US20100059210A1 - Fan impeller and heat dissipating device having the same - Google Patents
Fan impeller and heat dissipating device having the same Download PDFInfo
- Publication number
- US20100059210A1 US20100059210A1 US12/399,031 US39903109A US2010059210A1 US 20100059210 A1 US20100059210 A1 US 20100059210A1 US 39903109 A US39903109 A US 39903109A US 2010059210 A1 US2010059210 A1 US 2010059210A1
- Authority
- US
- United States
- Prior art keywords
- hub
- blades
- air outlet
- subsidiary
- air inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/26—Rotors specially for elastic fluids
- F04D29/32—Rotors specially for elastic fluids for axial flow pumps
- F04D29/38—Blades
Definitions
- the disclosure relates to a heat dissipating device, and particularly to an electric fan having an improved fan impeller and a heat dissipation device having such a fan impeller.
- a heat-generating electric component such as CPU (central processing unit) is generating more and more heat which requires immediate dissipation.
- a heat sink is thermally attached to the CPU, and an electric fan is mounted on the heat sink for providing an airflow to cool the CPU.
- a typical electric fan includes a fan impeller having a cylindrical-shaped sidewall and a plurality of blades extending radially from the sidewall of the fan impeller.
- a bottom wall of the fan impeller facing the heat sink is flat and is perpendicular to the sidewall.
- the bottom wall of the fan impeller prevents the airflow from flowing to a center of the heat sink just under the fan impeller of the electric fan.
- FIG. 6 shows a flow field 92 of the airflow produced by a typical electric fan simulated by a computational fluid dynamics (CFD) software.
- the flow field 92 includes a central dark region through which almost no air flows and a surrounding bright region through which a strong air flows.
- FIG. 1 is an isometric, exploded view of a heat dissipating device, according to a first embodiment.
- FIG. 2 is an isometric view of a fan impeller of the heat dissipating device of FIG. 1 .
- FIG. 3 is a plan view of the fan impeller of FIG. 2 .
- FIG. 4 is an isometric view of the fan impeller of FIG. 2 , but viewed from another aspect.
- FIG. 5 is a view of an airflow field of the fan impeller of FIG. 2 simulated by a computational fluid dynamics software.
- FIG. 6 is a view of an airflow field of a prior fan impeller simulated by a computational fluid dynamics software.
- a heat dissipating device 10 according to a first embodiment is shown.
- the heat dissipating device 10 is assembled to a heat source (not shown), such as a CPU, for dissipating heat of the heat source.
- the heat dissipating device 10 includes a heat sink 4 , an electric fan 1 , two fixing members 7 for fixing the electric fan 1 onto the heat sink 4 , and two heat pipes 8 .
- the electric fan 1 is mounted on the heat sink 4 and generates an airflow flowing through the heat sink 4 to take away heat from the heat sink 4 .
- the heat sink 4 includes a base plate 6 and a heat dissipating body 5 located on the base plate 6 .
- the base plate 6 defines two first receiving grooves 61 in an upper surface 62 thereof.
- the two first receiving grooves 61 are semi-circular.
- a bottom surface 63 of the base plate 6 is used for thermally contacting with a heat source such as a CPU for absorbing heat therefrom.
- the heat dissipating body 5 includes a plurality of parallel fins 51 spaced from each other. Two adjacent fins 51 define an airflow channel therebetween.
- Two second receiving grooves 55 are defined at a bottom portion 54 of the heat dissipating body 5 corresponding to the two first receiving grooves 61 , respectively.
- the two second receiving grooves 55 are semi-circular.
- Each first receiving groove 61 and a corresponding second receiving groove 55 cooperatively define a circular receiving channel.
- the heat dissipating body 5 defines an elongated groove 53 through a middle of a top portion 56 thereof.
- the groove 53 is perpendicular to each of the fins 51 .
- Two holes 52 are defined in the heat dissipating body 5 and symmetrically located at two opposite sides of the groove 53 .
- Each heat pipe 8 is U-shaped and includes a condenser section 81 and an evaporator section 82 .
- the condenser section 81 of each heat pipe 8 is received in one of the two holes 52 .
- the evaporator section 82 of each heat pipe 8 is received in one of the two receiving channels.
- the two fixing members 7 are symmetrically mounted on a top of the heat dissipating body 5 .
- the electric fan 1 is fixed onto the fixing members 7 by screws (not shown).
- the electric fan 1 includes a fan bracket 2 and a fan impeller 3 received in the fan bracket 2 .
- the fan impeller 3 includes a hub 31 , a plurality of main blades 32 and subsidiary air-guiding blades 33 extending radially and outwardly from an outer circumferential surface of the hub 31 .
- the hub 31 is bowl-shaped and includes a bottom wall 317 and a sidewall 314 extending upwardly and outwardly from the bottom wall 317 .
- An air inlet 311 is formed at a top side of the fan bracket 2 and an air outlet 312 is formed at a bottom side of the fan bracket 2 .
- the air outlet 312 is provided adjacent to and faces the heat sink 4 .
- the bottom wall 317 of the hub 31 is located at the air outlet 312 .
- the sidewall 314 tapers from the air inlet 311 towards the air outlet 312 . Accordingly, an outer diameter of the hub 31 gradually decreases along an axial direction from the air inlet 311 towards the air outlet 312 .
- the hub 31 defines a receiving space 313 adjacent to the air inlet 311 .
- An inner surface 315 of the hub 31 surrounds the receiving space 311 .
- a diameter of the receiving space 313 defined by the inner surface 315 decreases along the axial direction from the air inlet 311 towards the air outlet 312 .
- Each main blade 32 has a connecting side edge 34 on the sidewall 314 , and the connecting side edge 34 is extended from the sidewall 314 of the hub 31 at the air inlet 311 towards a center of the hub 31 at the air outlet 312 .
- Each subsidiary air-guiding blades 33 is located between two adjacent main blades 32 .
- Each subsidiary air-guiding blades 33 has a much smaller radial length (i.e., height) than each main blade 32 .
- a radial length of the subsidiary air-guiding blades 33 decreases along the axial direction from the air inlet 311 towards the air outlet 312 .
- the subsidiary air-guiding blades 33 has a connecting side edge 35 on the sidewall 314 , and the connecting side edge 35 is extended from the sidewall 314 of the hub 31 towards a center of the hub 31 at the air outlet 312 .
- the connecting side edge 34 of the main blade 32 has a greater axial length than the connecting side edge 35 of the subsidiary air-guiding blades 33 .
- the main blade 32 has a much greater radial length than the subsidiary air-guiding blades 33 .
- the main blades 32 and the air-guiding blades 33 cooperatively drive the airflow to a center of the hub 31 at the air outlet 312 when the fan impeller 3 is rotated.
- FIG. 5 shows a flow field 91 of the airflow produced by the fan impeller 3 simulated by a computational fluid dynamics software.
- the flow field 91 includes a central dark region through which almost no air flows and a surrounding bright region through which a strong air flows.
- the dark region of the flow field 91 is smaller and more uniform than the dark region of the flow field 92 generated by the conventional fan impeller of FIG. 6 .
- the fan impeller 3 rotates, the airflow flows from the air inlet 311 towards the heat sink 4 . Due to the diameter of the outer circumference of the hub 31 decreasing along a direction from the air inlet 311 towards the air outlet 312 , more airflow can flow to the center of the air outlet 312 .
- the main blades 32 and the air-guiding blades 33 can drive more air of the airflow to flow to the center of the air outlet 312 . Therefore, an amount of the air of the airflow driven by the fan impeller 3 to the center of the heat sink 4 is increased.
- the hub 31 occupies a smaller space than a conventional hub.
- the main blades 32 can have a relatively larger size. Accordingly, the amount of airflow generated by the main blades 32 is increased in comparison with the prior art.
Abstract
Description
- Relevant subject matter is disclosed in co-pending U.S. patent application Ser. No. 12/325,281 filed on Dec. 1, 2008 and entitled “FAN IMPELLER AND HEAT DISSIPATING DEVICE INCORPORATING THE SAME”. The co-pending U.S. patent application is assigned to the same assignee as the instant application. The disclosure of the above-identified co-pending application is incorporated herein by reference.
- 1. Technical Field
- The disclosure relates to a heat dissipating device, and particularly to an electric fan having an improved fan impeller and a heat dissipation device having such a fan impeller.
- 2. Description of Related Art
- With continuing development of electronic technology, a heat-generating electric component such as CPU (central processing unit) is generating more and more heat which requires immediate dissipation. Generally, a heat sink is thermally attached to the CPU, and an electric fan is mounted on the heat sink for providing an airflow to cool the CPU.
- A typical electric fan includes a fan impeller having a cylindrical-shaped sidewall and a plurality of blades extending radially from the sidewall of the fan impeller. A bottom wall of the fan impeller facing the heat sink is flat and is perpendicular to the sidewall. When the blades rotate to generate an airflow flowing to the heat sink, the bottom wall of the fan impeller prevents the airflow from flowing to a center of the heat sink just under the fan impeller of the electric fan.
FIG. 6 shows aflow field 92 of the airflow produced by a typical electric fan simulated by a computational fluid dynamics (CFD) software. Theflow field 92 includes a central dark region through which almost no air flows and a surrounding bright region through which a strong air flows. It is found that most of the airflow flows out from a circumference of the impeller and an amount of the airflow at the center of the heat sink is approximately zero. However, the center of the heat sink is usually attached to the heat-generating electric component and has more heat than other portion of the heat sink. Thus, the airflow provided by the typical electric fan cannot efficiently dissipate heat of the heat sink absorbed from the heat-generating electric component. - Therefore, a heat dissipation device having an improved fan impeller is desired to overcome the above describe shortcomings.
-
FIG. 1 is an isometric, exploded view of a heat dissipating device, according to a first embodiment. -
FIG. 2 is an isometric view of a fan impeller of the heat dissipating device ofFIG. 1 . -
FIG. 3 is a plan view of the fan impeller ofFIG. 2 . -
FIG. 4 is an isometric view of the fan impeller ofFIG. 2 , but viewed from another aspect. -
FIG. 5 is a view of an airflow field of the fan impeller ofFIG. 2 simulated by a computational fluid dynamics software. -
FIG. 6 is a view of an airflow field of a prior fan impeller simulated by a computational fluid dynamics software. - Referring to
FIG. 1 , aheat dissipating device 10 according to a first embodiment is shown. Theheat dissipating device 10 is assembled to a heat source (not shown), such as a CPU, for dissipating heat of the heat source. Theheat dissipating device 10 includes aheat sink 4, anelectric fan 1, twofixing members 7 for fixing theelectric fan 1 onto theheat sink 4, and twoheat pipes 8. Theelectric fan 1 is mounted on theheat sink 4 and generates an airflow flowing through theheat sink 4 to take away heat from theheat sink 4. - The
heat sink 4 includes a base plate 6 and a heat dissipating body 5 located on the base plate 6. The base plate 6 defines twofirst receiving grooves 61 in anupper surface 62 thereof. The two first receivinggrooves 61 are semi-circular. Abottom surface 63 of the base plate 6 is used for thermally contacting with a heat source such as a CPU for absorbing heat therefrom. The heat dissipating body 5 includes a plurality ofparallel fins 51 spaced from each other. Twoadjacent fins 51 define an airflow channel therebetween. Twosecond receiving grooves 55 are defined at abottom portion 54 of the heat dissipating body 5 corresponding to the two first receivinggrooves 61, respectively. The twosecond receiving grooves 55 are semi-circular. Each first receivinggroove 61 and a correspondingsecond receiving groove 55 cooperatively define a circular receiving channel. The heat dissipating body 5 defines anelongated groove 53 through a middle of atop portion 56 thereof. Thegroove 53 is perpendicular to each of thefins 51. Twoholes 52 are defined in the heat dissipating body 5 and symmetrically located at two opposite sides of thegroove 53. Eachheat pipe 8 is U-shaped and includes acondenser section 81 and anevaporator section 82. Thecondenser section 81 of eachheat pipe 8 is received in one of the twoholes 52. Theevaporator section 82 of eachheat pipe 8 is received in one of the two receiving channels. The twofixing members 7 are symmetrically mounted on a top of the heat dissipating body 5. Theelectric fan 1 is fixed onto thefixing members 7 by screws (not shown). - Referring also to
FIGS. 2-4 , theelectric fan 1 includes a fan bracket 2 and afan impeller 3 received in the fan bracket 2. Thefan impeller 3 includes ahub 31, a plurality ofmain blades 32 and subsidiary air-guidingblades 33 extending radially and outwardly from an outer circumferential surface of thehub 31. Thehub 31 is bowl-shaped and includes abottom wall 317 and asidewall 314 extending upwardly and outwardly from thebottom wall 317. Anair inlet 311 is formed at a top side of the fan bracket 2 and anair outlet 312 is formed at a bottom side of the fan bracket 2. Theair outlet 312 is provided adjacent to and faces theheat sink 4. Thebottom wall 317 of thehub 31 is located at theair outlet 312. Thesidewall 314 tapers from theair inlet 311 towards theair outlet 312. Accordingly, an outer diameter of thehub 31 gradually decreases along an axial direction from theair inlet 311 towards theair outlet 312. Thehub 31 defines areceiving space 313 adjacent to theair inlet 311. Aninner surface 315 of thehub 31 surrounds thereceiving space 311. A diameter of thereceiving space 313 defined by theinner surface 315 decreases along the axial direction from theair inlet 311 towards theair outlet 312. Eachmain blade 32 has a connectingside edge 34 on thesidewall 314, and the connectingside edge 34 is extended from thesidewall 314 of thehub 31 at theair inlet 311 towards a center of thehub 31 at theair outlet 312. Each subsidiary air-guidingblades 33 is located between two adjacentmain blades 32. Each subsidiary air-guidingblades 33 has a much smaller radial length (i.e., height) than eachmain blade 32. A radial length of the subsidiary air-guidingblades 33 decreases along the axial direction from theair inlet 311 towards theair outlet 312. The subsidiary air-guidingblades 33 has a connectingside edge 35 on thesidewall 314, and the connectingside edge 35 is extended from thesidewall 314 of thehub 31 towards a center of thehub 31 at theair outlet 312. The connectingside edge 34 of themain blade 32 has a greater axial length than the connectingside edge 35 of the subsidiary air-guidingblades 33. Themain blade 32 has a much greater radial length than the subsidiary air-guidingblades 33. Themain blades 32 and the air-guidingblades 33 cooperatively drive the airflow to a center of thehub 31 at theair outlet 312 when thefan impeller 3 is rotated. -
FIG. 5 shows aflow field 91 of the airflow produced by thefan impeller 3 simulated by a computational fluid dynamics software. Theflow field 91 includes a central dark region through which almost no air flows and a surrounding bright region through which a strong air flows. The dark region of theflow field 91 is smaller and more uniform than the dark region of theflow field 92 generated by the conventional fan impeller ofFIG. 6 . When thefan impeller 3 rotates, the airflow flows from theair inlet 311 towards theheat sink 4. Due to the diameter of the outer circumference of thehub 31 decreasing along a direction from theair inlet 311 towards theair outlet 312, more airflow can flow to the center of theair outlet 312. In addition, themain blades 32 and the air-guidingblades 33 can drive more air of the airflow to flow to the center of theair outlet 312. Therefore, an amount of the air of the airflow driven by thefan impeller 3 to the center of theheat sink 4 is increased. Thehub 31 occupies a smaller space than a conventional hub. Thus themain blades 32 can have a relatively larger size. Accordingly, the amount of airflow generated by themain blades 32 is increased in comparison with the prior art. - It will be obvious that, within the scope of the invention, many variations are possible to those skilled in the art. The scope of protection of the invention is not limited to the example given herein.
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810304389.3 | 2008-09-05 | ||
CN200810304389A CN101666328B (en) | 2008-09-05 | 2008-09-05 | Radiating device and fan impeller thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100059210A1 true US20100059210A1 (en) | 2010-03-11 |
Family
ID=41798205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/399,031 Abandoned US20100059210A1 (en) | 2008-09-05 | 2009-03-06 | Fan impeller and heat dissipating device having the same |
Country Status (2)
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US (1) | US20100059210A1 (en) |
CN (1) | CN101666328B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102305218A (en) * | 2011-08-17 | 2012-01-04 | 深圳雅图数字视频技术有限公司 | Exhaust fan |
KR101342746B1 (en) * | 2013-03-15 | 2013-12-19 | 윤국영 | Cooling fan |
US20140286752A1 (en) * | 2013-03-25 | 2014-09-25 | Asustek Computer Inc. | Impeller and fan using the same |
CN106499650A (en) * | 2016-11-22 | 2017-03-15 | 广东美的厨房电器制造有限公司 | The radiator fan of microwave oven and the microwave oven with which |
US20220128059A1 (en) * | 2018-06-25 | 2022-04-28 | Delta Electronics, Inc. | Mixed flow fan with enhanced heat dissipation efficiency |
Families Citing this family (5)
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CN102371130A (en) * | 2010-08-11 | 2012-03-14 | 宜兴市溢洋水工业有限公司 | Vertical shaft-type double-turbine mixer |
CN101988522B (en) * | 2010-12-01 | 2012-08-29 | 鑫贺精密电子(东莞)有限公司 | Cooling fan |
CN102244438A (en) * | 2011-06-14 | 2011-11-16 | 许晓华 | Rotor insulation sheet |
CN102979761B (en) * | 2011-09-07 | 2017-07-25 | 技嘉科技股份有限公司 | Blast fan |
TWI658213B (en) * | 2018-08-13 | 2019-05-01 | 宏碁股份有限公司 | Axial flow fan |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6779595B1 (en) * | 2003-09-16 | 2004-08-24 | Cpumate Inc. | Integrated heat dissipation apparatus |
US6827131B1 (en) * | 2003-07-21 | 2004-12-07 | Neng Chao Chang | Apparatus of water-cooled heat sink |
US20070013242A1 (en) * | 2005-07-15 | 2007-01-18 | Chao-Nien Tung | Electrical fan |
US20070154314A1 (en) * | 2005-12-29 | 2007-07-05 | Minebea Co., Ltd. | Reduction of tonal noise in cooling fans using splitter blades |
US7264443B2 (en) * | 2005-01-21 | 2007-09-04 | General Motors Corporation | Centrifugal water pump |
US20080152502A1 (en) * | 2006-12-20 | 2008-06-26 | Shi-Ping Luo | Fan with spiral supercharging device |
US20080247868A1 (en) * | 2007-04-04 | 2008-10-09 | Chung-Kai Lan | Fan and impeller thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100389267C (en) * | 2004-07-06 | 2008-05-21 | 鸿富锦精密工业(深圳)有限公司 | Fan blade structure |
CN101008398B (en) * | 2006-01-27 | 2010-06-09 | 台达电子工业股份有限公司 | Fan and blade thereof |
TWM314797U (en) * | 2006-11-14 | 2007-07-01 | Asia Vital Components Co Ltd | Swirl pressurization device of fan |
-
2008
- 2008-09-05 CN CN200810304389A patent/CN101666328B/en not_active Expired - Fee Related
-
2009
- 2009-03-06 US US12/399,031 patent/US20100059210A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6827131B1 (en) * | 2003-07-21 | 2004-12-07 | Neng Chao Chang | Apparatus of water-cooled heat sink |
US6779595B1 (en) * | 2003-09-16 | 2004-08-24 | Cpumate Inc. | Integrated heat dissipation apparatus |
US7264443B2 (en) * | 2005-01-21 | 2007-09-04 | General Motors Corporation | Centrifugal water pump |
US20070013242A1 (en) * | 2005-07-15 | 2007-01-18 | Chao-Nien Tung | Electrical fan |
US20070154314A1 (en) * | 2005-12-29 | 2007-07-05 | Minebea Co., Ltd. | Reduction of tonal noise in cooling fans using splitter blades |
US20080152502A1 (en) * | 2006-12-20 | 2008-06-26 | Shi-Ping Luo | Fan with spiral supercharging device |
US20080247868A1 (en) * | 2007-04-04 | 2008-10-09 | Chung-Kai Lan | Fan and impeller thereof |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102305218A (en) * | 2011-08-17 | 2012-01-04 | 深圳雅图数字视频技术有限公司 | Exhaust fan |
KR101342746B1 (en) * | 2013-03-15 | 2013-12-19 | 윤국영 | Cooling fan |
WO2014142443A1 (en) * | 2013-03-15 | 2014-09-18 | 잘만테크(주) | Cooling fan |
US20140286752A1 (en) * | 2013-03-25 | 2014-09-25 | Asustek Computer Inc. | Impeller and fan using the same |
US9568022B2 (en) * | 2013-03-25 | 2017-02-14 | Asustek Computer Inc. | Impeller and fan using the same |
CN106499650A (en) * | 2016-11-22 | 2017-03-15 | 广东美的厨房电器制造有限公司 | The radiator fan of microwave oven and the microwave oven with which |
US20220128059A1 (en) * | 2018-06-25 | 2022-04-28 | Delta Electronics, Inc. | Mixed flow fan with enhanced heat dissipation efficiency |
Also Published As
Publication number | Publication date |
---|---|
CN101666328B (en) | 2012-09-19 |
CN101666328A (en) | 2010-03-10 |
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Legal Events
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AS | Assignment |
Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,C Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LI, SHU-MIN;ZHA, XIN-XIANG;XU, SHU-YUAN;AND OTHERS;REEL/FRAME:022353/0602 Effective date: 20090212 Owner name: FOXCONN TECHNOLOGY CO., LTD.,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LI, SHU-MIN;ZHA, XIN-XIANG;XU, SHU-YUAN;AND OTHERS;REEL/FRAME:022353/0602 Effective date: 20090212 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |