JP2013038111A - Complex chamfering apparatus of cylindrical ingot and method of performing cylindrical grinding and orientation flat grinding of work by using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the cylindrical grinding of the outer peripheral surface of a cylindrical ingot block, and to detect the crystal orientation of a workpiece with high accuracy.SOLUTION: In a complex chamfering apparatus 1 where same type n (n is an integer of 2-4) cylindrical grinders 500 are arranged across an XRD machine 600, wrinkles on the outer peripheral surface of a workpiece are removed by means of the cylindrical grinders 500, and then the crystal orientation of the workpiece thus ground is detected by means of the XRD machine 600 and marked. Thereafter, orientation flat grinding of the workpiece is performed using the cylindrical grinders 500.

Description

  The present invention relates to a composite chamfering apparatus for performing cylindrical grinding and orientation flat grinding of a cylindrical ingot (workpiece) such as sapphire and single crystal silicon, and a cylindrical grinding process of a cylindrical outer peripheral surface of the workpiece using the same. The present invention relates to a method for chamfering a workpiece, in which the orientation of the workpiece is detected by an X-ray diffraction crystal orientation measuring device (XRD machine), laser-marked, and then the orientation flat grinding is performed after the orientation flat orientation of the workpiece is centered.

  The columnar sapphire ingot block (work), which is the raw material for the sapphire substrate for LED substrates, is an ingot grown by the Czochralski method (CZ method) or the Bernoulli method. ) Cut in the crystal direction to form an ingot block. The crystal orientation of the sapphire ingot has an a-plane, r-plane, m-plane and c-plane orientation. The diameter of cylindrical sapphire ingot blocks is 2 inches, 4 inches, and 6 inches, and the diameter of single crystal silicon ingot blocks is 8 inches, 10 inches, 12 inches, and 20 inches. .

  Paragraph 0008 of JP-A-2009-298676 (Patent Document 1) states that "the cylindrical ingot block has its outer peripheral surface cylindrically ground with a cup wheel type grindstone, and is further oriented flat (commonly referred to as" orientation flat ") or An index flat (commonly called “infrastructure”) is ground or cut, and then sliced into a thickness of 200 to 900 μm by a wire cut saw of an ingot block to manufacture a wafer. ". Further, paragraphs 0020-0023 states that “the orientation flat is that the crystal orientation is specified by cutting out a part of the outer periphery of the circular semiconductor substrate in the direction parallel to the crystal orientation. Formed on the outer periphery of the semiconductor substrate for discriminating the front and back sides, however, in order to discriminate the front and back of the semiconductor substrate, the orientation flat and the infrastructure are formed at positions that are asymmetric with respect to the center of the semiconductor substrate "The orientation flat of the sapphire substrate specifies the crystal orientation (11-20 direction)."

  JP 2008-207992 A (Patent Document 2) states, in paragraphs 0002 to 0004, “Sapphire is a single crystal of aluminum oxide having a hexagonal crystal structure (melting point: about 2050 ° C.). The crystal is used as, for example, a substrate material such as a GaN film formation substrate for a blue LED, etc. A sapphire single crystal is an anisotropic material, and a GaN film formation wafer is cut out from an ingot of a sapphire single crystal. In general, the main surface of the wafer is cut so as to be a plane (c-plane) perpendicular to the c-axis <0001> of the sapphire single crystal, and sapphire is an optically uniaxial transparent material. It is also used as an optical material for liquid crystal projector films, etc. When used as an optical material, it must be transparent without coloring. That. Also, the polarization properties of the sapphire single crystal, as in the case of the substrate material, c plane substrate whose principal surface perpendicular to the c-axis is mainly used.

When cutting a c-plane substrate from a sapphire single crystal ingot, in order to avoid wasting material as much as possible, the crystal is grown in the c-axis direction to obtain a substantially cylindrical ingot, and this ingot is formed in the c-axis direction (ingot direction). It is desirable to cut perpendicularly to (axial direction). However, it is known that bubble defects tend to occur when crystals are grown in the c-axis direction. If there are bubble defects in the ingot, cracks are likely to occur during processing, and when used as a substrate material or an optical material, their characteristics are likely to be insufficient. As a method for reducing the occurrence of bubble defects, it is known that the growth direction of the sapphire single crystal is shifted by a predetermined angle from the c-axis, or the a-axis or m-axis direction perpendicular to the c-axis (for example, JP, 2004-83316, A). ".

  The sapphire ingot block is manufactured by punching out a large thick plate-like sapphire crystal with a boring core bit (blade) as disclosed in Japanese Patent Application Laid-Open No. 2008-971 (Patent Document 3). There is also.

Furthermore, Japanese translations of PCT publication No. 2010-514581 (patent document 4) discloses the surface processing method of the sapphire substrate by which the ingot block was sliced, from the group consisting of a-plane, r-plane, m-plane, and c-plane orientation. N having a selected crystal orientation and not more than about 0.037 μm / cm ²
A sapphire substrate including a generally flat surface having a TTV, wherein the nTTV is a total thickness variation normalized by the surface area of the substantially zero flat surface, the substrate having a diameter of about 9.0 cm or more And disclosed. As an embodiment thereof, in paragraphs 0005 to 0009, "the first fixed abrasive is used to grind the first surface of the sapphire substrate, and the second particle having an average particle size smaller than that of the first fixed abrasive. A method for machining a sapphire substrate that includes grinding a first surface of a sapphire substrate using a fixed abrasive of: Another embodiment is an abrasive such that the first surface has c-plane orientation. Is used to provide a sapphire substrate lot comprising a plurality of sapphire substrates comprising grinding a first surface of each sapphire substrate, the sapphire substrate lot comprising at least 20 sapphire substrates. the sapphire substrate (i) c plane orientation, (ii) m plane misorientation angle of the crystal (θ _m), and (iii) a surface Misuo crystals Having a first surface having a ene station angle (theta _a), where, (a) misorientation angle theta standard deviation sigma _m of _m is about 0.0130 or less, and (b) misorientation angle theta _a standard The deviation σ _a is at least one of about 0.0325 or less.
A sapphire substrate lot including at least 20 sapphire substrates is targeted. Each sapphire substrate has a first surface having (i) c-plane orientation, (ii) m-plane misorientation angle (θ _m ) of the crystal, and (iii) a-plane misorientation angle (θ _a ) of the crystal. , where, (a) a standard deviation sigma _m of misorientation angle theta _m of about 0.0130 or less, and (b) misorientation angle theta _a standard deviation sigma _a of at least one of about 0.0325 or less true . ".

Japanese Patent Application Laid-Open No. 2009-186181 (Patent Document 5) includes an X-ray diffraction crystal orientation measuring apparatus that measures the crystal orientation of a cylindrical ingot in FIG. 2, and an X-ray diffraction crystal orientation measurement apparatus in FIG. 3 shows a cylindrical grinding apparatus for a cylindrical ingot, and after measuring the crystal orientation h of the cylindrical ingot according to paragraphs 0070 to 0077 and paragraphs 0085 to 0089, the ingot is moved to the cut chamfering machine shown in FIG. Therefore, the first cut surface Wa ₁ is ground perpendicularly to the axial crystal orientation h to obtain a new first cut surface Wa _3, and the second cut surface Wa ₂ in the opposite direction is ground to obtain a new second cut surface Wa ₂ . a cut surface Wa _4, then an ingot having a vertical cutting plane W _3, W ₄ in the first transfer robot and transferred to the clamping device of the cylindrical grinding apparatus with a cylindrical grinding wheel A method of cylindrical grinding of the outer peripheral surface of a cylindrical ingot is described. Furthermore, in FIG. 10 and paragraph 0090 described in Patent Document 5, the radial crystal orientation k of the cylindrically ground ingot is measured by the X-ray diffraction crystal orientation measuring device, and the radial direction of the ingot is measured by the cylindrical grinding device. Disclosed is a method of forming an orientation flat surface based on a crystal orientation k.

Japanese Unexamined Patent Application Publication No. 2009-111260 (Patent Document 6) discloses at least a cutting unit that cuts an ingot placed on a cutting tray by a cutting unit and cuts the block into blocks, and the cutting tray is sent out from the cutting unit. An ingot cutting device comprising: a feed-in unit having a table for performing a process; a control unit for controlling the operation of the feed-in unit; and a transfer unit for transferring the cut block from the cutting tray to the transfer tray In the above, the transfer unit is at least
An arm mechanism for holding the block; and an inversion mechanism for inverting the block on the transport tray. A long block whose block has reached a predetermined length is transferred to the transport tray by the arm mechanism. The short block in which the block does not reach the predetermined length is placed on the inversion mechanism by the arm mechanism, and the block is brought down by the inversion mechanism and transferred to the transport tray. A featured ingot cutting device is disclosed.

  Furthermore, JCM Co., Ltd. sells a JBS-110 fully automatic band saw device (trade name) that automatically performs block cutting with a specified length after cutting the top and tail of a single crystal silicon ingot. Patent Document 1).

Japanese Unexamined Patent Application Publication No. 2004-66734 (Patent Document 7) is a cutting device for an ingot (work) that cuts a workpiece with a wire.
The wire line is obtained by locally heating the outer periphery of the workpiece on the set plate on which the ingot is mounted by adjusting the posture of the workpiece so that the crystal plane is parallel to the depth direction of the groove by the YAG laser device. A groove processing apparatus for forming a groove having a width according to the diameter;
A cutting device equipped with an XRD machine, comprising: a wire saw device that is mounted with the set plate and relatively moves a wire along a depth direction of a groove formed on the outer periphery of the workpiece. Is disclosed.

  On the other hand, a laser device (XRD machine) with an X-ray diffraction crystal orientation measuring device capable of notching or laser processing a semiconductor substrate is also used to measure the crystal orientation of the substrate or ingot. For example, Yoshito Tanaka, JST-CREST, described the XRD machine in the “Advanced Phase Measurement of Optical Recording Media by Synchrotron Radiation Time-Resolved X-ray Diffraction Measurement”, Advanced Magnetic Materials Research Group 100316 @ Tokyo Institute of Technology (Non-Patent Document 2). The structure and its use are disclosed.

  In addition, Shinsaku Kikuta et al. From Seikei Graduate School have published the XRD machine structure and its results in a joint paper published by Seikei University and Amada Co., Ltd. (Non-Patent Document 3). The usage method is disclosed.

  Furthermore, methods for measuring the crystal orientation of a single crystal ingot with an XRD machine are disclosed in JP-A-10-160688 (Patent Document 8), JP-A 2000-2672 (Patent Document 9), and JP-A-2001-13092. (Patent Document 10), Japanese Patent Application Laid-Open No. 2001-272359 (Patent Document 11), and the like.

  On the other hand, in Japanese Patent Application Laid-Open No. 2005-255463 (Patent Document 12), the ingot orientation flat processing (102) is performed after the ingot cylindrical grinding processing (101) in FIG. 1, and then the ingot is processed by wafer slicing (see FIG. 1). 103), and then, a process diagram for performing wafer peripheral grinding (104) is disclosed.

  Japanese Patent Laid-Open No. 2011-136382 (Patent Document 13) discloses the cylindrical grinding of the four corner R corners of the prismatic ingot shown in FIG. 3 with one grinding wheel 9g and the four-side plane of the prismatic ingot. Chamfering of the ingot is completed by performing synchronous control grinding with a pair of rough grinding wheels 10g, 10g, and then chamfering the four chamfered surfaces with synchronous control grinding with a pair of precision finish grinding wheels 11g, 11g. An apparatus 500 is disclosed.

  Japanese Laid-Open Patent Publication No. 2000-158123 (Patent Document 14) discloses an ingot transfer robot and an ingot transfer method.

JCM Co., Ltd., “Solar Cell Manufacturing Equipment”, [online], searched on July 21, 2011], Internet <URL: www.e-jcm.co.jp/SolarCell/Mono/JBS-110.html> Yoshito Tanaka, “Phase change structure measurement of optical recording media by synchrotron radiation time-resolved X-ray diffraction measurement” Advanced Magnetic Materials Research Group 100316 @ Tokyo Institute of Technology PDF paper, [online], searched July 6, 2011], Internet <URL: www.spring8.or.jp/ext/ja/iuss/htm/text/06file /.../ tanaka.pdf> Susumu Kikuta, 3 others, “Estimation of springback amount of laser processed material using XRD crystal orientation database”, [online], searched on July 6, 2011], Internet <URL: www.sd.seikei .ac.jp / lab / zairiki /_.../ 2011zairyo_powerpoint_kikuta.pdf>

JP 2009-298676 A JP 2008-207992 A JP 2008-971 A Japanese Translation of PCT International Publication No. 2010-514581 JP 2009-186181 A JP 2009-111260 A JP 2004-66734 A Japanese Patent Laid-Open No. 10-160688 JP 2000-2672 A JP 2001-13092 A JP 2001-272359 A JP 2005-255463 A JP 2011-136382 A JP 2000-158123 A

  A crystalline ingot block (workpiece) shipped from an ingot manufacturer to a semiconductor substrate manufacturer is an ingot block in which both end surfaces of the C-axis of the ingot are cut at right angles to the C-axis. Therefore, a work for chamfering a commercially available workpiece using the XDR machine described in Patent Document 5, a cut surface grinding machine for workpiece C-axis end face cutting and orientation flat grinding, and a composite chamfering machine equipped with a cylindrical grinding machine. In this case, the orientation flat grinding process of the cut surface grinding machine is unnecessary. In addition, since the crystal orientation of the workpiece is measured by the XRD machine to detect the orientation flat orientation for orientation flat grinding, the workpiece is shipped with a flaw on the outer peripheral surface before cylindrical grinding of the workpiece. The crystal orientation due to existence (sapphire ingot crystal is hexagonal) The measurement accuracy of sapphire ingots varies from 88.5 to 90 degrees in the vertical line (90 degrees) from the C-axis of the workpiece to the orientation flat line. A chamfered workpiece can be obtained. Further, in the work of chamfering a commercially available workpiece using the composite chamfering device described in Patent Document 5, the cylindrical grinding of the workpiece is a rate-limiting step, and 2 to 2 of the workpiece C-axis end face cutting and orientation flat grinding processing steps. Over four times the processing time is spent. Therefore, the emergence of a complex chamfering machine with an XDR machine that can make more efficient use of expensive XDR machines of around 30 million yen per board and increase the production of chamfered ingot blocks. Is desired.

The inventors of the present application pay attention to the fact that the ingot chamfering apparatus disclosed in Patent Document 13 can perform cylindrical grinding and orientation flat grinding of workpieces. This ingot chamfering apparatus is laterally arranged with respect to one XDR machine. And chamfering to meet the demands of semiconductor substrate manufacturers by switching to processing software that measures and marks the crystal orientation of workpieces that have been cylindrically ground with an XRD machine after cylindrical grinding of workpieces It came to be the device and came to the present invention.

Claim 1 of the present invention provides
A transfer robot (200) capable of sliding on the first guide rail (100) extending in the left-right direction;
A first storage shelf (300) of a cylindrical ingot block (work) provided at the right end of the first guide rail,
A second storage shelf (400) of a workpiece (finally processed product) subjected to orientation flat processing provided at the left end of the first guide rail,
With respect to the first guide rail (100) for sliding of the transfer robot, a single X-ray diffraction crystal orientation measuring device (600) is sandwiched on the rear side, and a cylindrical grinding device (500, 500) is spaced between the left and right sides. A group of chamfering processing equipment,
A workpiece chamfering processing apparatus (1) comprising:
The cylindrical grinding device (500) includes a clamping device (a spindle stock (7a) having a centering function capable of sliding on the second guide rails (3, 3) extending in the front-rear direction and a tailstock (7b) ( 7) A pair of moving tables (4) for mounting the same are provided, and a pair is arranged in a direction perpendicular to the C axis of the work supported on the support shafts (7a ₁ , 7b ₁ ) of the clamping device and across the C axis. A grinding wheel shaft for supporting the cup grinding wheel (10 g, 10 g) for cylindrical grinding is provided so as to be able to advance and retreat, and includes an autoloader device (13) and a work stocker (14), and the work stocker (14) and the auto A loader device (13) and the clamping device (7) constitute a work loading / unloading stage, and the clamping device (7) and the pair of cylindrical grinding cups A cylindrical grinding apparatus (500) that constitutes a cylindrical grinding stage and an orientation flat grinding stage of a workpiece with a grinding wheel shaft that supports a wheel-type grinding wheel (10g, 10g).
The composite chamfering apparatus (1) characterized by this is provided.

  According to a second aspect of the present invention, a cylindrical ingot block (10 g, 10 g) is used with a pair of cylindrical grinding cup wheel grindstones (10 g, 10 g) of the cylindrical grinding device (500) using the composite chamfering processing device (1) according to the first aspect. After the workpiece is cylindrically ground, the crystal orientation of the workpiece is measured and marked with an X-ray diffraction crystal orientation measuring device (600), and then the marked workpiece is clamped (7) of the cylindrical grinding device (500). ) And performing a flat chamfering method using a cup wheel type grindstone (10 g) for cylindrical grinding.

  In the composite chamfering apparatus (1) of the present invention, a plurality of cylindrical grinding apparatuses (500) are arranged for one XRD machine (600), so that one XRD machine can be used effectively. Moreover, since the crystal orientation of the workpiece is measured by the X-ray diffraction crystal orientation measuring device (600) after the workpiece crystal orientation is made into a smooth surface by removing the wrinkles on the outer peripheral surface by cylindrical grinding, the crystal orientation measurement accuracy Becomes more accurate.

  Moreover, since a workpiece | work can be cylindrical-ground using the cup-wheel type grindstone pair (10g, 10g) of a cylindrical grinding apparatus (500) simultaneously, it is cylindrical grinding compared with the cylindrical grinding apparatus of the compound chamfering processing apparatus of patent document 5 Processing time can be reduced to ½.

FIG. 1 is a plan view of a composite chamfering apparatus. FIG. 2 is a side view of the cylindrical grinding apparatus. FIG. 3 is a plane surface of the cylindrical grinding apparatus. FIG. 4 is a rear view of the autoloader device. FIG. 5 is a plan view of the cylindrical grinding apparatus, and the autoloader device is omitted. FIG. 6 is a work diagram in which the outer peripheral surface of the workpiece is chamfered, and is a diagram viewed from the end surface direction of the workpiece. 6a shows a cylindrical rough grinding operation, FIG. 6b shows a cylindrical finish grinding operation, and FIG. 6c shows an orientation flat grinding operation.

  A composite chamfering apparatus 1 of the present invention shown in FIG. 1 includes a transfer robot 200 that can slide on a first guide rail 100 extending in the left-right direction, and a first storage shelf 300 for workpieces provided at the right end of the first guide rail. , A second storage shelf 400 for workpieces subjected to orientation flat processing provided at the left end of the first guide rail 100, and a left end from a right end provided parallel to the rear side with respect to the first guide rail 100 for sliding of the transfer robot. The composite chamfering apparatus 1 is provided with two cylindrical grinding devices 500, one XRD machine 600, and two cylindrical grinding devices 500 that are spaced apart from each other toward the side.

  The four cylindrical grinding devices 500 are the same type of cylindrical grinding device. The cylindrical grinding device 500 includes a pair of cup wheel type grinding wheels 10g and 10g. As in the cylindrical grinding device shown in FIGS. 2 and 3, a pair of cup wheel type rough grinding wheels 10g and 10g, and a cup It is good also as the cylindrical grinding device 500 provided with a pair of 11g and 11g of wheel type finishing grinding wheels.

  As shown in FIGS. 2, 3, and 5, the cylindrical grinding device 500 can reciprocate in the left-right direction on a pair of guide rails 3, 3 laid on the machine frame (base) 2 in the left-right direction. A work table 4 is provided. When the work table 4 is reciprocated left and right, the ball screw 6 receives rotation driven by the servo motor 5 and rotates, and a fixing base (not shown) screwed to the ball screw advances leftward or rightward. As a result, the work table 4 having the back surface of the work table 4 fixed to the surface of the fixed base advances in the left direction or the right direction. The advancement of the work table 4 in the left direction or the right direction depends on whether the rotation shaft of the servo motor 5 is clockwise or counterclockwise.

On the work table 4 is mounted a clamping device 7 composed of a pair of a headstock 7a and a tailstock 7b which are mounted separately on the front and rear. Therefore, in association with the movement of the forward or backward direction of the work table 4 moves in the clamping device 7 also forward or backward direction, the headstock center support shaft 7a ₁ and the tailstock center support shaft 7b of the clamping device 7 _The workpiece w that is suspended (held) by ₁ and suspended in the air can move to the first cylindrical grinding stage 10, the second cylindrical grinding stage 11, or the load port 8 position.

The clamping device 7 is a known chuck mechanism and is often used in a silicon ingot cylindrical grinder. Headstock 7a has a function of rotating the workpiece w 360 degrees by rotating the headstock center support shaft 7a ₁ by the servo motor 7a _m. Tailstock 7b is provided on the movable table 7b _t which can be moved on the guide rails with an air cylinder 7e drive the left and right, after支架the workpiece by the clamp mechanism 7, and fixed by depressing the lever, movement of the work table 4 moving base 7b _t for mounting the tailstock 7b is prevented from moving by.

The positional relationship between the first cylindrical grinding stage 10, the second cylindrical grinding stage 11, and the load port 8 is a direction in which the work table 4 is viewed at a right angle from the side surface side, and from the front side direction toward the rear side direction. The first cylindrical grinding stage 10, the second grinding stage 11, and the load port 8 are provided. The first cylindrical grinding stage 10 and the second cylindrical grinding stage 11 are covered with a hermetic cover 12. The load port 8 is closed by a one-hand side sliding door 12a. An exhaust duct 18 is connected to the space of each grinding 10, 11 covered with the hermetic cover 12, and mist and grinding debris floating in this space are discharged to the outside.

The first cylindrical grinding stage 10 is composed of a pair of grinding wheels 10a, 10a, 10a, 10a, 10a, 10a, 10a, 10a, 10a. provided at a position 10g the grinding wheel surface _10g s, 10g _s across the work table 4 so as to face each other and symmetrically around the work table 4 grindstone axis ₁₀ o, 10 _o is collinear, grindstone axis 10a, 10a has a structure that is rotated by the rotational driving of the servo motor _{10 M, 10} M.

  When the ball screw receives rotation by the servo motors 10m and 10m and rotates, and the fixing table screwed to the ball screw advances or retracts forward or backward, the tool tables 10t and 10t are placed on the surface of the fixing table. The tool tables 10t and 10t whose back surfaces are fixed move forward or backward. The forward or backward movement direction of the tool table depends on whether the rotation shafts of the servo motors 10m and 10m are clockwise or counterclockwise.

The second cylindrical grinding stage 11 includes a pair of grinding wheels 11a, 11a provided on a tool table 11t, 11t that can be moved back and forth by rotation of servo motors 11m, 11m, a pair 11g of cup wheel type grinding wheels supported by 11a, provided at a position 11g the grinding wheel surface _11g s, 11g _s is and symmetrically around the work table 4 across the work table 4 so as to face each other grindstone axis ₁₁ o, 11 _o is collinear, grindstone axis 11a, 11a has a structure that is rotated by the rotational driving of the servo motor _{11 M, 11} M.

When the ball screw receives the rotation drive by the servo motors 11m and 11m and rotates, and the fixed base screwed into the ball screw moves forward or backward in the forward or backward direction, the tool table 11t, The tool tables 11t and 11t to which the back surface of 11t is fixed move forward or backward. The forward or backward movement direction of the tool table depends on whether the rotation shafts of the servomotors 11m and 11m are clockwise or counterclockwise.

The second cylindrical grinding stage 11 is provided in parallel to the rear side of the first cylindrical grinding stage 10. That is, the grindstone axes 10 _o and 11 _{o of} both the stages 10 and 11 are parallel.

  The cup wheel type grinding wheel diameter of the cup wheel type cylindrical grinding wheel 10g, 10g, 11g, 11g and the cup wheel type grinding wheel for orientation flat grinding is 100 when the workpiece is a cylindrical ingot block for a sapphire substrate of 2 to 6 inches. ~ 240 mm. The width of the cup grindstone piece is preferably 3 to 10 mm and the width of the ring-shaped grindstone is preferably 5 to 15 mm from the viewpoint of preventing grinding burn of the workpiece.

The abrasive grains of the cup wheel type cylindrical grinding wheels 10g and 11g are preferably diamond abrasive grains and CBN abrasive grains, and the binder is preferably a metal bond, vitrified bond, or epoxy resin bond. For example, a cup wheel type cylindrical grinding wheel is used for a bottom annular ring of a bottomed cylindrical grinding wheel base metal disclosed in Japanese Patent Laid-Open Nos. 9-38866, 2000-94342, 2004-167617, and the like. A cup wheel type grindstone in which a large number of blades are annularly arranged with a gap interval where the grinding liquid is dissipated, and a structure in which the grinding liquid supplied to the inside of the base metal is dissipated from the gap is preferable. The diameter of the annular grinding wheel of this cup wheel type cylindrical grinding wheel is preferably 1.2 to 1.5 times the workpiece diameter. The annular grindstone blade of the cup wheel type rough grinding grindstone 10g is preferably a diamond resin bond grindstone having a grind number of 100 to 280 or a diamond vitrified bond grindstone. Further, the annular grindstone blade of the cup wheel type finish grinding grindstone 11g is preferably a diamond resin bond grindstone, a diamond vitrified bond grindstone, or a diamond metal bond grindstone with a grind number of 300 to 1,200.

  As the grinding liquid, pure water, colloidal silica aqueous dispersion, ceria aqueous dispersion, SC-1 liquid, SC-2 liquid, or an aqueous dispersion in which an organic phosphorus compound is mixed with these aqueous dispersions may be used. preferable.

  The load port 8 is formed by providing an opening that allows the workpiece w to be transferred into and out of the clamping device 7 in a housing material located behind the second cylindrical grinding stage 11 and in front of the work table 4. Is done.

  During the orientation flat grinding of the workpiece by the cup wheel type cylindrical grinding wheel 11g of the cylindrical grinding device 500, the second cylindrical grinding stage 11 is called an orientation flat grinding stage.

  In FIG. 2, reference numeral 20 denotes a control device, and reference numeral 21 denotes an operation panel. Moreover, in FIG. 3, the code | symbol 9c shows a grinding fluid supply pipe | tube.

  As shown in FIGS. 1, 2, 3, and 4, the cylindrical grinding device (500) is automatically installed in the space between the load port 8 and the second grinding stage 11 on the front side of the work table 4. A loader device (work loading / unloading device) 13 and a work stocker 14 for storing three ingot blocks are juxtaposed on the machine frame 2. Reference numeral 15 denotes a spare work stocker (storage shelf) placed on the table of the transport carriage 16 provided with a stepladder.

  The work stockers (storage shelves) 14 and 15 are provided with V-shaped shelves having an inverted isosceles triangle shape capable of storing three workpieces w, w, and w inclined at 45 degrees, and positioning pins 16 protruding from the machine frame. It is placed on top.

  The autoloader device (work loading / unloading device) 13 holds a workpiece stored on a work stocker 14V-shaped shelf with a pair of claws 13a and 13b, and lifts both claws to raise the workpiece. Lifting, then retreating, moving in the right direction, descending, positioning in front of the load port 8, and further retreating the workpiece from the load port 8 between the headstock 7a and the tailstock 7b of the clamping device 7 Transport. After one end of the work is brought into contact with the center support shaft 7a1 of the headstock 7a, the tailstock 7b is moved to the right by the air cylinder 7e, and the other end is brought into contact with the center support shaft 7b1 so that the work is 45 degrees V. Inclined and suspended on 4 sides suspended. Next, the claws 13a and 13b are separated to release the workpiece, and then the fixing base 13f supporting the claws 13a and 13b is lifted, moved to the left, and further moved backward to move both claws. 13a and 13b are returned to the standby position.

  Further, the chamfering process and the cleaned and air-dried work supported in a suspended state in the clamp device 7 are gripped by both claws 13a and 13b, and then the fixing base 13f supporting both the claws 13a and 13b is raised, After moving the claw 13a, 13b above the empty shelves of the work stockers 14, 15 after moving the claw 13a, 13b to the left and moving the claw 13a, 13b downward, , 13b are separated and the workpiece is released, and then the claws 13a, 13b are returned to the standby position.

The movement of the fixing base 13f that supports the claws 13a and 13b in the front-rear direction is the servo motor 13m
This is done by sliding the sliding surface 13s of the fixed base 13f, whose back surface is screwed to the ball screw 13k that is driven by rotation, on the guide rail 13g provided on the side surface of the column 13c. The vertical movement of the fixing base 13f that supports the claws 13a and 13b is performed by the air cylinder 13p. The two claws 13a and 13b are separated from each other by using a micro week air cylinder 13e shown in a circle in FIG. Fine adjustment of the slight raising and lowering of the claws 13a and 13b is performed using a micro week air cylinder 13l. Both pawls 13a, fine adjustment of a small back-and-forth movement of the 13b is performed using a micro weak air cylinder 13 _R.

The workpiece w stored in the workpiece stockers 14 and 15 installed in the cylindrical grinding device 500 is automatically clamped (supported) on the support shafts 7a ₁ and 7b ₁ of the clamp device 7 using the robot claws 13a and 13b of the autoloader device 13. ) Is performed as follows.

Robot claw 13a of the autoloader devices 13, diameter 13b is Rmm, grinding allowance (t) set to grip the central portion of the cylindrical ingot block (work) of _t g mm thickness. S01

Wherein the gripped workpiece to the robot claws and carried into between the support shaft 7b ₁ of the support shaft 7a ₁ and tailstock 7b headstocks 7a, the longitudinal axis (C axis of the workpiece w by advancing the tailstock 7b Both ends in the direction) are supported by the support shafts 7a ₁ and 7b ₁ of the clamp device 7. A line connecting both shaft centers of the support shafts 7a ₁ and 7b ₁ is called a C-axis center of the clamp device 7. S02

  The robot claws 13a and 13b of the autoloader device 13 are moved away from the workpiece w. S03

  The orientation flat direction of the workpiece with respect to the cup wheel type grindstone 11g is based on the value of the crystal orientation marked by the XRD machine, and the orientation flat direction of the workpiece is changed to the cup wheel type grinding wheel by rotating the support shaft of the headstock 7a with a servo motor. This is done by rotating the workpiece so as to be parallel to the 11 g cutting edge surface.

Cylindrical grinding of a workpiece with a pair of cup wheel-type grindstones 10g, 10g is performed while moving a work table 4 mounted with a clamp mechanism 7 that supports the workpiece suspended in the air at a speed of 1 to 15 mm / min. A pair of 10 g and 10 g grinding wheel shafts rotating at a rotational speed of 800 to 3,000 rpm while rotating the center support shaft 7 a ₁ of the table at a rotational speed of ₁₀ to 300 rpm is used as the C axis of the clamping device 7. is advanced into the heart side cup wheel type grindstone 10g, initiate and infeed grinding to a distance (grinding start point position) of the cutting edge position of 10g from C axis of the clamping device 7 (R / 2-t g ) Then, while the grinding fluid is supplied to the grinding work point in an amount of 5 to 100 cc / min, The Got block peripheral surface thickness is infeed cylindrical grinding of allowance removal amount of t _g mm.

Cup wheel type grindstone 10g, 10g grinding allowance of the work by the _{(t g)} is 0.5~1.0mm.

  As described above, the transfer robot 200 that slides on the first guide rail 100 includes the work locker 14, the storage shelves 300 and 400, the cylindrical grinding devices 500 and 500 on the right side, the XDR machine 600, and the cylindrical grinding device 500 on the left side. , 500 is used to deliver the workpiece w.

A laser device (X-ray diffraction) 600 with an X-ray diffraction crystal orientation measuring device includes an X-ray irradiator, an X-ray diffraction device, a CCD camera, a work table, a controller having a time circuit, and the like.
It is possible to image the workpiece, measure the crystal orientation of the workpiece, perform laser marking on the workpiece, and calculate the radius from the C axis of the workpiece to the outer periphery of the workpiece.

  1 and FIG. 2 is used to cylindrically grind a cylindrical ingot block (workpiece) with a pair of cylindrical grinding cup wheel-type grindstones 10g, 10g of a cylindrical grinding device 500, and then X-ray rotation The crystal orientation measurement apparatus 600 measures the crystal orientation of the workpiece, then returns the workpiece to the cylindrical grinding device 500, and performs the orientation flat grinding with one cylindrical grinding wheel 10g or 11g. Done in order.

  1). The workpiece w stored in the first storage shelf 300 is gripped by the transport robot 200, and then the gripped workpiece is transferred onto the workpiece stocker 14 of the cylindrical grinding apparatus 500. (Work transfer process)

2). The workpiece placed on the workpiece stocker 14 of the cylindrical grinding device 500 is held in the hand claw of the autoloader device 13, and the support shaft 7 a ₁ of the headstock of the clamping device 7.
And between the support shaft 7b ₁ of the tailstock C axis of the workpiece to支架the workpiece to match the C axis connecting the support shaft of the headstock support shaft and the tailstock of the clamping device. (Work loading process)

3) The work supported by the clamp device 7 is rotated around the C axis of the clamp device by a servo motor of the headstock 7a, the cup wheel type grindstone shaft is rotated, and the cup wheel type grindstones 10g, 10g are rotated. Is moved forward (moved in the left direction) so as to come into contact with the circumferential surface of the workpiece rotating around the C-axis to start cylindrical rough grinding, and the cylindrical wheel grinding allowance (t _gr ) After performing cutting (moving leftward) up to a distance where a cylindrical grinding workpiece having a radius (R / 2) minus is obtained, the clamp device is further advanced toward the cup wheel type grindstone 10g, 10g side. Then, the outer peripheral surface of the work supported by the clamping device is subjected to cylindrical rough grinding.

Next, the clamp device 7 mounted on the work table 4 is advanced toward the pair of rotating cup wheel type grindstones 11g and 11g, and is rotated around the C axis supported by the clamp device 7. The workpiece is brought into contact with the cutting edges of the cup wheel type grindstones 11g and 11g, and cylindrical finish grinding is started, and the radius of the cup wheel type grindstone (11g and 11g) minus the cylindrical finish grinding allowance (t _gf ) ( R / 2) After cutting (moving in the left direction) to a distance where a cylindrical grinding workpiece can be obtained, the clamp device is further advanced and passed between the pair of cup wheel type grindstones 11g, 11g. Then, the outer peripheral surface of the workpiece w supported by the clamping device 7 is subjected to cylindrical finish grinding. Next, after the work table 4 on which the clamping device 7 is mounted is retracted to the cylindrical grinding start point standby position, the workpiece w subjected to the cylindrical grinding is held by the hand claw of the autoloader device 13 and transferred to the work stocker 14. . (Workpiece cylindrical grinding process) (See FIGS. 6a and 6b)

  4). The workpiece w placed on the workpiece stocker 14 of the cylindrical grinding apparatus 500 is gripped by the transfer robot 200 and transferred onto the work table of the X-ray diffraction crystal orientation measuring apparatus 600, where the crystal orientation of the workpiece is converted into a laser beam. Mark with. (Work crystal orientation marking process)

  5). The workpiece marked with the crystal orientation is gripped by the transfer robot 200 and transferred to the workpiece stocker 14 of the cylindrical grinding apparatus 500. (Marking work transfer process)

6). The workpiece placed on the workpiece stocker 14 of the cylindrical grinding apparatus 500 is held in the hand claw of the autoloader device 13, and the spindle support shaft 7 a ₁ and the tailstock support shaft 7 b of the clamp device 7 are mounted. _The workpiece is supported so that the C-axis of the workpiece coincides with the C-axis that connects the support shaft of the headstock and the support shaft of the tailstock. Next, centering is performed by rotating the support shaft 7a ₁ of the headstock so that the supported workpiece is rotated so that the orientation of the orientation of the workpiece is parallel to the cup wheel grindstone 11g. (Work orientation flat alignment process)

7). Of the pair of cup wheel type grindstone shafts of the cylindrical grinding device 500, the grindstone shaft that supports the cup wheel type grindstone 11g on the side close to the position where the workpiece is subjected to the orientation flat processing is rotated, and the rotating cup wheel type grindstone 11g is rotated. The work table 4 on which the clamping device 7 is mounted is then moved forward (moved in the left direction) so as to come into contact with the circumferential surface of the work centered in the crystal orientation to be subjected to the orientation flat processing (the orientation flat starting position). was advance by contacting the cup wheel type grindstone 11g and the work w to the cup wheel type grindstone 11g side starts orientation flat grinding, and further advancing the cup wheel type grindstone 11g and orientation flat grinding allowance (t _oo) After the cutting process for moving forward (to the left) to the grinding distance, the clamping device 7 is moved to the cup wheel. Type grindstone 11g, performs movement passing between 11g to form a orientation flat on the outer peripheral surface of the workpiece. Next, the work table 4 on which the clamping device 7 is mounted is retracted to the cylindrical grinding start point standby position, the work is held in the hand claw of the autoloader device 13, and transferred to the work stocker 14 of the cylindrical grinding device 500. (Orientation flat grinding process of workpiece) (See Fig. 6c)

  and,

  8). The transfer robot 200 receives the work w placed on the work locker 14 and transfers it to the second storage shelf 400. (Work unloading process)

  By using a chamfering processing program that shifts the time for the work to be supported on the clamp device 7 of each cylindrical grinding device 500a, 500b, 500a, 500b, each cylindrical grinding device 500a, 500b, 500a, 500b is set to the same time zone. It can be operated and one XRD machine can be used effectively.

  Since the composite chamfering apparatus 1 of the present invention can perform cylindrical grinding and orientation flat grinding of an ingot block by using one XRD machine 600 and a plurality (2 to 4) of cylindrical grinding apparatuses 500, a composite chamfering process is possible. The production amount of the chamfering workpiece per hour per one XRD machine of the apparatus 1 can be improved by about n times or more. In particular, since a workpiece is ground with a pair of cup wheel-type grinding wheels (10 g, 10 g), the time required for grinding the workpiece per cylinder grinding machine with an XDR machine described in Patent Document 5 is halved. it can.

1 Compound chamfering machine w Workpiece (Cylindrical sapphire ingot block)
DESCRIPTION OF SYMBOLS 100 1st guide rail 200 Conveyance robot 300,400 Storage shelf 500 Cylindrical grinding device 4 Work table 6 2nd guide rail 7 Clamp mechanism 7a Shaft base 7b Tailstock 8 Load port 10 First grinding stage 10g Cup wheel type cylindrical grinding wheel 11 Second grinding stage 11g Cup wheel type cylindrical grinding wheel 13 Autoloader equipment 14 Work stocker 600 XRD machine

Claims (2)

A transfer robot (200) capable of sliding on the first guide rail (100) extending in the left-right direction;
A first storage shelf (300) of a cylindrical ingot block (work) provided at the right end of the first guide rail,
A second storage shelf (400) of a workpiece (finally processed product) subjected to orientation flat processing provided at the left end of the first guide rail,
With respect to the first guide rail (100) for sliding of the transfer robot, a single X-ray diffraction crystal orientation measuring device (600) is sandwiched on the rear side, and a cylindrical grinding device (500, 500) is spaced between the left and right sides. A group of chamfering processing equipment,
A workpiece chamfering processing apparatus (1) comprising:
The cylindrical grinding device (500) includes a clamping device (a spindle stock (7a) having a centering function capable of sliding on the second guide rails (3, 3) extending in the front-rear direction and a tailstock (7b) ( 7) A pair of moving tables (4) for mounting the same are provided, and a pair is arranged in a direction perpendicular to the C axis of the work supported on the support shafts (7a ₁ , 7b ₁ ) of the clamping device and across the C axis. A grinding wheel shaft for supporting the cup grinding wheel (10 g, 10 g) for cylindrical grinding is provided so as to be able to advance and retreat, and includes an autoloader device (13) and a work stocker (14), and the work stocker (14) and the auto A loader device (13) and the clamping device (7) constitute a work loading / unloading stage, and the clamping device (7) and the pair of cylindrical grinding cups A cylindrical grinding apparatus (500) that constitutes a cylindrical grinding stage and an orientation flat grinding stage of a workpiece with a grinding wheel shaft that supports a wheel-type grinding wheel (10g, 10g).
A composite chamfering apparatus (1) characterized by the above.   After cylindrical grinding of a cylindrical ingot block (work) with a pair of cylindrical grinding cup wheel grindstones (10 g, 10 g) of a cylindrical grinding device (500) using the composite chamfering device (1) according to claim 1. The crystal orientation of the workpiece is measured and marked by the X-ray diffraction crystal orientation measuring device (600), and then the marked workpiece is returned to the clamping device (7) of the cylindrical grinding device (500), and one cylindrical grinding is performed. A composite chamfering method for a workpiece, characterized in that orientation flat grinding is performed using a cup wheel type grindstone (10 g).

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