TW202145325A - Holding mechanism of processed object, and processing device to realize proper holding and easy removal of the processed object - Google Patents

Abstract

To provide a holding mechanism of a processed object, which can realize proper holding and easy removal of the processed object. A holding mechanism of a processed object comprises: a holding base having a holding surface corresponding to the shape and size of the processed object, the processed object includes a material exhibiting strong magnetism; a magnet provided on the holding surface of the holding base and generating an attractive force between the magnet and the processed object; and a release means, which applies the force in the direction away from the holding surface to the processed object held on the holding surface side of the holding base by the attractive force between the magnet and the processed object . Moreover, the release means includes: a cover sheet that covers the holding surface; and a fluid supply part that supplies the fluid between the holding surface and the cover sheet. Further, the surface of the cover sheet opposite to the holding surface is arranged with a concave-convex structure that suppresses the adsorption of the processed object caused by the cover sheet, or a layer containing a peeling promoter that promotes the peeling of the processed object from the cover sheet.

Description

The holding mechanism and the processing device of the workpiece

The present invention relates to a holding mechanism for holding a plate-shaped workpiece, and a processing apparatus provided with the holding mechanism.

When dividing a plate-shaped workpiece represented by a semiconductor wafer, a package substrate, or the like into a plurality of wafers, a processing apparatus such as a dicing apparatus or a laser processing apparatus is used, for example. These processing apparatuses are provided with a chuck table that sucks and holds a workpiece by a vacuum (negative pressure) formed by a pump or the like (for example, refer to Patent Document 1).

The workpiece is sucked and held by this chuck table in a state where, for example, an adhesive film called a dicing film or the like is attached to the lower surface. In order to facilitate handling of the divided workpiece (a plurality of wafers), the outer peripheral portion of the adhesive film may be fixed to a ring-shaped frame.

However, since the above-mentioned adhesive film used for dividing the workpiece is disposable, it is easy to increase the processing cost. Then, there has been proposed a jig table or the like that includes a suction portion corresponding to each wafer so that the divided workpiece (a plurality of wafers) can be held without using an adhesive film (for example, refer to Patent Documents 2 and 3).

On the other hand, in the above-mentioned chuck table, if the wafers are miniaturized to a certain extent, the attractive force acting on each wafer becomes insufficient, and it becomes impossible to properly hold the wafers. The same problem occurs in the conveying unit that sucks, holds, and conveys the divided workpiece. In order to solve this problem, a holding mechanism has been proposed in recent years, which holds a workpiece (wafer) by the magnetic force of a magnet, and removes the workpiece (wafer) by expanding a sheet arranged so as to cover the magnet. See, for example, Patent Document 4).

[Previously known technical literature] [Patent Literature] Patent Document 1: Japanese Patent Laid-Open No. 2004-200440. Patent Document 2: Japanese Patent Laid-Open No. 2013-65603. Patent Document 3: Japanese Patent Laid-Open No. 2014-116486. Patent Document 4: Japanese Patent Laid-Open No. 2017-228617.

[Problems to be solved by the invention] However, since the cover sheet of the above-mentioned holding mechanism is formed of a soft resin such as rubber, if the workpiece is pressed against the cover sheet by the strong magnetic force of the magnet, the gap between the cover sheet and the workpiece will be lost. It becomes easy to act on the cover sheet due to the formation of a vacuum or the surface tension of the water remaining in the workpiece. As a result, the workpiece is adsorbed to the cover sheet, and even if the cover sheet swells, the workpiece cannot be removed from the cover sheet.

The present invention was made in view of this problem, and an object of the present invention is to provide a holding mechanism for a workpiece that can appropriately hold and easily remove the workpiece, and a processing apparatus provided with the holding mechanism.

[Technical means to solve the problem] According to an aspect of the present invention, there is provided a holding mechanism for a workpiece, comprising: a holding base having a holding surface whose shape and size correspond to the workpiece, the workpiece containing a material expressing ferromagnetism; a magnet, which is arranged on the holding surface of the holding base, and generates an attractive force with the workpiece; and a releasing means, which is held on the holding base by the attractive force with the magnet. The workpiece on the holding surface side of the table applies a force in a direction away from the holding surface, and the release means includes: a cover sheet covering the holding surface; and a fluid supply portion that supplies fluid to the holding surface Between the holding surface and the cover sheet, and on the surface of the cover sheet on the opposite side to the holding surface, a concavo-convex structure is provided, which suppresses the adsorption of the workpiece by the cover sheet ; or a layer comprising a peeling accelerator that promotes the peeling of the workpiece from the cover sheet and retains the workpiece through the cover sheet and by the attraction between the magnet and the magnet The cover sheet is expanded with the fluid supplied from the fluid supply portion, thereby generating a force in a direction away from the holding surface.

In one aspect of the present invention, the release means preferably further has: a first flow path, which connects the holding surface and the fluid supply part; a valve, which is arranged in the first flow path; and a second flow path, which passes through the valve diverges from the first flow path; and an ejector having a suction port connected to the holding surface side closer to the first flow path than the valve side of the first flow path, and connected to the second flow path a supply port and a discharge port for discharging the fluid supplied from the supply port, and the valve is switchable between a first state and a second state, the first state supplying the fluid to the holding through the first flow path Between the surface and the cover sheet, the second state is that fluid is supplied to the supply port of the injector through the second flow path and negative pressure is generated at the suction port.

According to another aspect of the present invention, there is provided a processing apparatus including: a chuck table for holding a workpiece containing a material exhibiting ferromagnetic properties; and a processing unit for processing the workpiece held on the chuck table and conveying means for carrying the workpiece into or out of the chuck table, and the conveying means is provided with: a holding base having a shape and size corresponding to the workpiece the holding surface; a magnet, which is arranged on the holding surface of the holding base, and generates an attractive force with the workpiece; and a releasing means, which is used for holding the A force in a direction away from the holding surface is applied to the workpiece on the holding surface side of the holding base, and the release means includes: a cover sheet covering the holding surface; and a fluid supply portion A fluid is supplied between the holding surface and the cover sheet, and a surface of the cover sheet opposite to the holding surface is provided with a concavo-convex structure that suppresses the adsorption of the object to be processed; or a layer containing a peeling accelerator that promotes peeling of the object to be processed from the cover sheet, and the conveying means is through the cover sheet and by being in contact with the magnet The workpiece is held by the attractive force generated therebetween, and the cover sheet is expanded by the fluid supplied from the fluid supply unit, thereby generating a force in a direction away from the holding surface.

In another aspect of the present invention, the release means preferably further has: a first flow path, which connects the holding surface and the fluid supply part; a valve, which is arranged in the first flow path; and a second flow path, which passes through the valve diverges from the first flow path; and an ejector having a suction port connected to the holding surface side closer to the first flow path than the valve side of the first flow path, and connected to the second flow path a supply port and a discharge port for discharging the fluid supplied from the supply port, and the valve is switchable between a first state and a second state, the first state supplying the fluid to the holding through the first flow path Between the surface and the cover sheet, the second state is that fluid is supplied to the supply port of the injector through the second flow path and negative pressure is generated at the suction port.

[Inventive effect] The workpiece holding mechanism of one aspect of the present invention includes a magnet on the holding surface of the holding base, and the magnet generates an attractive force with the workpiece containing a material exhibiting ferromagnetic properties. Therefore, the workpiece can be appropriately held by the attractive force with the magnet. Similarly, the processing apparatus of another aspect of the present invention can also appropriately hold the workpiece by the attractive force generated between the processing apparatus and the magnet.

Moreover, the workpiece holding mechanism of one aspect of the present invention includes release means for applying a force in a direction away from the holding surface to the workpiece held on the holding surface side of the holding base. Also, the cover sheet of the release means here is provided with: a concavo-convex structure that suppresses the adsorption of the workpiece by the cover sheet; or a layer containing a peeling accelerator that promotes the removal of the workpiece from the cover Sheet peeling.

Therefore, by applying a force to the workpiece by the release means, the workpiece can be easily removed from the holding base or the cover sheet. Similarly, in the processing apparatus of another aspect of the present invention, the workpiece can be easily removed from the holding base or the cover sheet.

Embodiments of an aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view showing a configuration example of a processing apparatus (cutting apparatus) 2 according to the present embodiment. In addition, in this embodiment, although the processing apparatus 2 for cutting and processing a plate-shaped workpiece has been described, the processing apparatus of the present invention may be a laser processing apparatus for processing a workpiece by a laser beam. Wait.

As shown in FIG. 1, the processing apparatus 2 is provided with the base 4 which supports each structure. A rectangular opening 4 a is formed in the center of the base 4 in the X-axis direction (the front-rear direction, the machining feed direction). In this opening 4a, the X-axis moving stage 6, the X-axis moving mechanism (moving means) (not shown) for moving the X-axis moving stage 6 in the X-axis direction, and the dust-proof and drip-proof cover covering the X-axis moving mechanism are arranged 8.

A chuck table 10 for holding a plate-shaped workpiece 11 is provided above the X-axis moving table 6 . As shown in FIG. 1 , the workpiece 11 is, for example, a rectangular package substrate, a ceramic substrate, a glass substrate, a semiconductor wafer, etc., which are formed of materials such as iron, cobalt, and nickel exhibiting ferromagnetic properties. Adhesive film (adhesive film) 13.

However, the shape and the like of the workpiece 11 are not limited. For example, a disk-shaped package substrate or the like may be used as the workpiece 11 . In addition, an annular frame (support member) or the like may be fixed to the outer edge portion of the adhesive film 13 . In this case, the workpiece 11 is supported by an annular frame or the like through the adhesive film 13 .

The chuck table 10 is connected to a rotational drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction (vertical direction, height direction). In addition, when the X-axis moving stage 6 is moved in the X-axis direction by the above-mentioned X-axis moving mechanism, the chuck table 10 is also moved in the X-axis direction.

For example, when the workpiece 11 is loaded into the chuck table 10 or unloaded from the chuck table 10, between the loading and unloading area before the workpiece 11 is loaded and unloaded and the processing area in the center where the workpiece 11 is processed During this time, the chuck table 10 is moved in the X-axis direction. In addition, when machining the workpiece 11 , the chuck table 10 is moved in the X-axis direction within the above-described machining area (machining feed).

The upper surface of the chuck table 10 is formed in a shape corresponding to the workpiece 11 (a substantially flat rectangle in this embodiment), and serves as a holding surface 10 a for holding the workpiece 11 . The holding surface 10a is substantially parallel to the X-axis direction and the Y-axis direction (left-right direction, index feeding direction), and is connected to the suction through a flow path (not shown) formed in the chuck table 10 and the like. source (not shown) connection.

On the upper surface of the base 4 , a gate-shaped support structure 14 for supporting two sets of cutting units (processing units, processing means) 12 is arranged so as to extend over the opening 4 a. The upper part of the front surface of the support structure 14 is provided with two sets of cutting unit moving mechanisms 16 that move each cutting unit 12 in the Y-axis direction and the Z-axis direction.

Each of the cutting unit moving mechanisms 16 includes a pair of Y-axis guide rails 18 that are arranged on the front surface of the support structure 14 and are parallel to the Y-axis direction in common. A Y-axis moving plate 20 constituting each cutting unit moving mechanism 16 is slidably mounted on the Y-axis guide rail 18 . The rear side (rear side) of each Y-axis moving plate 20 is provided with a nut portion (not shown), and the Y-axis ball screw 22 parallel to the Y-axis guide rail 18 is screwed to the nut portion.

A Y-axis pulse motor 24 is connected to one end of each Y-axis ball screw 22 . When the Y-axis ball screw 22 is rotated by the Y-axis pulse motor 24 , the Y-axis moving plate 20 moves in the Y-axis direction along the Y-axis guide rail 18 .

A pair of Z-axis guide rails 26 is provided on the front surface (front surface) of each Y-axis moving plate 20 in parallel with the Z-axis direction. A Z-axis moving plate 28 is slidably attached to the Z-axis guide rail 26 . The rear side (rear side) of each Z-axis moving plate 28 is provided with a nut portion (not shown), and a Z-axis ball screw 30 parallel to the Z-axis guide rail 26 is screwed to the nut portion, respectively.

A Z-axis pulse motor 32 is connected to one end of each Z-axis ball screw 30 . When the Z-axis ball screw 30 is rotated by the Z-axis pulse motor 32 , the Z-axis moving plate 28 moves in the Z-axis direction along the Z-axis guide rail 26 .

The lower part of each Z-axis moving plate 28 is provided with the cutting unit 12 . The cutting unit 12 includes an annular cutting blade 34 attached to one end side of a main shaft (not shown) serving as a rotating shaft. A nozzle 36 for supplying a cutting fluid (working fluid) such as pure water is arranged near the dicing blade 34 . In addition, a camera 38 is provided at a position adjacent to the cutting unit 12 , and the camera 38 captures the workpiece 11 and the like held on the chuck table 10 .

When the Y-axis moving plate 20 is moved in the Y-axis direction by each cutting unit moving mechanism 16 , the cutting unit 12 and the camera 38 are moved in the Y-axis direction (indexing feed). In addition, when the Z-axis moving plate 28 is moved in the Z-axis direction by each cutting unit moving mechanism 16, the cutting unit 12 and the camera 38 are moved in the Z-axis direction.

In the front side of the support structure 14 and one side area in the left-right direction of the opening 4 a, a carry-in side table (loading table) 40 on which the workpiece 11 before processing is placed is arranged. The upper surface of the carrying-in side table 40 is formed in a shape corresponding to the workpiece 11 (in this embodiment, a substantially flat rectangle), and serves as a holding surface 40 a for holding the workpiece 11 . The holding surface 40 a is connected to a suction source (not shown) through a flow path (not shown) or the like formed in the inside of the carrying-in side table 40 .

Below the carry-in side table 40, a carry-in side table moving mechanism 42 is provided, and the carry-in side table moving mechanism 42 moves the carry-in side table 40 above the opening 4a. The carry-in side table moving mechanism 42 includes a pair of guide rails 44 extending from one side area of the opening 4a toward the opening 4a, and moves the carry-in side table 40 along the guide rails 44 by a force generated by an air cylinder or the like. Specifically, the carry-in side table 40 is moved between a loading area adjacent to the carry-in and carry-out area on one side of the opening 4a, and an area directly above the carry-in and carry-out area.

In the front side of the support structure 14 and the other side area|region of the left-right direction of the opening 4a, the unloading side table (unloading table) 46 which mounts the to-be-processed object 11 after processing is arrange|positioned. The upper surface of the unloading side table 46 is formed in a shape corresponding to the workpiece 11 (a substantially flat rectangle in this embodiment), and serves as a holding surface 46 a for holding the workpiece 11 . The holding surface 46a is connected to the suction source 46d (see FIG. 6(B) ) through a flow path 46b (see FIG. 6(B) ), a valve 46c (see FIG. 6(B) ), and the like.

Below the carry-out side table 46, the carry-out side table moving mechanism 48 is provided, and the carry-out side table moving mechanism 48 moves the carry-out side table 46 to the upper side of the opening 4a. The unloading side table moving mechanism 48 includes a pair of guide rails 50 extending from the other side area of the opening 4a toward the opening 4a, and moves the unloading side table 46 along the guide rails 50 by a force generated by an air cylinder or the like. Specifically, the unloading side table 46 is moved between the unloading area on the other side of the opening 4a and adjacent to the carrying-in and carrying-out area, and the area directly above the carrying-in and carry-out area.

In addition, in the present embodiment, the carrying-in side table 40 and the carrying-out side table 46 which can suck the workpiece 11 are exemplified, but the carrying-in side table and the carrying-out side table provided in the processing apparatus 2 only need to be able to support at least the workpiece 11 . way to be constituted. That is, the carrying-in side table and the carrying-out side table do not necessarily have to be capable of attracting the workpiece 11 .

A transfer unit (transfer means) 52 that transfers the workpiece 11 between the chuck table 10 and the transfer-side table 40 or the transfer-side table 46 is arranged further above the directly above area. and transfer. The conveyance unit 52 includes a holding mechanism (holding means) 54 that holds the workpiece 11 , and a linear motion mechanism (moving means) 56 that moves the holding mechanism 54 in the vertical direction. Details of the holding mechanism 54 will be described later.

Between the opening 4a and the carry-out side table 46, and in a region above the carry-out side table 46, a nozzle 58 capable of spraying air downward is arranged. The nozzle 58 blows air to the workpiece 11 and the like on the unloading side table 46 while the unloading side table 46 holding the workpiece 11 is moved from the directly above area to the unloading area. Thereby, the cutting liquid adhering to the to-be-processed object 11 etc. can be dried and removed.

Next, the holding mechanism 54 assembled to the conveyance unit 52 will be described in detail. FIG. 2 is a cross-sectional view mainly showing the holding mechanism 54 , and FIG. 3 is a partial enlarged cross-sectional view of FIG. 2 . In addition, in FIG. 2, some constituent elements are represented by functional blocks or symbols. As shown in FIGS. 2 and 3 , the holding mechanism 54 of the present embodiment includes a holding base 60 having a size corresponding to the workpiece 11 (size capable of appropriately holding the entire upper surface of the workpiece 11 ). The shape of the holding base 60 is arbitrary, but here it is a flat plate.

The lower surface of the holding base 60 is formed in a shape and size corresponding to the workpiece 11 (the shape and size of the entire upper surface of the workpiece 11 can be appropriately maintained, and in this embodiment, the shape and size are substantially flat and consistent with the workpiece 11 . The upper surface of the workpiece 11 is a rectangle having the same size), and becomes the holding surface 60 a for holding the workpiece 11 . FIG. 4 is a perspective view showing the holding surface 60 a side of the holding base 60 . As shown in FIGS. 2 , 3 and 4 , a plurality of magnets 62 are provided on the holding surface 60 a.

Each magnet 62 is, for example, a permanent magnet or an electromagnet. As described above, since the workpiece 11 contains a material that exhibits ferromagnetic properties, if the holding surface 60 a of the holding base 60 is brought close to the workpiece 11 , an attractive force (magnetic force) can be generated between the magnets 62 and the workpiece 11 . . The workpiece 11 is held on the holding surface 60a side of the holding base 60 by this attractive force. Conditions such as the number and arrangement of the magnets 62 can be arbitrarily determined within a range in which the workpiece 11 can be appropriately held.

The holding base 60 is provided with a release mechanism (releasing means) 64 for easily removing the workpiece 11 from the holding base 60 for the workpiece held on the holding base 60 . The workpiece 11 is applied with a force in a direction away from the holding surface 60a. The release mechanism 64 includes a cover sheet 66 that covers the holding surface 60a.

The cover sheet 66 is made of, for example, a material such as rubber (natural rubber or synthetic rubber) or resin (eg vinyl chloride or polyolefin) with high elasticity and low air permeability (liquid permeability), and is formed into a film shape, and is surrounded by The fixing frame 68 holding the side portion of the base 60 is fixed to the holding base 60 . In this way, by using the fixing frame 68 to fix the cover sheet 66 to the entire circumference of the holding base 60, the gap between the cover sheet 66 and the holding base 60 can be reduced, and the airtightness can be improved.

Moreover, as shown in FIG. 3, the surface 66a of the cover sheet 66 on the opposite side to the holding surface 60a is formed with a plurality of convex portions (concave-convex structure) 66b. Each convex portion 66b is provided at a position corresponding to each of the plurality of wafers obtained by dividing the workpiece 11 (positions where the plurality of wafers are in contact), for example, and suppresses the suction of the workpiece 11 by the cover sheet 66 .

That is, the surface 66a of the cover sheet 66 is provided with the convex parts 66b, and the number of the convex parts 66b is equal to or more than the number of wafers obtained by dividing the workpiece 11. In addition, in this embodiment, although the several convex part 66b is provided in the surface 66a of the cover sheet 66, you may provide a several recessed part (concave-convex structure) instead of the several convex part 66b. In addition, both the convex part 66b and the concave part may be provided.

The size, shape, and the like of each convex portion 66b (or concave portion) are not strictly limited. For example, if the setting size (length in the direction parallel to the surface 66a) is about 5% to 50% of the size (for example, the length of one side) of the wafer obtained by dividing the workpiece 11, and the height difference (relative to the surface 66a) The convex portion 66b (or the concave portion) having a length in the vertical direction) of about 50 μm to 500 μm can appropriately suppress the adsorption of the workpiece 11 by the cover sheet 66 without hindering the holding of the workpiece 11 .

A plurality of openings 60b are formed in the holding surface 60a, and the openings 60b are connected to one end side of the first flow path 70a. The other end of the first flow path 70a is connected to a fluid supply source (fluid supply unit) 72 for supplying fluid. The fluid supply source 72 constitutes the release mechanism 64 together with the cover sheet 66 . In addition, in the present embodiment, gas such as air is used as the fluid supplied from the fluid supply source 72 .

A first valve 74a and a second valve 74b for controlling the supply of fluid are provided on the fluid supply source 72 side of the first flow path 70a. The first valve 74a on the upstream side controls the supply of fluid to the second valve 74b on the downstream side. Specifically, when the first valve 74a is opened, the fluid is supplied from the fluid supply source 72 to the second valve 74b. On the other hand, when the first valve 74a is closed, the fluid is not supplied from the fluid supply source 72 to the second valve 74b.

The second valve 74b supplies the fluid supplied from the fluid supply source 72 to either one end side (the holding surface 60a side, the opening 60b side) of the first flow path 70a or the second flow path 70b, the second flow path 70b. The passage 70b is branched from the first passage 70a through the second valve 74b. Specifically, when the second valve 74b is brought into the first state, the fluid is supplied to one end side of the first flow path 70a. On the other hand, when the second valve 74b is brought into the second state, the fluid is supplied to the second flow path 70b.

For example, when the first valve 74a is opened and the second valve 74b is set to the first state, the fluid is supplied between the holding surface 60a and the cover sheet 66 through the first flow path 70a, the opening 60b, and the like. As described above, the cover sheet 66 is formed of a material with high stretchability and low air permeability (liquid permeability). Therefore, when the fluid is supplied between the holding surface 60a and the cover sheet 66, the cover sheet 66 can be inflated downward (transformed into a curved surface).

An ejector (aspirator) 76 is provided in the second flow path 70b. The suction port 76a of the injector 76 is connected to the first flow path 70a between the second valve 74b and the opening 60b (one end). That is, the suction port 76a is connected to the holding surface 60a side of the first flow path 70a that is closer to the second valve 74b side of the first flow path 70a. Moreover, the fluid which passed the 2nd valve 74b is supplied to the supply port 76b of the injector 76 through the 2nd flow path 70b. In addition, the fluid supplied to the inside of the ejector 76 from the supply port 76b is discharged to the outside of the ejector 76 through the discharge port 76c.

For example, when the first valve 74a is opened and the second valve 74b is set to the second state, the fluid flows from the supply port 76b of the ejector 76 toward the discharge port 76c, and negative pressure is generated in the suction port 76a of the ejector 76 . Therefore, by utilizing this negative pressure, the fluid between the holding surface 60a and the cover sheet 66 can be discharged to the outside through the opening 60b, the first flow path 70a, the second flow path 70b, and the like.

One end side of the first flow path 70a is provided with a pressure gauge 78 for measuring the pressure (in this embodiment, air pressure) of the first flow path 70a. By measuring the pressure of the first flow path 70a with this pressure gauge 78, it can be appropriately determined, for example, whether or not the fluid between the holding surface 60a and the cover sheet 66 has been sufficiently discharged.

Next, the conveyance method of conveying the workpiece 11 using the conveyance unit 52 described above will be described. In addition, in this embodiment, the case where the workpiece 11 divided into a plurality of wafers after the dicing process is carried out from the chuck table 10 to the unloading side table 46 is described as an example, but the workpiece before the dicing process is carried out. The same applies to the case where 11 is loaded from the loading side table 40 to the chuck table 10 .

5(A) is a sectional view showing the first step when the workpiece 11 is carried out, FIG. 5(B) is a sectional view showing the second step when the workpiece 11 is carried out, and FIG. 6(A) is a sectional view showing the unloading The cross-sectional view of the third step when the workpiece 11 is carried out, and FIG. 6(B) is a cross-sectional view showing the fourth step when the workpiece 11 is carried out.

When the workpiece 11 is unloaded from the chuck table 10 to the unloading side table 46 , first, the position of the chuck table 10 is aligned with the loading and unloading area, and the position of the unloading side table 46 is aligned with the area outside the directly above area (for example, unload area). Moreover, after the fluid between the holding surface 60a and the cover sheet 66 is discharged, the first valve 74a is closed.

Thereafter, as shown in FIG. 5(A) , the holding mechanism 54 is lowered by the linear motion mechanism 56 ( FIG. 1 ), and the holding surface 60 a of the holding base 60 is brought close to the upper surface of the workpiece 11 on the chuck table 10 . . As described above, the plurality of magnets 62 are provided on the holding surface 60a. Therefore, when the holding surface 60 a is brought close to the workpiece 11 , an attractive force is generated between the magnet 62 and the workpiece 11 , and the workpiece 11 is held by the holding base 60 through the cover sheet 66 .

However, in the present embodiment, since the projections 66 b are provided at the positions corresponding to the respective wafers on the surface 66 a of the cover sheet 66 , the workpiece 11 (wafer) can be moved by the attractive force acting on the magnets 62 . Even if it is strongly pressed against the surface 66a of the cover sheet 66, the to-be-processed object 11 is not attracted to the cover sheet 66 either.

After the workpiece 11 is held by the holding base 60, the suction of the workpiece 11 (adhesive film 13) by the holding surface 10a of the chuck table 10 is stopped, and as shown in FIG. The linear motion mechanism 56 ( FIG. 1 ) raises the holding mechanism 54 . In addition, the first valve 74a is also closed at this time.

After that, the carrying-out side table 46 is moved to the area just above, and as shown in FIG. 6(A) , the holding mechanism 54 is lowered. Moreover, the 1st valve 74a is opened, and the 2nd valve 74b is made into a 1st state. Thereby, the fluid is supplied from the fluid supply source 72 between the holding surface 60a and the cover sheet 66, and the cover sheet 66 expands downward. In addition, the height of the holding mechanism 54 with respect to the holding surface 46a is adjusted within a range where the expansion (deformation) of the cover sheet 66 is not hindered by the holding surface 46a.

When the cover sheet 66 expands downward, the distance between the magnet 62 provided on the holding surface 60a and the workpiece 11 increases, and the attractive force acting between the magnet 62 and the workpiece 11 decreases. Therefore, in this state, for example, as shown in FIG. 6(B), if the valve 46c is opened and the negative pressure of the suction source 46d is applied to the holding surface 46a, the workpiece 11 ( The adhesive film 13 is adhered, and the workpiece 11 (the adhesive film 13 ) can be easily removed from the holding base 60 or the cover sheet 66 .

After the workpiece 11 is removed from the holding base 60 or the cover sheet 66, the holding mechanism 54 is raised. Also, the second valve 74b is switched to the second state. Thereby, the fluid between the holding surface 60a and the cover sheet 66 is discharged to the outside, and the cover sheet 66 is in close contact with the holding surface 60a. That is, the surface 66a of the cover sheet 66 reflects the shape of the holding surface 60a (substantially flat shape in this embodiment). Thereby, the workpiece 11 can be held again.

In addition, the discharge state of the fluid between the holding surface 60a and the cover sheet 66 can be determined from the pressure in the first flow path 70a measured by the pressure gauge 78 . For example, when the pressure in the first flow path 70a measured by the pressure gauge 78 is higher than a predetermined threshold value (or more than the threshold value), it is determined that fluid remains between the holding surface 60a and the cover sheet 66 .

In addition, when the pressure in the first flow path 70a measured by the pressure gauge 78 is equal to or less than a predetermined threshold value (or lower than the threshold value), it is determined that no fluid remains between the holding surface 60a and the cover sheet 66 . In addition, in a state where fluid remains between the holding surface 60 a and the cover sheet 66 , since the workpiece 11 cannot be properly held by the holding mechanism 54 , the conveying unit 52 can be made to stand by until the holding surface 60 a and the cover sheet 66 until the end of the fluid discharge between. When the fluid discharge between the holding surface 60a and the cover sheet 66 is completed, the surface 66a of the cover sheet 66 reflects the shape of the holding surface 60a.

As described above, the holding mechanism 54 of the workpiece 11 and the processing device 2 of the present embodiment are provided with the magnet 62 on the holding surface 60a of the holding base 60, and the magnet 62 generates an attractive force with the workpiece 11, so The workpiece 11 includes a material that exhibits ferromagnetism. Therefore, the workpiece 11 can be appropriately held by the attractive force with the magnet 62 .

Moreover, the holding mechanism 54 of the workpiece 11 and the processing device 2 of the present embodiment are provided with a release mechanism (release means) 64 that applies the release mechanism to the workpiece 11 held on the holding surface 60 a side of the holding base 60 . The force in the direction in which the face 60a leaves. Furthermore, the cover sheet 66 of this release mechanism 64 is provided with a convex portion (concave-convex structure) 66 b that suppresses suction of the workpiece 11 by the cover sheet 66 . Therefore, by applying force to the workpiece 11 by the release mechanism 64 , the workpiece 11 can be easily removed from the holding base 60 or the cover sheet 66 .

In addition, this invention is not limited to the description of the above-mentioned embodiment, Various changes can be made and implemented. For example, in the above-described embodiment, the surface 66a of the cover sheet 66 is provided with the convex portion (concave-convex structure) 66b so that the workpiece 11 can be easily removed from the cover sheet 66, but the present invention maintains the The cover sheet with which the mechanism is provided may be provided with a layer containing a peeling accelerator that promotes peeling of the workpiece 11 .

FIG. 7 is a partially enlarged cross-sectional view of a holding mechanism of a modification. In addition, most of the components of the holding mechanism of this modification are the same as the components of the holding mechanism 54 of the above-described embodiment. Therefore, the same components as those of the above-described holding mechanism 54 are assigned the same reference numerals and detailed descriptions thereof are omitted.

The release mechanism (release means) of the holding mechanism of the modification also includes the cover sheet 86 that covers the holding surface 60a. The material and the like of the cover sheet 86 are the same as those of the cover sheet 66 of the above-described embodiment. As shown in FIG. 7 , the surface 86a of the cover sheet 86 on the opposite side to the holding surface 60a is provided with a layer 86b containing a peeling accelerator that promotes peeling of the workpiece 11 .

The peeling accelerator used for the layer 86b is, for example, a fluororesin represented by polytetrafluoroethylene. By providing the layer 86b containing such a peeling accelerator on the surface 86a of the cover sheet 86, the workpiece 11 can be peeled from the cover sheet 86 without hindering the holding of the workpiece 11.

Also, for example, the size of the holding surface 60 a of the holding base 60 may be larger than the upper surface of the workpiece 11 . Moreover, for example, a pattern made of a conductive material can be formed on the surface of the cover sheet or the like. In this case, static electricity generated due to deformation of the cover sheet and the like can be suppressed. In addition, as the fluid supplied from the fluid supply source, a liquid such as water can be used. Furthermore, the holding mechanism of the present invention can also be used for a chuck table or the like of a processing apparatus.

In addition, the structure, method, etc. of the above-mentioned embodiment and modification can be changed suitably and implemented in the range which does not deviate from the objective of this invention.

2: Processing device (cutting device) 4: Abutment 4a: Opening 6: X-axis moving table 8: Dust-proof and drip-proof cover 10: Chuck table 10a: Keep Faces 12: Cutting unit (processing unit, processing means) 14: Support structure 16: Cutting unit moving mechanism 18: Y-axis guide 20: Y-axis moving board 22: Y-axis ball screw 24: Y-axis pulse motor 26: Z-axis guide 28: Z-axis moving board 30: Z-axis ball screw 32: Z-axis pulse motor 34: Cutting Blades 36: Nozzle 38: Camera 40: Carrying in the side table (loading table) 40a: Keep Face 42: Moving into the side table moving mechanism 44: Rails 46: Carry out the side table (unloading table) 46a: Keep Face 46b: flow path 46c: Valve 46d: Source of attraction 48: Move out the side table moving mechanism 50: Rails 52: Conveying unit (conveying means) 54: Keeping Means (Means of Keeping) 56: Linear motion mechanism (moving means) 58: Nozzle 60: Hold the abutment 60a: Keep Face 60b: Opening 62: Magnet 64: Release Mechanism (Release Means) 66: Cover Sheet 66a: face 66b: convex part (concave-convex structure) 68: Fixed frame 70a: first flow path 70b: Second flow path 72: Fluid supply source (fluid supply part) 74a: First valve 74b: Second valve 76: Ejector (Aspirator) 76a: Attraction mouth 76b: Supply port 76c: discharge port 78: Manometer 86: Cover sheet 86a: face 86b: Layer 11: Processed objects 13: Adhesive film

FIG. 1 is a perspective view showing a configuration example of a processing apparatus. Fig. 2 is a cross-sectional view showing a holding mechanism. FIG. 3 is a partial enlarged cross-sectional view of FIG. 2 . FIG. 4 is a perspective view showing the structure on the holding surface side of the holding base. FIG. 5(A) is a cross-sectional view showing the first step when the workpiece is carried out, and FIG. 5(B) is a cross-sectional view showing the second step when the workpiece is carried out. FIG. 6(A) is a cross-sectional view showing the third step when the workpiece is carried out, and FIG. 6(B) is a cross-sectional view showing the fourth step when the workpiece is carried out. FIG. 7 is a partially enlarged cross-sectional view of a holding mechanism of a modification.

60: Hold the abutment

60a: Keep Face

60b: Opening

62: Magnet

66: Cover Sheet

66a: face

66b: convex part (concave-convex structure)

Claims (4)

A holding mechanism for a processed object, which has: a holding base having a holding surface having a shape and size corresponding to a workpiece containing a material exhibiting ferromagnetic properties; a magnet, which is arranged on the holding surface of the holding base and generates an attractive force with the workpiece; and release means for applying a force in a direction away from the holding surface to the workpiece held on the holding surface side of the holding base by an attractive force generated between the magnet and the holding base, The means of release has: a cover sheet covering the holding surface; and a fluid supply unit that supplies fluid between the holding surface and the cover sheet, The surface of the cover sheet opposite to the holding surface is provided with: a concavo-convex structure that suppresses the adsorption of the workpiece by the cover sheet; or a layer containing a peeling accelerator that promotes the peeling The agent promotes the peeling of the workpiece from the cover sheet, The workpiece is held through the cover sheet by an attractive force with the magnet, and the cover sheet is expanded with the fluid supplied from the fluid supply unit, thereby causing separation from the holding surface force in the direction. As claimed in claim 1 for the holding mechanism of the processed object, wherein the releasing means further has: a first flow path connecting the holding surface and the fluid supply part; a valve, which is arranged in the first flow path; a second flow path that diverges from the first flow path through the valve; and An injector having a suction port connected to the holding surface side closer to the first flow path than the valve side of the first flow path, a supply port connected to the second flow path, and a supply port from the supply port A discharge port from which the supplied fluid is discharged, The valve can switch between a first state through which fluid is supplied between the holding surface and the cover sheet through the first flow path, and a second state through the second flow path Fluid is supplied to the supply port of the injector and negative pressure is generated at the suction port. A processing device comprising: A chuck table, which holds a workpiece containing a material that exhibits strong magnetic properties; a processing unit that processes the workpiece held on the chuck table; and conveying means for carrying the workpiece into the chuck table or carrying the workpiece out of the chuck table, This means of transport includes: a holding base, which has a holding surface whose shape and size correspond to the workpiece; a magnet, which is arranged on the holding surface of the holding base and generates an attractive force with the workpiece; and release means for applying a force in a direction away from the holding surface to the workpiece held on the holding surface side of the holding base by an attractive force generated between the magnet and the holding base, The means of release has: a cover sheet covering the holding surface; and a fluid supply unit that supplies fluid between the holding surface and the cover sheet, The surface of the cover sheet opposite to the holding surface is provided with: a concavo-convex structure that suppresses the adsorption of the workpiece by the cover sheet; or a layer containing a peeling accelerator that promotes the peeling The agent promotes the peeling of the workpiece from the cover sheet, The conveying means holds the workpiece through the cover sheet by the attractive force with the magnet, and expands the cover sheet with the fluid supplied from the fluid supply unit, thereby generating a The force that holds the direction in which the face leaves. The processing device of claim 3, wherein the releasing means further has: a first flow path connecting the holding surface and the fluid supply part; a valve, which is arranged in the first flow path; a second flow path that diverges from the first flow path through the valve; and An injector having a suction port connected to the holding surface side closer to the first flow path than the valve side of the first flow path, a supply port connected to the second flow path, and a supply port from the supply port A discharge port from which the supplied fluid is discharged, The valve can switch between a first state through which fluid is supplied between the holding surface and the cover sheet through the first flow path, and a second state through the second flow path Fluid is supplied to the supply port of the injector and negative pressure is generated at the suction port.

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