201114339 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種分離裴置，特 β 將一薄膜自其所貼附於上之一印刷雷疋有關於一種可 離裝置及其分離方法。 板而進行分離之分 【先前技術】 在印刷電路板與ABF膜之間完成壓合 用人工方式對於位在ABF膜之上的保^ 傻，一般是採 PET(polyethylene terephthalate，聚乙二:二（例如，ΡΕ 或 進行撕除。 、、本二甲酸酯膜）） 然而，以人工方式撕除保護膜時，除 且效率降低之外，更使得印刷電路板受到^工成本增高 物沾黏等傷害而會影響印刷電路板品質。1傷、污染及異 【發明内容】 有鏗於此，本發明係提供一種分離裝置及t八 法，除了可有效提升印刷電路板之撕膜致率及/、分離方 本外，尚還可避免印刷電路板受到刮傷、九低人工成 等傷害，以確保印刷電路板之品質。 ：、異物/占黏 本發明之分離裴置係可對於相互連接之一 一第二基材之間進行完全分離。本發明 基材與 Αώιώ? 墙 .„ 刀離裝置包括—201114339 VI. Description of the Invention: [Technical Field] The present invention relates to a separation device, a beta film for printing a film from a film attached thereto, relating to a detachable device and a method for separating the same . Separation of the board [Prior Art] The manual method of pressing the printed circuit board and the ABF film for the stupidity above the ABF film is generally PET (polyethylene terephthalate). For example, ΡΕ or tearing off.,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Damage can affect the quality of printed circuit boards. 1Injury, pollution and difference [Summary of the Invention] In view of the above, the present invention provides a separation device and a t-eight method, in addition to effectively improving the tear film rate and/or separation of the printed circuit board, Avoid damage to the printed circuit board, such as scratches, nine-fold artificial damage, to ensure the quality of the printed circuit board. : Foreign matter/occupation The separation device of the present invention can completely separate between one of the second substrates connected to each other. The substrate of the invention and the Αώιώ? wall. „ Knife-off device includes-
^座與一第一夾頭早元。基座係用以支承相互連接之I 土材與第二基材。第-爽頭單元係相對於基座而可於 -位置與-第二位置之間移動。當第—夾頭單元位於f 位置與第二位置之間之一既定位置時，第一失頭單元係造 成第一基材與第二基材之間的局部地分離且對於被分離之 201114339 第二f材進行夾持’並且當第-夹頭單元自既定位置而移 動ί —位置時’受第—夾頭單元所失持之第二基材係受 到第二夹頭單元之驅動而完全分離於第一基材。 離裝置更可包括—定位|置，定位裝置係用以將相 互、、之第一基材與第二基材定位於基座之上。定位裝置 厭、位4 ’疋位裝置之複數定位部係以可轉動方式 壓迫於第一基材之上。 水瓿ΐ一夹頭單元包括-吸附裝置與-剝離裝置。當第-位於第一位置與第二位置之間之既定位置時，吸 吸附方式造成第-基材與第二基材之間的局部 二：L並且剝.離裝置係造成第一基材與第二基材之間的 離且對於被分離之第二基㈣行緒。吸附裝置 係”」為一吸盤，剥離裝置係可為一刀刃。 式支ί座係對於相互連接之第-基材與第 二基材進行直立 刀雜裝置更可包括—第二夹頭單元。當第—夾頭單元 所夾持之第二基材係受到第一类 _ 於筮一f一第冑頭早70之驅動而完全分離^ Block with a first chuck early. The base is for supporting the interconnected I soil and the second substrate. The first-slow head unit is movable between a position and a second position with respect to the base. When the first collet unit is located at a predetermined position between the f position and the second position, the first head loss unit causes partial separation between the first substrate and the second substrate and is separated for 201114339 The second substrate is clamped' and the second substrate that is lost by the first chuck unit is completely separated by the second chuck unit when the first chuck unit is moved from the predetermined position. On the first substrate. The off device may further include a positioning device for positioning the first substrate and the second substrate adjacent to each other on the base. Positioning device The plurality of positioning portions of the dislocation and position 4' clamping device are rotatably pressed onto the first substrate. The leeches one collet unit includes an adsorption device and a detachment device. When the first position is between the first position and the second position, the adsorption mode causes a partial two between the first substrate and the second substrate: L and the peeling device causes the first substrate to be The separation between the second substrate is in the middle of the separated second base (four). The adsorption device is a suction cup, and the peeling device can be a blade. The pedestal holder may further include a second chuck unit for the interconnected first substrate and the second substrate. When the second substrate held by the first collet unit is driven by the first type _ 筮一一一一胄头70, it is completely separated.
Si，第二夾頭單元錢持被分離之第二基材且 隨後第一夾頭單元分離於被分離之第二基材。 離之i離ί置更可包括—接收裝置’接收裝置係接收被分 雕^罘一基材。 者推:裝置更可包括可供應一工作流體之-供氣裝置。 二仃—基材與第二基材之間之分離時，供氣裝置所提 被輸送至第一基材與第二基材之間。工作 刀離裝置更可包括具有-電極之一消除靜電裝置，此 201114339 消除靜電裝置之電極係對於第二基材之周邊空氣進行放 電’並且消除靜電裝置之電極係隨著第一夹頭單元之移動 而移動。 第一基材係可為一電路板，第二基材係可為至少一薄 膜。 本發明更提供一種分離方法，此分離方法係可對於相 互連接之一第一基材與一第二基材之間進行完全分離。本 發明之分離方法包括以下步驟：對於相互連接之第一基材 與第二基材進行支承；吸附第二基材而造成第一基材與第 二基材之間的局部地分離；局部地再分離第一基材與第二 基材且對於被分離之第二基材進行夾持；以及拉動被夾持 並被局部地分離之第二基材以使得第二基材與第一基材之 間完全分離。 於支承相互連接之第一基材與第二基材進行時係對於 第一基材進行壓迫。 於拉動被夾持並被局部地分離之第二基材而完全分離 於第一基材之後係對於已被完全分離於第一基材之第二基 材進行夾持，如此以避免第二基材接觸於第一基材。 於拉動被夾持並被局部地分離之第二基材以進行第二 基材與第一基材之間之分離過程中係同時對於第一基材與 第二基材之間進行吹氣。 於拉動被夾持並被局部地分離之第二基材以進行第二 基材與第一基材間之分離過程中係同時對於第二基材之周 邊空氣進行放電。 為了讓本發明之上述和其它目的、特徵、和優點能更 明顯易懂’下文特舉一較佳實施例，並配合所附圖示，作 201114339 詳細說明如下： 【實施方式】 第 ΙΑ、1B、1C、ID、IE、1F 圖係表厂 分離裝置Μ對於相互連接之一第一基、持"不利用本發明之 F1、F2之間進行分離之操作程序之Β二-:二基材 2C、2D、2E、2；F圖係表示對應於第 U第、2B、 IE、IF圖之利用本發明之分離裝置對於 ' ' 1D > 材JB與第二基材FI、F2之間進行分齙目^連接之第一基 示意圖。 之操作程序之側視 請同時參閱第1A/2A、1B/2B圖，第j 根據本發明之分離裝置]v[之示意圖，第1=、2A圖係表示 利用本發明之分離裝置Μ對於相互連接之、圖係表示 二基材FI、F2進行支承與定位之前之 一^材B與第Si, the second chuck unit holds the separated second substrate and then the first chuck unit is separated from the separated second substrate. More preferably, the receiving device receives a substrate that is divided into a plurality of substrates. Push: The device may further include a gas supply device that can supply a working fluid. The separation between the substrate and the second substrate is carried out by the gas supply device between the first substrate and the second substrate. The working knife separating device may further comprise an antistatic device having one electrode, wherein the electrode of the 201114339 antistatic device discharges the air surrounding the second substrate and the electrode system of the static eliminating device follows the first chuck unit Move and move. The first substrate may be a circuit board and the second substrate may be at least one film. The present invention further provides a separation method which is capable of completely separating between a first substrate and a second substrate which are interconnected. The separation method of the present invention comprises the steps of: supporting the interconnected first substrate and the second substrate; adsorbing the second substrate to cause partial separation between the first substrate and the second substrate; Separating the first substrate from the second substrate and clamping the separated second substrate; and pulling the second substrate that is clamped and partially separated to make the second substrate and the first substrate Completely separated between. The first substrate is pressed while supporting the interconnected first substrate and the second substrate. After the second substrate that is clamped and partially separated is completely separated from the first substrate, the second substrate that has been completely separated from the first substrate is clamped, so as to avoid the second base. The material is in contact with the first substrate. The second substrate that is held and partially separated is pulled to separate the first substrate from the first substrate while blowing between the first substrate and the second substrate. The second substrate that is held and partially separated is pulled to discharge the ambient air of the second substrate while separating the second substrate from the first substrate. The above and other objects, features, and advantages of the present invention will become more apparent and <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; , 1C, ID, IE, 1F diagram factory separation device Μ for the interconnection of one of the first base, holding the operation procedure of the separation between F1 and F2 of the present invention - two substrates 2C, 2D, 2E, 2; F diagram shows that the separation device using the present invention corresponding to the Uth, 2B, IE, and IF diagrams is performed between ''1D>' material JB and the second substrate FI, F2 The first base diagram of the connection. For the side view of the operation procedure, please refer to the drawings 1A/2A, 1B/2B, j, the schematic diagram of the separation device according to the present invention, and the first and second diagrams represent the separation device using the present invention. The connection diagram indicates that the two substrates FI and F2 are supported and positioned before the material B and the
圖係表示利用本發明之分離裝置Μ對於相 ！C、2C ;Ϊ:Β與一第二基材F1、F2完成… 分離裝置Μ係用於對於相互連接之 基材F1、F2之間進行完全分離。於本實“m 材B係為一印刷電路板，第_其 第基 , +,, 弟一基材FI、F2係包括兩 表面，，於本實施例中之;'=印:電= 族並非肖减制本發明，於其它實施射亦可利 之分離裝置對於單-表面貼附有單―皿薄膜之任—電路 板或任一類似構件進行兩者間之分離。 分離裝置Μ包括一基座卜_第一夹顯單元2、一定 201114339 接收農置 5 供氣裝置 位裝置3、一第二失頭單元4、一 6與一消除靜電裝置7。 基座1係用以對於相互連接之第〜 FI、F2進行支承。定位裝置3包括相B與第二基材 30,這些定位部30係以轉動方式而直接2隔之複數定位部 之上，如此便可將相互連接之第一基材&遣於第一基材B F2進行定位。於本實施例中，各定位邹與第二基材F1、 並且複數定位部30係以轉動9〇产方 係具有L型狀， 一基材B與第二基材F1 F=方立，1相互連接之第 2B所示），亦即，將相互連接之第—基材^ F2以垂直於一水平面（未圖示）之方向進行定位。 第-夾頭單元2係以相對於基座i而可於二 (或-初始位细與-第二位£ P2之 1A/2A、1B/2B圖中之第—夾頭單元2係位在第—位置^第 如第2A圖所示，第-夾頭單元2包括—吸附裝置幻鱼― 剥離裝置22。於本實施例中，第一位置ρι與第二位置打 係分別為具有不同水平高度之位置且第一位置ρι之高度 係高於第二位置P2之高度，吸附裝置21係為一吸盤门^ 離裝置22係為具有V型結構之一成對刀刀，而各刀刃係 具有一端部220。消除靜電裝置7包括一可移動電極7〇， 此可移動電極70係隨著第一夾頭單元2之移動而移動，經 由可移動電極70可向外產生高壓放電，如此可使得周邊空 氣被電離而形成大量的正、負離子。 請同時參閱第1F、2F圖，第二夾頭單元4、接收裝置 5係設置於基座1之一側或最下方位置，藉由第二夾頭單 元4對於已被完全分離於第一基材b之第二基材pi、F2 201114339 進行夾持（將於下文中針對第二基材PI、F2是如何被完全 分離於第一基材B之方式提出詳盡說明），並丑#由接收裝 置5以接收經由第二夾頭單元4所釋放之第二基材pi、 °供氣裝置6係位於基座1之一側或最上方位置，由供 氣裝置6所供應之一工作流體w(例如：空氣或其它氣體) 係朝向於即將進行分離之相互連接之第一基材B與第二基 特FI、F2之一側進行持續地吹送。The figure shows the use of the separation device of the present invention for the phase! C, 2C; Ϊ: Β and a second substrate F1, F2 are completed... The separation device is used for complete separation between the interconnected substrates F1, F2. In the present, "m material B is a printed circuit board, the first base, +,, the first substrate FI, F2 system includes two surfaces, in this embodiment; '=印: electric = family The invention is not limited to the invention, and the separating device can be separated from the single-surface-attached single-panel film-circuit board or any similar member. The separating device includes a base. Block _ first clip display unit 2, certain 201114339 receives the farm equipment 5 gas supply device device 3, a second head unit 4, a 6 and a static elimination device 7. The pedestal 1 is used for interconnection The first to FI and F2 support. The positioning device 3 includes a phase B and a second base material 30. The positioning portions 30 are directly rotatably separated by a plurality of positioning portions, so that the first bases connected to each other can be connected. The material & is placed on the first substrate B F2 for positioning. In this embodiment, each of the positioning and the second substrate F1, and the plurality of positioning portions 30 are rotated to produce an L-shaped shape, a base The material B and the second substrate F1 F=square, 1 is connected to the second BB), that is, the first substrate to be connected to each other Positioning in a direction perpendicular to a horizontal plane (not shown). The first collet unit 2 is configurable to the second with respect to the pedestal i (or - initial position fine and - second position £ P2 of 1A/2A, The first collet unit 2 in the 1B/2B diagram is located at the first position as shown in Fig. 2A, and the first collet unit 2 includes the adsorption device magic fish-peeling device 22. In this embodiment, The first position ρι and the second position are respectively at positions having different horizontal heights, and the height of the first position ρι is higher than the height of the second position P2, and the adsorption device 21 is a suction cup door device 22 having One of the V-shaped structures is paired with a knife, and each blade has an end portion 220. The static eliminating device 7 includes a movable electrode 7 that moves with the movement of the first chuck unit 2, The high-voltage discharge can be generated outward through the movable electrode 70, so that the surrounding air is ionized to form a large amount of positive and negative ions. Please refer to FIGS. 1F and 2F simultaneously, and the second chuck unit 4 and the receiving device 5 are disposed on the base. One side or lowermost position of the seat 1 by means of the second collet unit 4 The second substrate pi, F2 201114339, which is completely separated from the first substrate b, is clamped (to be explained in detail below on how the second substrates PI, F2 are completely separated from the first substrate B) And by the receiving device 5 to receive the second substrate pi, the gas supply device 6 released via the second chuck unit 4 is located at one side or the uppermost position of the base 1, by the air supply device 6 One of the working fluids w (for example, air or other gas) is continuously blown toward the side of the first substrate B and the second bases FI and F2 which are to be separated from each other.
第1D、2D圖係表示利用本發明之分離裝置Μ對於相 互連接之第一基材Β與第二基材FI、F2之間進行局部地 分離時之示意圖。 如第ID、2D圖所示，當第一夾頭單元2自第一位置 Η而向下移動至一既定位置Pa(位於第一位置與第二位 置P2之間）時，吸附裝置21係以吸附方式造成第一基材b 與第二基材FI、F2之間的局部地分離，亦即，利用吸附裝 置21之真空吸附所產生之一吸力N而使得第二基材F1、 之邊緣f〇i、f〇2局部地分離於第一基材b，如此便可在 第二基材FI、F2之邊緣f(H、f02與第一基材B之間形成 了 一空隙（未圖示），並且同時將剥離裝置22之端部22〇插 入於空隙且再利用剥離裝置22之端部220對於被局部分離 之第—基材F1、F2之邊緣ί〇 1、f02進行爽持。 之間進行局部地 第1E、2E圖係表示利用本發明之分離裝置％對於相 互連接之第一基材Β與第二基材FI、;ρ2 、 分離時之示意圖。 如第1Ε、2Ε圖所示，由於被局部分離 h之邊緣f〇i、f〇2係受到第一失頭單 一土 之端部220的失持，當第一夾頭軍元2自之剝離裝置22 目既定位置Pa而向 201114339 下移動朝向於第二位置P2時，被局部分離之第二基材以、 F2係逐漸地分離於第一基材B，亦即，第二基材Fl、 與第一基材B之間的實際黏著面積逐漸地減少，並且供氣 裝置6所供應之工作流體W係持續地朝向於第一基材B ^ 第二基材FI、F2之間之被分離區域進行吹送，如此以確^ 被分離之第二基材；pl、F2之間不會再次地與第一基材^ 之間產生結合’並且同時防止其它污染及異物沾黏於第一 基材B之上。由於在第一基材B與第二基材F1、F2之分 離過程中會產生靜電，此時可藉由消除靜電裝置7之^ 70之放電作用下所形成之大量正、負離子而中和了第一美 材B之靜電，如此以避免因靜電作用下而造成不 二 粒子被吸附於第一基材Β之上。 /、或 第1F圖係表示利用本發明之分離裝置Μ對於相車 ==騎Β .與第二基材F1、F2之間進行完全分離時 如IF、2F圖所示，當持續地受到第一夾頭單， ==向下艇動或拉動下且當第_夹頭單 ，裝置U移動至第二位置p2flf，受第一夹頭單元 持之第二基材F】、F2完全分離於繁一 用第二夹頭單㈣被;B ’ Μ隨後利 4 T分離於被分離之第二基材㈣。隨後， ;ϊ —Λ可接全釋放第二基材fi、㈣，藉由接收 ^置便τ接4㈣放 第3八、33、3〇、31)圖係 •基材^ 丨兀力乂了弟一基材B與# 2之間之完全分離後之對於第-基材B進巧 201114339 分離之操作示意圖。第3A、3B圖係表示定位裝置3之複 數定位部30係以轉動方式而對於其所夾持之第一基材B 進行完全釋放，並且隨後經由一工作人員（未圖示）所收 集。第3C、3D圖係表示第一夾頭單元2自第二位置P2而 移動至第一位置P1且分離裝置Μ恢復至第1A圖時之待機 狀態，如此便可準備再進行如第1Α至1F圖之分離裝置Μ 之操作程序。 雖然本發明已以諸實施例揭露如上，然其並非用以限 制本發明，任何熟習此項技藝者，在不脫離本發明之精神 和範圍内，當可做更動與潤飾，因此本發明之保護範圍當 以申請專利範圍所界定者為準。 201114339 【圖式簡單說明】 第1A、IB、1C ' ID、IE、1F圖係表示利用本發明之 分離裝置對於相互連接之一第一基材與一第二基材之間進 行分離之操作程序之示意圖； 第2A、2B、2C、2D、2E、2F圖係分別表示對應於第 1A、IB、1C、ID、IE、1F圖之侧視圖；以及 第3A、3B、3C、3D圖係表示完成了第一基材與第二 基材之間之完全分離後之對於第一基材進行分離之操作示 意圖。 【主要元件符號說明】 1〜基座 2〜第一夾頭單元 21〜吸附裝置 22〜剝離裝置 220〜端部 3〜定位裝置 30〜定位部 4〜第二夾頭單元 5〜接收裝置 6〜供氣裝置 7〜消除靜電裝置 70〜可移動電極 B〜第一基材 fDl、fD2〜邊緣 FI、F2〜第二基材 Μ〜分離裝置 N〜吸力 Ρ1〜第一位置 P2〜第二位置 Pa〜既定位置 W〜工作流體 12Figs. 1D and 2D are views showing a state in which the first substrate Β and the second substrates FI and F2 which are connected to each other are partially separated by the separation device of the present invention. As shown in the ID, 2D, when the first chuck unit 2 is moved downward from the first position to a predetermined position Pa (between the first position and the second position P2), the adsorption device 21 is The adsorption mode causes partial separation between the first substrate b and the second substrates FI, F2, that is, one suction force N generated by vacuum adsorption of the adsorption device 21 causes the edge of the second substrate F1 to be f 〇i, f〇2 are partially separated from the first substrate b, so that a gap can be formed between the edges f (H, f02 and the first substrate B of the second substrate FI, F2 (not shown) And at the same time, the end portion 22 of the peeling device 22 is inserted into the gap and the end portion 220 of the peeling device 22 is used to cool the edges 〇1, f02 of the partially separated first substrates F1, F2. The first and second E1 drawings show a schematic diagram of the first substrate Β and the second substrate FI, ρ2 separated from each other by the separation device of the present invention, as shown in Fig. 1 and Fig. 2 Because the edges f〇i, f〇2 of the partial separation h are subjected to the loss of the end portion 220 of the first lost single soil, when the first When the head unit 2 moves from the predetermined position Pa to the lower position P2 toward the first position P2, the partially separated second substrate is gradually separated from the first substrate B by the F2 system, that is, The actual adhesion area between the second substrate F1 and the first substrate B is gradually reduced, and the working fluid W supplied from the gas supply device 6 is continuously oriented toward the first substrate B ^ the second substrate FI And the separated area between F2 is blown, so as to be sure to separate the second substrate; pl, F2 does not recombine with the first substrate ^ and prevent other pollution and foreign matter Adhered to the first substrate B. Since static electricity is generated during the separation of the first substrate B and the second substrate F1, F2, the discharge of the electrostatic device 7 can be eliminated. The large amount of positive and negative ions formed neutralizes the static electricity of the first material B, so as to prevent the second particles from being adsorbed on the first substrate by electrostatic action. /, or the 1F figure indicates By using the separating device of the present invention, the vehicle is in contact with the second substrate F1 and F2. When the line is completely separated, as shown in the IF and 2F diagrams, when continuously receiving the first chuck, == down or pulling down and when the first chuck is single, the device U moves to the second position p2flf, subject to The second substrate F] and F2 held by a chuck unit are completely separated from the single (four) by the second chuck; B' Μ is subsequently separated from the separated second substrate (4). Subsequently, ϊ - Λ can fully release the second substrate fi, (4), by receiving ^ 便 τ 接 4 (four) put the third eight, 33, 3 〇, 31) map • substrate ^ 丨兀 force 乂 一 a substrate Schematic diagram of the operation of separation of the first substrate B from 201114339 after the complete separation between B and #2. Figs. 3A and 3B show that the plurality of positioning portions 30 of the positioning device 3 are completely released from the first substrate B held by them in a rotational manner, and are then collected by a worker (not shown). The 3C and 3D drawings show the standby state in which the first chuck unit 2 is moved from the second position P2 to the first position P1 and the separating device Μ returns to the first A picture, so that it is ready to perform the first step 1 to 1F again. The operating procedure of the separation device of the figure. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and retouched without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of patent application. 201114339 [Simplified description of the drawings] The 1A, IB, 1C 'ID, IE, 1F diagrams show the operation procedure for separating the first substrate and the second substrate from each other by the separation device of the present invention. 2A, 2B, 2C, 2D, 2E, 2F diagrams respectively show side views corresponding to the 1A, IB, 1C, ID, IE, 1F diagram; and 3A, 3B, 3C, 3D diagram representation A schematic diagram of the operation of separating the first substrate after complete separation between the first substrate and the second substrate is completed. [Description of main component symbols] 1 to pedestal 2 to first chuck unit 21 to adsorption device 22 to peeling device 220 to end portion 3 to positioning device 30 to positioning portion 4 to second chuck unit 5 to receiving device 6 to Air supply device 7 to static elimination device 70 to movable electrode B to first substrate fD1, fD2 to edge FI, F2 to second substrate Μ to separation device N to suction Ρ 1 to first position P2 to second position Pa ~ established position W ~ working fluid 12