TW201312328A - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- TW201312328A TW201312328A TW100132355A TW100132355A TW201312328A TW 201312328 A TW201312328 A TW 201312328A TW 100132355 A TW100132355 A TW 100132355A TW 100132355 A TW100132355 A TW 100132355A TW 201312328 A TW201312328 A TW 201312328A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat sink
- fan
- slit
- air outlet
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
本發明涉及一種散熱裝置，特別涉及一種適用於發熱電子元件散熱的散熱裝置。The invention relates to a heat dissipating device, in particular to a heat dissipating device suitable for dissipating heat of a heat-generating electronic component.
隨著電子產業的飛速發展，電子元件（如中央處理器）運行速度的不斷提升，運行時產生大量的熱量，使其本身及系統溫度升高，繼而影響其系統的穩定性。為確保電子元件能正常運行，通常在其上安裝一散熱裝置，排出其所產生的熱量。With the rapid development of the electronics industry, electronic components (such as central processing units) continue to increase in speed, generate a large amount of heat during operation, and increase the temperature of the system itself, which in turn affects the stability of the system. In order to ensure the normal operation of the electronic components, a heat sink is usually mounted thereon to discharge the heat generated by the components.
習知的散熱裝置通常包括一散熱器，並於該散熱器的一側設置一散熱風扇，通過該散熱風扇由外界吸入氣流並吹向散熱器以將其熱量帶走。然而，散熱風扇由外界吸入的氣流中往往會帶有大量的粉塵，且由於散熱風扇吹出的冷卻氣流的強度不等，從而使粉塵集中於由冷卻氣流強的區域開始被散熱風扇吹向散熱器，導致散熱器於靠近散熱風扇的一側被粉塵堆積而影響其散熱性能。Conventional heat sinks generally include a heat sink, and a heat dissipating fan is disposed on one side of the heat sink, through which the airflow is drawn from the outside and blown toward the heat sink to carry away the heat. However, the airflow from the outside of the cooling fan tends to carry a large amount of dust, and the intensity of the cooling airflow blown by the cooling fan is not equal, so that the dust is concentrated in the area where the cooling airflow is strong and is blown to the radiator by the cooling fan. As a result, the heat sink is accumulated on the side close to the heat dissipation fan to affect the heat dissipation performance.
有鑒於此，有必要提供一種可防止粉塵堆積的散熱裝置。In view of this, it is necessary to provide a heat sink that prevents dust from accumulating.
一種散熱裝置，包括散熱器及設於該散熱器一側的散熱風扇，該散熱風扇對應散熱器設有一出風口，該散熱風扇於出風口處具有至少一強風區及弱風區，所述散熱器包括靠近散熱風扇的入風面及遠離散熱風扇的出風面，所述散熱器由複數散熱片排列而成，每相鄰兩散熱片間形成氣流通道，所述散熱器設有對應強風區的切口，所述切口由散熱器最外側的散熱片向內側開設，所述切口由入風面向出風面的方向延伸，所述散熱風扇由出風口吹出的氣流中帶有的粉塵通過所述切口流至散熱器的外部。A heat dissipating device includes a heat sink and a heat dissipating fan disposed on a side of the heat dissipating fan, wherein the heat dissipating fan is provided with an air outlet corresponding to the heat sink, and the heat dissipating fan has at least one strong wind zone and a weak wind zone at the air outlet, the heat dissipating The air blower includes an air inlet surface adjacent to the heat dissipation fan and an air outlet surface away from the heat dissipation fan. The heat sink is formed by a plurality of heat sinks, and an air flow passage is formed between each adjacent two heat sinks, and the heat sink is provided with a corresponding strong wind zone. a slit extending from the outermost fin of the heat sink to the inner side, the slit extending from the windward direction facing the windward surface, and the dust carried by the air blower from the air outlet through the air outlet passes through The slit flows to the outside of the heat sink.
一種散熱裝置，包括散熱器、設於該散熱器一側的散熱風扇及與散熱器連接的熱管，該散熱風扇對應散熱器設有一出風口，該散熱風扇於出風口處具有至少一強風區及弱風區，所述散熱器包括靠近散熱風扇的入風面及遠離散熱風扇的出風面，所述散熱器由複數散熱片排列而成，每相鄰兩散熱片間形成氣流通道，所述散熱器設有一收容熱管的收容槽，所述收容槽由入風面向內凹進，所述散熱器設有對應強風區的切口，所述切口由散熱器最外側的散熱片向內側開設並位於收容槽的下方，所述切口由入風面向出風面的方向延伸，所述散熱風扇由出風口吹出的氣流中帶有的粉塵通過所述切口流至散熱器的外部。A heat dissipating device includes a heat sink, a heat dissipating fan disposed on one side of the heat sink, and a heat pipe connected to the heat sink, wherein the heat dissipating fan is provided with an air outlet corresponding to the heat sink, and the heat dissipating fan has at least one strong wind area at the air outlet and In the weak wind zone, the heat sink includes an air inlet surface adjacent to the heat dissipation fan and an air outlet surface away from the heat dissipation fan, wherein the heat sink is formed by a plurality of heat sinks, and an air flow passage is formed between each adjacent two heat sinks. The heat sink is provided with a receiving groove for accommodating the heat pipe, the receiving groove is recessed by the wind inward direction, and the heat sink is provided with a slit corresponding to the strong wind zone, and the slit is opened and located on the inner side of the heat sink of the outermost side of the heat sink. Below the receiving groove, the slit extends in a direction in which the wind inlet faces the wind surface, and the dust contained in the airflow blown by the air outlet through the air outlet flows through the slit to the outside of the heat sink.
與習知技術相比，該散熱裝置中的散熱風扇由出風口吹出的氣流中帶有的粉塵通過所述切口流至散熱器的外部，從而使防止粉塵於散熱器上的堆積而影響散熱性能。Compared with the prior art, the heat radiating fan in the heat dissipating fan flows the dust in the airflow blown out by the air outlet through the slit to the outside of the heat sink, thereby preventing the accumulation of dust on the heat sink and affecting the heat dissipation performance. .
如圖1所示，該散熱裝置100包括第一吸熱板10、第二吸熱板20、散熱器30、連接於第一吸熱板10與散熱器30之間的第一熱管60、連接於第二吸熱板20與散熱器30之間的第二熱管70及設於該散熱器30一側的散熱風扇80。As shown in FIG. 1 , the heat sink 100 includes a first heat absorbing plate 10 , a second heat absorbing plate 20 , a heat sink 30 , a first heat pipe 60 connected between the first heat absorbing plate 10 and the heat sink 30 , and a second heat pipe 60 . A second heat pipe 70 between the heat absorbing plate 20 and the heat sink 30 and a heat radiating fan 80 provided on the heat sink 30 side.
請同時參閱圖2，所述第一吸熱板10及第二吸熱板20均由銅等導熱性能良好的金屬製成，其下表面分別用於與一電子元件連接以吸收該電子元件所產生的熱量。2, the first heat absorbing plate 10 and the second heat absorbing plate 20 are made of a metal having good thermal conductivity such as copper, and the lower surface thereof is respectively connected to an electronic component to absorb the electronic component. Heat.
所述第一熱管60的一端及第二熱管70的一端分別與第一吸熱板10及第二吸熱板20連接，另一端與散熱器30連接，以將不同的電子元件所產生的熱量傳導至散熱器30上，再通過該散熱器30向外散發。One end of the first heat pipe 60 and one end of the second heat pipe 70 are respectively connected to the first heat absorbing plate 10 and the second heat absorbing plate 20, and the other end is connected to the heat sink 30 to conduct heat generated by different electronic components to The heat sink 30 is then radiated outward through the heat sink 30.
該散熱器30大致為方塊狀，該散熱器30於靠近散熱風扇80的一側面為入風面32，遠離該散熱風扇80的一側面為出風面33。該散熱器30上設有一收容槽31，以用於收容第一熱管60及第二熱管70。該收容槽31由散熱器30的入風面32中部向內凹進形成。請同時參閱圖3，該散熱器30包括並排設置的一第一散熱鰭片組40及兩第二散熱鰭片組50，且兩第二散熱鰭片組50分別位於第一散熱鰭片組40的相對兩側端。The heat sink 30 has a substantially square shape. The heat sink 30 is an air inlet surface 32 on a side of the heat dissipation fan 80 , and an air outlet surface 33 away from a side surface of the heat dissipation fan 80 . The heat sink 30 is provided with a receiving slot 31 for receiving the first heat pipe 60 and the second heat pipe 70. The receiving groove 31 is formed by inwardly recessing the central portion of the air inlet surface 32 of the heat sink 30. As shown in FIG. 3 , the heat sink 30 includes a first heat sink fin set 40 and two second heat sink fin sets 50 , and the second heat sink fin sets 50 are respectively located on the first heat sink fin set 40 . The opposite sides.
每一第一散熱鰭片組40由複數第一散熱片42排列而成，每相鄰的兩第一散熱片42間形成一第一氣流通道43。每一第一散熱片42包括一本體420及由本體420的相對兩側彎折延伸形成的折邊422。Each of the first heat dissipation fin sets 40 is formed by a plurality of first heat dissipation fins 42 , and a first air flow passage 43 is formed between each adjacent two first heat dissipation fins 42 . Each of the first fins 42 includes a body 420 and a flange 422 formed by bending and extending from opposite sides of the body 420.
所述第二散熱鰭片組50由複數第二散熱片52排列而成，每相鄰的兩第二散熱片52間形成一第二氣流通道53。每一第二散熱片52的結構與第一散熱片42的結構大體相同，其包括一本體520及由本體520的相對兩側彎折延伸形成的折邊522。每一第二散熱片52的結構與第一散熱片42的結構不同之處在於：每一第二散熱片52的本體520於入風面32的一側短於第一散熱片42，且所述本體520的頂端於靠近入風面32的一側向入風面32的方向延伸形成一延伸部523，所述延伸部523於入風面32的一端與第一散熱片42於入風面32的一端相平齊。組裝時，各第一散熱片42的折邊422及第二散熱片52的折邊522與其相鄰的本體420、520相抵靠，並通過折邊422、522上設有相互配合的卡扣結構（圖未示）而固定連接。由於第二散熱片52的本體520於入風面32的一側短於第一散熱片42的本體420，且本體520延伸有延伸部523，從而於各第二散熱鰭片組的底端形成一切口54，所述切口54由本體520與延伸部523圍成。所述切口54大致為方塊狀，所述切口54由第二散熱鰭片組50最外側的第二散熱片52向內側開設，並貫穿所有第二散熱片52。所述切口54開設於收容槽31的下方並與收容槽31相連通。所述切口54由散熱器30的入風面32向出風面33的方向延伸，所述第二氣流通道53連接設於切口54與出風面33之間。The second heat dissipation fin group 50 is formed by a plurality of second heat dissipation fins 52 , and a second air flow passage 53 is formed between each adjacent two second heat dissipation fins 52 . The structure of each of the second heat sinks 52 is substantially the same as that of the first heat sinks 42 . The structure includes a body 520 and a flange 522 formed by bending and extending from opposite sides of the body 520 . The structure of each second heat sink 52 is different from that of the first heat sink 42 in that the body 520 of each second heat sink 52 is shorter than the first heat sink 42 on one side of the air inlet surface 32, and The top end of the main body 520 extends toward the air inlet surface 32 to form an extending portion 523 at one end of the air inlet surface 32 and the first heat sink 42 on the air inlet surface. One end of 32 is flush. During assembly, the folded edge 422 of each first heat sink 42 and the folded edge 522 of the second heat sink 52 abut against the adjacent bodies 420, 520, and are provided with interlocking snap structures on the flanges 422, 522. (not shown) and fixedly connected. The body 520 of the second heat sink 52 is shorter than the body 420 of the first heat sink 42 on the side of the air inlet surface 32, and the body 520 extends with an extension portion 523 to form a bottom end of each of the second heat dissipation fin sets. A slit 54 is defined by the body 520 and the extension 523. The slits 54 are substantially in the shape of a square, and the slits 54 are opened inwardly by the second fins 52 on the outermost side of the second fin group 50 and penetrate through all the second fins 52. The slit 54 is opened below the receiving groove 31 and communicates with the receiving groove 31. The slit 54 extends from the air inlet surface 32 of the heat sink 30 toward the wind surface 33, and the second air flow passage 53 is connected between the slit 54 and the wind surface 33.
該散熱風扇80為一離心風扇，其包括一底座81及收容於該底座81內的一葉輪82及蓋設於該底座81上的一蓋板83。該底座81包括一底板84及由底板84周緣向上延伸形成的一側壁85。該底板84及蓋板83上分別設有一入風口86，所述側壁85為一渦形壁，其對應散熱器30的一側開設一出風口87。該側壁85上還設有一向內突出的舌部88。請同時參閱圖4，使用時，所述葉輪82旋轉帶動外界氣流由入風口86進入後由出風口87吹出，該吹出的氣流於出風口87處的兩側分別形成一強風區89，於出風口87的中間形成一弱風區90。所述散熱器30的第二散熱鰭片組50對應於強風區89，第一散熱鰭片組40對應於弱風區90，由於第二散熱鰭片組50上設有切口54，從而使散熱風扇80由外界吸入的氣流中所帶有的粉塵由切口54流出，防止粉塵於散熱器30的入風面32堆積而影響散熱裝置100的性能。由於切口54僅設於散熱器30的底端，從而既可以保證由入風口86吸入的粉塵由切口54處流出，又能保證散熱風扇80吹出的強氣流由切口54上方的第二氣流通道53的導引流過散熱器30。另外，由於切口54未延伸至散熱器30的出風面33，從而使散熱器30於出風面33仍保持習知的散熱器的結構，可防止外界的雜物由散熱器30的出風面33進入到散熱器30內而影響散熱裝置的性能。The cooling fan 80 is a centrifugal fan, and includes a base 81 and an impeller 82 received in the base 81 and a cover 83 disposed on the base 81. The base 81 includes a bottom plate 84 and a side wall 85 extending upward from the periphery of the bottom plate 84. An air inlet 86 is defined in the bottom plate 84 and the cover plate 83. The side wall 85 is a scroll wall, and an air outlet 87 is defined on a side corresponding to the heat sink 30. The side wall 85 is also provided with an inwardly projecting tongue 88. Referring to FIG. 4 at the same time, in use, the impeller 82 rotates to drive the external airflow to enter the air inlet 86, and then is blown out by the air outlet 87. The blown airflow forms a strong wind zone 89 on both sides of the air outlet 87, respectively. A weak wind zone 90 is formed in the middle of the tuyere 87. The second heat dissipation fin group 50 of the heat sink 30 corresponds to the strong wind region 89, and the first heat dissipation fin group 40 corresponds to the weak wind region 90. Since the second heat dissipation fin group 50 is provided with the slit 54 to dissipate heat. The dust contained in the airflow sucked by the outside of the fan 80 flows out of the slit 54 to prevent the dust from accumulating on the air inlet surface 32 of the radiator 30 to affect the performance of the heat sink 100. Since the slit 54 is provided only at the bottom end of the heat sink 30, it is ensured that the dust sucked by the air inlet 86 is discharged from the slit 54 and the strong air current blown by the heat radiating fan 80 is ensured by the second air flow passage 53 above the slit 54. The guide flows through the heat sink 30. In addition, since the slit 54 does not extend to the air outlet surface 33 of the heat sink 30, the heat sink 30 maintains the structure of the conventional heat sink on the air outlet surface 33, thereby preventing external air bubbles from being blown out by the heat sink 30. Face 33 enters heat sink 30 and affects the performance of the heat sink.
具體實施時，該散熱器30及散熱風扇80的結構不限於本實施例的情況，如散熱風扇80上可以不設有舌部88，從而散熱風扇80只有一個強風區89，即強風區89及弱風區90分別位於散熱風扇80於出風口87處的相對兩側，同時，散熱器30的結構亦對應的改變，即只包含一個第二散熱鰭片組50對應該強風區89設置，弱風區90對應設有第一散熱鰭片組40。In the specific implementation, the structure of the heat sink 30 and the heat dissipation fan 80 is not limited to the case of the embodiment. For example, the heat dissipation fan 80 may not have the tongue 88, so that the heat dissipation fan 80 has only one strong wind zone 89, that is, the strong wind zone 89 and The weak wind zones 90 are respectively located on opposite sides of the heat dissipation fan 80 at the air outlet 87. At the same time, the structure of the heat sink 30 is correspondingly changed, that is, only one second heat sink fin group 50 is disposed corresponding to the strong wind zone 89, which is weak. The wind zone 90 is correspondingly provided with a first heat dissipation fin set 40.
可以理解的是，對於本領域的普通技術人員來說，可以根據本發明的技術構思做出其他各種像應的改變與變形，而所有這些改變與變形都應屬於本發明權利要求的保護範圍。It is to be understood that those skilled in the art can make various changes and modifications of the various embodiments in accordance with the present invention, and all such changes and modifications are intended to fall within the scope of the appended claims.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
100．．．散熱裝置100. . . Heat sink
10．．．第一吸熱板10. . . First heat absorbing plate
20．．．第二吸熱板20. . . Second heat absorbing plate
30．．．散熱器30. . . heat sink
31．．．收容槽31. . . Storage slot
32．．．入風面32. . . Wind inlet
33．．．出風面33. . . Wind face
40．．．第一散熱鰭片組40. . . First heat sink fin set
42．．．第一散熱片42. . . First heat sink
43．．．第一氣流通道43. . . First air channel
50．．．第二散熱鰭片組50. . . Second heat sink fin set
52．．．第二散熱片52. . . Second heat sink
53．．．第二氣流通道53. . . Second air channel
54．．．切口54. . . incision
60．．．第一熱管60. . . First heat pipe
70．．．第二熱管70. . . Second heat pipe
80．．．散熱風扇80. . . Cooling fan
81．．．底座81. . . Base
82．．．葉輪82. . . impeller
83．．．蓋板83. . . Cover
84．．．底板84. . . Bottom plate
85．．．側壁85. . . Side wall
86．．．入風口86. . . Air inlet
87．．．出風口87. . . Air outlet
88．．．舌部88. . . Tongue
89．．．強風區89. . . Strong wind zone
90．．．弱風區90. . . Weak wind zone
420、520．．．本體420, 520. . . Ontology
422、522．．．折邊422, 522. . . Folding
523．．．延伸部523. . . Extension
圖1本發明散熱裝置的一實施例的立體組裝圖。1 is a perspective assembled view of an embodiment of a heat sink of the present invention.
圖2為圖1所示散熱裝置的分解圖。Figure 2 is an exploded view of the heat sink of Figure 1.
圖3為圖2所示散熱裝置的散熱器的倒置圖。3 is an inverted view of the heat sink of the heat sink shown in FIG. 2.
圖4為圖1所示散熱裝置去除吸熱板及熱管後的流場示意圖。4 is a schematic view of a flow field after the heat sink of FIG. 1 removes the heat absorbing plate and the heat pipe.
10．．．第一吸熱板10. . . First heat absorbing plate
20．．．第二吸熱板20. . . Second heat absorbing plate
30．．．散熱器30. . . heat sink
31．．．收容槽31. . . Storage slot
32．．．入風面32. . . Wind inlet
33．．．出風面33. . . Wind face
54．．．切口54. . . incision
60．．．第一熱管60. . . First heat pipe
70．．．第二熱管70. . . Second heat pipe
81．．．底座81. . . Base
82．．．葉輪82. . . impeller
83．．．蓋板83. . . Cover
84．．．底板84. . . Bottom plate
85．．．側壁85. . . Side wall
86．．．入風口86. . . Air inlet
87．．．出風口87. . . Air outlet
88．．．舌部88. . . Tongue
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110260210.0A CN102984915B (en) | 2011-09-05 | 2011-09-05 | Heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201312328A true TW201312328A (en) | 2013-03-16 |
| TWI510896B TWI510896B (en) | 2015-12-01 |
Family
ID=47752225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100132355A TWI510896B (en) | 2011-09-05 | 2011-09-08 | Heat dissipation device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20130056182A1 (en) |
| CN (1) | CN102984915B (en) |
| TW (1) | TWI510896B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI576038B (en) * | 2011-07-13 | 2017-03-21 | 鴻準精密工業股份有限公司 | Heat sink |
| CN104214747B (en) * | 2013-05-29 | 2017-06-23 | 深圳市海洋王照明工程有限公司 | Radiator |
| TWM525399U (en) | 2015-11-27 | 2016-07-11 | 宏碁股份有限公司 | Fan module and electronic device |
| CN107023517B (en) * | 2016-02-02 | 2019-02-01 | 宏碁股份有限公司 | Blower module and electronic device |
| CN108398993B (en) * | 2018-04-28 | 2023-12-05 | 中科寒武纪科技股份有限公司 | Heat dissipation device |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2741097Y (en) * | 2004-09-30 | 2005-11-16 | 仁宝电脑工业股份有限公司 | Radiator with dust-collecting mechanism |
| CN101242723A (en) * | 2007-02-09 | 2008-08-13 | 富准精密工业(深圳)有限公司 | Spring slice fixing structure and heat radiation module |
| TW200905457A (en) * | 2007-07-30 | 2009-02-01 | Inventec Corp | Heat-dissipating module |
| CN101370370B (en) * | 2007-08-17 | 2011-11-09 | 富准精密工业(深圳)有限公司 | Heat radiation module |
| JP2009076708A (en) * | 2007-09-21 | 2009-04-09 | Hitachi Ltd | Air cooling device |
| JP4929214B2 (en) * | 2008-03-25 | 2012-05-09 | 株式会社東芝 | Cooling device and electronic apparatus having cooling device |
| JP3143316U (en) * | 2008-05-07 | 2008-07-17 | 葉嘉銘 | Heat dissipation module |
| CN101621902B (en) * | 2008-07-04 | 2011-09-28 | 富准精密工业(深圳)有限公司 | Fixing device and heat sink using same |
| CN101853823B (en) * | 2009-03-31 | 2013-01-23 | 富准精密工业(深圳)有限公司 | Heat sink and manufacturing method thereof |
| CN101861076A (en) * | 2009-04-08 | 2010-10-13 | 鸿富锦精密工业（深圳）有限公司 | Heat radiating device |
| CN101861079A (en) * | 2009-04-10 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN101861078A (en) * | 2009-04-10 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Heat sink and manufacturing method thereof |
| CN102238846A (en) * | 2010-04-27 | 2011-11-09 | 富准精密工业(深圳)有限公司 | Radiating device |
| JP2011233849A (en) * | 2010-04-30 | 2011-11-17 | Sony Corp | Cooling device, electronics and heat sink |
| TWI536899B (en) * | 2011-05-16 | 2016-06-01 | 鴻準精密工業股份有限公司 | Heat dissipation device and electronic device having the same |
-
2011
- 2011-09-05 CN CN201110260210.0A patent/CN102984915B/en not_active Expired - Fee Related
- 2011-09-08 TW TW100132355A patent/TWI510896B/en not_active IP Right Cessation
-
2012
- 2012-04-26 US US13/456,240 patent/US20130056182A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN102984915A (en) | 2013-03-20 |
| TWI510896B (en) | 2015-12-01 |
| CN102984915B (en) | 2016-11-23 |
| US20130056182A1 (en) | 2013-03-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI463939B (en) | Electronic device | |
| TWI513400B (en) | Heat dissipation device | |
| US7561417B2 (en) | Thermal module and fin assembly thereof | |
| US7363963B2 (en) | Heat dissipation device | |
| US8023265B2 (en) | Heat dissipation device and centrifugal fan thereof | |
| US7986521B2 (en) | Heat dissipation device and computer using same | |
| US8011423B2 (en) | Heat sink with a centrifugal fan having vertically layered fins | |
| TWI510896B (en) | Heat dissipation device | |
| TWI535989B (en) | Heat dissipation device and electronic device having the same | |
| TW201314053A (en) | Electronic device and heat dissipation module and centrifugal blower thereof | |
| US8562291B2 (en) | Heat dissipation device and centrifugal fan thereof | |
| KR20170057018A (en) | Dehumidifying module using thermoeletric element and dehumidifyer having the same | |
| US20120175079A1 (en) | Heat dissipation device having centrifugal fan | |
| US20140218864A1 (en) | Electronic device with cooling assembly | |
| US9010406B2 (en) | Heat dissipation module | |
| US10067544B2 (en) | Heat dissipating module | |
| EP3349555B1 (en) | Electronic apparatus | |
| WO2016086855A2 (en) | Electronic terminal device | |
| US20110042043A1 (en) | Heat dissipation module | |
| TW201416822A (en) | Heat dissipation apparatus assembly | |
| CN111212544A (en) | Electronic device | |
| US20110073283A1 (en) | Heat dissipation device | |
| TWI465009B (en) | Heat dissipation device and centrifugal fan thereof | |
| TWI501719B (en) | Heat dissipation device | |
| WO2020031327A1 (en) | Outdoor unit and air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |