JP5767520B2 - Complex chamfering machine for workpieces - Google Patents

Description

  The present invention relates to a chamfering apparatus for grinding an orientation flat to a crystal orientation of a work outer peripheral surface after cylindrical grinding of a cylindrical outer surface of a columnar ingot block (work) such as sapphire or single crystal silicon.

  The columnar sapphire ingot block (work), which is the raw material for the sapphire substrate for LED substrates, is an ingot grown by the Czochralski method (CZ method) or the Bernoulli method (for example, 250 mm, 500 mm, 1,000 mm). ) Cut in the crystal direction to form an ingot block. The crystal orientation of the sapphire ingot has an a-plane, r-plane, m-plane and c-plane orientation. The diameter of cylindrical sapphire ingot blocks is 2 inches, 4 inches, and 6 inches, and the diameter of single crystal silicon ingot blocks is 8 inches, 10 inches, 12 inches, and 20 inches. .

  Paragraph 0008 of JP-A-2009-298676 (Patent Document 1) states that "the cylindrical ingot block has its outer peripheral surface cylindrically ground with a cup wheel type grindstone, and is further oriented flat (commonly referred to as" orientation flat ") or An index flat (commonly called “infrastructure”) is ground or cut, and then sliced into a thickness of 200 to 900 μm by a wire cut saw of an ingot block to manufacture a wafer. ". Further, paragraphs 0020-0023 states that “the orientation flat is that the crystal orientation is specified by cutting out a part of the outer periphery of the circular semiconductor substrate in the direction parallel to the crystal orientation. Formed on the outer periphery of the semiconductor substrate for discriminating the front and back sides, however, in order to discriminate the front and back of the semiconductor substrate, the orientation flat and the infrastructure are formed at positions that are asymmetric with respect to the center of the semiconductor substrate. "The orientation flat of the sapphire substrate specifies the crystal orientation (11-20 direction)."

  JP 2008-207992 A (Patent Document 2) states, in paragraphs 0002 to 0004, “Sapphire is a single crystal of aluminum oxide having a hexagonal crystal structure (melting point: about 2050 ° C.). The crystal is used as, for example, a substrate material such as a GaN film formation substrate for a blue LED, etc. A sapphire single crystal is an anisotropic material, and a GaN film formation wafer is cut out from an ingot of a sapphire single crystal. In general, the main surface of the wafer is cut so as to be a plane (c-plane) perpendicular to the c-axis <0001> of the sapphire single crystal, and sapphire is an optically uniaxial transparent material. It is also used as an optical material for liquid crystal projector films, etc. When used as an optical material, it must be transparent without coloring. That. Also, the polarization properties of the sapphire single crystal, as in the case of the substrate material, c plane substrate whose principal surface perpendicular to the c-axis is mainly used.

  When cutting a c-plane substrate from a sapphire single crystal ingot, in order to avoid wasting material as much as possible, the crystal is grown in the c-axis direction to obtain a substantially cylindrical ingot, and this ingot is formed in the c-axis direction (ingot direction). It is desirable to cut perpendicularly to (axial direction). However, it is known that bubble defects tend to occur when crystals are grown in the c-axis direction. If there are bubble defects in the ingot, cracks are likely to occur during processing, and when used as a substrate material or an optical material, their characteristics are likely to be insufficient. As a method for reducing the occurrence of bubble defects, it is known that the growth direction of the sapphire single crystal is shifted by a predetermined angle from the c-axis, or the a-axis or m-axis direction perpendicular to the c-axis (for example, JP, 2004-83316, A). ".

  The sapphire ingot block is manufactured by punching out a large thick plate-like sapphire crystal with a boring core bit (blade) as disclosed in Japanese Patent Application Laid-Open No. 2008-971 (Patent Document 3). There is also.

Furthermore, Japanese translations of PCT publication No. 2010-514581 (patent document 4) discloses the surface processing method of the sapphire substrate by which the ingot block was sliced, from the group consisting of a-plane, r-plane, m-plane, and c-plane orientation. N having a selected crystal orientation and not more than about 0.037 μm / cm ²
A sapphire substrate including a generally flat surface having a TTV, wherein the nTTV is a total thickness variation normalized by the surface area of the substantially zero flat surface, the substrate having a diameter of about 9.0 cm or more And disclosed. As an embodiment thereof, in paragraphs 0005 to 0009, "the first fixed abrasive is used to grind the first surface of the sapphire substrate, and the second particle having an average particle size smaller than that of the first fixed abrasive. A method for machining a sapphire substrate that includes grinding a first surface of a sapphire substrate using a fixed abrasive of: Another embodiment is an abrasive such that the first surface has c-plane orientation. Is used to provide a sapphire substrate lot comprising a plurality of sapphire substrates comprising grinding a first surface of each sapphire substrate, the sapphire substrate lot comprising at least 20 sapphire substrates. the sapphire substrate (i) c plane orientation, (ii) m plane misorientation angle of the crystal (θ _m), and (iii) a surface Misuo crystals Having a first surface having a ene station angle (theta _a), where, (a) misorientation angle theta standard deviation sigma _m of _m is about 0.0130 or less, and (b) misorientation angle theta _a standard The deviation σ _a is at least one of about 0.0325 or less.
A sapphire substrate lot including at least 20 sapphire substrates is targeted. Each sapphire substrate has a first surface having (i) c-plane orientation, (ii) m-plane misorientation angle (θ _m ) of the crystal, and (iii) a-plane misorientation angle (θ _a ) of the crystal. , where, (a) a standard deviation sigma _m of misorientation angle theta _m of about 0.0130 or less, and (b) misorientation angle theta _a standard deviation sigma _a of at least one of about 0.0325 or less true . ".

Japanese Patent Application Laid-Open No. 2009-186181 (Patent Document 5) includes an X-ray diffraction crystal orientation measuring apparatus that measures the crystal orientation of a cylindrical ingot in FIG. 2, and an X-ray diffraction crystal orientation measurement apparatus in FIG. 3 shows a cylindrical grinding apparatus for a cylindrical ingot, and after measuring the crystal orientation h of the cylindrical ingot according to paragraphs 0070 to 0077 and paragraphs 0085 to 0089, the ingot is moved to the cut chamfering machine shown in FIG. Therefore, the first cut surface Wa ₁ is ground perpendicularly to the axial crystal orientation h to obtain a new first cut surface Wa _3, and the second cut surface Wa ₂ in the opposite direction is ground to obtain a new second cut surface Wa ₂ . a cut surface Wa _4, then an ingot having a vertical cutting plane W _3, W ₄ in the first transfer robot and transferred to the clamping device of the cylindrical grinding apparatus with a cylindrical grinding wheel A method of cylindrical grinding of the outer peripheral surface of a cylindrical ingot is described. Furthermore, in FIG. 10 and paragraph 0090 described in Patent Document 5, the radial crystal orientation k of the cylindrically ground ingot is measured by the X-ray diffraction crystal orientation measuring device, and the radial direction of the ingot is measured by the cylindrical grinding device. Disclosed is a method of forming an orientation flat surface based on a crystal orientation k.

  On the other hand, a laser device (XRD machine) with an X-ray diffraction crystal orientation measuring device capable of notching or laser processing a semiconductor substrate is also used to measure the crystal orientation of the substrate or ingot. For example, Yoshito Tanaka, JST-CREST, published an XRD machine in the “Advanced Phase Measurement of Optical Recording Media by Synchrotron Radiation Time-Resolved X-ray Diffraction Measurement”, Advanced Magnetic Materials Research Group 100316 @ Tokyo Tech. The structure and its use are disclosed.

  In addition, Shinsaku Kikuta et al. Of Seikei Graduate School have published the XRD machine structure and its results in a joint paper published by Seikei University and Amada Co., Ltd. (Non-Patent Document 2). The usage method is disclosed.

  Furthermore, methods for measuring the crystal orientation of a single crystal ingot with an XRD machine are disclosed in JP-A-10-160688 (Patent Document 6), JP-A 2000-2672 (Patent Document 7), and JP-A-2001-13092. (Patent Document 8), Japanese Patent Application Laid-Open No. 2001-272359 (Patent Document 9), and the like.

  On the other hand, in Japanese Patent Application Laid-Open No. 2005-255463 (Patent Document 10), the ingot orientation flat processing (102) is performed after the ingot cylindrical grinding processing (101) in FIG. 1, and then the ingot is subjected to wafer slicing processing (see FIG. 1). 103), and then, a process diagram for performing wafer peripheral grinding (104) is disclosed.

  Further, Japanese Patent Laid-Open No. 2000-158123 (Patent Document 11) discloses an ingot transfer robot and an ingot transfer method.

Yoshito Tanaka, “Phase change structure measurement of optical recording media by synchrotron radiation time-resolved X-ray diffraction measurement” Advanced Magnetic Materials Research Group 100316 @ Tokyo Institute of Technology PDF paper, [online], searched July 6, 2011], Internet <URL: www.spring8.or.jp/ext/ja/iuss/htm/text/06file /.../ tanaka.pdf> Susumu Kikuta, 3 others, “Estimation of springback amount of laser processed material using XRD crystal orientation database”, [online], searched on July 6, 2011], Internet <URL: www.sd.seikei .ac.jp / lab / zairiki /_.../ 2011zairyo_powerpoint_kikuta.pdf>

JP 2009-298676 A JP 2008-207992 A JP 2008-971 A Japanese Translation of PCT International Publication No. 2010-514581 JP 2009-186181 A Japanese Patent Laid-Open No. 10-160688 JP 2000-2672 A JP 2001-13092 A JP 2001-272359 A JP 2005-255463 A JP 2000-158123 A

  In the cylindrical grinding apparatus with XDR machine described in Patent Document 5, orientation flat machining is performed after cylindrical grinding of the outer periphery of the ingot. From the sapphire substrate manufacturer, the appearance of a cylindrical grinding machine with an XDR machine having a higher production volume has appeared. It is desired.

Also, the semiconductor substrate manufacturers to use a cylindrical grinding apparatus, chamfering allowance of the cylindrical ingot block (workpiece) to (t _e) is set to less chamfering programs and 0.5 to 1.5 mm, the controller of the machining program (Numerical control device) The data is stored in the memory unit, and after the processor holds both ends of the C-axis of the workpiece with the clamping device, the chamfering operator of the cylindrical ingot block hits the workpiece with a hammer and the workpiece of the clamping device. After aligning the C-axis position of the workpiece with respect to the support shaft to the height of the grinding wheel starting position of the grinding wheel, chamfering of the workpiece with the grinding wheel is started.

  This method of correcting the clamping (supporting) position of the workpiece on the clamping device has the advantage that the amount of grinding waste used for regeneration is reduced. However, since the clamping position is corrected manually by hitting the cylindrical ingot block with a hammer, some of the workpieces that have been chamfered with grinding are not correct in the C-axis correction position and have a lack of peripheral dimensions. Since this is a cause of loss substrate generation, it is recycled as a reprocessed product, causing a reduction in substrate production rate. For example, in the case of a sapphire substrate, the angle of crystal coordination direction angle connecting the substrate center to the orientation flat of the sapphire substrate having a thickness of 0.2 to 1.0 mm obtained by slicing a cylindrical ingot block by the wire cut method is less than 90 degrees. This is because if it exceeds 5 degrees, it will be treated as a defective product as a sapphire substrate.

  Therefore, both in the cylindrical grinding stage of the workpiece and in the orientation flat processing of the cylindrically ground workpiece, the crystal direction of the workpiece is measured using a laser device (XRD machine) with an X-ray diffraction crystal orientation measuring device, and the laser beam is used. The crystal orientation direction is marked on the workpiece. The orientation flat machining time of the workpiece is extremely short compared to the cylindrical grinding time. Since XRD machines are expensive at 2,000 to 30 million yen / unit, semiconductor substrate manufacturers that use cylindrical grinding machines can perform workpiece cylindrical grinding and workpiece orientation flat machining with a single chamfering machine. We request the advent of multi-task machines with one XRD machine.

The compound chamfering apparatus for a cylindrical ingot provided with the X-ray diffraction crystal orientation measuring apparatus, the cut chamfering machine, and the cylindrical grinding apparatus described in Patent Document 5 satisfies the demands of a semiconductor substrate manufacturer using a cylindrical grinding apparatus. . However, after measuring the crystal orientation h of the cylindrical ingot, the first transfer robot moves the ingot to the cut chamfering machine, where the first cut surface Wa ₁ is ground perpendicularly to the axial crystal orientation h to newly The first cut surface Wa ₃ is formed, the second cut surface Wa ₂ in the opposite direction is ground to form a new second cut surface Wa _4, and then the ingot having the vertical cut surfaces W ₃ and W ₄ by the first transfer robot. Is transferred to a clamping device of a cylindrical grinding device to perform cylindrical grinding. However, the ingot block currently on the market for semiconductor substrate manufacturers is the one before the cylindrical grinding process, and has a first cut surface Wa ₃ and a second cut surface Wa _4, and has a C-axis. It is a work with a wrinkle on the outer peripheral surface where the marker is applied.

  In the cylindrical grinding apparatus attached to the XRD machine described in Patent Document 5, the time for performing the orientation flat grinding on the ingot is shorter than about 1/5 as compared with the outer circumferential cylindrical grinding time of the ingot. Therefore, if four cylindrical grinding machines are arranged for one XRD machine, and one conveyance robot that feeds and discharges workpieces is attached to these four cylindrical grinding machines, the yield of processed workpieces can be increased. Improve by 4 times. In addition, the crystal orientation can be marked by orientation flat processing with the laser light irradiated from the XRD machine, and the distance from the C axis of the cylindrical ingot block to the outer peripheral surface can be measured by the XRD machine.

  The first object of the present invention is to arrange four complex chamfering processing devices, two by two with a XRD machine, in which cylindrical grinding of a cylindrical ingot block (work) and orientation flat processing of a workpiece can be performed with one cylindrical grinding device. To provide a combined chamfering apparatus.

Claim 1 of the present invention provides
A transfer robot (200) capable of sliding on the first guide rail (100) extending in the left-right direction;
A first storage shelf (300) of a cylindrical ingot block (work) provided at the right end of the first guide rail,
A second storage shelf (400) of a workpiece (finally processed product) subjected to orientation flat processing provided at the left end of the first guide rail,
The first cylindrical grinding device (500a), the second cylindrical grinding device (500b), from the right end provided parallel to the rear side toward the left end side with respect to the first guide rail (100) for sliding of the transfer robot, A chamfering device group in which a laser device (600) with an X-ray diffraction crystal orientation measuring device, a third cylindrical grinding device (700a), and a fourth cylindrical grinding device (700b) are provided with an interval,
It is a composite chamfering machine for workpieces composed of:
The first cylindrical grinding device (500a), the second cylindrical grinding device (500b), the third cylindrical grinding device (700a), and the fourth cylindrical grinding device (700b) are the same kind of cylindrical grinding device, A moving table (4) for placing a clamping device (7) comprising a headstock (7a) and a tailstock (7b) having a centering function capable of sliding on a second guide rail (3, 3) extending in the front-rear direction. ) with Keru set to, in the direction perpendicular to C-axis of the support shaft (workpiece to be支架to 7a 1, _{7b 1)} of the clamping device, and a pair of cylindrical grinding cup wheel type grinding wheel across the C axis ( 10g, 10g, or 11g, 11g) is provided so as to be able to move forward and backward, and includes an autoloader device (13) and a work stocker (14). The loader device (13) and the clamping device (7) constitute a workpiece loading / unloading stage, and the clamping device (7) and the pair of cylindrical grinding cup wheel type grindstones (10g, 10g, or 11g, 11g). ) To form a workpiece cylindrical grinding stage and orientation flat grinding stage
A composite chamfering apparatus characterized by the above is provided.

  The compound chamfering apparatus of the present invention uses one XRD machine, and can perform cylindrical grinding and orientation flat grinding of a cylindrical ingot block with four cylindrical grinding apparatuses. The production of machined workpieces can be increased fourfold.

  Since the workpiece can be subjected to cylindrical grinding using a pair of cup wheel grindstones (10 g, 10 g, or 11 g, 11 g) simultaneously, the cylindrical grinding time can be shortened.

In the single cylindrical grinding machine (500a, 500b, 700a, 700b) using the composite chamfering machine of the present invention, the cylindrical ingot block (workpiece) is subjected to cylindrical grinding and orientation flat forming through the following steps. Is called.
(1) The workpiece (w) stored in the first storage shelf (300) is gripped by the block transfer robot (200), and then the gripped workpiece is laser device (600 with X-ray diffraction crystal orientation measuring device) ) Transfer before, detect the C-axis orientation at both ends of the workpiece with the laser device (600) with X-ray diffraction crystal orientation measuring device, and mark with laser light.
(2) The C-marked workpiece (w) held by the block transfer robot (200) is transferred to the workpiece stocker (14) of the cylindrical grinding apparatus, and then the workpiece is moved to the hand claw of the autoloader device (13). the embrace e inclusive, headstock support shaft of the clamping device (7a ₁₎ and the support shaft of the tailstock (7b ₁₎ C axis which is marking the workpiece between the headstock of the support shaft and the mind of the clamping device A workpiece loading process in which the workpiece is supported so as to coincide with the C-axis center connecting the support shafts of the pedestal.
(3) The cup wheel that rotates by rotating the work piece supported by the clamp device (7) around the C axis of the clamp device by the servo motor of the headstock (7a), and rotating the cup wheel type grindstone shaft. The mold grinding wheel (10 g, 10 g, or 11 g, 11 g) is moved forward (moved in the left direction) so as to come into contact with the circumferential surface of the workpiece rotating around the C axis, and cylindrical grinding is started. After performing a cutting process for moving the grindstone forward (moving in the left direction) to a distance where a cylindrical grinding workpiece having a radius (R / 2) minus a cylindrical grinding allowance (t _g ) is obtained, the clamping device is moved to the cup wheel. A step of performing cylindrical grinding, in which the outer peripheral surface of the work supported by the clamping device is further subjected to cylindrical grinding by being further advanced to the mold grindstone side and passed therethrough.
(4) A workpiece subjected to cylindrical grinding supported on the clamping device (7) is held by a hand claw of an autoloader device (13), and then cylindrically ground to a workpiece stocker (13) of the cylindrical grinding device. A workpiece unloading process for transferring w.
(5) The cylindrically ground workpiece (w) is received by the block transfer robot (200), and then the received workpiece is transferred to the front of the laser device (600) with an X-ray diffraction crystal orientation measuring device. An orientation flat marking process in which the orientation flat crystal orientation of a workpiece is detected by a machine, and then the orientation flat crystal orientation is marked on the workpiece with a laser beam.
(6) The workpiece (w) marked with the orientation flat crystal orientation held by the block transfer robot (200) is transferred to the workpiece stocker (14) of the cylindrical grinding apparatus, and then the autoloader device (13) The workpiece is held in the hand claw, and the C-axis centered on the workpiece between the support shaft of the headstock of the clamp device (7) and the support shaft of the tailstock is the support shaft of the headstock of the second clamp device. The workpiece delivery and loading process, in which the workpiece is supported so as to coincide with the C-axis center connecting the support shaft of the tailstock.
(7) A centering step of centering the ground workpiece in a crystal orientation to be subjected to orientation flat processing by rotating a support shaft (7a ₁ ) of the headstock of the clamp device (7).
(8) The grindstone shaft that supports the cupwheel grindstone (10 g or 11 g) on the side close to the position where the workpiece of the pair of cupwheel grindstone shafts of the cylindrical grinding apparatus is subjected to orientation flat processing is rotated and rotated. The cup wheel grindstone is moved forward (moved leftward) to contact the circumferential surface of the workpiece centered in the crystal orientation to be subjected to the orientation flat processing to start the orientation flat grinding, and further the cup wheel grinding wheel is advanced. After the incision processing is performed to advance (leftward movement) to the grinding distance _of the orientation flat grinding allowance (t _of ), the clamp device is moved to the cup wheel type grindstone side so that the outer peripheral surface of the cylindrical ingot block is moved. An orientation flat grinding process that forms orientation flats.
and,
(9) After the orientation flat grinding work (w) supported by the clamp device (7) is gripped by the robot claw of the autoloader device and transferred to the work locker, the transfer robot receives the work. Unloading process to transfer to the second storage shelf.

  Therefore, by shifting the loading timing of the work loaded by the block transfer robot (200) to one cylindrical grinding device of each of the four cylindrical grinding devices (500a, 500b, 700a, 700b), Cylindrical grinding devices (500a, 500b, 700a, 700b) can be operated in the same time zone.

FIG. 1 is a plan view of a composite chamfering apparatus. FIG. 2 is a side view of the cylindrical grinding apparatus. FIG. 3 is a plane surface of the cylindrical grinding apparatus. FIG. 4 is a rear view of the autoloader device. FIG. 5 is a plan view of the cylindrical grinding apparatus, and the autoloader device is omitted. FIG. 6 is a side view showing a centering operation and a cylindrical grinding operation in the workpiece clamping device. FIG. 7 is a process flow diagram leading to a centering process and a cylindrical grinding process in the workpiece clamping device. FIG. 8 is a work diagram in which the outer peripheral surface of the work is chamfered, and is a view seen from the end face direction of the work. FIG. 8a shows a cylindrical grinding work, and FIG. 8b shows an orientation flat working.

  A composite chamfering apparatus 1 of the present invention shown in FIG. 1 includes a transfer robot 200 that can slide on a first guide rail 100 extending in the left-right direction, and a first storage shelf 300 for workpieces provided at the right end of the first guide rail. , A second storage shelf 400 for workpieces subjected to orientation flat processing provided at the left end of the first guide rail 100, and a left end from a right end provided parallel to the rear side with respect to the first guide rail 100 for sliding of the transfer robot. This is a composite chamfering processing apparatus 1 in which five machines, that is, a first cylindrical grinding apparatus 500a, 500b, an XRD machine 600, and a second cylindrical grinding apparatus 700a, 700b are provided side by side toward the side.

  The first cylindrical grinding device 500a, the second cylindrical grinding device 500b, the third cylindrical grinding device 700a, and the fourth cylindrical grinding device 700b are the same type of cylindrical grinding device, and the first cylindrical grinding device 500a and the third cylindrical grinding device. A cup wheel type rough grinding wheel 10g is attached to 700a, and a cup wheel type finishing grinding wheel 11g is attached to the second cylindrical grinding device 500b and the fourth cylindrical grinding device 700b. The cup wheel type rough grinding wheel 10g and the cup wheel type finishing grinding wheel 11g are the same type of cup wheel type grinding wheel (10g or 11g) when the fourth cylindrical grinding device is used in the same time zone. Depending on the chamfering program used for the composite chamfering apparatus 1 of the present invention, after the workpiece is subjected to cylindrical grinding with the cup wheel type rough grinding wheel 10g of the first cylindrical grinding apparatus 500a, the workpiece is transferred by the block transfer robot 200. It is also possible to change the chamfering program so that it is transferred to the clamping device 7 of the second cylindrical grinding device 500b and the finishing cylindrical grinding is performed with the cup wheel type finishing grinding wheel 11g of the second cylindrical grinding device 500b.

  Instead of the first, second, third and fourth cylindrical grinding apparatuses 500a, 500b, 700a and 700b shown in FIG. 1, the cup wheel type rough grinding wheel 10g and the cup wheel type finishing grinding wheel shown in FIGS. Cylindrical grinding apparatuses 500 and 700 having 11 g may be used.

  As shown in FIGS. 2, 3, and 5, the cylindrical grinding devices 500 and 700 reciprocate in the left-right direction on a pair of guide rails 3, 3 laid on the machine frame (base) 2 in the left-right direction. A work table 4 provided so as to be able to be provided is provided. When the work table 4 is reciprocated left and right, the ball screw 6 receives rotation driven by the servo motor 5 and rotates, and a fixing base (not shown) screwed to the ball screw advances leftward or rightward. As a result, the work table 4 having the back surface of the work table 4 fixed to the surface of the fixed base advances in the left direction or the right direction. The advancement of the work table 4 in the left direction or the right direction depends on whether the rotation shaft of the servo motor 5 is clockwise or counterclockwise.

On the work table 4 is mounted a clamping device 7 composed of a pair of a headstock 7a and a tailstock 7b which are mounted separately on the front and rear. Therefore, in association with the movement of the forward or backward direction of the work table 4 moves in the clamping device 7 also forward or backward direction, the headstock center support shaft 7a ₁ and the tailstock center support shaft 7b of the clamping device 7 _The workpiece w that is suspended (held) by ₁ and suspended in the air can move to the first cylindrical grinding stage 10, the second cylindrical grinding stage 11, or the load port 8 position.

The clamping device 7 is a known chuck mechanism and is often used in a silicon ingot cylindrical grinder. Headstock 7a has a function of rotating the workpiece w 360 degrees by rotating the headstock center support shaft 7a ₁ by the servo motor 7a _m. Tailstock 7b is provided on the movable table 7b _t which can be moved on the guide rails with an air cylinder 7e drive the left and right, after支架the workpiece by the clamp mechanism 7, and fixed by depressing the lever, movement of the work table 4 moving base 7b _t for mounting the tailstock 7b is prevented from moving by.

  The positional relationship between the first cylindrical grinding stage 10, the second cylindrical grinding stage 11, and the load port 8 is a direction in which the work table 4 is viewed at a right angle from the side surface side, and from the front side direction toward the rear side direction. The first cylindrical grinding stage 10, the second grinding stage 11, and the load port 8 are provided. The first cylindrical grinding stage 10 and the second cylindrical grinding stage 11 are covered with a hermetic cover 12. The load port 8 is closed by a one-hand side sliding door 12a. An exhaust duct 18 is connected to the space of each grinding 10, 11 covered with the hermetic cover 12, and mist and grinding debris floating in this space are discharged to the outside.

The first cylindrical grinding stage 10 is composed of a pair of grinding wheels 10a, 10a, 10a, 10a, 10a, 10a, 10a, 10a, 10a. provided at a position 10g the grinding wheel surface _10g s, 10g _s across the work table 4 so as to face each other and symmetrically around the work table 4 grindstone axis ₁₀ o, 10 _o is collinear, grindstone axis 10a, 10a has a structure that is rotated by the rotational driving of the servo motor _{10 M, 10} M.

  When the ball screw receives rotation by the servo motors 10m and 10m and rotates, and the fixing table screwed to the ball screw advances or retracts forward or backward, the tool tables 10t and 10t are placed on the surface of the fixing table. The tool tables 10t and 10t whose back surfaces are fixed move forward or backward. The forward or backward movement direction of the tool table depends on whether the rotation shafts of the servo motors 10m and 10m are clockwise or counterclockwise.

The second cylindrical grinding stage 11 includes a pair of grinding wheels 11a, 11a provided on a tool table 11t, 11t that can be moved back and forth by rotation of servo motors 11m, 11m, a pair 11g of cup wheel type grinding wheels supported by 11a, provided at a position 11g the grinding wheel surface _11g s, 11g _s is and symmetrically around the work table 4 across the work table 4 so as to face each other grindstone axis ₁₁ o, 11 _o is collinear, grindstone axis 11a, 11a has a structure that is rotated by the rotational driving of the servo motor _{11 M, 11} M.

When the ball screw receives the rotation drive by the servo motors 11m and 11m and rotates, and the fixed base screwed into the ball screw moves forward or backward in the forward or backward direction, the tool table 11t, The tool tables 11t and 11t to which the back surface of 11t is fixed move forward or backward. The forward or backward movement direction of the tool table depends on whether the rotation shafts of the servomotors 11m and 11m are clockwise or counterclockwise.

The second cylindrical grinding stage 11 is provided in parallel to the rear side of the first cylindrical grinding stage 10. That is, the grindstone axes 10 _o and 11 _{o of} both the stages 10 and 11 are parallel.

  The cup wheel type grinding wheel diameter of the cup wheel type cylindrical grinding wheel 10g, 10g, 11g, 11g and the cup wheel type grinding wheel for orientation flat grinding is 100 when the workpiece is a cylindrical ingot block for a sapphire substrate of 2 to 6 inches. ~ 240 mm. The width of the cup grindstone piece is preferably 3 to 10 mm and the width of the ring-shaped grindstone is preferably 5 to 15 mm from the viewpoint of preventing grinding burn of the workpiece.

  The abrasive grains of the cup wheel type cylindrical grinding wheels 10g and 11g are preferably diamond abrasive grains and CBN abrasive grains, and the binder is preferably a metal bond, vitrified bond, or epoxy resin bond. For example, a cup wheel type cylindrical grinding wheel is used for a bottom annular ring of a bottomed cylindrical grinding wheel base metal disclosed in Japanese Patent Laid-Open Nos. 9-38866, 2000-94342, 2004-167617, and the like. A cup wheel type grindstone in which a large number of blades are annularly arranged with a gap interval where the grinding liquid is dissipated, and a structure in which the grinding liquid supplied to the inside of the base metal is dissipated from the gap is preferable. The diameter of the annular grinding wheel of this cup wheel type cylindrical grinding wheel is preferably 1.2 to 1.5 times the workpiece diameter. The annular grindstone blade of the cup wheel type rough grinding grindstone 10g is preferably a diamond resin bond grindstone having a grind number of 100 to 280 or a diamond vitrified bond grindstone. Further, the annular grindstone blade of the cup wheel type finish grinding grindstone 11g is preferably a diamond resin bond grindstone, a diamond vitrified bond grindstone, or a diamond metal bond grindstone with a grind number of 300 to 1,200.

  As the grinding liquid, pure water, colloidal silica aqueous dispersion, ceria aqueous dispersion, SC-1 liquid, SC-2 liquid, or an aqueous dispersion in which an organic phosphorus compound is mixed with these aqueous dispersions may be used. preferable.

  The load port 8 is formed by providing an opening that allows the workpiece w to be transferred into and out of the clamping device 7 in a housing material located behind the second cylindrical grinding stage 11 and in front of the work table 4. Is done.

  During the orientation flat grinding of the workpiece, the first cylindrical grinding stage 10 is called a first orientation flat grinding stage, and the second cylindrical grinding stage 11 is called a second orientation flat grinding stage.

  In FIG. 2, reference numeral 20 denotes a control device, and reference numeral 21 denotes an operation panel. Moreover, in FIG. 3, the code | symbol 9c shows a grinding fluid supply pipe | tube.

  As shown in FIGS. 1, 2, 3, and 4, the cylindrical grinding apparatuses 500 and 700 are arranged on the front side of the work table 4 and in the space between the load port 8 and the second grinding stage 11. A loader (work loading / unloading device) 13 and a work stocker 14 for storing three ingot blocks are juxtaposed on the machine frame 2. Reference numeral 15 denotes a spare work stocker (storage shelf) placed on the table of the transport carriage 16 provided with a stepladder. The spare work stocker 15 may be used as the above-described storage shelves 300 and 400 provided at both ends of the first guide rail.

  The work stockers (storage shelves) 14 and 15 are provided with V-shaped shelves having an inverted isosceles triangle shape capable of storing three workpieces w, w, and w inclined at 45 degrees, and positioning pins 16 protruding from the machine frame. It is placed on top.

  The autoloader device (work loading / unloading device) 13 holds a workpiece stored on a work stocker 14V-shaped shelf with a pair of claws 13a and 13b, and lifts both claws to raise the workpiece. Lifting, then retreating, moving in the right direction, descending, positioning in front of the load port 8, and further retreating the workpiece from the load port 8 between the headstock 7a and the tailstock 7b of the clamping device 7 Transport. After one end of the work is brought into contact with the center support shaft 7a1 of the headstock 7a, the tailstock 7b is moved to the right by the air cylinder 7e, and the other end is brought into contact with the center support shaft 7b1 so that the work is 45 degrees V. Inclined and suspended on 4 sides suspended. Next, the claws 13a and 13b are separated to release the workpiece, and then the fixing base 13f supporting the claws 13a and 13b is lifted, moved to the left, and further moved backward to move both claws. 13a and 13b are returned to the standby position.

  Further, the chamfering process and the cleaned and air-dried work supported in a suspended state in the clamp device 7 are gripped by both claws 13a and 13b, and then the fixing base 13f supporting both the claws 13a and 13b is raised, After moving the claw 13a, 13b above the empty shelves of the work stockers 14, 15 after moving the claw 13a, 13b to the left and moving the claw 13a, 13b downward, , 13b are separated and the workpiece is released, and then the claws 13a, 13b are returned to the standby position.

The fixed base 13f that supports the claws 13a and 13b is moved in the front-rear direction by providing, on the side surface of the column 13c, the sliding surface 13s of the fixed base 13f that is screwed back to the ball screw 13k that is rotationally driven by the servo motor 13m. This is done by sliding on the guide rail 13g. The vertical movement of the fixing base 13f that supports the claws 13a and 13b is performed by the air cylinder 13p. The two claws 13a and 13b are separated from each other by using a micro week air cylinder 13e shown in a circle in FIG. Fine adjustment of the slight raising and lowering of the claws 13a and 13b is performed using a micro week air cylinder 13l. Both pawls 13a, fine adjustment of a small back-and-forth movement of the 13b is performed using a micro weak air cylinder 13 _R.

The workpiece w stored in the workpiece stockers 14 and 15 installed in the cylindrical grinding device is automatically clamped (supported) on the support shafts 7a ₁ and 7b ₁ of the clamp device 7 using the robot claws 13a and 13b of the autoloader device 13. The process to perform is performed as follows.

Robot claw 13a of the autoloader devices 13, diameter 13b is Rmm, grinding allowance (t) set to grip the central portion of the cylindrical ingot block (work) of _t g mm thickness. S01

Wherein the gripped workpiece to the robot claws and carried into between the support shaft 7b ₁ of the support shaft 7a ₁ and tailstock 7b headstocks 7a, the longitudinal axis (C axis of the workpiece w by advancing the tailstock 7b Both ends in the direction) are supported by the support shafts 7a ₁ and 7b ₁ of the clamp device 7. A line connecting both shaft centers of the support shafts 7a ₁ and 7b ₁ is called a C-axis center of the clamp device 7. S02

  The robot claws 13a and 13b of the autoloader device 13 are moved away from the workpiece w. S03

The outer peripheral position height (H _r , H _l ) in the vicinity of both ends of the workpiece w supported by the clamp device 7 is used as a height measuring device HS (for example, touch probe sensor ΣD (trade name) of Tokyo Seimitsu Co., Ltd., Nikon Corporation) The workpiece is measured while rotating 360 degrees around the C axis on the headstock using an image pickup apparatus equipped with a laser displacement sensor device or a CCD camera. The measurement of H _r , H _l ) can also be obtained by measuring the workpiece radius from the center of the C axis to the outer periphery of the workpiece when the X axis machine detects the workpiece C axis.

The value of the maximum value of the peripheral position height from C axis of the measured two points _{(H h)} and minimum value _{(H m) (H h,} H m) are both _{(R / 2-t g)} mm If it is above, it will progress to S12a mentioned later which transmits the signal of the end of automatic clamp to work clamping device 7, and the infeed chamfering processing of the cylindrical ingot block by the cup wheel type grindstone of the next process will be started. S13

Numerical control device ½ amount of difference (H _h -H _m ) between maximum value (H _h ) and minimum value (H _m ) of outer peripheral position height from C point on two points measured in step S04 The calculation unit S05

Further, the distance between the C axis of the clamp device 7 and the grinding start point position of the cup wheel type grindstone 10g (R / 2−t _g ) and the minimum value (H _m ) are compared in the comparison unit of the numerical controller. Then, the value of (R / 2−t _g −H _m ) is a positive direction, and the C axis of the workpiece is moved on a plane including the C axis of the clamp device 7 and the height measuring device HS. Decide the direction. S06

  After the center of the workpiece w is gripped by the robot claws 13a and 13b of the autoloader device 13, the tailstock 7b of the clamping device 7 is retracted to release the workpiece. S07

Support axis (C-axis) of the clamp device for moving the C-axis position of the ingot block by a half amount of the calculated (H _h -H _m ) of the work held by the robot claw of the autoloader device ). S08

The tailstock 7b is moved forward to be supported on the support shafts 7a ₁ and 7b ₁ of the clamp device 7. S09

  The robot claws 13a and 13b are moved away from the workpiece w. S10

The height of the outer peripheral position (H _r , H _l ) in the vicinity of both ends of the supported work w is rotated 360 degrees around the C axis by the servo motor of the headstock 7a using the height measuring device HS. Measure while. S11

The value of the maximum value of the peripheral position height from C axis of the measured two points _{(H h)} and minimum value _{(H m) (H h,} H m) are both _{(R / 2-t g)} mm If it is above, the signal of the completion | finish of automatic clamping to the clamp apparatus 7 of a workpiece | work will be transmitted, and S12a will start the infeed chamfering grinding process of the cylindrical ingot block by the cup wheel type grindstone of the next process. S13

The value of the outer peripheral position height of at least one of the maximum value (H _h ) and the minimum value (H _m ) (H _h , H _m ) of the outer peripheral position height from the two measured C axes. Is less than (R / 2−t _g ) mm, an automatic clamping failure signal is sent to the workpiece clamping device, and the center portion of the workpiece w is gripped by the robot claws 13a and 13b of the autoloader device 13 in S12b. Thereafter, the tailstock 7b is moved backward to release the support by the workpiece clamping device 7, and then the robot claws 13a and 13b are moved to the workpiece stocker 14 (the workpiece is conveyed out of the clamping device 7). S14

The chamfering grinding process of the cylindrical ingot block by the cup wheel type grindstone 10g in the step S13 is performed while moving the clamp mechanism 7 that supports the ingot block suspended in the left-right direction at a speed of 1 to 15 mm / min, The center support shaft 7a ₁ is rotated at a rotational speed of ₁₀ to 300 rpm, and a pair of 10 g and 10 g of the grinding wheel shaft rotating at a rotational speed of 800 to 3,000 rpm is connected to the C axis side of the clamp device 7. is advanced cup wheel type grindstone 10g, and the infeed edge position of 10g from C axis of the clamping device 7 to (R / 2-t _g) distance (grinding start point position) to start the grinding to, While supplying the grinding fluid to the grinding work point in an amount of 5 to 100 cc / min, the cup wheel grindstone is transferred by a pair of 10 g and 10 g. The ingot block peripheral surface thickness of a infeed cylindrical grinding of allowance removal amount of t _g mm.

The workpiece grinding allowance (t _g ) by the cup wheel type cylindrical grinding wheel 10 g, 11 _g is 0.5 to 1.0 mm.

Since the cylindrical ingot block w determined to have an automatic clamping failure in the above-described step S12b is recovered without being subjected to cylindrical grinding, the grinding amount (t) is set to a value larger than the set grinding amount (t _g ). Can be reused as a cylindrical grinding material.

  As described above, the transfer robot 200 that slides on the first guide rail 100 moves the workpiece w between the work locker 14, the storage shelves 300 and 400, the first cylindrical grinding device 500, the XDR machine 600, and the second cylindrical grinding device 700. Used to deliver.

A laser device (X-ray diffraction) 600 with an X-ray diffraction crystal orientation measuring device includes an X-ray irradiator, an X-ray diffractor, a laser light irradiator, a CCD camera, a work table, a controller having a time circuit, and the like. . Workpiece imaging, workpiece crystal orientation measurement, laser marking on workpieces, etc. are possible.

The CCD camera can measure the radius from the C axis (center point) of the workpiece to the outer periphery of the workpiece, so the radius of the workpiece is measured with this XRD machine while rotating the workpiece, and the maximum radius (H _h ) and minimum If the value (H _m ) is measured, as described in paragraph 0057 of this specification, the maximum value (H _h ) and the minimum value of the height of the outer peripheral position from the C axis line of these two points are measured. If both (H _m ) values (H _h , H _m ) are equal to or greater than (R / 2−t _g ) mm, the process proceeds to step S12a, which will be described later, for transmitting an automatic clamping end signal to the workpiece clamping device 7, The process S13 which starts the infeed chamfering grinding process of the cylindrical ingot block by the cup wheel type grindstone of the next process can be performed.

  The process of performing cylindrical grinding and orientation flat forming on a cylindrical sapphire ingot block (work) using the composite chamfering apparatus 1 of the present invention is performed through the following steps.

  (1) The workpiece w stored in the first storage shelf 300 is gripped by the block transport robot 200, and then the gripped workpiece is transferred to the front of the XRD machine 600, and the C-axis orientations at both ends of the workpiece are detected by the XRD machine. Then, the C-axis direction is marked on the workpiece with a laser beam. (C-axis bearing detection step.)

  (2) The workpiece w marked with the C-axis gripped by the block transfer robot 200 is transferred to the workpiece stocker 14 of the cylindrical grinding apparatuses 500 and 700, and then the workpiece is held in the hand claw of the autoloader device 13, The C-axis centering the workpiece between the support shaft of the headstock 7a and the support shaft of the tailstock 7b of the clamping device 7 connects the support shaft of the headstock and the support shaft of the tailstock of the clamp device 7 Support the work so that they are in agreement. (Work loading process.)

(3) The work w supported on the clamp device 7 is rotated around the C axis of the clamp device 7 by the servo motors 10M and 11M of the headstock 7a, and the cup wheel type grindstone shafts 10o and 11o are rotated and rotated. The cup wheel type grindstone 10g is advanced so as to contact the circumferential surface of the work rotating around the C-axis to start cylindrical grinding, and the cup wheel type grindstone 10g is removed by cylindrical grinding allowance (t _g ) Is cut to advance to a distance where a cylindrical grinding workpiece having a target radius (R / 2) is obtained, and then the clamping device 7 is passed between a pair of cup wheel type grindstones 10g and 10g. The outer peripheral surface of the workpiece is subjected to rough cylindrical grinding, and the clamp device 7 is passed between a pair of rotating cup wheel grindstones 11g and 11g. Cylindrically finish grinding the outer peripheral surface of the over click. (Cylinder grinding process).

  (4) The cylindrically ground workpiece w supported on the clamp device 7 is held by the hand claw of the autoloader device 13, and then the cylindrically ground workpiece is transferred to the workpiece stocker 14 of the cylindrical grinding devices 500 and 700. To do. (Unloading process of the workpiece after cylindrical grinding).

  (5) The workpiece w subjected to cylindrical grinding is received by the block transfer robot 200, and then the received workpiece is transferred to the front of the XRD machine, and the orientation flat crystal orientation of the work is detected by the XRD machine, and then the orientation flat is applied to the work. Mark crystal orientation with laser light. (Oriental flat marking process.)

  (6) The workpiece w with the orientation flat crystal orientation marked by the block transfer robot 200 is transferred to the workpiece stocker 14 of the cylindrical grinding apparatus 500, 700, and then the workpiece is placed on the hand claw of the autoloader device 13. The C-axis with the workpiece marked between the support shaft of the headstock 7a and the support shaft of the tailstock 7b of the clamp device 7 is supported by the support shaft of the headstock and the tailstock of the clamp device 7 The work is supported so as to coincide with the C axis connecting the axes. (Work delivery loading process.)

  (7) A step of rotating the support shaft of the headstock 7a of the clamp device 7 to center the ground workpiece in a crystal orientation to be subjected to orientation flat processing. (Orienting flat alignment process.)

(8) The grindstone shaft 10o that supports the cupwheel grindstone 10g on the side close to the position where the workpiece of the pair of cupwheel grindstone shafts 10o, 10o of the cylindrical grinding apparatus 500, 700 is subjected to orientation flat processing is rotated. Then, 10 g of the rotating cup wheel grindstone is advanced to contact the circumferential surface of the workpiece centered in the orientation orientation of the orientation flat, and the orientation flat grinding is started, and the cup wheel grindstone is further advanced. After performing a cutting process to advance (leftward movement) to the grinding distance _{of the} orientation flat grinding allowance (t _of ), the clamp device 7 is passed between a pair of cup wheel type grindstones 10g, 10g to make a cup wheel type grindstone. The outer peripheral surface of the workpiece is subjected to cylindrical rough grinding with 10 g to form an orientation flat on the workpiece. The cup wheel grindstone 11g is passed between 11g, and the outer peripheral surface of the workpiece is cylindrically ground by the cup wheel grindstone 11g to form an orientation flat on the workpiece. (Oriental flat grinding process).

  and,

  (9) After the orientation flat grinding work w supported by the clamp device 7 is gripped by the robot claw of the autoloader device 13 and transferred to the work locker 14, the transfer robot 200 receives the work w. Transfer to the second storage shelf 400. (Unloading process.)

In the above, the cup wheel type grindstone 10 g, grinding allowance of a workpiece by 11g _{(t g)} is 0.5 to 1.0 mm.

  The compound chamfering apparatus of the present invention can perform cylindrical grinding and orientation flat grinding of an ingot block by using one XRD machine 600 and one cylindrical grinding apparatus 500, 700. By arranging the cylindrical grinders 500a, 500b, 700a and 700b, the production amount of chamfering workpieces per hour per composite chamfering machine can be improved by about four times or more. In particular, since a workpiece is subjected to cylindrical grinding with a pair of cup wheel type grindstones (10 g, 10 g or 11 g, 11 g), the cylindrical grinding time of the workpiece per cylindrical grinding device with an XDR machine described in Patent Document 5 is also reduced. Can be shortened.

1 Compound chamfering machine w Workpiece (Cylindrical sapphire ingot block)
DESCRIPTION OF SYMBOLS 100 1st guide rail 200 Conveyance robot 300,400 Storage shelf 500a, 500b Cylindrical grinding device 4 Work table 6 2nd guide rail 7 Clamp mechanism 7a Shaft base 7b Tailstock 8 Load port 10 First grinding stage 10g Cup wheel type cylinder Grinding wheel 11 Second grinding stage 11g Cup wheel type cylindrical grinding wheel HS Height measuring device 13 Autoloader device 14 Work stocker 600 XRD machine 700a, 700b Cylindrical grinding device

Claims (1)

A transfer robot (200) capable of sliding on the first guide rail (100) extending in the left-right direction;
A first storage shelf (300) of a cylindrical ingot block (work) provided at the right end of the first guide rail,
A second storage shelf (400) of a workpiece (finally processed product) subjected to orientation flat processing provided at the left end of the first guide rail,
The first cylindrical grinding device (500a), the second cylindrical grinding device (500b), from the right end provided parallel to the rear side toward the left end side with respect to the first guide rail (100) for sliding of the transfer robot, A chamfering device group in which a laser device (600) with an X-ray diffraction crystal orientation measuring device, a third cylindrical grinding device (700a), and a fourth cylindrical grinding device (700b) are provided with an interval,
It is a composite chamfering machine for workpieces composed of:
The first cylindrical grinding device (500a), the second cylindrical grinding device (500b), the third cylindrical grinding device (700a), and the fourth cylindrical grinding device (700b) are the same kind of cylindrical grinding device, A moving table (4) for placing a clamping device (7) comprising a headstock (7a) and a tailstock (7b) having a centering function capable of sliding on a second guide rail (3, 3) extending in the front-rear direction. ) with Keru set to, in the direction perpendicular to C-axis of the support shaft (workpiece to be支架to 7a 1, _{7b 1)} of the clamping device, and a pair of cylindrical grinding cup wheel type grinding wheel across the C axis ( 10g, 10g, or 11g, 11g) is provided so as to be able to move forward and backward, and includes an autoloader device (13) and a work stocker (14). The loader device (13) and the clamping device (7) constitute a workpiece loading / unloading stage, and the clamping device (7) and the pair of cylindrical grinding cup wheel type grindstones (10g, 10g, or 11g, 11g). ) To form a workpiece cylindrical grinding stage and orientation flat grinding stage
A composite chamfering machine characterized by that.

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