder base 10 is provided with a 方向 direction guide 43 which is straight along the 哕γ士丄, Y seat..., 23b, and the direction guide 43 is equipped with two third feeds Y The direction guide 43 is directed toward the movement and positioning along the 23a, 23b, and the side of the third feed holder 44a, 44bn / 1G is provided with the second direction of movement and positioning in the Z direction. The second guide member W is provided with two wheel seats 24a, 24b in a free flight. 8 201134609 In the x-direction manner, one of the wheel heads 24a is oriented with the rotor shaft facing the upper chamfering grinding wheel motor s2a for driving the upper chamfering grinding wheel 3a and the other - the wheel head 24b with the rotor axis facing the X direction. A lower chamfering grinding wheel motor 3仏 for driving the lower chamfering grinding wheel 3b is mounted, and the chamfering grinding wheel motors 32a and 32b are built-in motors having a rotational speed of 5000 to 15 rpm. The rotor shaft is a chamfering grinding wheel shaft. A chamfering grinding wheel 3a, 3b is fixed to the end of the chamfering grinding wheel shaft. A fourth feeding seat 25 is fitted along the x-direction guiding member 41. The fourth feeding seat 25 is guided by the X-direction guiding member 41 on the right side in the drawing. The two rails are guided to be freely movable and positioned. The z-direction third guide 46 is disposed on the surface of the fourth feed holder 25 facing the holder base 1 , along which the third guide 46 is free. The fifth feed seat 26 is assembled in a manner of ground movement and positioning. f 28 extends from above the fifth feed seat 26 toward the upper side of the holder base 2, and at the end of the arm 28, an inner peripheral grinding wheel motor for driving the rotation of the inner circumference grinding wheel 7 is mounted with the rotor shaft facing downward along the ZS. U, the inner circumference grinding wheel motor 72 is a built-in motor, and the rotor shaft is fixed. The inner circumference grinding wheel 7 is fixed to the lower end of the inner circumference grinding wheel (four). Along the guides f2m23b, 25, 26w24a, 24b6^, the clamping mechanism is preferably the following mechanism in terms of accuracy and reliability. Each feeding temple 91 〇〇μ "Restoration @ · Guide...42:43 ^ ^ 8 4b, 46 parallel feeding screw, the controlled motor/motor drive drives the feed screw, and the uniform motor is controlled by the controller. This mobile positioning mechanism is a prior art and is widely used in work hungry. 201134609 Next, the operation of the machine as described above will be described: the workpiece 1 to be processed is placed on the workpiece holder 12, and the workpiece 1 is adsorbed and held by supplying a negative pressure to the workpiece holder 12. On the workpiece holder 12, when the workpiece 1 is placed or removed, the inner circumference grinding wheel 7 is retracted by controlling the fifth feeding seat 26 to move upward, and the third feeding seat 23a, 23b is controlled to face in the γ direction. The chamfering grinding wheels 3a, 3b are retracted in a direction away from each other, and the outer peripheral grinding wheel 5 is retracted by controlling the movement of the first feeding seat 21 in the X direction toward the direction away from the holder base. When the workpiece axis rotates, 丄^ III In the state of being rotated, 'moving in the direction toward the holder base 10 in the direction of the control-feeding seat, the peripheral surface of the workpiece of the outer peripheral grinding wheel 5 is ground and reinforced, and the third feeding seat 23a is controlled. 23b is opposed to the center of the workpiece 1 in the γ direction. The chamfering grinding wheels 3a, 3b simultaneously chamfer the upper outer circumference angle and the lower outer circumference angle of the workpiece, and control the fourth accommodating seat to face in the X direction. The direction and movement of the holder base 1〇 are moved; the five-feed seat 26 is lowered to cause the inner-circumferential grinding wheel 7 to grind the hole wall surface of the center hole of the workpiece 1. After the workpiece 1 is finished from the soil, the workpiece is controlled to stop. The workpiece is stopped. The grinding wheels 3a, 3b, 5, and 7 are retracted to release the workpiece with the workpiece! The adsorption is maintained and the workpiece is moved away from the first feed S 21 @ by the transport device. . Direction When the chamfering grinding wheels 3a, 3b are worn and the machining accuracy of the straight chamfering surface 16 is the same as that of the angle grinding wheels 3a, 3b of the workpiece 1 (the square: the error can be adjusted by the inverted Adjusting the angle of the chamfering wheel, the angle of the two sides of the surface is still produced, and the amount of movement is corrected. The angle of the chamfer will also produce a slight error. When the angle of the chamfered surface is corrected, the error of 201134609 is corrected. The first = the music-feeding seat 23 moves in the z direction in the γ-seat 24a, 24b in the z direction, and the movement and the grinding wheel are moved to correct the wheel, and the wheels 3a, 3b are independently installed in the west. _ The lower chamfer sand is also fitted to the second feed seats 23 24a, 24b, so that the wear of the 23b and the wheel base 3b can be corrected. The cutters independently correct the outer circumference of the upper and lower chamfering grinding wheels 3a, and the cutting time = When the chamfering angle and the outer peripheral surface of the grinding are as shown in Fig. 2, the chamfering grinding wheel is added to the surface to be simultaneously contacted with the workpiece 1; if it is intended to be in the workpiece; In the case of Weiwei, as shown in Fig. 8, the chamfering grinding wheels 3a, ^ and the outer peripheral grinding wheel 5 are assembled to chamfer when the outer peripheral grinding wheel 5 is away from the work The grinding wheel is moved to the position at both ends of the diameter of the workpiece 1. For better chamfering effect, a multi-purpose grinding wheel 3 as shown in Fig. 9 can be employed, and the outer peripheral surface of the multi-purpose grinding wheel 3 is formed as a cylinder Face 35 (4) A shallow trapezoidal grinding surface composed of conical surfaces 34, 36 on both sides of the cylindrical surface 35, and a wire grinding wheel with a conical surface 34, (4) a cylinder surface % as a semi-finish grinding wheel, and a conical surface 36 as a fine grinding wheel' By the movement of the first feed seat 21 and the slight movement of the third feed seats 23a, 23b, the conical surface 34, the cylindrical surface % and the cone of the multifunctional grinding wheel 3 are made as shown in (4) - (8) - (4) of Fig. 9 The face 36 is sequentially slidably rubbed against the workpiece 1 'by this', and can be chamfered according to the processes of rough grinding, semi-finishing and fine grinding. Figures 10 and 11 are the second embodiment of the present invention, and are the same as the first embodiment. The components are denoted by the same reference numerals. The chamfering grinding wheels 3a, 3b are mounted on the chamfering grinding wheel shafts 31a, 31b which are driven to rotate by the chamfering grinding wheel motors 32a, 32b as in the first embodiment - only the chamfering grinding wheel shaft 3 The configuration of a, 3, b is different from that of the first embodiment. 201134609, second real The upper chamfering grinding wheel 3a and the lower chamfering grinding wheel 3b in the example are arranged to be offset by an equal angle with respect to the linear center with respect to the γ direction and to grind the upper outer peripheral angle and the lower outer peripheral angle of the workpiece 1, the straight line X. Through the center of the workpiece 0', the workpiece, the position a contacting the upper chamfering grinding wheel 3a and the center of the workpiece is a0, and the position where the workpiece i is in contact with the lower chamfering grinding wheel 3b is connected to the center of the workpiece. B0, the bisector of the angle formed by the connection a〇 and the series (10) is located on the straight line X. The angle α is a small angle of not more than 9 degrees. However, it is advantageous for the chamfering wheel motor 32a, the coffee machine and the grinding wheel. The setting of the seat 24 is preferably a good angle α. The chamfered stone of the upper chamfering grinding wheel 3 a is less than the station q 1 Q $ The chamfering wheel wheel 31b of the moonstone y axle 31a and the lower chamfering grinding wheel 3b is located above and below the wei... and the outer circumferential outer side with respect to the workpiece Offset, and along with the line a. , b. The orthogonal horizontal direction setting 'the upper chamfering grinding wheel motor 323 and the lower chamfering grinding wheel motor 32b for driving the rotation of the chamfering grinding wheel shafts 31a, 31b are disposed on the same grinding wheel holder 24, and the chamfering grinding wheels 3a, 3b are on the outer circumference thereof. The surface is slid from the inner side of the workpiece toward the outer side to rub the upper outer peripheral corner and the lower outer peripheral corner of the workpiece 1, that is, the chamfering grinding wheels 3a, 3b are rotated in the direction indicated by the arrow R in Fig. 11 . The wheel head 24 is disposed on the first lateral feed seat 29 in such a manner as to be freely movable and positioned in the Z direction, and the first-lateral feed seat 29 is fitted to the base 2 in such a manner as to be freely movable and positioned in the γ direction. Then, by moving the first lateral feed holder 29 toward the workpiece 1 in the 丫 direction, the chamfering grinding wheel 3a, such as the outer peripheral surface, simultaneously contacts the upper outer peripheral angle and the lower outer peripheral angle of the workpiece 1. The machining error caused by the wear of the chamfering wheels 3a, 3b can be corrected by adjusting the feed amount in the Y direction of the first cross feed seat 29, and the chamfered surface 16 of the workpiece caused by the wear of the chamfering grinding wheels 3a, 3b The angular error can be corrected by moving the 12 201134609 wheel base 24 in 2 directions. The outer circumference stone y wheel 5 is disposed on the workpiece 1 and is provided with the chamfering wheel 3 on the reverse side, and the outer circumference grinding wheel 5 is in the direction of the skirts - 3b, and the seat 3 〇 can be freely moved in the Y direction on the base 2 〇 The second transverse outer peripheral grinding wheel 5 moves and positions the workpiece, the ice cutting direction of the rod 1 is the γ direction, and the angular grinding wheels 3a, 3b and the outer moon ^ ς μ s are ground and inverted by the inverted outer peripheral surface. At the same time, the workpiece 5 can be balanced with the force of the workpiece A a 3b and the peripheral grinding wheel. The invention uses the chamfering grinding wheel 3a, 3 to slide the workpiece! ", A chamfered surface 16 from the inner side of the member 1 toward the outer side and the surface chamfering, it is possible to suppress the occurrence of debris at the angle 18 between the workpiece 1 and the conventional first and a7, so that the outer surface force grinding can be performed. In the case of one-time grinding, chamfering, and grinding, and finishing, the grinding and polishing are performed in the three steps, and the processing steps are greatly reduced. [Simplified Schematic] FIG. 1 is a view of the present invention. Figure 2 is a plan view of each of the grinding wheels and the workpiece of the present invention. Figure 3 is a partial front view of the workpiece after chamfering. Figure 4 is a partial top view of the workpiece after chamfering. Figure 5 is a perspective view of the present invention Figure 6 is a front view of the present invention. Figure 7 is a plan view of the present invention. Figure 8 is a top plan view of the stone wheel and the workpiece of the present invention. Figure 9 (a) (b) (c) FIG. 1 is a front view of another embodiment of each of the grinding wheel and the workpiece of the present invention. FIG. 11 is a front view of another embodiment of each of the grinding wheel and the workpiece of the present invention. Figure 1 2 is the main structure of the chamfering device of the prior art Fig. 1 is a partial plan view of a workpiece after chamfering by a chamfering device of the prior art. [Description of main components] 1 workpiece 1 〇 holder base 1 2 workpiece holder 15 outer peripheral surface 16 chamfered surface 17 Table, back 18 corners 20 base 21 first feed seat 22 second feed seats 23a, 23b third feed seats 24, 24a, 24b wheel base 25 fourth feed seat 26 fifth feed seat 27, 28 arm 29 first transverse feed seat 30 second transverse feed seat 3 multi-function chamfering grinding wheel 3a upper chamfering grinding wheel 14 201134609 3 b lower chamfering grinding wheel 31a ' 31b chamfering grinding wheel shaft 32a on chamfering grinding wheel motor 32b Chamfering wheel motor 35 cylindrical surface 34, 36 Conical surface 41 X-direction guide 42 Z-direction first guide 43 Y-direction guide 44a, 44b Z-direction second guide 46 Z-direction third guide 5 peripheral grinding wheel 52 Peripheral grinding wheel motor 7 inner circumference grinding wheel 7 2 inner circumference grinding wheel motor a workpiece contact with upper chamfering grinding wheel position b workpiece contact with lower chamfering grinding wheel position 〇 workpiece center d chamfering grinding wheel sliding friction direction R chamfering grinding wheel rotation Direction 15

Claims (1)

201134609 .七、申請專利範圍: 1. -種圓板狀卫件之外周加工裝置,其特徵在於, 該圓板狀工件之外周加工裝置具備: 旋轉工件軸,該工件轴以轴心處於錯直方向的方式設 置; °又 工件保持器’該工件保持器設於該工件軸的上端並水 平地保持作爲加工物件的圓板狀工件; 圓板狀的上倒角砂輪,該上倒角砂輪以其外周面一處 滑動摩擦所述工件的上外周角; 圓板狀的下倒角砂輪,該下倒角砂輪以其外周面一處 滑動摩擦所述工件的下外周角;以及 上倒角砂輪馬達與下倒角砂輪馬達,該倒角砂輪馬達 驅動上 '下倒角砂輪旋轉; 所述上倒角砂輪和下倒角砂輪配置於所述工件的上方 和下方; 所述上倒角砂輪和下倒角砂輪的滑動摩擦方向都爲從 所述工件的表面和背面朝向外周面的方向。 2. 如申請專利範圍帛項所述之圓板狀卫件之外周加 工裝置,其中所述上倒角砂輪的倒角砂輪軸和下倒角砂幹 的倒角砂輪軸以相互平行且與所述工件軸正交的方式配^ 於所述工件的上方和下方且相對於工件的外周靠外側的位 篆。 3_如申請專利範圍帛2項所述之圓板狀工件之外周加 工裝置,其中所述上倒角砂輪和下倒角砂輪被袭配成在工 件的直徑方向獨立地自由移動和自由定位。 16 201134609 4·如申請專利範圍第2項所述之圓板狀工件之外周加 工裝置,其中所述上倒角砂輪和下倒角砂輪被裝配成在工 件的直徑方向及工件軸的軸線方向獨立地自由移動和自由 定位。 5. 如申請專利範圍第2至4項任一項所述之圓板狀工件 之外周加工裝置’其進一步具備外周砂輪,該外周砂輪以 其外周面一處滑動摩擦所述工件的外周面,該外周砂輪裝 配於進給座上’該進給座在與上倒角砂輪和下倒角砂輪的 倒角砂輪軸平行的方向移動和定位,所述上倒角砂輪和下 倒角砂輪裝配於所述進給座的各砂輪座上,在通過所述進 給座朝向離開所述工件的方向移動而使外周砂輪離開工件 時’上倒角砂輪和下倒角砂輪移動到位於工件的直徑兩端 的位置。 6. 如申請專利範圍第彳項所述之圓板狀工件之外周加 工裝置,其中所述上倒角砂輪的倒角砂輪軸和下倒角砂輪 的倒角砂輪軸配置在相對於所述工件靠外側的位置,所述 工件跟上倒角砂輪和下倒角砂輪相接觸的接觸位置與工件 的中心連結起來的連線所形成的夾角不大於90度,所述上 倒角砂輪和下倒角砂輪一起被裝配成在該夾角的二等分線 平行的方向以及工件軸的軸線方向自由移動和自由定位7。 八、圖式·(如次頁) 17201134609. VII. Patent application scope: 1. A peripheral processing device for a circular plate-shaped guard, characterized in that the outer peripheral processing device of the circular plate-shaped workpiece has: a rotating workpiece shaft, the workpiece shaft is in a straight line with the axis Directional setting; ° Further workpiece holder 'The workpiece holder is disposed at the upper end of the workpiece shaft and horizontally holds the disc-shaped workpiece as the workpiece; the disc-shaped upper chamfering grinding wheel, the upper chamfering grinding wheel a peripheral surface of the outer peripheral surface of the workpiece is slidingly rubbed; a lower chamfering grinding wheel having a circular plate shape, the lower chamfering grinding wheel slidingly rubs a lower outer peripheral angle of the workpiece with a peripheral surface thereof; and an upper chamfering grinding wheel a motor and a lower chamfering grinding wheel motor, the chamfering grinding wheel motor driving the upper lower chamfering grinding wheel; the upper chamfering grinding wheel and the lower chamfering grinding wheel are disposed above and below the workpiece; the upper chamfering grinding wheel and The sliding rubbing direction of the lower chamfering grinding wheel is a direction from the front surface and the back surface of the workpiece toward the outer peripheral surface. 2. The outer peripheral processing device of the disc-shaped guard according to the scope of the invention, wherein the chamfering grinding wheel shaft of the upper chamfering grinding wheel and the chamfering grinding wheel shaft of the lower chamfering sand are parallel to each other and The workpiece axes are orthogonal to each other and are positioned above and below the workpiece with respect to the outer circumference of the workpiece. 3_ The outer peripheral processing apparatus of the disc-shaped workpiece according to claim 2, wherein the upper chamfering grinding wheel and the lower chamfering grinding wheel are arranged to be independently freely movable and freely positioned in the diameter direction of the workpiece. The outer peripheral processing device of the disc-shaped workpiece according to the second aspect of the invention, wherein the upper chamfering grinding wheel and the lower chamfering grinding wheel are assembled to be independent in the diameter direction of the workpiece and the axial direction of the workpiece shaft. Free movement and free positioning. 5. The disk-shaped workpiece peripheral processing device according to any one of claims 2 to 4, further comprising: a peripheral grinding wheel that slides around the outer peripheral surface of the workpiece with its outer peripheral surface, The peripheral grinding wheel is mounted on the feeding seat. The feeding seat is moved and positioned in a direction parallel to the chamfering grinding wheel shaft of the upper chamfering grinding wheel and the lower chamfering grinding wheel, and the upper chamfering grinding wheel and the lower chamfering grinding wheel are assembled The upper chamfering grinding wheel and the lower chamfering grinding wheel are moved to the diameter of the workpiece at each of the grinding wheel seats of the feeding seat when the outer grinding wheel is moved away from the workpiece by the feeding seat moving away from the workpiece. The location of the end. 6. The disc-shaped workpiece peripheral processing apparatus according to claim 2, wherein the chamfering grinding wheel shaft of the upper chamfering grinding wheel and the chamfering grinding wheel shaft of the lower chamfering grinding wheel are disposed relative to the workpiece By the position of the outer side, the angle formed by the contact position of the workpiece in contact with the chamfering grinding wheel and the lower chamfering grinding wheel and the connection of the center of the workpiece is not more than 90 degrees, and the upper chamfering grinding wheel and the lowering The angle grinding wheels are assembled together to be freely movable and freely positioned 7 in the direction parallel to the bisector of the included angle and in the axial direction of the workpiece axis. Eight, schema · (such as the next page) 17
TW100106317A 2010-02-26 2011-02-25 Device for processing outer periphery of disk-like workpiece TW201134609A (en)

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
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JP5988765B2 (en) * 2012-08-13 2016-09-07 ダイトエレクトロン株式会社 Wafer chamfering method, wafer chamfering apparatus, and jig for angle adjustment
JP2019072788A (en) * 2017-10-13 2019-05-16 オリンパス株式会社 Processing method, processing device and grindstone
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Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2180404Y (en) * 1993-08-03 1994-10-26 华南理工大学 Glass edge grinder
US5989108A (en) * 1996-09-09 1999-11-23 Koyo Machine Industries Co., Ltd. Double side grinding apparatus for flat disklike work
JP2000198057A (en) * 1998-10-26 2000-07-18 Komatsu Electronic Metals Co Ltd Device for mirror-finishing chamfered surface of semiconductor wafer
JP2000218482A (en) * 1999-01-28 2000-08-08 Daido Steel Co Ltd Paper sheet type end face polsher
JP2004050345A (en) * 2002-07-19 2004-02-19 Hitachi Zosen Corp Processing device for outer periphery of thin plate-like work
JP5020603B2 (en) * 2006-11-15 2012-09-05 ショーダテクトロン株式会社 Glass substrate chamfering equipment
JP5112703B2 (en) * 2007-01-18 2013-01-09 ダイトエレクトロン株式会社 Wafer chamfering method and apparatus
JP2008264941A (en) * 2007-04-20 2008-11-06 Yuhi Denshi Kk Device and method for polishing disc-shaped workpiece

Cited By (4)

* Cited by examiner, † Cited by third party
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