JP5108123B2 - Cylindrical ingot block cutting apparatus and method of processing into a square pillar block using the same - Google Patents

Description

  In the present invention, a cylindrical single crystal silicon ingot block is clamped by a clamp device comprising a headstock with an encoder and a tailstock having a function of rotating around its rotation C axis, and its four side surfaces are scraped off by a rotary cutting blade. The present invention relates to a cutting device that cuts into a square columnar block and a method of processing a cylindrical single crystal silicon ingot block into a square columnar block using the cutting device.

  Cylindrical ingot blocks used as raw materials for disk-shaped single crystal silicon substrates used for semiconductor substrates and rectangular single crystal silicon substrates used for solar power cell substrates are single crystal silicon grown by the Czochralski method (CZ method). The both ends of the C-axis of the ingot are cut off, and then clamped by a spindle device having a spindle and a tailstock having the function of rotating, and cylindrical grinding is performed to remove the bowl-shaped irregularities on the outer peripheral surface. , 250 mm, 400 mm, 500 mm, 800 mm, etc., are cut with a rotary cutting blade (peripheral blade) or Daiso, or wire cut, and are commercially available as outer peripheral smooth cylindrical single crystal silicon ingot blocks.

  This outer peripheral surface smooth cylindrical single crystal silicon ingot block is subjected to slicing processing to a thin substrate by multi-wire saw in the next step. Alternatively, the four side surfaces and the four corner corner portions of a quadrangular columnar block, which are supplied from an ingot block manufacturer to a solar cell substrate manufacturer and processed by scraping the four side surfaces with an outer peripheral blade, are chamfered (Japanese Patent Laid-Open No. 2010-263025). Reference: Patent Document 1), supplied to a slice processing stage into a thin substrate by multi-wire saw in the next step.

The patent applicant of the present application, as a method of cutting the cylindrical ingot block into a quadrangular prism block, disclosed in Japanese Patent Application No. 2010-251383 (Patent Document 2) through the following steps to convert the cylindrical single crystal silicon ingot block into a quadrangular prism shape. A method of chamfering into the shape of single crystal silicon ingot block was proposed.
(1) A cylindrical single crystal silicon ingot block is clamped by a clamp device comprising a headstock with an encoder and a tailstock having a function of rotating around its rotation C axis.
(2) A laser on a spindle base of a clamp device by irradiating laser light toward the C-axis of the cylindrical single crystal silicon ingot block from a displacement sensor installed at a front side of the sandwiched cylindrical single crystal silicon ingot block While the C-axis rotation angle is read with an encoder, the C-axis is rotated once, and a correlation diagram between the rotation angle and the pulse peak is displayed.
(3) Select one of the encoder rotation angles (θ) showing the four displayed high pulse peaks, and this angle (θ) is the position where the encoder rotation angle is 45 degrees with respect to the radial surface of the rotary cutting blade. The C-axis is rotated so as to be positioned at, and the position of the crystal orientation that becomes the cutting start position of the cylindrical single crystal silicon ingot block is fixed.
(4) The work table on which the clamp device is mounted is moved in the direction of the pair of rotating cutting blades, and the front and rear surfaces of the cylindrical single crystal silicon ingot block are cut by the pair of rotating cutting blades.
(5) The C axis of the cylindrical single crystal silicon ingot block is rotated by 90 degrees.
(6) The work table on which the clamp device is mounted is moved in the direction of the pair of rotating cutting blades to cut the front and rear surfaces of the cylindrical single crystal silicon ingot block with the pair of rotating cutting blades. A crystalline silicon ingot block is obtained.
Proposed.

  In the method of processing into the rectangular columnar block described in Patent Document 2 above, the arc-shaped side surfaces on both the front and rear sides of the cylindrical ingot block are simultaneously cut using a pair of rotary cutting blades (outer peripheral blades), so that the diameter is 200 mm and the length is 500 mm The cylindrical ingot block can be manufactured by scraping in 25 to 28 minutes. Compared with a commercially available cutting device, the time required to process one cylindrical single crystal silicon ingot block into a square columnar block is less than about 1/2. Has certain advantages.

JP 2010-263025 A Japanese Patent Application No. 2010-251484 (unpublished)

  In the cutting method described in Patent Document 2, an outer peripheral blade having a diameter of 550 mm having a diamond outer peripheral edge having a width of 4.0 mm and a width of 5.0 mm is used as the rotary cutting blade. In order to reduce the amount of cutting waste generated by the outer peripheral blade, the present inventors have a thickness of 4 to 5 mm of a diamond electrodeposition blade provided with a width of 5 to 8 mm on the outer peripheral edge of a disk-shaped base having a diameter of 500 to 600 mm. I thought that it can be solved by reducing the thickness of the Daiso blade to 1.3 to 2.5 mm, and if a peripheral cutting blade with a diameter of 550 mm having a diamond outer peripheral cutting edge with a width of 2.0 mm and a width of 5.0 mm is used as a rotary cutting blade The amount of cut silicon scrap was estimated to be half, and a diamond outer blade with a width of 2.0 mm and a width of 5.0 mm was prototyped and a cylindrical ingot block was cut. It was found that the load on the electric motor during cutting was large.

  If a large electric motor is used, the power consumption increases, and the footprint (installation area) of the cutting device also increases.

  The first object of the present invention is to provide a cylindrical ingot block cutting device that can reduce the amount of generated cutting waste without increasing the load of the electric motor. A second object of the present invention is to provide a method of processing a cylindrical ingot block into a square columnar block using this cutting device.

Claim 1 of the present invention provides
a) a work table provided so as to be able to reciprocate in the left-right direction on a guide rail provided in the left-right direction on the machine frame;
b) a clamp mechanism comprising a pair of headstock and tailstock mounted separately on the work table on the left and right;
c) a drive mechanism for reciprocating the work table carrying the work supported by the clamp mechanism in the left-right direction;
d) A direction in which the work table is viewed from the front side of the composite chamfering apparatus, and from the right side to the left side,
e) loading / unloading stage of cylindrical ingot block;
f) a standby position stage of the clamping mechanism provided behind the loading / unloading stage;
g) A pair of outer peripheral blades (rotary cutting blades) sandwiching the workpiece support shaft (C-axis) of the clamp mechanism so that the diameters of the rotary cutting blades face each other and from the height position of the workpiece support shaft A side-peeling slicing stage of a cylindrical ingot block in which a rotary cutting blade (tool) shaft is provided at the front and back of the guide rail so that the rotary cutting blade (tool) axis is located at a position above
and,
h) a crystal direction detection stage provided with an ingot block crystal direction detection device at a load port position of the loading / unloading stage;
The present invention provides a four-side stripping and cutting device for a cylindrical ingot block provided with the above.

The invention of claim 2 provides a method for chamfering a cylindrical ingot block into a prismatic ingot block through the following steps using the four-side stripping and cutting device of claim 1.
(1) With an encoder having a function of rotating a cylindrical ingot block, which is a workpiece (workpiece), around the rotation C axis of the clamp mechanism using a loading mechanism in a loading / unloading stage and passing through a load port. It is carried in between the headstock and the tailstock, and then the tailstock is advanced to hold the cylindrical ingot block between the clamp mechanisms.
(2) The crystal orientation of the cylindrical ingot block rotated by the motor of the headstock of the clamping device is measured by a sensor of a crystal direction detecting device placed away from the front side of the sandwiched cylindrical ingot block, and this C axis While the rotation angle is read by the encoder, the C-axis is rotated once (360 degrees), and a correlation diagram between the C-axis rotation angle of the cylindrical ingot block and the crystal orientation of the cylindrical ingot block is displayed.
(3) One of the encoder rotation angles (θ) indicating the four crystal orientations displayed is selected, and this angle is the position of the encoder rotation angle of 45 degrees with respect to the rotary cutting blade radial direction surface (cutting start C-axis The C-axis is rotated so as to be positioned at (position), and the crystal orientation position of the cylindrical ingot block is centered.
(4) A length that exceeds the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotary cutting blades by moving the work table on which the clamp mechanism is mounted in the direction of the pair of rotating cutting blades. The groove is processed. During this grooving, a cooling liquid is supplied to the front and rear surfaces of the rotary cutting blade.
(5) Next, the C-axis of the cylindrical ingot block is rotated 180 degrees using a servo motor on the headstock.
(6) The work table on which the clamp mechanism is mounted is moved in the direction of the pair of rotating cutting blades so that the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades exceeds 1/2. The groove is processed to cut the arc-shaped side surfaces before and after the cylindrical ingot block. During this cutting process, a coolant is supplied to the front and rear surfaces of the rotary cutting blade.
(7) Next, the C-axis of the cylindrical ingot block whose two side surfaces are cut is rotated 90 degrees using a servo motor for the headstock.
(8) Move the work table on which the clamp mechanism is mounted in the direction of the pair of rotating cutting blades to rotate, and reduce the height of the remaining front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades to ½. Grooves that exceed the length are processed. During this grooving, a cooling liquid is supplied to the front and rear surfaces of the rotary cutting blade.
(9) Next, the C-axis of the cylindrical ingot block is rotated 180 degrees using a servo motor for the headstock.
(10) The work table on which the clamp mechanism is mounted is moved in the direction of the pair of rotating cutting blades so that the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades exceeds 1/2. Then, the front and back arc-shaped side surfaces of the cylindrical ingot block are cut and processed into a square columnar ingot block. During this cutting process, a coolant is supplied to the front and rear surfaces of the rotary cutting blade.

The invention of claim 3 provides a method of chamfering a cylindrical ingot block into a prismatic ingot block through the following steps using the four-side stripping / cutting device according to claim 1.
(1) With an encoder having a function of rotating a cylindrical ingot block, which is a workpiece (workpiece), around the rotation C axis of the clamp mechanism using a loading mechanism in a loading / unloading stage and passing through a load port. It is carried in between the headstock and the tailstock, and then the tailstock is advanced to hold the cylindrical ingot block between the clamp mechanisms.
(2) The crystal orientation of the cylindrical ingot block rotated by the motor of the headstock of the clamping device is measured by a sensor of a crystal direction detecting device placed away from the front side of the sandwiched cylindrical ingot block, and this C axis While the rotation angle is read by the encoder, the C-axis is rotated once (360 degrees), and a correlation diagram between the C-axis rotation angle of the cylindrical ingot block and the crystal orientation of the cylindrical ingot block is displayed.
(3) One of the encoder rotation angles (θ) indicating the four crystal orientations displayed is selected, and this angle is the position of the encoder rotation angle of 45 degrees with respect to the rotary cutting blade radial direction surface (cutting start C-axis The C-axis is rotated so as to be positioned at (position), and the crystal orientation position of the cylindrical ingot block is centered.
(4) A length that exceeds the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotary cutting blades by moving the work table on which the clamp mechanism is mounted in the direction of the pair of rotating cutting blades. The groove is processed. During this grooving, a cooling liquid is supplied to the front and rear surfaces of the rotary cutting blade.
(5) Next, the C-axis of the cylindrical ingot block is rotated 90 degrees using a servo motor for the headstock.
(6) The work table on which the clamp mechanism is mounted is moved in the direction of the pair of rotating cutting blades so that the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades exceeds 1/2. The groove is processed. During the grooving, a cooling liquid is supplied to the front and rear surfaces of the rotary cutting blade.
(7) Next, the C-axis of the cylindrical ingot block in which the four grooves are formed is rotated 90 degrees using a servo motor for the headstock.
(8) The work table on which the clamp mechanism is mounted is moved in the direction of the pair of rotating cutting blades so that the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades exceeds 1/2. The groove is processed to cut the arc-shaped side surfaces before and after the cylindrical ingot block. During this cutting process, a coolant is supplied to the front and rear surfaces of the rotary cutting blade.
(9) Next, the C axis of the ingot block is rotated 90 degrees or -270 degrees using a servo motor of the headstock.
(10) The work table on which the clamp mechanism is mounted is moved in the direction of the pair of rotating cutting blades so that the height of the front and rear surfaces of the ingot block by the pair of rotating cutting blades exceeds 1/2. Groove processing is performed, and the arc-shaped side surfaces before and after the ingot block are cut and processed into a square columnar ingot block. During this cutting process, a coolant is supplied to the front and rear surfaces of the rotary cutting blade.

  Even if the width of the diamond cutting edge of the rotary cutting blade is as narrow as 1.2 to 2.5 mm, the cutting depth of the cylindrical ingot block of the diamond cutting edge exceeds 1/2 of the target groove cutting depth (h). Since the depth is limited to a depth exceeding 5 mm (h / 2 + 1 to 5 mm), the area where the diamond cutting edge of the rotary cutting blade is in contact with the grooved portion of the cylindrical ingot block cuts the side surface of the ingot with the diamond cutting edge of the rotary cutting blade. It becomes about 1/2 of that. Therefore, the load applied to the electric motor does not increase so much. Moreover, the generation amount of ingot cutting waste is reduced by setting the width of the diamond cutting edge of the rotary cutting blade to 1.2 to 2.5 mm. Further, the diameter of the rotary cutting blade can be reduced to 450 to 550 mm.

Since the crystal orientation of the cylindrical single crystal silicon ingot block sandwiched between the clamp devices can be accurately detected by the crystal direction detection device, it is finished and chamfered in the subsequent process of each batch-produced square columnar single crystal ingot block. The crystal orientation of the single crystal silicon of the square columnar single crystal silicon ingot block is constant. Therefore, the crystal orientation of the substrate (wafer) obtained from each batch obtained by slicing these finished chamfered square columnar single crystal silicon ingot blocks with multi-wire saw can be obtained.

FIG. 1 is a plan view of a four-side stripping and cutting device. FIG. 2 is a top view of the four-side stripping and cutting apparatus. FIG. 3 is a view of the flow of detecting and positioning the crystal direction of the cylindrical single crystal silicon ingot block as viewed from the right side of the four-side stripping and cutting apparatus. FIG. 4 is a flow diagram showing a process of manufacturing a rectangular columnar single crystal ingot block by cutting a cylindrical silicon ingot block with a rotary cutting blade, and is a view of the ingot block viewed from the side of the clamping device. FIG. 5 is a flow chart of another embodiment showing a process of manufacturing a rectangular columnar single crystal ingot block shape by cutting a cylindrical silicon ingot block with a rotary cutting blade, and is a view of the ingot block viewed from the side of the clamping device. .

  The side-stripping / cutting device 1 of the cylindrical single crystal silicon ingot block shown in FIGS. 1 and 2 includes the following components a) to h).

  a) Work table 4 provided so as to be able to reciprocate in the left-right direction on guide rails 3, 3 provided in the left-right direction on the machine frame 2.

    b) a clamping mechanism 7 comprising a pair of a headstock 7a and a tailstock 7b mounted separately on the work table 4 on the right and left sides;

  c) a drive mechanism 7am for reciprocating the work table 4 on which the work w supported by the clamp mechanism is mounted in the left-right direction;

  d) A direction in which the work table 4 is viewed from the front side of the cutting device 1 and from the right side to the left side.

  e) Cylindrical silicon ingot block loading / unloading stage 8R,

  f) a standby position stage 70 of the clamp mechanism 7 provided behind the loading / unloading stage 8R;

g) A pair of rotary cutting blades 91a and 91b with the workpiece support shafts 7a ₁ and 7b ₁ of the clamp mechanism sandwiched therebetween so that the diameters of the rotary cutting blades face each other and the workpiece support shaft (C axis) Side-peeling slicing of a cylindrical ingot block in which a rotary cutting blade (tool) shaft is provided in front of and behind the guide rails 3 and 3 so that the rotary cutting blade shaft centers 92a and 92b are positioned at a position above the height position. Stage 90,

  h) A crystal direction detection stage in which a crystal direction detection device S of an ingot block is provided at the load port 8 position of the loading / unloading stage 8R (see FIG. 3).

In addition, the pressure of the cooling water supplied to the rotary cutting blade is 20 to 35 Kgf / cm ² , and the amount of the cooling liquid is 2 to 20 liters / minute, so that the ingot cutting waste is blown off from the work.

As the crystal orientation detection device S of the cylindrical single crystal silicon ingot block (work), even a known X-ray analysis device (current price is about 15 million yen) is a laser light reflection type displacement sensor (current price is about 35 ~ 600,000 yen). As the crystal orientation detection device S of the sapphire ingot block, an X-ray analysis device is used. The laser light reflection type displacement sensor is not shown in FIG. 1, but is located on the same horizontal plane with respect to the C-axis of the work clamped by the clamp device 7 as shown in step (I) of FIG. And 45 to 55 mm in front of the workpiece to be measured. The laser light reflection type displacement sensor S is rotatably mounted using a swing arm so as not to cause an obstacle when a work is carried into the load port 8. The laser light reflection type displacement sensor is rotated downward so as to be at the position when measuring the crystal orientation, and is rotated upward so that no obstacle occurs when the workpiece is loaded into the load port 8 when not measuring. Then, it is attached to the cutting device 1 so as to evacuate to the measurement standby position.

  The crystal orientation of the cylindrical single crystal silicon ingot block is measured after the cylindrical single crystal silicon ingot block w is clamped by a clamp device 7 composed of a headstock 7a and a tailstock 7b as shown in I of FIG. The laser beam is irradiated toward the C axis of the cylindrical single crystal silicon ingot block from the laser light reflection type displacement sensor S installed in the horizontal direction away from the front side of the sandwiched cylindrical single crystal silicon ingot block w. As shown in II of II, the cylindrical single crystal silicon ingot block that rotates the C axis one time (360 degrees) is read while the C axis rotation angle by the motor of the headstock of the clamping device is read by the encoder, and the rotation angle and pulse A correlation diagram of the peak is displayed (refer to a and b in II of Fig. 3). A correlation diagram showing the peak height of the pulse in the direction (II in FIG. 3), or the rotation angle (0 to 360 degrees) around the C axis of the encoder is shown in a circle, and the pulse height on the outer circumference of the circle Can be displayed as a pie chart correlation diagram (IIb in FIG. 3).

  As crystal orientation detection device S using a laser light reflection type displacement sensor, “Laser Marker Microscope HL-C108F-BK” (trade name) manufactured by Panasonic Electric Works SUNX Co., Ltd. “Laser Type Displacement Sensor LK-H085” manufactured by Kiens Co., Ltd. Crystals of rotating ingot blocks such as “(trade name) and amplifier (LK-G500” (trade name) combination, TONIC system (trade name) using Renishaw's Signum encoder and pulse generator) A detection device that displays a pulse protrusion (peak) when a laser beam hits the direction can be used.

  The pulse frequency is 50 to 300 Hz, preferably 100 Hz, and KrF excimer laser light having a wavelength of 248 nm and XeCl excimer laser light having a wavelength of 308 nm are preferable. The laser light reflected in the crystal orientation is presented on the display screen by an electronic signal as a high reflection intensity. In addition, rotating the cylindrical single crystal silicon ingot block w from 0 to 360 degrees once is because the crystal orientation detection device is operating normally according to the data results displayed at intervals of about 90 degrees with four high peaks. It is because it leads to an operator confirming.

  For the centering of the cylindrical single crystal silicon ingot block, one of the encoder display rotation angles indicating the four displayed pulse peaks is selected, and this angle is the encoder for the rotary cutting blade radial direction surface of the outer peripheral blade. The C axis is rotated by the servo motor 7am of the headstock 7a so as to be positioned at a rotation angle of 45 degrees (cutting start C axis position) to fix the crystal orientation position of the cylindrical single crystal silicon ingot block ((FIG. 3 III) Normally, the angle to be selected is the angle (θ) indicating the first peak or the angle (θ) indicating the second peak. This is preferable because the angle can be small.

Returning to FIGS. 1 and 2, the ingot block transport mechanism 13 and the ingot stocker 14 constituting the loading / unloading stage 8 </ b> R are arranged in parallel on the front side of the work table 4. The structures of the ingot block transport mechanism 13 and the ingot stocker 14 are disclosed in detail in FIGS. 5 and 7 of Japanese Patent Application No. 2010-61844, filed earlier by the applicant of the present patent application. The ingot block transport mechanism 13 and the ingot stocker 14 can be obtained from the market.

  The work stockers 14, 14, and 14 each have a V-shaped shelf whose cross section that can store three ingot blocks has an inverted isosceles triangle shape, and is placed on a positioning pin protruding from the machine frame.

The ingot block transport mechanism 13 holds one ingot block stored on the work stocker 14V-shaped shelf with a pair of claws, lifts both claws and then lifts the workpiece, and then moves backward and moves to the right. Then, the workpiece is moved down and positioned in front of the load port 8 and further retracted to carry the workpiece from the load port 8 between the headstock 7a and the tailstock 7b of the clamping device 7. After contact with one end of the workpiece to the center support shaft 7a ₁ of the headstock 7a, the work of the tailstock 7b is brought into contact with the other end is moved to the right by the air cylinder 7e to the center support shaft 7b ₁ suspended Suspend to state. Next, the gripping of the workpiece is released by separating the both claws, and then the fixing base supporting both the claws is lifted, moved to the left, and further retracted forward to move both claws to the ingot block transport mechanism 13. Return to the standby position.

The side-peeling slicing stage 90 includes a clamping device 7, left and right moving guide rails 3 and 3 for the work table 4 on which the clamping device 7 is mounted, and a work support shaft 7a of the headstock 7a and tailstock 7b of the clamping mechanism. ₁ and 7b A pair of rotary cutting blades 91a and 91b, which are supported by a pair of spindle shafts 92a and 92b which can be moved back and forth across ₁ and 7b ₁ , are provided in front of and behind the work table so that their diameter surfaces face each other. The slicing head 9 is formed.

  When the rotary cutting blades 91a and 91b are moved back and forth, the tool tables 94t and 94t on which the servo motors 93m and 93m for rotating the spindle shafts 92a and 92b that support the rotary cutting blades 91a and 91b are mounted are mounted on motor driven ball screws (not shown). The rotation is performed by motors 94m and 94m. The forward or backward movement direction of the tool table 94t depends on whether the rotation shaft of the servo motor 94m is clockwise or counterclockwise.

The pair of rotary cutting blades 91a and 91b are supported by a pair of spindle shafts 92a and 92b, and the spindle shafts are driven and rotated by servo motors 93m and 93m, so that the rotary cutting blades 91a and 91b are the same clock with respect to the workpiece. It is rotated at a rotational speed of 50 to 7,500 min ^{−1 in} the rotation direction (the rotation directions of both spindle shafts are opposite to each other). The spindle shafts 92a and 92b can be moved to the ingot block chamfering start position by moving the tool tables 94t and 94t back and forth. The spindle shafts 92a and 92b are arranged so that the diameters of the rotary cutting blades 91a and 91b are opposed to each other with the workpiece support shafts 7a ₁ and 7b ₁ of the clamp mechanism interposed therebetween, and the workpiece support The rotary cutting blade shaft centers 92a and 92b are provided on the front and rear sides of the guide rails 3 and 3 so that the rotary cutting blade shaft centers 92a and 92b are positioned above the height position of the shaft (C axis). A side-peeling slicing stage 90 of the ingot block is configured.

  The work table 4 can move at a speed of 5 to 200 mm / min, and the rotary shafts 92a and 92b can move up and down to 100 mm.

As the rotary cutting blades 91a and 91b, diamond fine particles are 5 to 10 m wide on the outer peripheral edge (thickness 1.0 to 2.0 mm) of a steel sheet having a diameter of 450 to 600 mm and a thickness of 1 to 2 mm.
m, a diamond cutter electrodeposited with a thickness of 1.2 to 2.5 mm is used.

  By moving the work table 4 mounted with the clamp mechanism 7 that clamps the C-axis of the workpiece (cylindrical ingot block) in the horizontal direction to the left, the front and back of the workpiece end surface abut against the pair of outer peripheral blades 91a and 91b. Surface peeling cutting is performed in which the front and rear surfaces of the cylindrical workpiece are scraped off in an arc shape by the outer peripheral blade. When the surface peeling and cutting of the workpiece front and back surfaces is completed, the support shaft of the headstock 7a of the clamp mechanism 7 is rotated by 90 degrees to center (position) the arc surface of the workpiece that has not been surface peeled to the front and rear positions. Next, the work table 4 is moved, and the pair of outer peripheral blades 91a and 91b are rotationally driven by the servo motors 93m and 93m to perform the remaining surface peeling and cutting. The cylindrical single crystal silicon ingot block is stripped and cut on the four side surfaces for a cylindrical single crystal silicon ingot block having a diameter of 200 mm and a height of 250 mm for 10 to 20 minutes, a diameter of 200 mm and a height of 500 mm. It can be performed in a single crystal silicon ingot block in 22 to 27 minutes.

  A method of cutting a cylindrical single crystal silicon ingot block by using the cutting apparatus 1 to perform four-side strip cutting processing into a square columnar ingot block is performed through the following steps.

  (1) A cylindrical silicon ingot block (work) placed on the stocker 14 is gripped with both claws using the cylindrical ingot block transfer mechanism 13 on the loading stage 8R, and then both claws are The supporting base 13f is lifted and moved to the left, and the sliding surface 13s of the fixing base 13f, whose back surface is screwed to a ball screw rotated by a servo motor, is provided on the guide rail 13g provided on the side of the column. And a spindle head 7a with an encoder having a function of lowering the cylindrical ingot block by driving the air cylinder 13p and rotating it around the rotation C axis of the first clamp mechanism 7; After carrying in between the tailstocks 7b, the tailstock is advanced and the cylindrical silicon ingot block w is moved to the first cylinder. To hold in-flops mechanism 7.

  (2) A laser beam is emitted toward the C axis of the cylindrical single crystal silicon ingot block from the displacement sensor S that is set apart on the front side of the sandwiched cylindrical single crystal silicon ingot block. The C-axis rotation angle by the motor is read by the encoder while rotating the C-axis one rotation (360 degrees), and a correlation diagram between the rotation angle and the pulse peak is displayed. (See II in FIG. 3)

  (3) Select one of the encoder rotation angles (θ) indicating the four displayed pulse peaks, and this angle is the position of the encoder rotation angle of 45 degrees relative to the rotary cutting blade radial direction surface (cutting start C axis The C-axis is rotated so as to be positioned at (position), and the crystal orientation position of the cylindrical single crystal silicon ingot block is centered. (See III in FIG. 3)

  (4) The work table 4 on which the clamp mechanism 7 is mounted is moved in the direction in which the pair of rotating cutting blades 91a and 91b are located, and the cylindrical silicon ingot block w by the pair of outer cutting blades 91a and 91b. Grooves with a length exceeding the height h of h / 2 by 1 to 3 mm are performed. During this grooving, a cooling liquid is supplied to the front and rear surfaces of the rotary cutting blade. (Refer to I in FIG. 4)

  (5) Next, the C axis of the cylindrical ingot block is rotated 180 degrees using the servo motor of the headstock 7a. (Refer to II in FIG. 4)

(6) The work table 4 on which the clamp mechanism 7 is mounted is moved in the direction of the pair of rotating cutting blades 91a and 91b so that the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades 91a and 91b is increased. A groove having a length exceeding 1/2 is cut, and the arc-shaped side surfaces before and after the cylindrical ingot block are cut. During this cutting process, a coolant is supplied to the front and rear surfaces of the rotary cutting blades 91a and 91b. (See III in FIG. 4)

  (7) Next, the C-axis of the cylindrical ingot block whose two side surfaces are cut is rotated 90 degrees using the servo motor of the headstock 7a. (Refer to IV in FIG. 4)

  (8) The height of the remaining front and rear surfaces of the cylindrical ingot block by the pair of rotary cutting blades 91a and 91b by moving the work table on which the clamp mechanism is mounted in the direction of the pair of rotating cutting blades 91a and 91b. Grooves with a length exceeding 1/2 are performed. During this grooving, cooling liquid is supplied to the front and rear surfaces of the rotary cutting blades 91a and 91b. (Refer to V in FIG. 4)

  (9) Next, the C axis of the cylindrical ingot block is rotated 180 degrees using the servo motor of the headstock 7a. (Refer to VI in FIG. 4)

  (10) The work table 4 on which the clamp mechanism 7 is mounted is moved in the direction of the pair of rotating cutting blades 91a and 91b, and the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades 91a and 91b is increased. A groove having a length exceeding 1/2 is cut, and the arc-shaped side surfaces before and after the cylindrical ingot block are cut and processed into a square columnar ingot block. During this cutting process, a coolant is supplied to the front and rear surfaces of the rotary cutting blades 91a and 91b. (Refer to VII in FIG. 4)

  (11) The work table 4 is moved to the clamp mechanism standby stage 70, the square columnar block is gripped by the claw of the transfer mechanism 13 of the ingot block w in the loading / unloading stage 8R, and the tailstock 7b is retracted and clamped The restraint of the square columnar block by the mechanism 7 is removed.

  (12) Both claws of the ingot block transport mechanism 13 are moved onto the stocker 14, then both claws are opened, and the square columnar block is placed on the shelf on the stocker 14.

  As a processing method of another aspect in which a cylindrical single crystal silicon ingot block is cut and cut into four sides by using the cutting apparatus 1 to form a square columnar ingot block, the steps (5) to (9) are performed as follows. The step (5) may be replaced with the step (9).

  (5) Next, the C-axis of the cylindrical ingot block is rotated 90 degrees using a servo motor for the headstock. (See II in FIG. 5)

  (6) The work table 4 on which the clamp mechanism 7 is mounted is moved in the direction of the pair of rotating cutting blades 91a and 91b so that the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades 91a and 91b is increased. Grooves with a length exceeding 1/2 are performed. During the grooving, a cooling liquid is supplied to the front and rear surfaces of the rotary cutting blades 91a and 91b. (See III in FIG. 5)

  (7) Next, the C axis of the cylindrical ingot block in which the four grooves are formed is rotated 90 degrees using the servo motor of the headstock 7a. (Refer to IV in FIG. 5)

  (8) The work table 4 on which the clamp mechanism 7 is mounted is moved in the direction of the pair of rotating cutting blades 91a and 91b so that the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades is 1. A groove having a length exceeding / 2 is cut, and the arc-shaped side surfaces before and after the cylindrical ingot block are cut. During this cutting process, a coolant is supplied to the front and rear surfaces of the rotary cutting blade. (Refer to V in FIG. 5)

  (9) Next, the C axis of the ingot block is rotated 90 degrees or -270 degrees using a servo motor of the headstock. (Refer to VI in FIG. 5)

  Since the cylindrical ingot block side surface peeling and cutting apparatus 1 according to the present invention and the method of processing the same into a square columnar block can use a rotary cutting blade having a diamond blade width of 1.2 to 2.5 mm. The amount of cutting waste generated in the ingot block can be reduced.

  When the ingot material is a single crystal silicon ingot, it is possible to accurately detect the crystal orientation of a cylindrical single crystal silicon ingot block sandwiched between clamp devices using an inexpensive displacement sensor instead of an expensive X-ray diffraction device. .

1 Cutting device C C axis (workpiece rotation axis of clamp device)
w Ingot block (work)
S Laser beam reflection type displacement sensor 3 Guide rail 4 Work table 7 Clamp mechanism 7a Spindle base 7b Tailstock 8 Load port 8R Loading / unloading stage 13 Ingot block transport mechanism 14 Stocker 70 Clamp mechanism standby position stage 90 Slicing stage 91a, 91b Rotary cutting blade (peripheral blade)
92a, 92b Tool (rotary cutting blade) shaft

Claims (3)

a) a work table provided so as to be able to reciprocate in the left-right direction on a guide rail provided in the left-right direction on the machine frame;
b) a clamp mechanism comprising a pair of headstock and tailstock mounted separately on the work table on the left and right;
c) a drive mechanism for reciprocating the work table carrying the work supported by the clamp mechanism in the left-right direction;
d) A direction in which the work table is viewed from the front side of the composite chamfering apparatus, and from the right side to the left side,
e) loading / unloading stage of cylindrical ingot block;
f) a standby position stage of the clamping mechanism provided behind the loading / unloading stage;
g) Rotating and cutting a pair of rotary cutting blades across the workpiece support shaft of the clamp mechanism so that the diameter surfaces of the rotary cutting blades face each other and above the height position of the workpiece support shaft A side-peeling slicing stage of a cylindrical ingot block in which a rotary cutting blade shaft is provided at the front and back of the guide rail so that the blade axis is located;
and,
h) a crystal direction detection stage provided with an ingot block crystal direction detection device at a load port position of the loading / unloading stage;
4 side stripping and cutting device for cylindrical ingot block. A method for chamfering a cylindrical ingot block into a prismatic ingot block through the following steps using the four-side stripping and cutting device according to claim 1.
(1) Using a loading mechanism in the loading / unloading stage, passing between the load port and rotating the cylindrical ingot block around the work support shaft of the clamp mechanism, between the headstock with encoder and the tailstock Then, the tailstock is moved forward, and the cylindrical ingot block is clamped by the clamp mechanism.
(2) The crystal orientation of the cylindrical ingot block rotated by the motor of the headstock of the clamping device is measured by a crystal direction detecting device installed at the front side of the sandwiched cylindrical ingot block, and the workpiece support shaft is rotated. The workpiece support shaft is rotated once while the angle is read by the encoder, and a correlation diagram between the workpiece support shaft rotation angle of the cylindrical ingot block and the cylindrical ingot block crystal orientation is displayed.
(3) One of the encoder rotation angles (θ) indicating the four crystal orientations displayed is selected, and the workpiece is positioned at an encoder rotation angle of 45 degrees with respect to the rotary cutting blade radial direction surface. The support shaft is rotated to center the crystal orientation position of the cylindrical ingot block.
(4) A length that exceeds the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotary cutting blades by moving the work table on which the clamp mechanism is mounted in the direction of the pair of rotating cutting blades. The groove is processed. During this grooving, a cooling liquid is supplied to the front and rear surfaces of the rotary cutting blade.
(5) Next, the work support shaft of the cylindrical ingot block is rotated 180 degrees using a servo motor of the headstock.
(6) The work table on which the clamp mechanism is mounted is moved in the direction of the pair of rotating cutting blades so that the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades exceeds 1/2. The groove is processed to cut the arc-shaped side surfaces before and after the cylindrical ingot block. During this cutting process, a coolant is supplied to the front and rear surfaces of the rotary cutting blade.
(7) Next, the work support shaft of the cylindrical ingot block whose two side surfaces are cut is rotated 90 degrees using a servo motor of the headstock.
(8) Move the work table on which the clamp mechanism is mounted in the direction of the pair of rotating cutting blades to rotate, and reduce the height of the remaining front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades to ½. Grooves that exceed the length are processed. During this grooving, a cooling liquid is supplied to the front and rear surfaces of the rotary cutting blade.
(9) Next, the work support shaft of the cylindrical ingot block is rotated 180 degrees using a servo motor of the headstock.
(10) The work table on which the clamp mechanism is mounted is moved in the direction of the pair of rotating cutting blades so that the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades exceeds 1/2. Then, the front and back arc-shaped side surfaces of the cylindrical ingot block are cut and processed into a square columnar ingot block. During this cutting process, a coolant is supplied to the front and rear surfaces of the rotary cutting blade. A method for chamfering a cylindrical ingot block into a prismatic ingot block through the following steps using the four-side stripping and cutting device according to claim 1.
(1) Using a loading mechanism in the loading / unloading stage, passing between the load port and rotating the cylindrical ingot block around the work support shaft of the clamp mechanism, between the headstock with encoder and the tailstock Then, the tailstock is moved forward, and the cylindrical ingot block is clamped by the clamp mechanism.
(2) The crystal orientation of the cylindrical ingot block rotated by the spindle head motor of the clamping device is measured by a sensor of a crystal direction detecting device placed at the front side of the sandwiched cylindrical ingot block, and the workpiece is supported. The work support shaft is rotated once while the shaft rotation angle is read by the encoder, and a correlation diagram between the work support shaft rotation angle of the cylindrical ingot block and the crystal orientation of the cylindrical ingot block is displayed.
(3) One of the encoder rotation angles (θ) indicating the four crystal orientations displayed is selected, and the workpiece is positioned at an encoder rotation angle of 45 degrees with respect to the rotary cutting blade radial direction surface. The support shaft is rotated to center the crystal orientation position of the cylindrical ingot block.
(4) A length that exceeds the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotary cutting blades by moving the work table on which the clamp mechanism is mounted in the direction of the pair of rotating cutting blades. The groove is processed. During this grooving, a cooling liquid is supplied to the front and rear surfaces of the rotary cutting blade.
(5) Next, the work support shaft of the cylindrical ingot block is rotated 90 degrees using a servo motor of the headstock.
(6) The work table on which the clamp mechanism is mounted is moved in the direction of the pair of rotating cutting blades so that the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades exceeds 1/2. The groove is processed. During the grooving, a cooling liquid is supplied to the front and rear surfaces of the rotary cutting blade.
(7) Next, the work support shaft of the cylindrical ingot block in which the four grooves are formed is rotated 90 degrees using a servo motor on the headstock.
(8) The work table on which the clamp mechanism is mounted is moved in the direction of the pair of rotating cutting blades so that the height of the front and rear surfaces of the cylindrical ingot block by the pair of rotating cutting blades exceeds 1/2. The groove is processed to cut the arc-shaped side surfaces before and after the cylindrical ingot block. During this cutting process, a coolant is supplied to the front and rear surfaces of the rotary cutting blade.
(9) Next, the work support shaft of the ingot block is rotated 90 degrees or -270 degrees using a servo motor of the headstock.
(10) The work table on which the clamp mechanism is mounted is moved in the direction of the pair of rotating cutting blades so that the height of the front and rear surfaces of the ingot block by the pair of rotating cutting blades exceeds 1/2. Groove processing is performed, and the arc-shaped side surfaces before and after the ingot block are cut and processed into a square columnar ingot block. During this cutting process, a coolant is supplied to the front and rear surfaces of the rotary cutting blade.

Images