TW201343328A - Composite chamfering processing device of columnar ingot, and method for performing cylinder grinding work and notch grinding work on work by using the same - Google Patents

Abstract

To solve a problem of desiring to shorten the cylinder grinding work of an outer peripheral surface of a cylindrical ingot block, and to highly accurately detect a crystal azimuth of a work. After performing the cylinder grinding of a columnar work w by a pair of cup wheel type rough grinding wheels 10g and 10g, then, finishing the grinding of the work is performed by using one cup wheel type finishing grinding wheel 11g, next, the crystal azimuth of the work is measured by an XRD machine, and notch work is performed on the work by an inverse V-shaped grinding wheel 12g or orientation flat grinding work is performed by using the cup wheel type rough grinding wheel 10g.

Description

Composite lead angle processing device for cylindrical workpiece and composite lead angle processing method for cylindrical workpiece

The present invention relates to a composite angle forming apparatus for performing cylindrical grinding processing and V-grooving processing on a cylindrical ingot (workpiece) of a crystalline compound such as sapphire or single crystal germanium; and using the outer peripheral surface of the cylinder of the workpiece After the cylinder is polished, the crystal orientation of the workpiece is detected by an X-ray diffraction crystal orientation measuring device (XRD (X-Ray Diffraction)), and then the crystal orientation of the workpiece is centered and then grooved. A method of machining a corner of a workpiece that is ground.

Cylindrical sapphire for raw materials of sapphire substrates for LED substrates. The ingot (workpiece) is cut into the appropriate length in the crystal direction by the ingot grown by the Chai method (CZ method) or the Vernei single crystal cultivation method (for example, 250 mm, 500 mm, 1,000 mm). ) to form an ingot. sapphire. The crystal orientation of the ingot has an a-plane, an r-plane, an m-plane, and a c-plane alignment. Cylindrical sapphire. The ingots are 2 inches, 4 inches, and 6 inches in diameter, and the diameter of the single crystal ingots can be obtained from the market by 8 inches, 10 inches, 12 inches, and 20 inches.

After the surface of the cylindrical ingot (workpiece) is subjected to the angle forming process by the cylindrical polishing apparatus for the substrate or the LED substrate for the semiconductor device, the workpiece subjected to the lead angle processing is mounted on the jig including the pair of the headstock and the tailstock. In the mechanism, X-rays are irradiated to the workpiece from the XDR device, the crystal orientation of the workpiece is measured, and the crystal orientation of the workpiece to be grooved or oriented is polished, and then, along the crystal orientation of the marked mark, The grooving process is performed by inverting the V-shaped grinding wheel, or the orientation plane processing is performed by the grinding wheel. again The workpiece marked with the crystal orientation is cut along the crystal orientation by a wire saw to form a substrate (wafer) having a thickness of 750 to 950 μm.

In paragraph 0008 of Japanese Laid-Open Patent Publication No. 2009-298676 (Patent Document 1), the following paragraphs are described as follows: "The cylindrical ingot is subjected to cylindrical grinding of the outer peripheral surface by a grinding wheel type grindstone, and the orientation plane (generally referred to as " After grinding or cutting the Orientation flat") or the standard surface (referred to as "Index Flat"), the ingot is sliced into a thickness of 200 to 900 μm by a wire-cutting saw to fabricate the wafer. Furthermore, paragraphs 0020-0023 describe the following: "The orientation plane is formed by cutting a portion of the outer circumference of the circular semiconductor substrate in a direction parallel to the crystal orientation to thereby specify a crystal orientation, and the standard plane is formed together with the orientation plane. The outer surface of the semiconductor substrate is used to judge the front and back. However, in order to judge the front and back of the semiconductor substrate, the orientation plane and the standard surface must be formed at an asymmetrical position with respect to the center of the semiconductor substrate. The orientation plane specific crystallization of the sapphire substrate Orientation (11-20 direction)".

Further, in paragraphs 0002 to 0004, "sapphire" is a single crystal (melting point: about 2050 ° C) of alumina having a hexagonal crystal structure. The sapphire single crystal is used as a substrate material such as a GaN film-forming substrate for a blue LED. When the sapphire single crystal is an anisotropic material and the GaN film forming wafer is cut out from the sapphire single crystal ingot, the main surface of the wafer is generally perpendicular to the c-axis of the sapphire single crystal <0001. > The way of the face (c face) is cut out. Further, since sapphire is an optical uniaxial transparent material, it can be used as an optical material such as a film for a liquid crystal projector, and when it is used as an optical material, it is required to be colorless and transparent. Moreover, according to the polarizing characteristics of the sapphire single crystal, In the case of the above-described substrate material, a c-plane substrate having a surface perpendicular to the c-axis as a main surface is mainly used.

Japanese Laid-Open Patent Publication No. Hei 7-308849 (Patent Document 3) discloses that the surface of a cylindrical ingot (workpiece) having a hanger mechanism including a pair of headstocks and a tailstock is subjected to angle forming by a cylindrical grinding device. Then, the workpiece is irradiated with X-rays by the XDR device, the crystal orientation of the workpiece to be oriented plane processing is measured, and the rotation of the workpiece is stopped at the orientation plane position, and the method of orienting the surface to be processed by the grindstone is determined.

Further, in Japanese Laid-Open Patent Publication No. 2009-186181 (Patent Document 4), an X-ray diffraction crystal orientation measuring device for measuring the crystal orientation of a cylindrical ingot is shown in Fig. 2, and X-ray diffraction is shown in Fig. 6. In the cylindrical polishing apparatus for cylindrical ingots of the crystal orientation measuring device, paragraphs 0070 to 0077 and paragraphs 0085 to 0089 describe the method of measuring the crystal orientation h of the cylindrical ingot and then moving the ingot to the first transfer robot to FIG cutting the lead angle of the machine shown in FIG. 3, on the premises, the crystal orientation perpendicular to the axial direction of the first cut surface polishing h Wa _1, made of a first new cutting surface ₃ Wa, and polishing the second direction opposite to the cut surface Wa _2, made new second cutting surface Wa _4, and then, a first transfer robot having a vertical cutting plane W _3, W ₄ of the ingot is transferred to a cylindrical jig apparatus of the polishing apparatus, a cylindrical shape using a cylindrical grindstone The outer peripheral surface of the ingot is subjected to cylindrical grinding. Further, in the description of FIG. 10 and paragraph 0090 of Patent Document 5, it is disclosed that the radial direction crystal orientation k of the ingot subjected to the cylindrical grinding process is measured by the X-ray diffraction crystal orientation measuring device, and the crystal orientation is in the radial direction of the ingot. Taking k as a reference, the orientation plane is formed by the above-described cylindrical grinding device.

Japanese Laid-Open Patent Publication No. 2009-233819 (Patent Document 5) discloses a A cylindrical polishing apparatus for a single crystal ingot, comprising: a clamp mechanism for holding a single crystal ingot to rotate around a shaft; a cylindrical grinding wheel movable in a direction of a rotation axis of the single crystal ingot; and the single crystal ingot a grinding stone for orienting a plane and/or a grooving process; and the cylindrical polishing apparatus for the single crystal ingot includes at least a camera that acquires a side image of the single crystal ingot marked with a mark based on a crystal line; An image processing mechanism comprising: a controller for processing the acquired image, identifying a position of the mark for memory; and an X-ray diffraction device for performing X-ray diffraction measurement on a crystal orientation of the single crystal ingot; The image processing means stores the position of the marked mark, and the ingot is rotated around the shaft by the jig, and the cylindrical grinding wheel is moved in the rotation axis direction of the ingot to perform the side surface of the ingot After the cylinder is polished, the X-ray diffraction measurement of the crystal orientation of the ingot is performed by the X-ray diffraction device, and the position of the mark is used as a reference, and the measurement is performed according to the above Determining a position of the diffraction peak of the crystal orientation of a specific, and the position of the above-described determined as a reference plane oriented and / or grooving in any of the foregoing positions by the above grindstone.

Further, Japanese Laid-Open Patent Publication No. 2005-219506 (Patent Document 6) proposes a positioning processing method for a single crystal ingot, which is characterized in that a single crystal ingot is rotatably supported around a main axis, and the single crystal is supported. The outer peripheral track of the ingot is preset with a grinding reference position for forming a crystal plane index such as an orientation flat or a groove on the outer peripheral surface of the single crystal ingot; for measuring the single crystal ingot by X-ray diffraction measurement a measuring point of the lattice surface; and an index confirmation point for detecting a crystal surface index formed on the single crystal ingot; and the positioning processing method of the single crystal ingot comprises the following steps: The index confirmation position detecting step detects a relative angle between the polishing reference position and the index confirmation point as a center; and a measurement position detecting step of detecting the difference between the indicator confirmation point and the measurement point The relative angle of the spindle is centered; the lattice surface detecting step is to irradiate the X-ray to the measuring point, and detect the intensity of the X-ray reflected from the measuring point, thereby detecting the lattice plane of the single crystal ingot; a positioning step of, after the lattice surface detecting step, rotating the single crystal ingot to confirm the relative angle detected in the position detecting step based on the index and the relative angle detected in the measuring position detecting step And a relative angle centered on the main axis between the polishing reference position and the measurement point, thereby positioning the lattice plane of the single crystal ingot at the polishing reference position; and the polishing step, wherein the polishing reference position is Centering the outer peripheral surface of the single crystal ingot to form a crystal surface index on the outer peripheral surface of the ingot; and the above measurement In the position detecting step, the positioning jig for the single crystal ingot is rotatably supported by the center of the spindle, and the position of the rotation angle when the crystal face index of the positioning jig is detected by the above-mentioned index confirmation point is detected, and the positioning is detected by the measurement point. The relative angle between the above-mentioned index between the above-mentioned index confirmation point and the above-mentioned measurement point is detected by the rotation angle position of the crystal lattice surface of the crystal plate on the jig.

Japanese Laid-Open Patent Publication No. 2002-164311 (Patent Document 7) discloses an orientation flat processing method for an ingot, which is characterized in that grinding with a grindstone has been studied. a method of performing orientation planar processing by grinding an ingot of a cylindrical semiconductor crystal, and having the steps of: fixing the ingot to a spindle portion; and performing an orientation plane processing with the ingot by X-ray using an X-ray azimuth measuring mechanism Locating the peak of the 110th surface on the opposite side; measuring the diameter of the ingot; and measuring the position of the indenter fixed to the main shaft portion with respect to the ingot fixed to the main shaft portion; based on the detected position a coordinate measuring a positional shift amount between a central axis of the ingot and a central axis of the main shaft portion; and adjusting a grinding position of the grindstone based on the spindle portion based on the measured diameter and the positional shift amount Measuring the diameter is performed by rotating the ingot 90 degrees around the central axis of the main shaft portion, at a position after the orientation plane processing position and the peak search position are rotated by 90 degrees, based on a pair of The probe performs the position coordinate detected in the state in which the above-mentioned ingot is clamped, and the step of abutting the probe to the ingot and measuring the above position The step of shifting is performed at a position where the ingot is rotated by 270 degrees around the central axis of the main shaft portion, and one of the abutting faces of the probe abuts against the ingot on the side opposite to the orientation flat processing position. The side surface detects a coordinate of the position of the probe, and based on the position coordinate, measures a positional deviation of a central axis of the ingot and a central axis of the main shaft portion.

On the other hand, in Japanese Laid-Open Patent Publication No. 2005-255463 (Patent Document 8), it is disclosed in FIG. 1 that the cylindrical grinding process (101) of the ingot is performed. Orientation plane processing (102) of the ingot, followed by wafer slicing of the ingot by a wire saw (103), and thereafter, a step diagram of the wafer peripheral polishing process (104).

Further, Japanese Laid-Open Patent Publication No. 2011-136382 (Patent Document 9) discloses an in-angle forming apparatus 500 of the ingot shown in Fig. 3, which is an R angle of four corners of a diagonal columnar ingot of one grinding car 9g. The cylindrical grinding process is controlled, and the pair of coarse grinding stones 10g and 10g are used to control the four-sided plane of the diagonal column ingots. Then, a pair of precision grinding stones 11g and 11g are used. The four-sided guide surface is synchronously controlled to perform the grinding process, thereby completing the lead angle.

Japanese Patent Publication No. 2000-158123 (Patent Document 10) discloses an ingot transfer robot and an ingot transfer method.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-298676

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-207992

[Patent Document 3] Japanese Patent Laid-Open No. Hei 7-308849

[Patent Document 4] Japanese Patent Laid-Open Publication No. 2009-186181

[Patent Document 5] Japanese Patent Laid-Open Publication No. 2009-233819

[Patent Document 6] Japanese Patent Laid-Open Publication No. 2005-219506

[Patent Document 7] Japanese Patent Laid-Open Publication No. 2002-164311

[Patent Document 8] Fig. 1 of Japanese Laid-Open Patent Publication No. 2005-255463

[Patent Document 9] Fig. 3 of Japanese Laid-Open Patent Publication No. 2011-136382

[Patent Document 10] Japanese Patent Laid-Open Publication No. 2000-158123

The apparatus of the cylindrical polishing apparatus described in Patent Document 5 is downsized as a whole, and the processing time of the ingot is also compared with the orientation flat polishing machine in which the cylindrical polishing apparatus and the crystal orientation processing apparatus are connected as described in the above-mentioned Patent Document 4. The advantage of shorter.

The present inventors have found that one of the cylindrical polishing apparatuses described in Patent Document 5 can be shortened by adding one of the grinding wheel type grinding stones disclosed in the composite corner forming apparatus disclosed in Patent Document 9. In the technique of the barrel polishing time, the cylindrical polishing processing time can be shortened compared to the orientation flat polishing machine described in Patent Document 4, and the inverted V-shaped grinding wheel can be used as the grinding stone for grooving. Further, the present invention can be completed by performing grooving processing using an inverted V-shaped grinding wheel and performing orientation flat processing using the above-described grinding wheel type grinding stone.

According to a first aspect of the present invention, a composite corner forming apparatus (1) for a cylindrical workpiece is provided, comprising: a stage propulsion mechanism (200) for mounting a spindle head (7a) having a centering function; The moving table (4) of the clamp device (7) of the tailstock (7b) slides on the first guide rail (100) extending in the left-right direction; and the moving table (4) and the crane on which the clamp device (7) is placed a cylindrical crystal ingot (workpiece) is placed on the jig device to form a processing table (S _w ); and the workpiece is carried out by the front side facing the first rail (100) and from the left side to the right side. On the front side of the first rail (100), a loading/unloading station (S ₁ ) of the workpiece is formed by the processing table (S _w ) and the workpiece loading/unloading mechanism (300); on the right side of the processing table (S _w ) , in a direction perpendicular to the C axis of the workpiece on the support shafts (7a ₁ , 7b ₁ ) of the clamp device relative to the hanger, the bearing C is placed between the C axis and the C axis in a forward and backward manner cylindrical grinding wheel for polishing wheel spindle type roughing grindstone (10g, 10g) of (10o, 10o), and by the processing station (S _w) above Wheel spindle (10o, 10o) is formed rough grinding station (S _gr); to the right of the rough grinding station (S _gr) and of the first guide rail (100) prior to side with respect to the orthogonal axis C of the workpiece, the manner of the workpiece dimension measuring means (20), formed workpiece of the workpiece dimension measuring means (20) and the machining station (S _w) diameter of measurement stage (S _m); to the workpiece path of the measuring table (S _m) The right side of the first rail (100) and the rear side of the first guide rail (100) are in a direction perpendicular to the C axis of the workpiece on the support shafts (7a ₁ , 7b ₁ ) of the clamp device, and can be moved forward and backward. a grinding wheel spindle (11o) for a grinding wheel type grinding wheel (11g) for bearing cylinder grinding, and a finishing grinding table (S _gf ) formed by the processing table (S _w ) and the grinding wheel spindle (11o); The support shaft (7a ₁ , 7b _{1 )} with respect to the hanger on the clamp device is provided on the right side of the workpiece diameter measuring table (S _m ) and on the front side of the first rail (100) so as to be movable forward and backward and liftable an inverted V-shaped grinding wheel bearing (12g) on the C-axis of the workpiece) located at right angles to the direction of the wheel spindle (12o), and by the upper machining table (S _w) Wheel spindle (12o) is formed groove polishing cutting machining table (S _gn); to the grooving grinding right table (S _gn) of and said first guide rail (100) prior to the side, forming a crystalline orientation measuring station (S _XDR), The X-ray azimuth position measuring machine (XDR) measures the crystal orientation of the workpiece on the support shafts (7a ₁ , 7b ₁ ) of the clamp device, so that the support shaft of the spindle table (7a) of the clamp device ( 7a ₁ ) Rotate to rotate the workpiece and stop at the crystal orientation position where grooving or oriented plane machining is to be performed.

According to a second aspect of the present invention, in a composite lead angle processing apparatus (1) of a cylindrical workpiece according to the first aspect, the tailstock (7b) of the clamp mechanism (7) constituting the first aspect is provided in a built-in pressing shaft. (7S) The workpiece support shaft (7b ₁ ) has a three-touch sensor (7t) on the ring collar on the front side of the housing, which is opposite to the core including the grinding wheel spindle (10o, 10o). The plane parallel is set to two (7t _r , 7t _l ) on the left and right, and one (7t _u ) on the upper side.

According to a third aspect of the present invention, there is provided a method for processing a composite lead angle of a cylindrical workpiece (w), characterized in that a composite lead angle processing device (1) of a cylindrical workpiece according to claim 1 is used, and a circle is performed by the following steps Tube grinding and grooving: 1). Using the workpiece loading and unloading mechanism (300), the cylindrical workpiece (w) is suspended from the spindle table of the clamp mechanism (7) on the loading/unloading station (S ₁ ) (7a) and the tailstock (7b); 2). The workpiece table (4) carrying the jig mechanism (7) on the loading/unloading table (S ₁ ) is subjected to rough grinding on the first rail (100) The table (S _gr ) is moved in the right direction, and the grinding wheel main shaft (10o, 10o) of the pair of cylindrical grinding wheel type coarse grinding stones (10g, 10g) is advanced and rotated against the cylindrical workpiece. Connected to the cylindrical workpiece (w), and the rough guide angle is processed by sliding friction; 3). The workpiece table (4) of the clamp mechanism (7) of the cylindrical workpiece (w) equipped with the hanger through the thick lead angle the workpiece on the first guide rail (100) of diameter measurement stage (S _m) where the direction of movement of the right hand, and the workpiece dimension measuring means (20) measuring a cylindrical workpiece (w) of radius (R _r) 4). The workpiece table (4) of the jig mechanism (7) of the cylindrical workpiece (w) on which the hanger has been formed into a desired diameter is formed on the first guide rail (100) on the refining processing table (S _gf ) is moved in the right direction, and the grinding wheel spindle (11o) of the grinding wheel type grinding stone (11g) for bearing cylinder grinding advances against the cylindrical workpiece and rotates to abut against the cylindrical workpiece. Fine-angle machining by sliding friction; 5). The workpiece table (4) of the clamp mechanism (7) of the cylindrical workpiece (w) equipped with the hanger through the precision angle is placed on the first guide rail (100) on the workpiece The measuring table (S _m ) of the diameter moves in the left direction, and the diameter (R _f ) of the cylindrical workpiece is measured by the workpiece size measuring mechanism (20); 6). The mounted hanger has become the desired path of the fine guide The workpiece table (4) of the clamp mechanism (7) of the angular workpiece (w) is moved in the right direction of the crystal orientation measuring table (S _XDR ) on the first rail (100), and is in the X-ray orientation. position measuring machine (XDR) measuring the hanger (7) of the cylindrical workpiece to the jig apparatus including a crystal orientation, the spindle table (7a) of said chuck means of the support shaft (7a ₁₎ of rotation, and The cylindrical workpiece (w) is rotated and stopped at the crystal orientation position where the grooving process is to be performed; 7). The workpiece table (4) of the clamp mechanism (7) mounted on the cylindrical workpiece (w) at the crystal orientation position is The first guide rail (100) is moved in the left direction of the grooving processing table (S _gn ), and the grinding wheel spindle (12o) of the bearing inverted V-shaped grinding wheel (12g) is advanced to the hanger device (7). The cylindrical workpiece (w) has a crystal orientation position above and then descends, and the incision is made by grinding the slit at the crystal orientation position of the cylindrical workpiece (w) by the inverted V-shaped grinding wheel (12g); 8). The workpiece table (4) of the clamp mechanism (7) of the cylindrical workpiece (w) of the slat is moved on the first guide rail (100) in the left direction of the loading/unloading table (S ₁ ) of the workpiece, Next, the cylindrical workpiece (w) is carried out from the jig mechanism (7) to the outside of the composite corner forming device (1) by using the workpiece carry-in/out mechanism (300).

According to a fourth aspect of the present invention, there is provided a method for processing a composite lead angle of a cylindrical workpiece (w), characterized in that a composite lead angle processing device (1) of a cylindrical workpiece according to claim 1 is used, and a circle is performed through the following steps Tube polishing and orientation plane processing: 1). Using the workpiece loading and unloading mechanism (300), the cylindrical workpiece (w) is suspended from the spindle table of the clamp mechanism (7) on the loading/unloading station (S ₁ ) (7a) and the tailstock (7b); 2). The workpiece table (4) carrying the jig mechanism (7) on the loading/unloading table (S ₁ ) is subjected to rough grinding on the first rail (100) The table (S _gr ) is moved in the right direction, and the grinding wheel main shaft (10o, 10o) of the grinding wheel type coarse grinding stone (10g, 10g) for a pair of bearing cylinders is advanced and rotated with respect to the cylindrical workpiece. Connected to the cylindrical workpiece (w), and the thick guide angle is processed by sliding friction; 3). The workpiece table (4) of the clamp mechanism (7) of the cylindrical workpiece (w) equipped with the hanger through the thick lead angle The first guide rail (100) is moved in the right direction of the measuring table (S _m ) of the workpiece diameter, and the diameter of the cylindrical workpiece (w) is measured by the workpiece size measuring mechanism (20) (R) _r ); 4). The workpiece table (4) of the clamp mechanism (7) of the cylindrical workpiece (w) on which the hanger has become the desired diameter is formed on the first guide rail (100). The grinding table (S _gf ) is moved in the right direction, and the grinding wheel spindle (11o) of the grinding wheel type grinding stone (11g) for bearing cylinder grinding advances and rotates against the cylindrical workpiece to abut the cylindrical shape. The workpiece is subjected to fine-angle machining by sliding friction; 5). The workpiece table (4) of the clamp mechanism (7) of the cylindrical workpiece (w) on which the hanger is subjected to the fine guide angle is placed on the first guide rail (100) Moving on the left side of the measuring table (S _m ) of the workpiece diameter, and measuring the diameter (R _f ) of the cylindrical workpiece by the workpiece size measuring mechanism (20); 6). The mounting of the hanger has become a desired path. The workpiece table (4) of the clamp mechanism (7) of the cylindrical workpiece (w) processed by the fine angle is moved on the first rail (100) in the right direction of the crystal orientation measuring station (S _XDR ), and is X ray azimuth position measuring machine (XDR) measuring the crystal orientation of the cylindrical workpiece to the jig cradle means (7), the spindle table above the clamp means (7a) of the support shaft (7a ₁₎ of rotation, The cylindrical workpiece (w) is rotated and stopped at a crystal orientation position to be subjected to the orientation flat grinding process; 7). The workpiece table (4) of the clamp mechanism (7) mounted on the cylindrical cylindrical workpiece (w) at the crystal orientation position ) moving on the first guide rail (100) in the left direction of the rough grinding table (S _gr ), and making the bearing a cylindrical grinding wheel type coarse grinding stone (10g) grinding wheel spindle (10o) side opposite to the cylinder The workpiece is advanced toward the crystal azimuth position of the cylindrical workpiece (w) of the clamp device (7) and rotated to abut against the cylindrical workpiece (w), and is subjected to directional sliding grinding while sliding friction; 8). The workpiece table (4) of the jig mechanism (7) of the cylindrical workpiece (w) on which the hanger is subjected to the orientation flat grinding is placed on the first rail (100) on the left side of the loading/unloading table (S ₁ ) of the workpiece In the direction of movement, the cylindrical workpiece (w) is carried out from the jig mechanism (7) to the outside of the composite cornering device (1) by using the workpiece loading/unloading mechanism (300).

Since the composite angle-angle processing device 1 of the present invention can simultaneously use a pair of grinding wheel type coarse grinding stones 10g, 10g, and cylindrically grinding the cylindrical workpiece (w) with a grinding allowance of 0.8 to 2 mm, In the cylindrical polishing apparatus of the composite corner forming apparatus described in Patent Document 5, the cylindrical polishing processing time can be shortened to 1/2. Since the grinding allowance of 11 g of fine grinding stone is small, it is 2 to 20 μm, so 11 g of a grinding wheel type grinding stone is sufficient. By using one grinding wheel type grinding stone 11g, it is easy to arrange the workpiece size measuring mechanism 20 and the grinding wheel spindle 12o of the bearing inverted V-shaped grinding wheel 12g, so that the occupied area of the composite corner forming apparatus 1 can be occupied. miniaturization.

Further, the composite corner forming apparatus 1 of the present invention may be subjected to orientation flat grinding processing by 10 g of a grinding wheel type rough grinding stone or 11 g of a grinding wheel type grinding stone.

Further, among the three touch sensors 7t, by the two touch sensors 7t _r and 7t _l , it is confirmed that the grinding wheel for the cylindrical grinding wheel is 10 g, the position coordinate of 10 g, and the grinding wheel type grinding The position coordinates of the grindstone 11g, and by the remaining one touch sensor 7t _u , the position coordinates of the inverted V-shaped grinding wheel 12g can be confirmed, so that the wear of the grindstones 10g, 10g, 11g, 12g can be calculated. the amount.

The composite corner forming device (1) of the present invention shown in Fig. 1 has a processing table (S _w ), a loading/unloading table (S ₁ ) for a workpiece, a rough grinding table (S _gr ), and a measuring table for a workpiece diameter ( S _m ), fine grinding table (S _gf ), grooving processing table (S _gn ) and crystal orientation measuring table (S _XDR ). The above rough grinding table (S _gr ) can also be used as an oriented plane grinding table for workpieces.

The processing table (S _w ) includes a table pushing mechanism 200 that slides the first rail 100 extending in the left-right direction by the moving table 4 on which the clamp device 7 including the spindle head 7 a and the tailstock 7 b having the centering function is placed, and the table The table pushing mechanism 200 includes a ball screw fixing device 4f (see FIG. 2) provided on the bottom surface of the moving table 4, a ball screw 4b, and a ball screw driving actuator 4m; and the clamp device is placed thereon. The mobile station 4 of 7 and the cylindrical crystal ingot (w) suspended from the jig device 7 form a processing table (S _w ). The processing table (S _w ) is covered by the body covering device 400 and the pull-out door 400a.

5, the above-described system 7b provided in the tailstock are equipped with a touch sensor is provided with three push shaft 7S 7t of the annular collar of the workpiece support before 7r side shaft _{7b. 1} of the housing, wherein Two 7t _r and 7t _l are provided on the left and right sides in a manner parallel to the plane including the 10o and 10o cores of the grinding wheel spindle, and one 7t _u is provided on the upper portion. By the above two touch sensors 7t _r and 7t _l , it is possible to confirm the position coordinates of the grinding wheel type grindstone 10g, the position coordinate of 10g, and the grinding wheel type grindstone 11g by the remaining One 7t _u can confirm the position coordinates of the inverted V-shaped grinding wheel 12g, and the digit values of the position coordinates can be received by the recording unit of the numerical control device, and the wear amounts of the grindstones 10g, 10g, 11g, 12g can be calculated Department calculation. Moreover, the position coordinates of the grindstone at the start of the grinding can be corrected based on the numerical values of the position coordinates.

Loading the workpiece, the / unloading station (S ₁₎ based made toward the first guide rail front face 100 of the set on the left side, unloading work of loading mechanism side 300 forming the machining table (S _w) ie before the first guide rail 100. The workpiece loading/unloading mechanism 300 holds a pair of claws in a central portion of one workpiece (w) stored in the circular holders of the workpiece storages 14, 14, 14 to raise the two claws, thereby lifting the workpiece Then, it is moved backward, moved to the right, and lowered, and placed before the loading cassette 8, and then retracted, thereby transferring the workpiece from the loading cassette 8 to the spindle table 7a and the tailstock 7b of the jig device 7. So that it abuts the end of the workpiece headstock center 7a of the support _{shaft. 1} 7a, 7b tailstock air cylinder moves rightward, and the other end abuts on the central support shaft _{7b. 1,} the workpiece support in a state of floating. Next, the pair of claws are separated to release the grip of the workpiece, and then the fixed table 13f supporting the pair of the two claws is moved upward in the left direction, and further retracted in the forward direction to return the two claws to the standby position.

The rough grinding processing table (S _gr ) is on the right side of the loading/unloading table (S ₁ ) of the workpiece, and is at a right angle to the C axis of the workpiece of the support shafts 7a ₁ and 7b ₁ of the clamp device 7 with respect to the hanger. In the direction, the grinding wheel main shaft 10o, 10o of the pair of cylindrical grinding grinding wheel type grindstone 10g, 10g is placed between the pair of cylindrical grinding wheels so as to be movable forward and backward, and the machining table (S) _w ) Forming a rough grinding table (S _gr ) with the above-mentioned grinding wheel spindles 10o, 10o.

As shown in Fig. 2, the grinding wheel spindle 10o of the rough grinding table (S _gr ) is rotated by the first servo motors 10m ₁ and 10m ₁ and can be driven by the second servo motors 10m ₂ and 10m ₂ . Lifting. Further, the grinding wheel spindles 10o and 10o on the stone table 10t and 10t are driven by the third servo motors 10m ₃ and 10m _{3 to} rotate the ball screws 10s and 10s to advance and retreat with respect to the workpiece w. .

The workpiece diameter measuring table (S _m ) is disposed on the right side of the polishing processing table (S _gr ), that is, on the front side of the first rail 100, and the workpiece size measuring mechanism 20 is disposed to be orthogonal to the C axis of the workpiece. The workpiece size measuring mechanism 20 and the processing table (S _w ) form a measuring table (S _m ) of the workpiece diameter. As the workpiece size measuring mechanism 20, a workpiece size measuring mechanism using a laser light displacement sensor is used, and a radius distance (r) from a C axis of the workpiece to the outer circumference of the workpiece can be calculated using an image pickup device having a CCD camera and can be used. The value r is displayed on the display panel.

As shown in Fig. 1, the refining processing table (S _gf ) is on the right side of the measuring table (S _m ) of the workpiece diameter, that is, the rear side of the first rail 100, and is supported on the support shaft of the clamp device with respect to the hanger. The C axis of the workpiece on 7a ₁ and 7b ₁ is a right angle direction, and the grinding wheel spindle 11g of the grinding wheel type grinding wheel 11g for bearing cylinder grinding is set so as to be able to advance and retreat, and the above processing table (S _w ) and the above The grinding wheel spindle 11o forms a finishing table (S _gf ).

About grinding wheel type cylinder coarse grinding stone 10g, 10g and grinding wheel type cylindrical grinding stone 11g grinding wheel type grinding stone diameter, when the workpiece is 2~6 inches of sapphire substrate cylindrical ingot, it is 100~ 240 mm. Moreover, in the case where the workpiece is a single crystal germanium ingot of 8 to 12 inches, the diameter of the grinding wheel type is 1.15 to 1.45 times the diameter of the workpiece. From the viewpoint of preventing the grinding burn of the workpiece, the width of the cup-shaped grinding piece is 3 to 10 mm, and the width of the ring-shaped grinding stone is 5 to 15 mm.

The abrasive grains of the grinding wheel type cylindrical grinding stone 10g and 11g are preferably diamond abrasive grains, CBN (Cubic Boron Nitride) abrasive grains, and the bonding agent is preferably a metal adhesive or a ceramic adhesive ( Vitrified Bond), epoxy resin adhesive. For example, the grinding wheel type cylindrical grinding stone is preferably a bottomed cylindrical grinding machine as disclosed in Japanese Laid-Open Patent Publication No. Hei 9-38866, JP-A-2000-94342, or JP-A-2004-167617. a grinding wheel type grindstone in which a plurality of grindstones are arranged in a ring shape at intervals along a gap between the stone base and the grinding wheel, and is configured such that the slurry supplied to the inner side of the base is dissipated from the gap . The diameter of the ring-shaped grinding stone of the grinding wheel type cylindrical grinding stone is preferably 1.2 to 1.5 times the diameter of the workpiece. The ring-shaped grindstone of the above-mentioned grinding wheel type coarse grinding stone 10g is preferably a diamond resin adhesive grindstone of grinding number 100-280 or a diamond ceramic adhesive grindstone. Further, the ring-shaped grindstone of the grinding wheel type fine grinding stone 11g is preferably a diamond resin adhesive grindstone of a grinding number of 300 to 1,200, a diamond ceramic adhesive grindstone, or a diamond metal adhesive grindstone.

As the polishing liquid, it is preferred to use deionized water, colloidal cerium oxide aqueous dispersion, cerium oxide aqueous dispersion, SC-1 liquid, SC-2 liquid, or water in which an organic phosphorus compound is formulated in the aqueous dispersion. Dispersions.

The cylindrical rough grinding process for the workpiece by a pair of grinding wheel type patterns 10g and 10g is a plunge type cylindrical grinding process as follows: On the one hand, the workpiece stage 4 on which the jig mechanism 7 supporting the workpiece is suspended is placed in the left-right direction. The speed of 1~15 mm/min is moved, and the center support shaft 7a _{1 of} the spindle head is rotated at a rotation speed of 10 to 300 rpm, and on the other hand, one of the grinding wheel type grinding stones is rotated at a rotation speed of 800 to 3,000 rpm. The C-axis side of the main axial clamp device 7 of the 10 g grinding wheel advances, and the cutting edge position of the grinding wheel type grindstone 10g and 10g is cut from the C-axis center of the clamp device 7 to the distance of (R/2-tg) (grinding) At the start point position, the grinding process is started, and the polishing liquid is supplied to the polishing operation point at a rate of 5 to 100 cc/min, and the moving ingot is removed by the above-mentioned pair of grinding wheel type grindstones 10g and 10g in a tg mm ratio. The thickness of the outer peripheral surface of the block.

The grooving processing table (S _gn ) is disposed on the right side of the measuring path (S _m ) of the workpiece diameter, that is, on the front side of the first rail 100, and is disposed to be movable relative to the front side of the first rail 100 so as to be movable forward and backward. a grinding wheel main shaft 12o which is placed in a direction perpendicular to the C axis of the workpiece supporting the shafts 7a ₁ and 7b ₁ of the clamp device and which is inverted by the V-shaped grinding wheel 12g, and the above-mentioned processing table (S _w ) and the above-mentioned grinding wheel spindle 12o A grooving grinding station (S _gn ) is formed.

As shown in Fig. 4, the grinding wheel spindle 12o of the grooving processing table (S _gn ) is mounted on the whetstone table 12t and can be rotated by the driving of the servo motor 12m ₁ and can be driven by the servo motor 12m ₁ The drive is lifted and lowered. Further, by driving the servo motor 12m ₁ of the grindstone table 12t w forward and backward relative to the workpiece, whereby the bearing can inverted V-shaped grinding wheel spindle 12g of 12o forward and backward relative to the workpiece w. In Fig. 4, the inverted V-shaped grinding wheel 12g is indicated by a solid line at the grinding stone standby position, and is indicated by an imaginary line at the workpiece grooving processing start position.

The crystal orientation measuring station (S _XDR ) is formed by the processing table (S _w ) indicated by an imaginary line in Fig. 1 and an X-ray azimuth position measuring machine (XDR), which is in the X-ray azimuth position measuring machine (XDR) The workpiece on the support shafts 7a ₁ and 7b ₁ of the clamp device is irradiated with X-rays on the right side of the grooving processing table (S _gn ) and on the front side of the first guide rail 100, and the reflected light is received to measure the workpiece. The crystal orientation is stored and the crystal orientation is memorized; the crystal orientation measuring table (S _XDR ) has the support shaft 7a ₁ of the spindle table 7a of the clamp device rotated at the crystal orientation position of the measured workpiece, and the workpiece is rotated and stopped. The function of the crystal orientation position where grooving or oriented plane machining is to be performed.

In the case where the workpiece w is a single crystal germanium ingot, the orientation of the crystal orientation with respect to <111>, <511>, and <100> deviation (OFF) of 4° is defined as the orientation plane grinding crystal orientation. The crystal orientation of the workpiece subjected to the orientation flat grinding process or the V grooving process may be any one of the three crystal orientations (see Patent Document 5). Further, a method of positioning the crystal orientation of the workpiece by the clamp mechanism 7 is described in Patent Document 6 and Patent Document 3.

As shown in FIG. 3, an X-ray diffraction XDR having an X-ray diffraction crystal orientation measuring device constituting the above-described crystal orientation measuring table (S _XDR ) is provided with an X-ray irradiator 9a and an X-ray dimmer. 9b, CCD camera 9d, workpiece table, controller with time circuit. It can take the shooting of the workpiece, the measurement of the crystal orientation of the workpiece, the laser marking of the workpiece, the calculation of the radius from the C axis of the workpiece to the outer circumference of the workpiece. The workpiece w that is hoisted on the support shafts 7a ₁ and 7b ₁ of the above-described jig apparatus is irradiated with X-rays by the X-ray irradiator 9a, and the reflected light is received by the X-ray dimmer 9b to measure the crystal orientation of the workpiece. The 9c angle modulation knob shown in Figure 1.

The step of performing a cylindrical grinding process, a grooving process, or an orientation flat grinding process on the cylindrical workpiece (w) is performed in the following order using the composite corner-angle processing apparatus 1 shown in FIG.

1) Using the workpiece carry-in/out mechanism 300, the cylindrical workpiece (w) is suspended from the support shaft 7a ₁ and the tailstock 7b of the spindle table 7a of the chuck mechanism 7 of the loading/unloading station (S ₁ ) 7b ₁ room.

2). The workpiece stage 4 on which the jig mechanism 7 of the loading/unloading table (S ₁ ) is mounted is moved on the first guide rail 100 in the right direction of the rough grinding processing table (S _gr ), and the bearing is paired with a circle The grinding wheel type grindstone 10g and the 10g grinding wheel main shafts 10o and 10o are advanced and rotated with respect to the cylindrical workpiece to abut against the cylindrical workpiece (w), and on the one hand, the frictional processing is performed by sliding friction. Preferably, the core heights of the pair of grinding wheel spindles 10o and 10o are ground so as to be 5 to 75 mm as shown in Figs. 1 and 6a.

3). The workpiece stage 4 of the jig mechanism 7 of the cylindrical workpiece (w) on which the hanger is subjected to rough grinding is moved in the right direction of the measuring path (S _m ) of the workpiece diameter on the first rail 100, and The diameter (Rr) of the cylindrical workpiece (w) is measured by the workpiece size measuring mechanism 20.

4). The workpiece table 4 of the jig mechanism 7 of the cylindrical workpiece (w) on which the hanger has become the desired diameter is formed on the first guide rail 100 at the finishing table (S _gf ) Moving in the right direction, the grinding wheel spindle 11o of the grinding wheel type grinding wheel 11g of the bearing cylinder is advanced and rotated against the cylindrical workpiece to abut against the cylindrical workpiece, and the fine angle is processed by sliding friction (refer to Figure 6b).

5). The workpiece stage 4 of the jig mechanism 7 of the cylindrical workpiece (w) on which the hanger is subjected to the fine guide angle is moved on the first guide rail 100 in the left direction of the measuring path (S _m ) of the workpiece diameter, and The diameter (R _f ) of the cylindrical workpiece is measured by the workpiece size measuring mechanism 20.

6). The workpiece table 4 of the jig mechanism 7 of the cylindrical workpiece (w) on which the hanger has become the desired diameter is formed on the first guide rail 100 at the crystal orientation measuring station (S _XDR ) Moving in the right direction, and measuring the crystal orientation of the cylindrical workpiece on the clamp device 7 by the X-ray azimuth position measuring machine (XDR), rotating the support shaft 7a ₁ of the spindle table 7a of the clamp device, and making the cylinder The workpiece (w) rotates and stops at the crystal orientation position where the grooving process is to be performed.

7). The workpiece stage 4 of the jig mechanism 7 mounted on the cylindrical workpiece (w) in the crystal orientation position is moved on the first rail 100 in the left direction of the grooving processing table (S _gn ), and the bearing is made The grinding wheel spindle 12o of the inverted V-shaped grinding wheel 12g is advanced to the top of the cylindrical azimuth position of the cylindrical workpiece (w) of the clamp device 7, and then descends, and the inverted V-shaped grinding wheel 12g is applied to the cylindrical workpiece (w). The slit is ground at the position of the crystal orientation, and the cylindrical workpiece is grooved.

When the grooving process is not performed and the orientation flat processing is performed (refer to Fig. 6c), the following 7') orientation flat grinding process is employed instead of the above 7) step.

7'). The workpiece stage 4 of the jig mechanism 7 mounted on the cylindrical workpiece (w) in the crystal orientation position is moved on the first guide rail 100 in the left direction of the rough grinding table (S _gr ), and the bearing is made A grinding wheel spindle (10o) of a grinding wheel type coarse grinding stone (10g) is advanced and rotated against a cylindrical workpiece to a cylindrical azimuth position of the cylindrical workpiece (w) of the clamp device 7 Oriented plane grinding is performed on the cylindrical workpiece (w) while sliding friction.

8). The workpiece table 4 of the jig mechanism 7 of the cylindrical workpiece (w) on which the hanger is subjected to grooving or orientation flat processing is placed on the first rail 100 to the loading/unloading table (S ₁ ) of the workpiece. Moving in the left direction, the cylindrical workpiece (w) is carried out from the jig mechanism 7 to the outside of the composite cornering processing apparatus 1 by using the workpiece loading/unloading mechanism 300.

When the workpiece is ground, the wear loss of the grindstone has a large influence on the grinding time (grinding life). Therefore, in the above grinding process, the grindstone is brought into contact before or after the grinding process. Touch the sensor 7t, measure the position coordinates of the grindstone, and calculate the wear loss of the grindstone.

[Industrial availability]

The composite corner-angle processing apparatus 1 of the present invention compares the cylindrical grinding processing time of the crystalline compound ingot with the composite corner-angle processing apparatus of the previous cylindrical polishing apparatus and the grooving apparatus, and can perform cylindrical grinding processing. The time is shortened by about 1/2. Further, since the touch sensor 7t is attached to the tailstock 7b, it is helpful to judge the replacement time of the grindstone.

1‧‧‧Composite corner processing device

4‧‧‧Workpiece table

4b‧‧‧Ball screw

4m‧‧‧Drive actuator

6‧‧‧2nd rail

7‧‧‧Clamping mechanism

7a‧‧‧ headstock

7b‧‧‧ tail seat

7a ₁ ‧‧‧ Support shaft

7b ₁ ‧‧‧Support shaft

7t‧‧‧Touch sensor

7t _r ‧‧‧Touch sensor

7t _l ‧‧‧Touch sensor

7t _u ‧‧‧Touch sensor

8‧‧‧Loading

9a‧‧‧X-ray illuminator

9c‧‧‧ Angle Modulation Knob

10g‧‧‧ grinding wheel type coarse grinding stone

10o‧‧‧ grinding wheel spindle

10t‧‧‧Minestone

10s‧‧‧Ball screw

10m ₁ ‧‧‧1st servo motor

10m ₂ ‧‧‧2nd servo motor

10m ₃ ‧‧‧3rd servo motor

11g‧‧‧Wheel type fine grinding stone

11o‧‧‧ grinding wheel spindle

12t‧‧‧Minestone

12m ₁ ‧‧‧Servo motor

12m ₂ ‧‧‧Servo motor

12o‧‧‧ grinding wheel spindle

12g‧‧‧ inverted V-shaped grinding wheel

13‧‧‧Automatically equipped machine

13f‧‧‧Two-pronged fixed table

14‧‧‧Workpiece storage

20‧‧‧Workpiece size measuring mechanism

100‧‧‧1st rail

200‧‧ ‧ push mechanism

300‧‧‧Working and unloading of workpieces

400‧‧‧ Body Covering Device

400a‧‧‧ Pull out the door

w‧‧‧Cylindrical workpiece

S _gf ‧‧‧ fine grinding table

S _gn ‧‧‧ slotting grinding table

S _gr ‧‧‧ rough grinding table

S ₁ ‧‧‧Loading/unloading station for workpieces

S _m ‧‧‧Working table for workpiece diameter

S _w ‧‧‧Processing table

S _XDR ‧‧‧crystal orientation measuring table

XDR‧‧‧X-ray azimuth position measuring machine

Figure 1 is a plan view of a composite corner forming apparatus.

Figure 2 is a side view of the roughing station.

Figure 3 is a side view of the measuring table (S _m ) of the workpiece diameter.

Figure 4 is a side view of a grooving station (S _gn ).

Figure 5 is a top view of the tailstock.

Fig. 6 is a working view of the outer peripheral surface of the workpiece, and is viewed from the end face of the workpiece; Fig. 6a shows the rough grinding operation of the cylinder; Fig. 6b shows the finishing operation of the cylinder; Fig. 6c The orientation plane is used to mask the grinding operation.

1‧‧‧Composite corner processing device

4‧‧‧Workpiece table

4b‧‧‧Ball screw

4m‧‧‧Drive actuator

7‧‧‧Clamping mechanism

7a‧‧‧ headstock

7a ₁ ‧‧‧ Support shaft

7b‧‧‧ tail seat

7b ₁ ‧‧‧Support shaft

8‧‧‧Loading

9c‧‧‧ Angle Modulation Knob

10g‧‧‧ grinding wheel type coarse grinding stone

10o‧‧‧ grinding wheel spindle

11g‧‧‧Wheel type fine grinding stone

11o‧‧‧ grinding wheel spindle

12o‧‧‧ grinding wheel spindle

13f‧‧‧Two-pronged fixed table

14‧‧‧Workpiece storage

20‧‧‧Workpiece size measuring mechanism

100‧‧‧1st rail

200‧‧ ‧ push mechanism

300‧‧‧Working and unloading of workpieces

400‧‧‧ Body Covering Device

400a‧‧‧ Pull out the door

w‧‧‧Cylindrical workpiece

S _gf ‧‧‧ fine grinding table

S _gn ‧‧‧ slotting grinding table

S _gr ‧‧‧ rough grinding table

S ₁ ‧‧‧Loading/unloading station for workpieces

S _m ‧‧‧Working table for workpiece diameter

S _w ‧‧‧Processing table

S _XDR ‧‧‧crystal orientation measuring table

XDR‧‧‧X-ray azimuth position measuring machine

Claims (4)

A composite corner forming device (1) for a cylindrical workpiece, comprising: a table propulsion mechanism (200) for mounting a jig including a spindle head (7a) and a tailstock (7b) having a centering function The moving table (4) of the device (7) slides on the first guide rail (100) extending in the left-right direction; and the movable table (4) on which the clamp device (7) is placed and the cylindrical shape of the hanger device Forming a processing table (S _w ) with a crystalline ingot (workpiece); and placing the workpiece loading/unloading mechanism (300) before the first rail (100) with the front surface facing the first rail (100) and the left side toward the right side a loading/unloading station (S ₁ ) for forming a workpiece from the processing table (S _w ) and the workpiece loading/unloading mechanism (300); on the right side of the processing table (S _w ), in the fixture relative to the hanger The C axis of the workpiece on the support shafts (7a ₁ , 7b ₁ ) of the device is in a right angle direction, and the pair of cylindrical grinding wheels are coarsely ground by sandwiching the C axis so as to be movable forward and backward and movable up and down. Milling wheel (10g, 10g) grinding wheel spindle (10o, 10o), and the above processing table (S _w ) and the above grinding wheel spindle (10o, 10o) form a rough grinding a workpiece (S _gr ); a workpiece size measuring mechanism (20) disposed on a right side of the rough grinding table (S _gr ) and on a front side of the first rail (100) so as to be orthogonal to a C axis of the workpiece a workpiece measuring device (20) and the processing table (S _w ) forming a measuring table (S _m ) of the workpiece diameter; a right side of the measuring table (S _m ) of the workpiece diameter and the first rail (100) On the rear side, in the direction perpendicular to the C axis of the workpiece on the support shafts (7a ₁ , 7b ₁ ) of the clamp device with respect to the hanger, the grinding wheel type grinding grinding wheel for the bearing cylinder grinding is provided in a forwardly retractable manner. a grinding wheel spindle (11o) of stone (11g), and a finishing grinding table (S _gf ) formed by the processing table (S _w ) and the grinding wheel spindle (11o); on the right side of the measuring table (S _m ) of the workpiece diameter And on the front side of the first rail (100), the C axis of the workpiece on the support shaft (7a ₁ , 7b ₁ ) of the clamp device is disposed in a right angle direction so as to be movable forward and backward and movable up and down. an inverted V-shaped grinding wheel bearing (12g) of the wheel spindle (12o), and a slot is formed above the polishing wheel spindle plus (12o) by the processing station (S _w) Station (S _gn); processing the right table (S _gn) of the above-described slots polishing and said first guide rail until side (100), forming a crystalline orientation measuring station (S _XDR), which is based X-ray azimuthal position measuring machine ( XDR) measuring the crystal orientation of the workpiece on the support shaft (7a ₁ , 7b ₁ ) of the clamp device, rotating the support shaft (7a ₁ ) of the spindle table (7a) of the clamp device, and rotating the workpiece Stop at the crystal orientation position where grooving or oriented plane machining is to be performed. The composite corner forming device (1) of the cylindrical workpiece of claim 1, wherein the tailstock (7b) of the clamp mechanism (7) constituting the claim 1 is attached to the workpiece support shaft provided on the inner pressing shaft (7S) (3b ₁ ) The front annular ring of the housing is provided with three touch sensors (7t), which are arranged on the left and right in a manner parallel to the plane containing the core of the grinding wheel (10o, 10o). 2 (7t _r , 7t _l ), and 1 (7t _u ) in the upper part. A method for processing a composite lead angle of a cylindrical workpiece (w), characterized in that the composite corner forming device (1) of the cylindrical workpiece of claim 1 is used for cylindrical grinding and grooving through the following steps: 1) Using the workpiece loading and unloading mechanism (300), the cylindrical workpiece (w) is suspended from the spindle table (7a) and the tailstock (7b) of the clamp mechanism (7) on the loading/unloading station (S ₁ ) 2). The workpiece table (4) carrying the jig mechanism (7) on the loading/unloading table (S ₁ ) is placed on the first guide rail (100) on the right side of the rough grinding table (S _gr ) The direction of the movement, and the grinding wheel spindle (10o, 10o) of the pair of cylindrical grinding wheel type coarse grinding stone (10g, 10g) is advanced and rotated against the cylindrical workpiece to abut the cylindrical workpiece (w) The rough guide angle is processed by sliding friction; 3). The workpiece table (4) of the clamp mechanism (7) of the cylindrical workpiece (w) equipped with the hanger through the thick lead angle is on the first guide rail (100) Moving in the right direction of the measuring table (S _m ) of the workpiece diameter, and measuring the diameter (R _r ) of the cylindrical workpiece (w) by the workpiece size measuring mechanism (20); 4) making the mounting hanger has become desired The workpiece table (4) of the clamp mechanism (7) of the cylindrical workpiece (w) processed by the thick lead angle is moved on the first guide rail (100) in the right direction of the refining processing table (S _gf ), and The grinding wheel main shaft (11o) of the grinding wheel type fine grinding stone (11g) for bearing cylinder grinding advances against the cylindrical workpiece and rotates to abut against the cylindrical workpiece, and performs fine-angle machining by sliding friction; 5) The workpiece table (4) of the jig mechanism (7) of the cylindrical workpiece (w) equipped with the hanger through the fine angle is placed on the first rail (100) on the left side of the measuring table (S _m ) of the workpiece diameter The direction is moved, and the diameter of the cylindrical workpiece (R _f ) is measured by the workpiece size measuring mechanism (20); 6). The fixture of the cylindrical workpiece (w) which has been subjected to the fine guide angle machining with the desired hanger diameter The workpiece table (4) of the mechanism (7) moves on the first guide rail (100) in the right direction of the crystal orientation measuring station (S _XDR ), and the X-ray azimuth position measuring machine (XDR) measures the hanger on the above fixture crystal orientation of the cylindrical workpiece (7) of the headstock (7a) of said chuck means of the support shaft (7a ₁₎ is rotated, the cylindrical workpiece (w) is rotated and stopped in The position of the crystal orientation of the grooving process is performed; 7). The workpiece stage (4) of the jig mechanism (7) mounted on the cylindrical workpiece (w) at the crystal orientation position is diced on the first guide rail (100). The processing table (S _gn ) is moved in the left direction, and the grinding wheel spindle (12o) of the bearing inverted V-shaped grinding wheel (12g) is advanced to the crystal orientation of the cylindrical workpiece (w) of the hanger device (7). After the position is lowered, the inverted V-shaped grinding wheel (12g) is used to grind the slit in the crystal orientation position of the cylindrical workpiece (w) to perform the grooving process; 8). The cylindrical workpiece on which the hanger is machined by grooving ( w) The workpiece table (4) of the jig mechanism (7) moves on the first rail (100) in the left direction of the loading/unloading table (S ₁ ) of the workpiece, and then the workpiece loading and unloading mechanism (300) is used. The cylindrical workpiece (w) is carried out from the jig mechanism (7) to the outside of the composite corner forming device (1). A composite lead angle machining method for a cylindrical workpiece (w), characterized in that a composite corner forming device (1) of a cylindrical workpiece according to claim 1 is used, and cylindrical grinding processing and orientation flat grinding processing are performed through the following steps :1). Using the workpiece loading and unloading mechanism (300), the cylindrical workpiece (w) is suspended from the spindle table (7a) and the tailstock of the clamp mechanism (7) on the loading/unloading station (S ₁ ) ( 7b); 2). The workpiece table (4) on which the jig mechanism (7) on the loading/unloading table (S ₁ ) is mounted is placed on the first guide rail (100) on the rough grinding table (S _gr ) Moving in the right direction, the grinding wheel main shaft (10o, 10o) of the pair of cylindrical grinding grinding wheel type grindstones (10g, 10g) is advanced and rotated against the cylindrical workpiece to abut against the cylindrical workpiece (w ), the thick guide angle is processed by sliding friction; 3). The workpiece stage (4) of the clamp mechanism (7) of the cylindrical workpiece (w) equipped with the hanger through the thick lead angle is on the first guide rail (100) Moving in the right direction of the measuring table (S _m ) of the workpiece diameter, and measuring the diameter (R _r ) of the cylindrical workpiece (w) by the workpiece size measuring mechanism (20); 4). The workpiece table (4) of the clamp mechanism (7) of the cylindrical workpiece (w) processed by the thick lead angle of the desired diameter is on the first guide rail (100) in the right direction of the refining processing table (S _gf ) Moving, and grinding the grinding wheel main shaft (11o) of the grinding wheel type fine grinding stone (11g) for bearing cylinder grinding, and rotating against the cylindrical workpiece to abut against the cylindrical workpiece, and sliding friction to perform fine guiding angle processing; 5). The workpiece table (4) of the clamp mechanism (7) of the cylindrical workpiece (w) equipped with the hanger through the precision angle is placed on the first guide rail (100) on the measuring table (S _m ) of the workpiece diameter The left direction moves, and the diameter of the cylindrical workpiece (R _f ) is measured by the workpiece size measuring mechanism (20); 6). The cylindrical workpiece (w) that has been mounted with the hanger has become the desired diameter. The workpiece table (4) of the clamp mechanism (7) moves on the first guide rail (100) in the right direction of the crystal orientation measuring station (S _XDR ), and the hanger is measured by the X-ray azimuth position measuring machine (XDR). The crystal orientation of the cylindrical workpiece of the clamp device (7) rotates the support shaft (7a ₁ ) of the spindle table (7a) of the clamp device to rotate and stop the cylindrical workpiece (w) The position of the crystal orientation to be subjected to the orientation flat grinding process; 7). The workpiece table (4) of the jig mechanism (7) mounted on the cylindrical workpiece (w) in the crystal orientation position is on the first rail (100) Moving in the left direction of the rough grinding table (S _gr ), and making the bearing a cylindrical grinding wheel-type coarse grinding stone (10g) grinding wheel spindle (10o) on the side of the cylindrical workpiece to the hanger device (7) The cylindrical azimuth position of the cylindrical workpiece (w) advances and rotates to abut against the cylindrical workpiece (w), and is subjected to directional flat grinding processing by sliding friction; 8). Orienting the surface of the mounting hanger The workpiece table (4) of the clamp mechanism (7) of the cylindrical workpiece (w) is moved on the first rail (100) in the left direction of the loading/unloading table (S ₁ ) of the workpiece, and then the workpiece is taken out. The loading mechanism (300) carries out the cylindrical workpiece (w) from the jig mechanism (7) to the outside of the composite corner forming device (1).