TW201124065A - Heat dissipation device - Google Patents

Abstract

A heat dissipation device includes a base, a first fin assembly arranged on the base, a centrifugal fan arranged on the first fin assembly, and a heat pipe connecting the base with the first fin assembly. A second fin assembly is arranged at an air outlet of the centrifugal fan. The heat pipe includes an evaporating section, and first and second condensing sections formed at two ends of the evaporating section, respectively. The evaporating section is connected with the base. The second condensing section is connected with the first fin assembly. The first condensing section extends to the air outlet of the centrifugal fan and is connected with the second fin assembly.

Description

201124065 VI. Description of the Invention: [Technical Field] The present invention relates to a heat sink, and more particularly to a heat sink for dissipating heat from electronic components. [Previous 彳 · · · [0002] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (especially the central processing unit) are constantly increasing. Due to the high frequency and high speed, the heat generated by the electronic components will increase, and the temperature will increase continuously. The serious zero threatens the performance of the electronic components. To ensure the normal operation of the electronic components, the electronic components must be discharged in time. The heat dissipation of various structures of a large amount of heat is also continuously designed. [0003] A conventional heat sink device generally includes a substrate, a heat sink disposed on the substrate, a plurality of heat pipes disposed between the substrate and the heat sink, and a fan disposed on the heat sink. The heat absorbing plate is attached to the upper surface of the electronic component. One end of the heat pipe is coupled to the heat absorbing plate, and the other end is coupled to the heat sink I - 22. The heat generated by the electronic component is absorbed by the substrate and transmitted to the heat pipe. Further, it is dissipated through the heat sink, and a forced air flow is provided by the fan to accelerate the heat dissipation of the heat sink. [0004] However, as the electronic product is lighter and thinner, the height of the heat dissipating device is limited, and the above-mentioned heat dissipating device cannot meet the heat dissipating demand of the conventional electronic product. [Summary of the Invention] [〇〇〇5] In view of Therefore, it is necessary to provide a heat sink having a thinner thickness and better heat dissipation performance. 098144171 Form No. A0101 Page 3 of 15 0982075560-0 201124065 ~ Substrate, first heat dissipation on the substrate

The first condensation section and the (0006) heat dissipation device are respectively disposed at the two ends of the evaporation section, and include a second condensation section, the evaporation section is connected to the substrate, and the second condensation section and the first heat dissipation section are The chip group connection 'the air outlet of the centrifugal fan is further provided with a second heat dissipation fin set'. The first condensation section extends to the air outlet and is connected to the second heat dissipation fin set. [0007] Compared with the prior art, the heat dissipating device uses the first heat dissipating fin group to dissipate heat, and the second heat dissipating fin group is disposed at the air outlet of the centrifugal fan. The airflow blown by the tuyere takes away the heat of the second heat sink fin group, thereby further improving the heat dissipation performance of the heat sink device. Therefore, under the premise of improving the heat dissipation performance, the heat sink device can be made thinner overall and at the same time Good heat dissipation performance. [Embodiment] The heat sink of the present invention will be further described below with reference to the accompanying drawings. As shown in FIG. 1 and FIG. 2, the heat dissipating device 1 includes a substrate 12, a first heat dissipation fin group 14 disposed on the substrate 12, and the substrate 12 and the first heat dissipation device. Two heat pipes 16 between the fins 14 , a heat dissipation fan 18 disposed on the first heat dissipation fin set 14 , and a second heat dissipation fin set 15 disposed on one side of the heat dissipation fan 18 » [0010] The substrate 12 has a rectangular plate shape and has a flat lower surface I20 and an upper surface 122 opposite to the lower surface 120. The upper surface 122 is provided with two mutually parallel horizontal grooves 123. 098144171 Form No. A0101 Page 4 of 15 0982075560-0 201124065 [0012] The first heat sink fin set 14 is attached to the upper surface 122 of the substrate 12, and is composed of a plurality of first heat sink fins. The sheets 140 are arranged. The plurality of first heat dissipation fins 140 are parallel and spaced apart from each other, and a first-class track 142 is formed between each adjacent two first heat dissipation fins 140. Referring to FIG. 3 , the middle portion of the bottom surface of the first heat dissipation fin set 14 is provided with two grooves 144 extending through the plurality of first heat dissipation fins 140 , and the grooves 144 are opposite to the grooves 123 on the substrate 12 . Correspondingly, after the first heat dissipation fin set 14 is assembled on the substrate 12, the groove 144 and the groove 123 are enclosed by two circular holes (not shown). The top surface of the first heat dissipation fin set 14 is provided with a circular receiving hole 146 extending through the plurality of first heat dissipation fins 140 on both sides thereof. The two heat pipes 16 are disposed between the substrate 12 and the first heat dissipation fin group 14, and respectively include an evaporation section 160, a first condensation section 162 extending from one end of the evaporation section 160, A second condensation section 164 is disposed at the other end of the evaporation section 160 and a connection section 166 is connected between the second condensation section 164 and the evaporation section 160. The evaporation section 160 is disposed in parallel with the second condensation section 164 and forms a U-shape with the connection section 160. The first condensation section 162 extends vertically upward from one end of the evaporation section 160. When assembled, the evaporation sections 160 of the two heat pipes 16 are respectively received in the two circular holes of the groove 123 of the substrate 12 and the groove 144 of the first heat dissipation fin set 14 , and the second The condensing sections 164 are respectively disposed in the two receiving holes 146 of the first heat dissipation fin set 14 , and the first condensation section 162 is leaked outside the first heat dissipation fin set 14 , and One side of a heat dissipation fin group 14 extends upward. The cooling fan 18 is a centrifugal fan disposed at the top end of the first heat dissipation fin set 14. The heat dissipation fan 18 includes a bottom plate 180, a cover body 182 disposed on the bottom plate 098144171, a form number Α0101, a fifth page, a total of 15 pages 0982075560-0, and a spring 184 received in the cover body 182. . [0014] The bottom plate 180 is disposed on a top surface of the first heat dissipation fin group η, and is a rectangular plate body made of a metal having better thermal conductivity such as aluminum, and a circular shape is disposed at a center of the bottom plate 18〇. The air inlet 181. [0015] The cover 182 is covered on the bottom plate 180, and may be made of a metal having better thermal conductivity. The cover body includes a top plate 183 and a scroll-shaped side wall 185 extending downward from the periphery of the top plate 183. The top plate 183 and the side wall 185 together form a receiving space 187. The middle portion of the top plate 183 is provided with another circular air inlet 188. The air vent i rib is perpendicular to the air vent 193. The air inlet 188 is provided with a support plate 189 and the support plate 189 is directed to a·k - > r, ·> Four ribs 190 formed by outer extension 〇 The support plate 189 has a circular plate shape,

The middle portion extends vertically downward to form a tubular body 191, and a bearing 192 is received in the tubular body 191. The four ribs 190 are equally spaced between the outer periphery of the support plate 189 and the inner periphery of the air inlet 188. The side of the side wall 185 is provided with an air outlet 193 perpendicular to the air inlet 188. The outer surface of side wall 185 extends outwardly to form a plurality of fins 194. When the heat dissipation fan 18 is assembled on the first heat dissipation fin group 14, the air outlet 193 corresponds to the first condensation section 162 of the two heat pipes 16 outside the first heat dissipation fin group 14 of the outer leakage G. [(8) 16] The impeller 184 includes a hub 170, an annular disc 172 disposed around the outer circumference of the hub 170, a plurality of connecting ribs 174 connected between the hub 170 and the disc 172, and a circle A plurality of blades 176 on the upper and lower sides of the disk 172. The hub 170 includes a circular bottom wall 171 and an annular wall 173 extending upwardly from the periphery of the bottom wall 171. The central portion of the bottom wall 171 extends upwardly to form a mandrel 175 through which the impeller 184 passes. Assembly 098144171 Form No. 101 0101 Page 6 / Total 15 page 0982075560-0 201124065 The bearing 192 is thus rotatably mounted on the support plate 189 and is housed in the receiving space 187 of the cover 182. The second heat-dissipating fin group 15 is disposed at the air outlet 193 of the heat-dissipating fan 18, and is formed by stacking a plurality of second heat-dissipating fins 150 in the height direction of the air outlet 193. The second heat dissipating fin group 15 is provided with two through holes 152 extending through the plurality of second heat dissipating fins 150. The second heat dissipating fin group 15 is disposed through the first condensation section 162 of the two heat pipes 16 The two through holes 152 are disposed inside the air outlet 193 of the heat dissipation fan 18. The heat sink 10 is attached to a heat-generating electronic component through the lower surface 12 of the substrate 12, and the heat generated by the heat-generating electronic component is absorbed by the substrate 12 and transmitted to the evaporation section 160 of the heat pipe 16. Conducted by the evaporation section 16 of the heat pipe 16 to the first and second condensation sections 162, 164, respectively, and further through the first and second heat dissipation fin groups connected to the first and second condensation sections 162, 164 14, 15 is distributed outward to the surrounding environment. At the same time, the impeller I84 of the cooling fan I8 is swirled through the air inlets 181 and 188, and then blown by the air outlet I93 to the second heat dissipation fin group 15 to heat the heat dissipation band of the second heat dissipation fin group 15. The air inlet 181 is located above the first heat dissipation fin group 14 and can directly draw airflow from the flow channel 142 of the first heat dissipation fin group 14 to thereby heat the first heat radiation scale group 14 go. In the heat dissipating device 1 , since the air outlet 193 of the heat dissipating fan 18 has the first heat dissipating Korean chip group 15 and extends the heat pipe 16 outwardly out of the first condensation section 162 and the second heat dissipation fin The chip group 15 is connected to make up for the poor heat dissipation effect caused by the height limitation in the conventional heat sink device. Under the premise of improving the heat dissipation, the heat sink device 10 can be made thinner and has better heat dissipation. performance. In addition, the bottom plate 180 and the cover 182 of the heat dissipation fan 18 are made of metal having good thermal conductivity by 098144171, the form number A0101, and the cover body 182, and the cover body 182 is provided with a plurality of wings. The sheet 194 can conduct the heat of the first heat dissipation fin group 14 to the bottom plate 180 and the cover 182 of the heat dissipation fan 18, and further radiate outward through the bottom plate 180 and the cover 182 of the heat dissipation fan 18, thereby further enhancing the Heat Dissipation Performance of Heat Dissipating Device 10 [0019] In summary, the present invention complies with the invention patent requirements, and patent applications are filed according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0020] FIG. 1 is an exploded perspective view of a heat sink according to a preferred embodiment of the present invention. 2 is an assembled, isometric view of FIG. 1. 3 is an inverted perspective view of FIG. 1. [Main component symbol description] [0023] 10: heat sink [0024] 12: substrate [0025] 14, 15: heat sink fin group [0026] 16: heat pipe [0027] 18: heat sink fan [0028] 120: lower surface 122: upper surface 0982075560-0 098144171 Form No. A0101 Page 8 of 15 201124065 [0030] 123: Trench [0031] 140, 150: heat sink fin [0032] 142: runner [0033] 144 : Groove [0034] 146 : receiving hole [0035] 152 : perforation [0036] 160 : evaporation section ❹ [0037] 162, 164 · · condensation section [0038] 166: connection section [0039] 170: hub [0040] 171: bottom wall [0041] 172: disc [0042] 173: annular niche [0043] 174: connecting rib [0044] 175: mandrel [0045] 176: fan blade [0046] 180: bottom plate [0047] 181 , 188: air inlet [0048] 182: cover lPr

098144171 Form No. A0101 Page 9 / Total 15 Page 0992075560-0 201124065 [0049] [0055] [0055] [0058] [0058] 183: Top plate 184: Impeller 185: side wall 187: receiving space 189: support plate 190: rib 191: pipe body 9 9 2: bearing 193: air outlet 194: fin

098144171 Form No. A0101 Page 10 of 15

0982075560-0

Claims (1)

201124065 VII. Patent application scope: 1. A heat dissipating device, comprising a substrate, a first heat dissipating fin set disposed on the substrate, a centrifugal fan disposed on the first heat dissipating fin group, and connected to the substrate and The heat pipe comprises: an evaporation section and a first condensation section and a second condensation section respectively disposed at two ends of the evaporation section, the evaporation section being connected to the substrate, wherein the heat pipe comprises: The second condensation section is connected to the first heat dissipation fin group, and the air outlet of the centrifugal fan further has a second heat dissipation fin group, and the first condensation section extends to the air outlet and the second heat dissipation fin The slice group is connected. 2. The heat dissipating device according to claim i, wherein the second fin group is formed by stacking a plurality of fins along a height direction of the air outlet. In the heat dissipating device, a first-condensing section is disposed between the first condensation section and the evaporation section, and the first condensation section and the steaming/condensing section are formed from the end section of the heat pipe and the connecting section. U-shaped 'the first * - 1 portion extends perpendicularly toward the air outlet β. The 々 埶 埶 device' of the centrifugal wind. The heat dissipation of the bottom plate and the cover fan according to claim 1 or 2 includes a bottom plate and Covered at the bottom is made of a metal having good thermal conductivity. In the private camp, the cover boat includes 5. The heat sink-top plate according to item 4 of the patent application and the (4) extending downward from the periphery of the top plate, the outer surface of the side wall extends outward to form a plurality of fins. Bile is stationed in the middle of the board. 6. The heat dissipation as described in item 5 of the patent application scope is straightforward with the air outlet. The heat dissipating device, wherein the bottom plate is provided with an air inlet, the air inlet is 098144171 as described in claim 4, Form No. 1010101, page 11/I5 buy 0982075560-0 201124065, the first heat sink fin group An air inlet is disposed at a center of the bottom plate, and the air inlet is perpendicular to the air outlet. The centrifugal fan draws airflow from the air passage of the first heat dissipation fin group through the air inlet. 098144171 Form No. A0101 Page 12 of 15 Ο ❹ 0982075560-0