JP2013022720A - Composite chamfering device of workpiece and composite chamfering method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten a production time when performing cylinder grinding and orientation flat grinding to the outer peripheral surface of a cylindrical ingot block (workpiece).SOLUTION: A composite chamfering device is provided with four devices of cylindrical rough grinding devices 500a, 500b and cylindrical finish grinding devices 700a, 700b of the same type in a manner of sandwiching an XRD machine 600. A transfer robot 200 of the workpiece is accompanied so that chamfering work of the workpiece by the four cylindrical grinding devices 500a, 500b, 700a, 700b can be performed simultaneously in the same time zone.

Description

  The present invention relates to a composite chamfering method for grinding an orientation flat in a crystal orientation of a work outer peripheral surface after cylindrical grinding of a cylindrical outer surface of a cylindrical ingot block (work) such as sapphire or single crystal silicon.

  The columnar sapphire ingot block (work), which is the raw material for the sapphire substrate for LED substrates, is an ingot grown by the Czochralski method (CZ method) or the Bernoulli method (for example, 250 mm, 500 mm, 1,000 mm). ) Cut in the crystal direction to form an ingot block. The crystal orientation of the sapphire ingot has an a-plane, r-plane, m-plane and c-plane orientation. The diameter of cylindrical sapphire ingot blocks is 2 inches, 4 inches, and 6 inches, and the diameter of single crystal silicon ingot blocks is 8 inches, 10 inches, 12 inches, and 20 inches. .

  Paragraph 0008 of JP-A-2009-298676 (Patent Document 1) states that "the cylindrical ingot block has its outer peripheral surface cylindrically ground with a cup wheel type grindstone, and is further oriented flat (commonly referred to as" orientation flat ") or An index flat (commonly called “infrastructure”) is ground or cut, and then sliced into a thickness of 200 to 900 μm by a wire cut saw of an ingot block to manufacture a wafer. ". Further, paragraphs 0020-0023 states that “the orientation flat is that the crystal orientation is specified by cutting out a part of the outer periphery of the circular semiconductor substrate in the direction parallel to the crystal orientation. Formed on the outer periphery of the semiconductor substrate for discriminating the front and back sides, however, in order to discriminate the front and back of the semiconductor substrate, the orientation flat and the infrastructure are formed at positions that are asymmetric with respect to the center of the semiconductor substrate "The orientation flat of the sapphire substrate specifies the crystal orientation (11-20 direction)."

  JP 2008-207992 A (Patent Document 2) states, in paragraphs 0002 to 0004, “Sapphire is a single crystal of aluminum oxide having a hexagonal crystal structure (melting point: about 2050 ° C.). The crystal is used as, for example, a substrate material such as a GaN film formation substrate for a blue LED, etc. A sapphire single crystal is an anisotropic material, and a GaN film formation wafer is cut out from an ingot of a sapphire single crystal. In general, the main surface of the wafer is cut so as to be a plane (c-plane) perpendicular to the c-axis <0001> of the sapphire single crystal, and sapphire is an optically uniaxial transparent material. It is also used as an optical material for liquid crystal projector films, etc. When used as an optical material, it must be transparent without coloring. That. Also, the polarization properties of the sapphire single crystal, as in the case of the substrate material, c plane substrate whose principal surface perpendicular to the c-axis is mainly used.

  When cutting a c-plane substrate from a sapphire single crystal ingot, in order to avoid wasting material as much as possible, the crystal is grown in the c-axis direction to obtain a substantially cylindrical ingot, and this ingot is formed in the c-axis direction (ingot direction). It is desirable to cut perpendicularly to (axial direction). However, it is known that bubble defects tend to occur when crystals are grown in the c-axis direction. If there are bubble defects in the ingot, cracks are likely to occur during processing, and when used as a substrate material or an optical material, their characteristics are likely to be insufficient. As a method for reducing the occurrence of bubble defects, it is known that the growth direction of the sapphire single crystal is shifted by a predetermined angle from the c-axis, or the a-axis or m-axis direction perpendicular to the c-axis (for example, JP, 2004-83316, A). ".

  The sapphire ingot block is manufactured by punching out a large thick plate-like sapphire crystal with a boring core bit (blade) as disclosed in Japanese Patent Application Laid-Open No. 2008-971 (Patent Document 3). There is also.

Furthermore, Japanese translations of PCT publication No. 2010-514581 (patent document 4) discloses the surface processing method of the sapphire substrate by which the ingot block was sliced, from the group consisting of a-plane, r-plane, m-plane, and c-plane orientation. N having a selected crystal orientation and not more than about 0.037 μm / cm ²
A sapphire substrate including a generally flat surface having a TTV, wherein the nTTV is a total thickness variation normalized by the surface area of the substantially zero flat surface, the substrate having a diameter of about 9.0 cm or more And disclosed. As an embodiment thereof, in paragraphs 0005 to 0009, "the first fixed abrasive is used to grind the first surface of the sapphire substrate, and the second particle having an average particle size smaller than that of the first fixed abrasive. A method for machining a sapphire substrate that includes grinding a first surface of a sapphire substrate using a fixed abrasive of: Another embodiment is an abrasive such that the first surface has c-plane orientation. Is used to provide a sapphire substrate lot comprising a plurality of sapphire substrates comprising grinding a first surface of each sapphire substrate, the sapphire substrate lot comprising at least 20 sapphire substrates. the sapphire substrate (i) c plane orientation, (ii) m plane misorientation angle of the crystal (θ _m), and (iii) a surface Misuo crystals Having a first surface having a ene station angle (theta _a), where, (a) misorientation angle theta standard deviation sigma _m of _m is about 0.0130 or less, and (b) misorientation angle theta _a standard The deviation σ _a is at least one of about 0.0325 or less.
A sapphire substrate lot including at least 20 sapphire substrates is targeted. Each sapphire substrate has a first surface having (i) c-plane orientation, (ii) m-plane misorientation angle (θ _m ) of the crystal, and (iii) a-plane misorientation angle (θ _a ) of the crystal. , where, (a) a standard deviation sigma _m of misorientation angle theta _m of about 0.0130 or less, and (b) misorientation angle theta _a standard deviation sigma _a of at least one of about 0.0325 or less true . ".

Japanese Patent Application Laid-Open No. 2009-186181 (Patent Document 5) includes an X-ray diffraction crystal orientation measuring apparatus that measures the crystal orientation of a cylindrical ingot in FIG. 2, and an X-ray diffraction crystal orientation measurement apparatus in FIG. 3 shows a cylindrical grinding apparatus for a cylindrical ingot, and after measuring the crystal orientation h of the cylindrical ingot according to paragraphs 0070 to 0077 and paragraphs 0085 to 0089, the ingot is moved to the cut chamfering machine shown in FIG. Therefore, the first cut surface Wa ₁ is ground perpendicularly to the axial crystal orientation h to obtain a new first cut surface Wa _3, and the second cut surface Wa ₂ in the opposite direction is ground to obtain a new second cut surface Wa ₂ . a cut surface Wa _4, then an ingot having a vertical cutting plane W _3, W ₄ in the first transfer robot and transferred to the clamping device of the cylindrical grinding apparatus with a cylindrical grinding wheel A method of cylindrical grinding of the outer peripheral surface of a cylindrical ingot is described. Furthermore, in FIG. 10 and paragraph 0090 described in Patent Document 5, the radial crystal orientation k of the cylindrically ground ingot is measured by the X-ray diffraction crystal orientation measuring device, and the radial direction of the ingot is measured by the cylindrical grinding device. Disclosed is a method of forming an orientation flat surface based on a crystal orientation k.

  On the other hand, a laser device (XRD machine) with an X-ray diffraction crystal orientation measuring device capable of notching or laser processing a semiconductor substrate is also used to measure the crystal orientation of the substrate or ingot. For example, Yoshito Tanaka, JST-CREST, published an XRD machine in the “Advanced Phase Measurement of Optical Recording Media by Synchrotron Radiation Time-Resolved X-ray Diffraction Measurement”, Advanced Magnetic Materials Research Group 100316 @ Tokyo Institute of Technology (non-patent document 1). The structure and its use are disclosed.

In addition, Shinsaku Kikuta et al. Of Seikei Graduate School have published the XRD machine structure and its results in a joint paper published by Seikei University and Amada Co., Ltd. (Non-Patent Document 2). The usage method is disclosed.

  Furthermore, methods for measuring the crystal orientation of a single crystal ingot with an XRD machine are disclosed in JP-A-10-160688 (Patent Document 6), JP-A 2000-2672 (Patent Document 7), and JP-A-2001-13092. (Patent Document 8), Japanese Patent Application Laid-Open No. 2001-272359 (Patent Document 9), and the like.

  On the other hand, in Japanese Patent Application Laid-Open No. 2005-255463 (Patent Document 10), the ingot orientation flat processing (102) is performed after the ingot cylindrical grinding processing (101) in FIG. 1, and then the ingot is subjected to wafer slicing processing (see FIG. 1). 103), and then, a process diagram for performing wafer peripheral grinding (104) is disclosed.

Japanese Patent Application Laid-Open No. 2011-136382 (Patent Document 11)
a) a work table provided so as to be able to reciprocate in the left-right direction on a guide rail provided in the left-right direction on the machine frame (base);
b) A clamping mechanism comprising a pair of headstock and tailstock mounted separately on the work table on the left and right,
c) A drive mechanism for reciprocating the work table on which a work (rectangular prism-shaped ingot) supported by the clamp mechanism is mounted in a horizontal direction;
d) The work table is viewed from the front side at a right angle, and from the left side to the right side,
e) A first grinding stage provided in front of and behind the work table with a pair of cup wheel type grindstones or ring-shaped grindstones supported by a pair of grindstone shafts movable back and forth, with the grindstone surfaces facing each other. ,
f) A pair of cup wheel type grindstones or ring-shaped grindstones, which are mounted parallel to the right side of the first grinding stage and are supported by a pair of grindstone shafts that can move back and forth, so that their grindstone surfaces face each other. A second grinding stage provided before and after the work table across the table,
g) a load port provided with an opening that allows a workpiece to be transferred to and from the clamp mechanism in a housing material located on the right side of the second grinding stage and on the front side of the work table;
and,
h) On the rear side of the work table facing the load port, a grinding wheel shaft having a grinding wheel is parallel to the horizontal direction of the work table, and the grinding wheel shaft is movable in the front-rear direction. R corner grinding stage provided above,
Disclosed is a chamfering apparatus characterized by comprising

  Furthermore, Japanese Unexamined Patent Publication No. 2000-158123 (Patent Document 12) discloses an ingot transfer robot and an ingot transfer method.

Yoshito Tanaka, “Phase change structure measurement of optical recording media by synchrotron radiation time-resolved X-ray diffraction measurement” Advanced Magnetic Materials Research Group 100316 @ Tokyo Institute of Technology PDF paper, [online], searched July 6, 2011], Internet <URL: www.spring8.or.jp/ext/ja/iuss/htm/text/06file /.../ tanaka.pdf> Susumu Kikuta, 3 others, “Estimation of springback amount of laser processed material using XRD crystal orientation database”, [online], searched on July 6, 2011], Internet <URL: www.sd.seikei .ac.jp / lab / zairiki /_.../ 2011zairyo_powerpoint_kikuta.pdf>

JP 2009-298676 A JP 2008-207992 A JP 2008-971 A Japanese Translation of PCT International Publication No. 2010-514581 JP 2009-186181 A Japanese Patent Laid-Open No. 10-160688 JP 2000-2672 A JP 2001-13092 A JP 2001-272359 A JP 2005-255463 A JP 2011-136382 A JP 2000-158123 A

  In the compound chamfering grinding apparatus with an XDR machine described in Patent Document 5, one chamfering machine for C-axis end face grinding and orientation flat grinding of a workpiece on one XDR machine having a price of about 30 million yen, and One cylindrical grinding device on the outer periphery of the ingot is arranged. The cylindrical grinding process of the workpiece is a rate-limiting process, and requires 3 to 4 times as long as the C-axis end grinding and orientation flat grinding of the workpiece.

  Therefore, from a semiconductor substrate manufacturer that uses a cylindrical grinding machine, a combined chamfering machine with multiple cylindrical grinding machines will improve the production per unit time of chamfered ingot blocks per XDR machine. Therefore, there has been a demand for providing such a composite chamfering grinding apparatus.

  The inventors of the present application have found that the composite chamfering apparatus described in Patent Document 11 can perform both cylindrical grinding and orientation flat processing of a cylindrical ingot block. An object of the present invention is to provide a device for cylindrically grinding and orientation flat grinding of an ingot block and a method for performing cylindrical grinding and orientation flat grinding of a cylindrical ingot block using the device.

Claim 1 of the present invention provides
A transfer robot (200) capable of sliding on the first guide rail (100) extending in the left-right direction;
A first storage shelf (300) of a cylindrical ingot block (work) provided at the right end of the first guide rail,
A second storage shelf (400) of a workpiece (finally processed product) subjected to orientation flat processing provided at the left end of the first guide rail,
The first cylindrical rough grinding device (500a) and the second cylindrical rough grinding device (500b) from the right end provided parallel to the rear side toward the left end side with respect to the first guide rail (100) for sliding of the transfer robot. ), A chamfering device group in which a laser device (600) with an X-ray diffraction crystal orientation measuring device, a first cylindrical finish grinding device (700a), and a second cylindrical finish grinding device (700b) are provided with an interval,
A workpiece chamfering processing apparatus (1) comprising:
The first and second cylindrical rough grinding devices (500a, 500b) and the first and second cylindrical finish grinding devices (700a, 700b) have cup wheel grindstones (10g, 10g, or 11g, 11g) to be attached. Except for different points, it is the same kind of cylindrical grinding machine, and a headstock (7) having a centering function capable of sliding on the second guide rails (3, 3) extending in the front-rear direction.
a moving table (4) on which a clamping device (7) comprising a) and a tailstock (7b) is placed, and a C-axis of a work supported on the supporting shafts (7a ₁ , 7b ₁ ) of the clamping device A grindstone shaft that supports a pair of cylindrical grinding cup wheel grindstones (10 g, 10 g, or 11 g, 11 g) across the C axis is provided so as to be capable of moving forward and backward, and an autoloader device (13 ) And a work stocker (14), and the work stocker (14), the autoloader device (13), and the clamp device (7) constitute a work loading / unloading stage, and the clamp device (7) Cylindrical grinding of a workpiece with a pair of grinding wheel shafts that support the pair of cylindrical grinding cup wheel type grinding wheels (10 g, 10 g, or 11 g, 11 g) Configure stage and orientation flat grinding stage,
The composite chamfering apparatus (1) characterized by this is provided.

Claim 2 of the present invention provides a manufacturing method for performing cylindrical grinding processing and orientation flat forming processing of a cylindrical ingot block (workpiece) through the following steps using the composite chamfering processing device (1) according to claim 1. It is.
1). The workpiece (w) stored in the first storage shelf (300) is gripped by the block transport robot (200), and then the gripped workpiece is placed in front of the laser device (600) with the X-ray diffraction crystal orientation measuring device. Transfer, detect C-axis orientation at both ends of workpiece with laser device (600) with X-ray diffraction crystal orientation measuring instrument, mark with laser light, detect orientation flat crystal orientation, and mark with laser light, crystal Orientation measurement process.
2). The C-marked workpiece (w) held by the block transfer robot (200) is transferred to the workpiece stocker (14) of the cylindrical grinding machine (500), and then the workpiece is transferred to the hand claw of the autoloader device (13). the embrace e inclusive, headstock support shaft of the clamping device (7a ₁₎ and the support shaft of the tailstock (7b ₁₎ C axis which is marking the workpiece between the headstock of the support shaft and the mind of the clamping device A workpiece loading process in which the workpiece is supported so as to coincide with the C-axis center connecting the support shafts of the pedestal.
3). The cup wheel grindstone that rotates by rotating the cup wheel grindstone shaft by rotating the work supported by the clamp device (7) around the C axis of the clamp device by the servo motor of the headstock (7a). 10g, 10g) is moved forward (moved in the left direction) so as to come into contact with the circumferential surface of the workpiece rotating around the C axis to start cylindrical grinding, and the cup wheel grindstone (10g, 10g) is cylindrical After performing a cutting process that advances (moves in the left direction) to a distance at which a rough grinding allowance (t _gr ) is obtained, the clamp device (7) is further advanced toward the cup wheel grindstone (10g, 10g) side, A process of roughing the cylinder, wherein the outer peripheral surface of the work supported by the clamping device is subjected to a roughing grinding process.
4). The cylindrically ground workpiece supported by the clamping device (7) is held by the hand claw of the autoloader device (13), and then the cylindrical workpiece (w) is cylindrically ground by the workpiece stocker (13) of the cylindrical grinding device. The workpiece unloading process.
5). The workpiece (w) that has been subjected to cylindrical rough grinding is received by the block transfer robot (200), and then the received workpiece (w) is transferred to the workpiece stocker (14) of the cylindrical grinding device (700). The workpiece is held in the hand claw of the autoloader device (13), and the C axis with the workpiece marked between the support shaft of the headstock and the support shaft of the tailstock is the second clamp. A workpiece delivery loading process in which the workpiece is supported so as to coincide with the C-axis center connecting the support shaft of the headstock of the apparatus and the support shaft of the tailstock.
6). The workpiece (w) supported on the clamping device (7) is rotated around the C axis of the clamping device by the servo motor of the headstock (7a), and the cup wheel type grinding wheel shaft of the cylindrical grinding device (700) is rotated. Then, the rotating cup wheel type grindstone (11g, 11g) is moved forward (moved in the left direction) so as to come into contact with the circumferential surface of the workpiece rotating around the C axis to start cylindrical finish grinding, After performing a cutting process for moving the cup wheel type grindstone (11g, 11g) forward (moving in the left direction) to a distance where a cylindrical finishing grinding allowance (t _gf ) is obtained, the clamp device (7) is moved to the cup wheel type grindstone. (11g, 11g) A cylinder finishing grinding machine that further advances to the side and passes the outer peripheral surface of the work supported on the clamping device (7) by cylindrical finishing grinding. Step of processing.
7). To center headstock support shaft said (7a ₁₎ a by rotating the crystal orientation is the orientation flat machined cylindrical finish grinding machined workpiece (w) of the clamping device (7), the orientation flat centering process.
8). A cup wheel that rotates by rotating a grindstone shaft that supports a cupwheel grindstone (11g) on the side close to a position where a workpiece of the pair of cupwheel grindstone shafts of the cylindrical grinding apparatus (700) is subjected to orientation flat machining. The mold grindstone (11g) is moved forward (moved in the left direction) so as to come into contact with the circumferential surface of the workpiece (w) centered in the crystal orientation to be subjected to the orientation flat processing, and the orientation flat grinding processing is started. After performing a cutting process to advance the grindstone (11g) to advance to the distance where the orientation flat grinding allowance (t _of ) is ground (moving leftward), the clamp device is moved to the cup wheel grindstone side to make a circle. An orientation flat grinding process that forms orientation flats on the outer peripheral surface of a columnar ingot block.
and,
9). The orientation flat ground workpiece (w) supported by the clamp device (7) is gripped by the robot claw of the autoloader device and transferred to the workpiece locker. An unloading process of transferring to the shelf (400).

  The composite chamfering apparatus of the present invention is the use of one XRD machine, and cylindrical rough grinding of a cylindrical ingot block by two of the four cylindrical grinding machines (500a, 500b). Since the remaining two cylindrical finish grinding devices (700a, 700b) can perform machining, cylindrical finish grinding and orientation flat grinding of workpieces, the production of chamfered workpieces for the use of one XRD machine can be increased fourfold. .

  Since a workpiece can be cylindrically ground using a pair of cup wheel type grindstones (10 g, 10 g, or 11 g, 11 g) at the same time, the cylindrical grinding time is reduced by half compared to the cylindrical grinding device of the composite chamfering device described in Patent Document 5. it can.

Therefore, by shifting the loading timing of the work loaded by the block transfer robot (200) to one cylindrical grinding device of each of the four cylindrical grinding devices (500a, 500b, 700a, 700b), Cylindrical grinding devices (500a, 500b, 700a, 700b) can be operated in the same time zone. By setting the cylindrical rough grinding allowance (t _gr ) to 1 to 2 mm thickness and the cylindrical finish grinding allowance (t _gf ) to 5 to 50 μm thickness, the rough cylindrical grinding step of the third step in all steps Becomes the rate limiting, and the processing time is longer than the total time required for the sixth, seventh, eighth and ninth steps.

FIG. 1 is a plan view of a composite chamfering apparatus. FIG. 2 is a side view of the cylindrical grinding apparatus. FIG. 3 is a plane surface of the cylindrical grinding apparatus. FIG. 4 is a rear view of the autoloader device. FIG. 5 is a plan view of the cylindrical grinding apparatus, and the autoloader device is omitted. FIG. 6 is a work diagram in which the outer peripheral surface of the workpiece is chamfered, and is a diagram viewed from the end surface direction of the workpiece. 6a shows a cylindrical rough grinding operation, FIG. 6b shows a cylindrical finish grinding operation, and FIG. 6c shows an orientation flat grinding operation.

A composite chamfering apparatus 1 of the present invention shown in FIG. 1 includes a transfer robot 200 that can slide on a first guide rail 100 extending in the left-right direction, and a first storage shelf 300 for workpieces provided at the right end of the first guide rail. , A second storage shelf 400 for workpieces subjected to orientation flat processing provided at the left end of the first guide rail 100, and a left end from a right end provided parallel to the rear side with respect to the first guide rail 100 for sliding of the transfer robot. This is a composite chamfering processing apparatus 1 in which two machines 500a and 500b of cylindrical rough grinding apparatuses, five XRD machines 600, and two machines 700a and 700b of cylindrical finishing grinding apparatuses are provided side by side with an interval. .

  The cylindrical rough grinding devices 500a and 500b and the cylindrical finish grinding devices 700a and 700b are the same type of cylindrical grinding device. The first cylindrical grinding devices 500a and 500b include cup wheel type rough grinding wheels 10g and 10g. Cup wheel type finishing grinding wheels 11g and 11g are attached to the two-cylinder grinding apparatuses 700a and 700b.

  The cup wheel type rough grinding wheels 10g and 10g and the cup wheel type finishing grinding wheels 11g and 11g shown in FIGS. 2 and 3 are the same instead of the cylindrical rough grinding devices 500a and 500b and the cylindrical finish grinding devices 700a and 700b shown in FIG. Cylindrical grinding devices 500 and 700 provided in the machine may be used.

  As shown in FIGS. 2, 3, and 5, the cylindrical grinding devices 500 and 700 reciprocate in the left-right direction on a pair of guide rails 3, 3 laid on the machine frame (base) 2 in the left-right direction. A work table 4 provided so as to be able to be provided is provided. When the work table 4 is reciprocated left and right, the ball screw 6 receives rotation driven by the servo motor 5 and rotates, and a fixing base (not shown) screwed to the ball screw advances leftward or rightward. As a result, the work table 4 having the back surface of the work table 4 fixed to the surface of the fixed base advances in the left direction or the right direction. The advancement of the work table 4 in the left direction or the right direction depends on whether the rotation shaft of the servo motor 5 is clockwise or counterclockwise.

On the work table 4 is mounted a clamping device 7 composed of a pair of a headstock 7a and a tailstock 7b which are mounted separately on the front and rear. Therefore, in association with the movement of the forward or backward direction of the work table 4 moves in the clamping device 7 also forward or backward direction, the headstock center support shaft 7a ₁ and the tailstock center support shaft 7b of the clamping device 7 _The workpiece w that is suspended (held) by ₁ and suspended in the air can move to the first cylindrical grinding stage 10, the second cylindrical grinding stage 11, or the load port 8 position.

The clamping device 7 is a known chuck mechanism and is often used in a silicon ingot cylindrical grinder. Headstock 7a has a function of rotating the workpiece w 360 degrees by rotating the headstock center support shaft 7a ₁ by the servo motor 7a _m. Tailstock 7b is provided on the movable table 7b _t which can be moved on the guide rails with an air cylinder 7e drive the left and right, after支架the workpiece by the clamp mechanism 7, and fixed by depressing the lever, movement of the work table 4 moving base 7b _t for mounting the tailstock 7b is prevented from moving by.

  The positional relationship between the first cylindrical grinding stage 10, the second cylindrical grinding stage 11, and the load port 8 is a direction in which the work table 4 is viewed at a right angle from the side surface side, and from the front side direction toward the rear side direction. The first cylindrical grinding stage 10, the second grinding stage 11, and the load port 8 are provided. The first cylindrical grinding stage 10 and the second cylindrical grinding stage 11 are covered with a hermetic cover 12. The load port 8 is closed by a one-hand side sliding door 12a. An exhaust duct 18 is connected to the space of each grinding 10, 11 covered with the hermetic cover 12, and mist and grinding debris floating in this space are discharged to the outside.

The first cylindrical grinding stage 10 is composed of a pair of grinding wheels 10a, 10a, 10a, 10a, 10a, 10a, 10a, 10a, 10a. 10 g of the grinding wheel surface 10 g _s , 10 g _s
Are provided symmetrically before and after the work table 4 with the work table 4 sandwiched therebetween and at positions where the grindstone shaft cores 10 _o and 10 _o are on the same line, and the grindstone shafts 10 a and 10 a are servo motors 10 _M and 10. _The structure is rotated by _M rotational drive.

  When the ball screw receives rotation by the servo motors 10m and 10m and rotates, and the fixing table screwed to the ball screw advances or retracts forward or backward, the tool tables 10t and 10t are placed on the surface of the fixing table. The tool tables 10t and 10t whose back surfaces are fixed move forward or backward. The forward or backward movement direction of the tool table depends on whether the rotation shafts of the servo motors 10m and 10m are clockwise or counterclockwise.

The second cylindrical grinding stage 11 includes a pair of grinding wheels 11a, 11a provided on a tool table 11t, 11t that can be moved back and forth by rotation of servo motors 11m, 11m, a pair 11g of cup wheel type grinding wheels supported by 11a, provided at a position 11g the grinding wheel surface _11g s, 11g _s is and symmetrically around the work table 4 across the work table 4 so as to face each other grindstone axis ₁₁ o, 11 _o is collinear, grindstone axis 11a, 11a has a structure that is rotated by the rotational driving of the servo motor _{11 M, 11} M.

When the ball screw receives the rotation drive by the servo motors 11m and 11m and rotates, and the fixed base screwed into the ball screw moves forward or backward in the forward or backward direction, the tool table 11t, The tool tables 11t and 11t to which the back surface of 11t is fixed move forward or backward. The forward or backward movement direction of the tool table depends on whether the rotation shafts of the servomotors 11m and 11m are clockwise or counterclockwise.

The second cylindrical grinding stage 11 is provided in parallel to the rear side of the first cylindrical grinding stage 10. That is, the grindstone axes 10 _o and 11 _{o of} both the stages 10 and 11 are parallel.

  The cup wheel type grinding wheel 10g, 10g, 11g, 11g and the orientation of the cup wheel type grinding wheel of the cup wheel type grinding wheel for orientation flat grinding are as follows. 100 to 240 mm. The width of the cup wheel type grindstone piece is preferably 3 to 10 mm and the width of the ring-shaped grindstone is preferably 5 to 15 mm from the viewpoint of preventing grinding burn of the workpiece.

  The abrasive grains of the cup wheel type grindstones 10g and 11g are preferably diamond abrasive grains and CBN abrasive grains, and the bonding agent (bond) is preferably a metal bond, a vitrified bond, or an epoxy resin bond. For example, a cup wheel type grindstone has a grindstone blade attached to a lower annular ring of a bottomed cylindrical grindstone base metal disclosed in Japanese Patent Laid-Open Nos. 9-38866, 2000-94342, 2004-167617, and the like. A cup wheel type grindstone that is arranged in a ring shape with a gap interval where the grinding fluid is dissipated, and has a structure in which the grinding fluid supplied to the inside of the base metal is dissipated from the gap. It is preferable that the diameter of the annular grindstone blade of this cup wheel grindstone is 1.2 to 1.5 times the workpiece diameter. The annular grindstone blade of the cup wheel type rough grinding grindstone 10g is preferably a diamond resin bond grindstone having a grind number of 100 to 280 or a diamond vitrified bond grindstone. Further, the annular grindstone blade of the cup wheel type finish grinding grindstone 11g is preferably a diamond resin bond grindstone, a diamond vitrified bond grindstone, or a diamond metal bond grindstone with a grind number of 300 to 1,200.

  As the grinding liquid, pure water, colloidal silica aqueous dispersion, ceria aqueous dispersion, SC-1 liquid, SC-2 liquid, or an aqueous dispersion in which an organic phosphorus compound is mixed with these aqueous dispersions may be used. preferable.

  The load port 8 is formed by providing an opening that allows the workpiece w to be transferred into and out of the clamping device 7 in a housing material located behind the second cylindrical grinding stage 11 and in front of the work table 4. Is done.

  At the time of orientation flat grinding of the workpiece in the cylindrical finish grinding apparatus 700, the second cylindrical grinding stage 11 is called a cylindrical finish grinding stage and an orientation flat grinding stage.

  In FIG. 2, reference numeral 20 denotes a control device, and reference numeral 21 denotes an operation panel. Moreover, in FIG. 3, the code | symbol 9c shows a grinding fluid supply pipe | tube.

  As shown in FIGS. 1, 2, 3, and 4, the cylindrical grinding apparatuses 500 and 700 are arranged on the front side of the work table 4 and in the space between the load port 8 and the second grinding stage 11. A loader (work loading / unloading device) 13 and a work stocker 14 for storing three ingot blocks are juxtaposed on the machine frame 2. Reference numeral 15 denotes a spare work stocker (storage shelf) placed on the table of the transport carriage 16 provided with a stepladder. The spare work stocker 15 may be used as the above-described storage shelves 300 and 400 provided at both ends of the first guide rail.

  The work stockers (storage shelves) 14 and 15 are provided with V-shaped shelves having an inverted isosceles triangle shape capable of storing three workpieces w, w, and w inclined at 45 degrees, and positioning pins 16 protruding from the machine frame. It is placed on top.

  The autoloader device (work loading / unloading device) 13 holds a workpiece stored on a work stocker 14V-shaped shelf with a pair of claws 13a and 13b, and lifts both claws to raise the workpiece. Lifting, then retreating, moving in the right direction, descending, positioning in front of the load port 8, and further retreating the workpiece from the load port 8 between the headstock 7a and the tailstock 7b of the clamping device 7 Transport. After one end of the work is brought into contact with the center support shaft 7a1 of the headstock 7a, the tailstock 7b is moved to the right by the air cylinder 7e, and the other end is brought into contact with the center support shaft 7b1 so that the work is 45 degrees V. Inclined and suspended on 4 sides suspended. Next, the claws 13a and 13b are separated to release the workpiece, and then the fixing base 13f supporting the claws 13a and 13b is lifted, moved to the left, and further moved backward to move both claws. 13a and 13b are returned to the standby position.

  Further, the chamfering process and the cleaned and air-dried work supported in a suspended state in the clamp device 7 are gripped by both claws 13a and 13b, and then the fixing base 13f supporting both the claws 13a and 13b is raised, After moving the claw 13a, 13b above the empty shelves of the work stockers 14, 15 after moving the claw 13a, 13b to the left and moving the claw 13a, 13b downward, , 13b are separated and the workpiece is released, and then the claws 13a, 13b are returned to the standby position.

The fixed base 13f that supports the claws 13a and 13b is moved in the front-rear direction by providing, on the side surface of the column 13c, the sliding surface 13s of the fixed base 13f that is screwed back to the ball screw 13k that is rotationally driven by the servo motor 13m. This is done by sliding on the guide rail 13g. The vertical movement of the fixing base 13f that supports the claws 13a and 13b is performed by the air cylinder 13p. The two claws 13a and 13b are separated from each other by using a micro week air cylinder 13e shown in a circle in FIG. Fine adjustment of the slight raising and lowering of the claws 13a and 13b is performed using a micro week air cylinder 13l. Both pawls 13a, fine adjustment of a small back-and-forth movement of the 13b is performed using a micro weak air cylinder 13 _R.

The workpiece w stored in the workpiece stockers 14 and 15 installed in the cylindrical grinding devices 500 and 700 is automatically clamped on the support shafts 7a ₁ and 7b ₁ of the clamping device 7 by using the robot claws 13a and 13b of the autoloader device 13. The process of (supporting) is performed as follows.

Robot claw 13a of the autoloader devices 13, diameter 13b is Rmm, grinding allowance (t) set to grip the central portion of the cylindrical ingot block (work) of _t g mm thickness. S01

Wherein the gripped workpiece to the robot claws and carried into between the support shaft 7b ₁ of the support shaft 7a ₁ and tailstock 7b headstocks 7a, the longitudinal axis (C axis of the workpiece w by advancing the tailstock 7b Both ends in the direction) are supported by the support shafts 7a ₁ and 7b ₁ of the clamp device 7. A line connecting both shaft centers of the support shafts 7a ₁ and 7b ₁ is called a C-axis center of the clamp device 7. S02

  The robot claws 13a and 13b of the autoloader device 13 are moved away from the workpiece w. S03

  Returning to FIG. 1, the transfer robot 200 sliding on the first guide rail 100 is between the work locker 14, storage shelves 300 and 400, cylindrical rough grinding devices 500 a and 500 b, XDR machine 600, and cylindrical finish grinding devices 700 a and 700 b. Used to deliver the work w.

A laser device (X-ray diffraction) 600 with an X-ray diffraction crystal orientation measuring device includes an X-ray irradiator, an X-ray diffractor, a laser light irradiator, a CCD camera, a work table, a controller having a time circuit, and the like. . Workpiece imaging, workpiece crystal orientation measurement, laser marking on workpieces, etc. are possible.

  The process of performing cylindrical grinding and orientation flat forming on a cylindrical sapphire ingot block (work) using the composite chamfering apparatus 1 of the present invention is performed through the following steps.

  1). The workpiece w stored in the first storage shelf 300 is gripped by the block transport robot 200, and then the gripped workpiece is transferred to the XRD machine 600, and the X-axis machine detects the C-axis azimuths at both ends of the workpiece. The C-axis orientation is marked on the workpiece with light, the orientation flat orientation is detected, and the orientation flat orientation is marked on the workpiece with laser light. (C-axis direction and orientation flat direction detection process.)

  2). The workpiece w marked with the C-axis gripped by the block transfer robot 200 is transferred to the workpiece stocker 14 of the cylindrical rough grinding device 500, and then the workpiece is held in the hand claw of the autoloader device 13 and the clamping device 7 The C-axis center of the workpiece marked between the support shaft of the headstock 7a and the support shaft of the tailstock 7b is aligned with the C-axis centering the support shaft of the headstock and the support shaft of the tailstock. Support the work. (Work loading process.)

3). The workpiece supported by the clamping device 7 of the cylindrical rough grinding device 500 is rotated around the C axis of the clamping device 7 by the servo motors 10M and 11M of the headstock 7a at a rotational speed of ₁₀ to 300 rpm. The cup wheel type grindstone shafts 10o, 10o are rotated at a rotational speed of 800 to 3,000 rpm, and the rotating cup wheel type grindstone 10g, 10g is applied to the circumferential surface of the work rotating around the C axis. Advancing (moving leftward) so as to come into contact with each other and starting cylindrical grinding, and cutting (moving leftward) the cup wheel type grindstones 10g and 10g to a distance where a cylindrical rough grinding allowance (t _gr ) can be obtained. Then, the clamping device 7 is further advanced to the cup wheel type grindstone 10g, 10g side at a speed of 1 to 15 mm / min and passed. Was cylindrically rough grinding the outer peripheral surface of the workpiece being 支架 to the clamping device 7, a cylindrical rough grinding step (see FIG. 6a).

  Note that during the cylindrical grinding process, an amount of 5 to 100 cc / min of grinding fluid is supplied to the grinding work point. Further, when the cylindrical rough grinding apparatus 500 further includes a pair of cup wheel type finishing grinding wheels 11g, 11g, the clamping device 7 is further passed between the pair of rotating cup wheel type grinding wheels 11g, 11g. Then, the outer peripheral surface of the workpiece may be subjected to cylindrical finish grinding to reduce the finish cylindrical grinding time of the workpiece by the cylindrical finish grinding apparatus 700 in a subsequent process.

  4). The cylindrical rough-grinded workpiece w supported on the clamp device 7 is held by the hand claw of the autoloader device 13, and then the cylindrical coarse-grinded workpiece is transferred to the work stocker 14 of the cylindrical rough grinding device 500. (Unloading process of the workpiece after cylindrical rough grinding).

5). The workpiece w subjected to cylindrical rough grinding is received by the block transfer robot 200, and then the received workpiece w is transferred to the workpiece stocker 14 of the cylindrical finish grinding apparatus 700, and then the workpiece w is transferred to the hand claw of the autoloader device 13. the embrace e inclusive, the clamp device 7 headstock 7a of the support shaft 7a ₁ and tailstock 7b of the support shaft 7b C axis which is marked of the workpiece between ₁ headstock support shaft of the second clamping device A workpiece delivery and loading process in which the workpiece is supported so as to coincide with the C-axis center connecting 7a ₁ and the support shaft 7b ₁ of the tailstock.

6). The workpiece w supported by the clamping device 7 of the cylindrical finishing grinding device 700 is rotated at a rotational speed of 10 to 200 rpm around the C axis of the clamping device by a servo motor of the headstock 7a, and the cup of the cylindrical grinding device 700 is rotated. The wheel type grindstone shaft is rotated, and the rotating cup wheel type grindstones 11g, 11g are moved forward (moved in the left direction) so as to contact the circumferential surface of the work w rotating around the C axis to perform cylindrical finish grinding. The cup wheel grindstone 11g, 11g is cut and advanced by 5 to 50 μm to a distance where a cylindrical finishing grinding allowance (t _gf ) is obtained, and then the clamping device 7 is moved to the cup wheel grindstone 11g, It is further advanced to the 11g side at a speed of 1 to 15 mm / min, and is passed between the cup wheel type grindstones 11g and 11g, Cylindrical finish grinding process in which the outer peripheral surface of the work supported by the clamp device 7 is subjected to cylindrical finish grinding (see FIG. 6b).

  Note that during the cylindrical finish grinding process, a grinding liquid of 5 to 100 cc / min is supplied to the grinding work point. Further, after the cylindrical finish grinding is completed, the cup wheel type grindstone shaft is retracted from the workpiece w, and then the clamp device 7 mounted on the work table 4 is retracted from the cup wheel type grindstones 11g and 11g to start cylindrical finish grinding. It returns to the point position.

7). An orientation flat centering step in which the support w (7a ₁ ) of the headstock of the clamping device (7) is rotated to center the workpiece w subjected to the cylindrical finish grinding in a crystal orientation to be orientation flat processed.

8). The grindstone shaft that supports the cup wheel grindstone 11g on the side close to the position where the workpiece of the pair of cupwheel grindstone shafts of the cylindrical finish grinding apparatus 700 is subjected to orientation flat machining is rotated at a rotational speed of 10 to 200 rpm. The rotating cup wheel type grindstone 11g is moved forward (moved in the left direction) so as to come into contact with the circumferential surface of the workpiece w centered in the crystal orientation to be processed by the orientation flat, and the orientation flat grinding process is started. After performing a cutting process to advance the grindstone 11g and advance (leftward movement) to the distance for grinding the orientation flat grinding allowance (t _of ), the clamp device 7 is moved to the cup wheel grindstone side by 1 to 15 mm / min. An orientation flat grinding process in which orientation flats are formed on the outer peripheral surface of the cylindrical ingot block by moving at a speed (see FIG. 6c).

  and,

  9). After the orientation flat grinding work w supported by the clamping device (7) is gripped by the robot claw of the autoloader device and transferred to the work locker 14, the transfer robot 200 receives the work w and receives the second work w. An unloading process of transferring to the storage shelf 400.

  The compound chamfering apparatus 1 of the present invention measures the crystal orientation of a workpiece with one XRD machine 600, performs marking with a laser, and performs cylindrical rough grinding of a cylindrical ingot block with two cylindrical rough grinding apparatuses 500. Since the cylindrical finishing grinding process and the orientation flat grinding process of the cylindrical ingot block can be performed by the two cylindrical finishing grinding apparatuses 700, the production amount of the chamfering workpiece per hour per one XRD machine 600 is achieved. Can be improved by about 4 times or more. In particular, since the workpiece is ground with a pair of cup wheel type grindstones (10 g, 10 g or 11 g, 11 g), the cylindrical grinding time of the workpiece per cylinder grinding device described in Patent Document 5 is halved. Can be shortened.

1 Compound chamfering machine w Workpiece (Cylindrical sapphire ingot block)
DESCRIPTION OF SYMBOLS 100 1st guide rail 200 Conveyance robot 300,400 Storage shelf 500 Cylindrical rough grinding device 4 Work table 6 2nd guide rail 7 Clamp mechanism 7a Spindle 7b Tailstock 8 Load port 10 First grinding stage 10g Cup wheel type rough grinding Grinding wheel 11 Second grinding stage 11g Cup wheel type finishing grinding wheel 13 Autoloader device 14 Work stocker 600 XRD machine 700 Cylindrical finishing grinding device

Claims (2)

A transfer robot (200) capable of sliding on the first guide rail (100) extending in the left-right direction;
A first storage shelf (300) of a cylindrical ingot block (work) provided at the right end of the first guide rail,
A second storage shelf (400) of the workpiece subjected to orientation flat processing provided at the left end of the first guide rail,
The first cylindrical rough grinding device (500a) and the second cylindrical rough grinding device (500b) from the right end provided parallel to the rear side toward the left end side with respect to the first guide rail (100) for sliding of the transfer robot. ), A chamfering device group in which a laser device (600) with an X-ray diffraction crystal orientation measuring device, a first cylindrical finish grinding device (700a), and a second cylindrical finish grinding device (700b) are provided with an interval,
A workpiece chamfering processing apparatus (1) comprising:
The first and second cylindrical rough grinding devices (500a, 500b) and the first and second cylindrical finish grinding devices (700a, 700b) have cup wheel grindstones (10g, 10g, or 11g, 11g) to be attached. Except for different points, they are the same kind of cylindrical grinding device, and the headstock (7a) and tailstock (7b) having a centering function capable of sliding on the second guide rails (3, 3) extending in the front-rear direction. And a moving table (4) on which a clamping device (7) is formed, and a direction perpendicular to the C-axis of the workpiece supported on the supporting shafts (7a ₁ , 7b ₁ ) of the clamping device, and A grindstone shaft for supporting a pair of cylindrical grinding cup wheel grindstones (10 g, 10 g, or 11 g, 11 g) with a C axis interposed therebetween is provided so as to be capable of moving forward and backward, and an autoloader device (13) and And the work stocker (14), the work stocker (14), the autoloader device (13), and the clamp device (7) constitute a work loading / unloading stage, and the clamp device (7) A cylindrical grinding stage and an orientation flat grinding stage of a workpiece are constituted by a grinding wheel shaft that supports a pair of cylindrical grinding cup wheel grinding wheels (10 g, 10 g, or 11 g, 11 g).
A composite chamfering apparatus (1) characterized by the above. A manufacturing method in which a cylindrical ingot block (workpiece) is subjected to cylindrical grinding and orientation flat forming processing using the composite chamfering apparatus (1) according to claim 1 through the following steps.
1). The workpiece (w) stored in the first storage shelf (300) is gripped by the block transport robot (200), and then the gripped workpiece is placed in front of the laser device (600) with the X-ray diffraction crystal orientation measuring device. Transfer, detect C-axis orientation at both ends of workpiece with laser device (600) with X-ray diffraction crystal orientation measuring instrument, mark with laser light, detect orientation flat crystal orientation, and mark with laser light, crystal Orientation measurement process.
2). The C-marked workpiece (w) held by the block transfer robot (200) is transferred to the workpiece stocker (14) of the cylindrical grinding machine (500), and then the workpiece is transferred to the hand claw of the autoloader device (13). the embrace e inclusive, headstock support shaft of the clamping device (7a ₁₎ and the support shaft of the tailstock (7b ₁₎ C axis which is marking the workpiece between the headstock of the support shaft and the mind of the clamping device A workpiece loading process in which the workpiece is supported so as to coincide with the C-axis center connecting the support shafts of the pedestal.
3). The cup wheel grindstone that rotates by rotating the cup wheel grindstone shaft by rotating the work supported by the clamp device (7) around the C axis of the clamp device by the servo motor of the headstock (7a). 10 g, 10 g) is advanced so as to contact the circumferential surface of the workpiece rotating around the C axis to start cylindrical grinding, and the cup wheel type grindstone (10 g, 10 g) is subjected to cylindrical rough grinding allowance ( t _gr ) is advanced to a distance that can be obtained, and then the clamp device (7) is further advanced to the cup wheel type grindstone (10g, 10g) side, passed through and supported by the clamp device. A process of roughing cylindrical grinding on the outer peripheral surface of a workpiece.
4). The cylindrically ground workpiece supported by the clamping device (7) is held by the hand claw of the autoloader device (13), and then the cylindrical workpiece (w) is cylindrically ground by the workpiece stocker (13) of the cylindrical grinding device. The workpiece unloading process.
5). The workpiece (w) that has been subjected to cylindrical rough grinding is received by the block transfer robot (200), and then the received workpiece (w) is transferred to the workpiece stocker (14) of the cylindrical grinding device (700). The workpiece is held in the hand claw of the autoloader device (13), and the C axis with the workpiece marked between the support shaft of the headstock and the support shaft of the tailstock is the second clamp. A workpiece delivery loading process in which the workpiece is supported so as to coincide with the C-axis center connecting the support shaft of the headstock of the apparatus and the support shaft of the tailstock.
6). The workpiece (w) supported on the clamping device (7) is rotated around the C axis of the clamping device by the servo motor of the headstock (7a), and the cup wheel type grinding wheel shaft of the cylindrical grinding device (700) is rotated. Then, the rotating cup wheel type grindstone (11g, 11g) is advanced to come into contact with the circumferential surface of the workpiece rotating around the C axis to start cylindrical finish grinding, and the cup wheel type grindstone ( 11g, 11g) is advanced to a distance at which a cylindrical finish grinding allowance (t _gf ) is obtained, and then the clamp device (7) is further advanced toward the cup wheel grindstone (11g, 11g). A step of cylindrical finishing grinding, wherein the outer peripheral surface of the work supported by the clamping device (7) is subjected to cylindrical finishing grinding.
7). To center headstock support shaft said (7a ₁₎ a by rotating the crystal orientation is the orientation flat machined cylindrical finish grinding machined workpiece (w) of the clamping device (7), the orientation flat centering process.
8). A cup wheel that rotates by rotating a grindstone shaft that supports a cupwheel grindstone (11g) on the side close to a position where a workpiece of the pair of cupwheel grindstone shafts of the cylindrical grinding apparatus (700) is subjected to orientation flat machining. The mold grindstone (11g) is advanced to contact the circumferential surface of the workpiece (w) centered in the crystal orientation to be subjected to the orientation flat processing to start the orientation flat grinding, and further the cup wheel type grinding stone (11g) After advancing and cutting to advance the grinding flat grinding allowance (t _of ) to the grinding distance, the clamping device is moved to the cup wheel grinding wheel side to form an orientation flat on the outer peripheral surface of the cylindrical ingot block The orientation flat grinding process.
and,
9). The orientation flat ground workpiece (w) supported by the clamp device (7) is gripped by the robot claw of the autoloader device and transferred to the workpiece locker. An unloading process of transferring to the shelf (400).

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