CN113707592A - Workpiece holding mechanism and machining device - Google Patents

Workpiece holding mechanism and machining device Download PDF

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Publication number
CN113707592A
CN113707592A CN202110527385.7A CN202110527385A CN113707592A CN 113707592 A CN113707592 A CN 113707592A CN 202110527385 A CN202110527385 A CN 202110527385A CN 113707592 A CN113707592 A CN 113707592A
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CN
China
Prior art keywords
workpiece
holding
holding surface
cover sheet
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110527385.7A
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Chinese (zh)
Inventor
福冈武臣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
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Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN113707592A publication Critical patent/CN113707592A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • B23Q3/154—Stationary devices
    • B23Q3/1543—Stationary devices using electromagnets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/92—Devices for picking-up and depositing articles or materials incorporating electrostatic or magnetic grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Jigs For Machine Tools (AREA)
  • Feeding Of Workpieces (AREA)

Abstract

The invention provides a holding mechanism and a processing device for a processed object, which can realize appropriate holding and simple removal of the processed object. The holding mechanism of the processed object comprises: a holding base having a holding surface whose shape and size correspond to a workpiece containing a ferromagnetic material; a magnet provided on a holding surface of the holding base, the magnet generating attraction force between the magnet and the workpiece; and a releasing member that applies a force in a direction away from the holding surface to the workpiece held on the holding surface side of the holding base by an attractive force generated between the releasing member and the magnet, the releasing member including: a cover sheet covering the holding surface; and a fluid supply unit that supplies a fluid between the holding surface and the cover sheet, wherein a surface of the cover sheet opposite to the holding surface is provided with a concavo-convex structure that suppresses adsorption of the cover sheet to the workpiece or a layer containing a peeling accelerator that accelerates peeling of the workpiece from the cover sheet.

Description

Workpiece holding mechanism and machining device
Technical Field
The present invention relates to a holding mechanism for holding a plate-shaped workpiece and a processing apparatus including the holding mechanism.
Background
When dividing a plate-shaped object to be processed, such as a semiconductor wafer or a package substrate, into a plurality of chips, a processing apparatus, such as a cutting apparatus or a laser processing apparatus, is used. These machining apparatuses are provided with a chuck table that sucks and holds a workpiece by a vacuum (negative pressure) generated by a pump or the like (see, for example, patent document 1).
The work is attracted to and held on the chuck table in a state where an adhesive tape called a dicing tape or the like is attached to a lower surface thereof, for example. In order to facilitate handling of the divided workpiece (a plurality of chips), an annular frame may be fixed to an outer peripheral portion of the adhesive tape.
In addition, since the adhesive tape used for dividing the workpiece is disposable, the processing cost is likely to increase. Therefore, a jig table or the like having a suction portion corresponding to each chip has been proposed so as to hold a divided workpiece (a plurality of chips) without using an adhesive tape (see, for example, patent documents 2 and 3).
On the other hand, in the jig table as described above, when the chip is miniaturized to some extent, the suction force acting on each chip is insufficient and the chip cannot be held properly. The same problem occurs with the conveyance unit that sucks, holds, and conveys the divided workpieces. In order to solve this problem, in recent years, the following holding mechanism has been proposed: the work (chip) is held by the magnetic force of the magnet, and the work is removed by expanding a cover sheet arranged so as to cover the magnet (see, for example, patent document 4).
Patent document 1: japanese patent laid-open publication No. 2004-200440
Patent document 2: japanese patent laid-open publication No. 2013-65603
Patent document 3: japanese patent laid-open publication No. 2014-116486
Patent document 4: japanese patent laid-open publication No. 2017-228617
However, since the cover sheet of the holding means is made of a soft resin such as rubber, when the object is pressed against the cover sheet by the strong magnetic force of the magnet, a vacuum is formed in the gap between the cover sheet and the object, or the surface tension of water remaining in the object is likely to act on the cover sheet. As a result, the object to be processed is adsorbed to the lid sheet, and the object may not be removed from the lid sheet even if the lid sheet is expanded.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a holding mechanism for a workpiece and a processing apparatus including the same, which can appropriately hold and easily remove the workpiece.
According to one aspect of the present invention, there is provided a workpiece holding mechanism including: a holding base having a holding surface whose shape and size correspond to a workpiece containing a ferromagnetic material; a magnet provided on the holding surface of the holding base, the magnet generating an attractive force between the magnet and the workpiece; and a releasing member that applies a force in a direction away from the holding surface to the workpiece held on the holding surface side of the holding base by an attractive force generated between the releasing member and the magnet, the releasing member including: a cover sheet covering the holding surface; and a fluid supply unit that supplies a fluid between the holding surface and the cover sheet, wherein an uneven structure that suppresses adsorption of the cover sheet to the workpiece or a layer containing a peeling accelerator that accelerates peeling of the workpiece from the cover sheet is provided on a surface of the cover sheet on a side opposite to the holding surface, the workpiece is held by an attractive force generated between the workpiece and the magnet via the cover sheet, and the cover sheet is expanded by the fluid supplied from the fluid supply unit to generate a force in a direction in which the workpiece is separated from the holding surface.
In one aspect of the present invention, it is preferable that the releasing member further includes: a 1 st flow path connecting the holding surface and the fluid supply unit; a valve provided in the 1 st flow path; a 2 nd flow path branched from the 1 st flow path via the valve; and an ejector having a suction port connected to the 1 st flow path at a position closer to the holding surface side than the valve, a supply port connected to the 2 nd flow path, and a discharge port for discharging the fluid supplied from the supply port, wherein the valve is switched between a 1 st state in which the fluid is supplied between the holding surface and the cover sheet through the 1 st flow path and a 2 nd state in which the fluid is supplied to the supply port of the ejector through the 2 nd flow path to generate a negative pressure in the suction port.
According to another aspect of the present invention, there is provided a processing apparatus including: a chuck table for holding a workpiece including a ferromagnetic material; a machining unit that machines the workpiece held by the chuck table; and a conveying member that carries the workpiece into and out of the chuck table, the conveying member including: a holding base having a holding surface whose shape and size correspond to the workpiece; a magnet provided on the holding surface of the holding base, the magnet generating an attractive force between the magnet and the workpiece; and a releasing member that applies a force in a direction away from the holding surface to the workpiece held on the holding surface side of the holding base by an attractive force generated between the releasing member and the magnet, the releasing member including: a cover sheet covering the holding surface; and a fluid supply unit that supplies a fluid between the holding surface and the cover sheet, wherein an uneven structure that suppresses adsorption of the cover sheet to the workpiece or a layer containing a peeling accelerator that accelerates peeling of the workpiece from the cover sheet is provided on a surface of the cover sheet on a side opposite to the holding surface, and the carrying member holds the workpiece via the cover sheet by an attractive force generated between the workpiece and the magnet, and expands the cover sheet by the fluid supplied from the fluid supply unit to generate a force in a direction in which the workpiece is separated from the holding surface.
In another aspect of the present invention, it is preferable that the releasing member further includes: a 1 st flow path connecting the holding surface and the fluid supply unit; a valve provided in the 1 st flow path; a 2 nd flow path branched from the 1 st flow path via the valve; and an ejector having a suction port connected to the 1 st flow path at a position closer to the holding surface side than the valve, a supply port connected to the 2 nd flow path, and a discharge port for discharging the fluid supplied from the supply port, wherein the valve is switched between a 1 st state in which the fluid is supplied between the holding surface and the cover sheet through the 1 st flow path and a 2 nd state in which the fluid is supplied to the supply port of the ejector through the 2 nd flow path to generate a negative pressure in the suction port.
A holding mechanism for a workpiece according to an aspect of the present invention includes a magnet on a holding surface of a holding base, the magnet generating an attractive force with the workpiece including a material exhibiting ferromagnetic properties. Therefore, the workpiece can be appropriately held by the attractive force generated between the magnet and the workpiece. Similarly, the machining device according to the other aspect of the present invention can appropriately hold the workpiece by the attractive force generated between the magnet and the machining device.
The workpiece holding mechanism according to one aspect of the present invention includes a releasing member that applies a force in a direction away from the holding surface to the workpiece held on the holding surface side of the holding base. The cover sheet of the release member is provided with a concavo-convex structure for suppressing adsorption of the cover sheet to the object to be processed or a layer containing a peeling accelerator for accelerating peeling of the object to be processed from the cover sheet.
Therefore, the workpiece can be easily removed from the holding base and the cover by applying a force to the workpiece by the release member. Similarly, the processing apparatus according to another aspect of the present invention can easily remove the object to be processed from the holding base and the cover plate.
Drawings
Fig. 1 is a perspective view showing a configuration example of a processing apparatus.
Fig. 2 is a sectional view showing the holding mechanism.
Fig. 3 is an enlarged sectional view of a portion of fig. 2.
Fig. 4 is a perspective view showing a structure of a holding surface side of the holding base.
Fig. 5 (a) is a cross-sectional view showing a 1 st step when the workpiece is carried out, and fig. 5 (B) is a cross-sectional view showing a 2 nd step when the workpiece is carried out.
Fig. 6 (a) is a cross-sectional view showing a 3 rd step when the workpiece is carried out, and fig. 6 (B) is a cross-sectional view showing a 4 th step when the workpiece is carried out.
Fig. 7 is an enlarged cross-sectional view of a part of a holding mechanism of a modification.
Description of the reference symbols
2: a machining device (cutting device); 4: a base station; 4 a: an opening; 6: an X-axis moving stage; 8: a dustproof drip-proof cover; 10: a chuck table; 10 a: a holding surface; 12: a cutting unit (machining unit, machining member); 14: a support structure; 16: a cutting unit moving mechanism; 18: a Y-axis guide rail; 20: moving the plate along the Y axis; 22: a Y-axis ball screw; 24: a Y-axis pulse motor; 26: a Z-axis guide rail; 28: moving the plate along the Z axis; 30: a Z-axis ball screw; 32: a Z-axis pulse motor; 34: a cutting tool; 36: a nozzle; 38: a camera; 40: a carry-in side table (loading table); 40 a: a holding surface; 42: a carry-in side table moving mechanism; 44: a guide rail; 46: a carry-out side table (unload table); 46 a: a holding surface; 46 b: a flow path; 46 c: a valve; 46 d: an attraction source; 48: a moving mechanism of the carry-out side table; 50: a guide rail; 52: a conveying unit (conveying member); 54: a holding mechanism (holding member); 56: a linear motion mechanism (moving member); 58: a nozzle; 60: holding the base; 60 a: a holding surface; 60 b: an opening; 62: a magnet; 64: a release mechanism (release member); 66: a cover sheet; 66 a: kneading; 66 b: a convex portion (concave-convex structure); 68: a fixing frame; 70 a: a 1 st flow path; 70 b: a 2 nd flow path; 72: a fluid supply source (fluid supply portion); 74 a: a 1 st valve; 74 b: a 2 nd valve; 76: an ejector (vacuum ejector); 76 a: a suction port; 76 b: providing a port; 76c, and (5 c): an outlet port; 78: a pressure gauge; 86: a cover sheet; 86 a: kneading; 86 b: a layer; 11: a workpiece; 13: and (4) bonding the tape.
Detailed Description
An embodiment according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of a machining device (cutting device) 2 according to the present embodiment. In the present embodiment, the machining device 2 that cuts a plate-shaped workpiece is described, but the machining device of the present invention may be a laser machining device that machines a workpiece with a laser beam, or the like.
As shown in fig. 1, the processing apparatus 2 includes a base 4 for supporting each structure. A rectangular opening 4a that is long in the X-axis direction (front-rear direction, machining feed direction) is formed in the center of the base 4. In the opening 4a are disposed: an X-axis moving table 6, an X-axis moving mechanism (moving means) (not shown) for moving the X-axis moving table 6 in the X-axis direction, and a dust-proof and drip-proof cover 8 for covering the X-axis moving mechanism.
A chuck table 10 for holding a plate-like workpiece 11 is provided above the X-axis moving table 6. As shown in fig. 1, the object 11 is, for example, a rectangular package substrate, a ceramic substrate, a glass substrate, a semiconductor wafer, or the like, which is made of a material such as iron, cobalt, or nickel, which exhibits ferromagnetic properties, and an adhesive tape (adhesive film) 13 is attached to the lower surface of the object 11.
However, the shape and the like of the workpiece 11 are not limited. For example, a disc-shaped package substrate or the like may be used as the object 11. Further, an annular frame (support member) or the like may be fixed to the outer edge portion of the adhesive tape 13. In this case, the workpiece 11 is supported by an annular frame or the like via the adhesive tape 13.
The chuck table 10 is connected to a rotation driving source (not shown) such as a motor, and rotates about a rotation axis substantially parallel to the Z-axis direction (vertical direction and height direction). Further, if the X-axis moving table 6 is moved in the X-axis direction by the X-axis moving mechanism, the chuck table 10 is also moved in the X-axis direction.
For example, when the workpiece 11 is carried into or out of the chuck table 10, the chuck table 10 is moved in the X-axis direction between a carrying-in/out area in front of carrying in/out of the workpiece 11 and a central processing area in which the workpiece 11 is processed. Further, when the workpiece 11 is machined, the chuck table 10 is moved in the X-axis direction (machining feed) in the machining area.
The upper surface of the chuck table 10 is formed in a shape corresponding to the workpiece 11 (in the present embodiment, a substantially flat rectangular shape), and serves as a holding surface 10a for holding the workpiece 11. The holding surface 10a is substantially parallel to the X-axis direction and the Y-axis direction (the left-right direction, the indexing direction), and is connected to a suction source (not shown) through a flow path (not shown) formed inside the chuck table 10.
A gate-shaped support structure 14 for supporting 2 sets of cutting units (processing units, processing members) 12 is disposed on the upper surface of the base 4 so as to straddle the opening 4 a. On the upper front surface of the support structure 14, 2 sets of cutting unit moving mechanisms 16 for moving the respective cutting units 12 in the Y-axis direction and the Z-axis direction are provided.
The cutting unit moving mechanisms 16 each have a pair of Y-axis guide rails 18 arranged on the front surface of the support structure 14 and parallel to the Y-axis direction. A Y-axis moving plate 20 constituting each cutting unit moving mechanism 16 is slidably attached to the Y-axis guide rail 18. On the back surface side (rear surface side) of each Y-axis moving plate 20, a nut portion (not shown) is provided, and a Y-axis ball screw 22 parallel to the Y-axis guide rail 18 is screwed into each nut portion.
A Y-axis pulse motor 24 is connected to one end of each Y-axis ball screw 22. If the Y-axis ball screw 22 is rotated by the Y-axis pulse motor 24, the Y-axis moving plate 20 moves in the Y-axis direction along the Y-axis guide 18.
A pair of Z-axis guide rails 26 parallel to the Z-axis direction are provided on the front surface (front surface) of each Y-axis moving plate 20. A Z-axis moving plate 28 is slidably attached to the Z-axis guide rail 26. On the back surface side (rear surface side) of each Z-axis moving plate 28, a nut portion (not shown) is provided, and a Z-axis ball screw 30 parallel to the Z-axis guide rail 26 is screwed into each nut portion.
A Z-axis pulse motor 32 is connected to one end of each Z-axis ball screw 30. If the Z-axis ball screw 30 is rotated by the Z-axis pulse motor 32, the Z-axis moving plate 28 moves in the Z-axis direction along the Z-axis guide rail 26.
A cutting unit 12 is provided below each Z-axis moving plate 28. The cutting unit 12 includes an annular cutting tool 34 attached to one end side of a spindle (not shown) serving as a rotating shaft. A nozzle 36 for supplying a cutting fluid (machining fluid) such as pure water is disposed in the vicinity of the cutting tool 34. A camera 38 for imaging the workpiece 11 held by the chuck table 10 is provided at a position adjacent to the cutting unit 12.
If the Y-axis moving plate 20 is moved in the Y-axis direction by each cutting unit moving mechanism 16, the cutting unit 12 and the camera 38 are moved in the Y-axis direction (indexed feed). Then, if the Z-axis moving plate 28 is moved in the Z-axis direction by each cutting-unit moving mechanism 16, the cutting unit 12 and the camera 38 are moved in the Z-axis direction.
A carry-in side table (loading table) 40 on which the workpiece 11 before machining is placed is disposed in a region on the one side of the opening 4a in the left-right direction on the front side of the support structure 14. The upper surface of the carry-in-side table 40 is formed in a shape (substantially flat rectangular shape in the present embodiment) corresponding to the workpiece 11, and is a holding surface 40a for holding the workpiece 11. The holding surface 40a is connected to a suction source (not shown) through a flow path (not shown) formed inside the carry-in-side table 40.
A carry-in-side table moving mechanism 42 for moving the carry-in-side table 40 to the upper side of the opening 4a is provided below the carry-in-side table 40. The carry-in-side table moving mechanism 42 has a pair of guide rails 44 extending from one region of the opening 4a toward the opening 4a, and moves the carry-in-side table 40 along the guide rails 44 by a force generated from an air cylinder or the like. Specifically, the carrying-in-side table 40 moves between a loading area located on one side of the opening 4a and adjacent to the carrying-in/out area and an area immediately above the carrying-in/out area.
A carry-out-side table (unloading table) 46 on which the processed workpiece 11 is placed is disposed in a region on the other side of the opening 4a in the left-right direction on the front side of the support structure 14. The upper surface of the carry-out-side table 46 is formed in a shape (substantially flat rectangular shape in the present embodiment) corresponding to the workpiece 11, and is a holding surface 46a for holding the workpiece 11. The holding surface 46a is connected to a suction source 46d (see fig. 6B) via a flow path 46B (see fig. 6B), a valve 46c (see fig. 6B), and the like.
A carrying-out-side table moving mechanism 48 for moving the carrying-out-side table 46 to the upper side of the opening 4a is provided below the carrying-out-side table 46. The carry-out-side table moving mechanism 48 has a pair of guide rails 50 extending from the other side region of the opening 4a toward the opening 4a, and moves the carry-out-side table 46 along the guide rails 50 by a force generated from an air cylinder or the like. Specifically, the carrying-out-side table 46 moves between an unloading area located on the other side of the opening 4a and adjacent to the carrying-in-and-out area and an area immediately above the carrying-in-and-out area.
In the present embodiment, the carrying-in side table 40 and the carrying-out side table 46 capable of sucking the workpiece 11 are exemplified, but the carrying-in side table and the carrying-out side table of the processing apparatus 2 may be configured to be capable of supporting at least the workpiece 11. That is, the carry-in side table and the carry-out side table may not necessarily be able to suck the workpiece 11.
A conveying unit (conveying member) 52 for conveying and replacing the workpiece 11 between the chuck table 10 and the carry-in side table 40 or the carry-out side table 46 is arranged further above the region immediately above. The conveyance unit 52 includes: a holding mechanism (holding member) 54 for holding the workpiece 11; and a linear movement mechanism (moving member) 56 that moves the holding mechanism 54 in the vertical direction. The details of the holding mechanism 54 will be described later.
A nozzle 58 capable of ejecting air downward is disposed between the opening 4a and the delivery-side table 46 and in a region above the delivery-side table 46. The nozzle 58 blows air to the workpiece 11 and the like on the carry-out side table 46 while the carry-out side table 46 holding the workpiece 11 moves from the directly above area to the unload area. This enables the cutting fluid adhering to the workpiece 11 and the like to be dried and removed.
Next, the holding mechanism 54 assembled to the conveyance unit 52 will be described in detail. Fig. 2 is a sectional view mainly showing the holding mechanism 54, and fig. 3 is an enlarged sectional view of a part of fig. 2. In fig. 2, some of the components are represented by functional blocks or symbols. As shown in fig. 2 and 3, the holding mechanism 54 of the present embodiment has a holding base 60 having a size corresponding to the workpiece 11 (a size capable of appropriately holding the entire upper surface of the workpiece 11). The holding base 60 is arbitrary in shape, but here is formed in a flat plate shape.
The lower surface of the holding base 60 is formed into a shape and size corresponding to the workpiece 11 (a shape and size capable of appropriately holding the entire upper surface of the workpiece 11, and in the present embodiment, is a substantially flat rectangle having a size equal to the upper surface of the workpiece 11), and serves as a holding surface 60a for holding the workpiece 11. Fig. 4 is a perspective view showing a structure of the holding base 60 on the holding surface 60a side. As shown in fig. 2, 3, and 4, the holding surface 60a is provided with a plurality of magnets 62.
Each magnet 62 is, for example, a permanent magnet or an electromagnet. As described above, since the workpiece 11 contains a material exhibiting ferromagnetism, an attractive force (magnetic force) can be generated between each magnet 62 and the workpiece 11 by bringing the holding surface 60a of the holding base 60 close to the workpiece 11. The workpiece 11 is held on the holding surface 60a side of the holding base 60 by the attractive force. The number, arrangement, and other conditions of the magnets 62 may be arbitrarily determined within a range capable of appropriately holding the workpiece 11.
The holding base 60 is provided with a release mechanism (release member) 64, and the release mechanism 64 applies a force in a direction away from the holding surface 60a to the workpiece 11 held by the holding base 60 so as to facilitate removal of the workpiece 11 from the holding base 60. The release mechanism 64 includes a flap 66 that covers the retaining surface 60 a.
The cover sheet 66 is formed in a film shape using a material such as rubber (natural rubber or synthetic rubber) or resin (e.g., vinyl chloride or polyolefin) having high stretchability and low air permeability (liquid permeability), and the cover sheet 66 is fixed to the holding base 60 by a fixing frame 68 surrounding the side portion of the holding base 60. In this way, by fixing the cover 66 to the entire circumference of the holding base 60 using the fixing frame 68, the gap between the cover 66 and the holding base 60 can be reduced, and airtightness can be improved.
As shown in fig. 3, a plurality of projections (concave-convex structures) 66b are formed on a surface 66a of the cover sheet 66 on the opposite side to the holding surface 60 a. The convex portions 66b are provided, for example, at positions corresponding to the respective chips obtained by dividing the workpiece 11 (positions at which the respective chips come into contact with each other), and suppress the suction of the cover sheet 66 to the workpiece 11.
That is, the surface 66a of the cover sheet 66 is provided with the projections 66b having the same number as or a number greater than the number of chips obtained by dividing the workpiece 11. In the present embodiment, the plurality of convex portions 66b are provided on the surface 66a of the cover sheet 66, but a plurality of concave portions (concave-convex structure) may be provided instead of the plurality of convex portions 66 b. In addition, both the convex portion 66b and the concave portion may be provided.
The size, shape, and the like of each convex portion 66b (or concave portion) are not also strictly limited. For example, when the projection 66b (or the recess) having a size (length in a direction parallel to the surface 66 a) of about 5% to 50% of the size (e.g., length of one side) of the chip obtained by dividing the workpiece 11 and having a step (length in a direction perpendicular to the surface 66 a) of about 50 μm to 500 μm is provided, the suction of the cover sheet 66 to the workpiece 11 can be appropriately suppressed without hindering the holding of the workpiece 11.
The holding surface 60a is formed with a plurality of openings 60b, and the openings 60b are connected to one end side of the 1 st channel 70 a. A fluid supply source (fluid supply unit) 72 for supplying a fluid is connected to the other end of the 1 st channel 70 a. The fluid supply 72 together with the flap 66 constitute the release mechanism 64. In the present embodiment, a gas such as air (air) is used as the fluid supplied from the fluid supply source 72.
A 1 st valve 74a and a 2 nd valve 74b for controlling supply of the fluid are provided on the fluid supply source 72 side of the 1 st flow path 70 a. The 1 st valve 74a on the upstream side controls supply of the fluid to the 2 nd valve 74b on the downstream side. Specifically, when the 1 st valve 74a is opened, fluid is provided from the fluid supply source 72 to the 2 nd valve 74 b. On the other hand, when the 1 st valve 74a is closed, no fluid is supplied from the fluid supply source 72 to the 2 nd valve 74 b.
The 2 nd valve 74b supplies the fluid supplied from the fluid supply source 72 to any one of one end sides (the holding surface 60a side and the opening 60b side) of the 1 st channel 70a and the 2 nd channel 70b branched from the 1 st channel 70a via the 2 nd valve 74 b. Specifically, when the 2 nd valve 74b is set to the 1 st state, the fluid is supplied to the one end side of the 1 st flow path 70 a. On the other hand, when the 2 nd valve 74b is set to the 2 nd state, the fluid is supplied to the 2 nd flow path 70 b.
For example, when the 1 st valve 74a is opened and the 2 nd valve 74b is brought into the 1 st state, the fluid is supplied between the holding surface 60a and the lid plate 66 through the 1 st flow path 70a, the opening 60b, and the like. As described above, the cover sheet 66 is made of a material having high stretchability and low air permeability (liquid permeability). Therefore, when fluid is supplied between the holding surface 60a and the cover sheet 66, the cover sheet 66 can be expanded downward (deformed into a curved surface shape).
An ejector (vacuum ejector) 76 is provided in the 2 nd flow path 70 b. The suction port 76a of the ejector 76 is connected to the 1 st flow path 70a between the 2 nd valve 74b and the opening 60b (one end). That is, the suction port 76a is connected to the 1 st channel 70a at a position closer to the holding surface 60a than the 2 nd valve 74 b. The fluid passing through the 2 nd valve 74b is supplied to the supply port 76b of the injector 76 through the 2 nd flow path 70 b. In addition, the fluid supplied from the supply port 76b to the inside of the ejector 76 is discharged to the outside of the ejector 76 through the discharge port 76 c.
For example, when the 1 st valve 74a is opened and the 2 nd valve 74b is set to the 2 nd state, the fluid flows from the supply port 76b toward the discharge port 76c of the ejector 76, and a negative pressure is generated in the suction port 76a of the ejector 76. Therefore, by utilizing this negative pressure, the fluid between the holding surface 60a and the cover sheet 66 can be discharged to the outside through the opening 60b, the 1 st channel 70a, the 2 nd channel 70b, and the like.
A pressure gauge 78 for measuring the pressure (in the present embodiment, the air pressure) in the 1 st channel 70a is provided at one end of the 1 st channel 70 a. By measuring the pressure in the 1 st channel 70a by the pressure gauge 78, it can be appropriately determined whether or not the fluid is sufficiently discharged between the holding surface 60a and the cover plate 66, for example.
Next, a method of conveying the workpiece 11 by using the conveying unit 52 will be described. In the present embodiment, a case where the workpiece 11 divided into a plurality of chips after the cutting process is carried out from the chuck table 10 to the carry-out side table 46 is described as an example, but the same applies to a case where the workpiece 11 before the cutting process is carried in from the carry-in side table 40 to the chuck table 10.
Fig. 5 (a) is a cross-sectional view showing a 1 st step when the workpiece 11 is carried out, fig. 5 (B) is a cross-sectional view showing a 2 nd step when the workpiece 11 is carried out, fig. 6 (a) is a cross-sectional view showing a 3 rd step when the workpiece 11 is carried out, and fig. 6 (B) is a cross-sectional view showing a 4 th step when the workpiece 11 is carried out.
When the workpiece 11 is carried out from the chuck table 10 to the carry-out side table 46, first, the position of the chuck table 10 is made to coincide with the carry-in and carry-out region, and the position of the carry-out side table 46 is made to coincide with a region other than the region immediately above (for example, an unload region). In addition, after the fluid between the holding surface 60a and the lid plate 66 is discharged, the 1 st valve 74a is closed.
Then, as shown in fig. 5 a, the holding mechanism 54 is lowered by the linear motion mechanism 56 (fig. 1), and the holding surface 60a of the holding base 60 is brought close to the upper surface of the workpiece 11 on the chuck table 10. As described above, the holding surface 60a is provided with the plurality of magnets 62. Therefore, when the holding surface 60a is brought close to the workpiece 11, attractive force is generated between the magnet 62 and the workpiece 11, and the workpiece 11 is held on the holding base 60 via the cover plate 66.
However, in the present embodiment, since the convex portions 66b are provided at positions corresponding to the respective chips on the surface 66a of the lid plate 66, even if the object 11 (chip) is strongly pressed against the surface 66a of the lid plate 66 by the attractive force acting on the magnet 62, the object 11 is not attracted to the lid plate 66.
After the workpiece 11 is held by the holding base 60, the suction of the workpiece 11 (adhesive tape 13) by the holding surface 10a of the chuck table 10 is stopped, and then the holding mechanism 54 is raised by the linear motion mechanism 56 (fig. 1) as shown in fig. 5B. In addition, the 1 st valve 74a is also closed at this time.
Thereafter, the carry-out-side table 46 is moved to the area directly above, and the holding mechanism 54 is lowered as shown in fig. 6 (a). Further, the 1 st valve 74a is opened, and the 2 nd valve 74b is set to the 1 st state. Thus, fluid is supplied from the fluid supply source 72 between the holding surface 60a and the patch 66, and the patch 66 swells downward. Further, the height of the holding mechanism 54 with respect to the holding surface 46a is adjusted to a range in which the expansion (deformation) of the cover sheet 66 is not hindered by the holding surface 46 a.
When the lid plate 66 is expanded downward, the distance between the magnet 62 provided on the holding surface 60a and the workpiece 11 is increased, and the attractive force acting between the magnet 62 and the workpiece 11 is decreased. Therefore, in this state, for example, as shown in fig. 6 (B), if the valve 46c is opened and the negative pressure of the suction source 46d is applied to the holding surface 46a, the work 11 (the adhesive tape 13) is easily sucked and held by the carry-out side table 46 and removed from the holding base 60 and the cover sheet 66.
After the workpiece 11 is removed from the holding base 60 or the cover plate 66, the holding mechanism 54 is raised. In addition, the 2 nd valve 74b is switched to the 2 nd state. Thereby, the fluid between the holding surface 60a and the cover sheet 66 is discharged to the outside, and the cover sheet 66 is brought into close contact with the holding surface 60 a. That is, the shape of the holding surface 60a (substantially flat shape in the present embodiment) is reflected on the surface 66a of the cover sheet 66. This enables the workpiece 11 to be held again.
Further, the discharge state of the fluid between the holding surface 60a and the cover 66 can be determined from the pressure in the 1 st flow path 70a measured by the pressure gauge 78. For example, when the pressure in the 1 st channel 70a measured by the pressure gauge 78 is higher than a predetermined threshold value (or equal to or higher than the threshold value), it is determined that the fluid remains between the holding surface 60a and the cover plate 66.
When the pressure in the 1 st channel 70a measured by the pressure gauge 78 is equal to or lower than a predetermined threshold value (or lower than the threshold value), it is determined that no fluid remains between the holding surface 60a and the cover plate 66. In a state where the fluid remains between the holding surface 60a and the cover sheet 66, the workpiece 11 cannot be held properly by the holding mechanism 54, and therefore the conveyance unit 52 may wait until the discharge of the fluid between the holding surface 60a and the cover sheet 66 is completed. When the discharge of the fluid between the holding surface 60a and the cover sheet 66 is completed, the shape of the holding surface 60a is reflected on the surface 66a of the cover sheet 66.
As described above, in the holding mechanism 54 for the workpiece 11 and the processing apparatus 2 according to the present embodiment, the holding surface 60a of the holding base 60 is provided with the magnet 62, and the magnet 62 generates an attractive force with the workpiece 11 including a ferromagnetic material. Therefore, the workpiece 11 can be appropriately held by the attractive force generated between the magnet 62 and the workpiece.
The holding mechanism 54 of the workpiece 11 and the processing apparatus 2 according to the present embodiment include a release mechanism (release member) 64, and the release mechanism 64 applies a force in a direction away from the holding surface 60a to the workpiece 11 held on the holding surface 60a side of the holding base 60. The lid 66 of the release mechanism 64 is provided with a projection (concave-convex structure) 66b that suppresses the suction of the lid 66 to the workpiece 11. Therefore, by applying a force to the workpiece 11 by the release mechanism 64, the workpiece 11 can be easily removed from the holding base 60 and the cover plate 66.
The present invention is not limited to the above-described embodiments, and can be implemented by various modifications. For example, in the above-described embodiment, the convex portion (concave-convex structure) 66b is provided on the surface 66a of the cover sheet 66 in order to easily remove the workpiece 11 from the cover sheet 66, but a layer containing a peeling accelerator that accelerates peeling of the workpiece 11 may be provided on the cover sheet provided in the holding mechanism of the present invention.
Fig. 7 is an enlarged cross-sectional view of a part of a holding mechanism of a modification. Most of the components of the holding mechanism of this modification are the same as those of the holding mechanism 54 of the above-described embodiment. Therefore, the same reference numerals are given to the components common to the holding mechanism 54 described above, and detailed description thereof is omitted.
The release mechanism (releasing member) of the holding mechanism of the modified example also includes a cover sheet 86 covering the holding surface 60 a. The material and the like of the cover sheet 86 are the same as those of the cover sheet 66 of the above embodiment. As shown in fig. 7, a layer 86b containing a peeling accelerator for accelerating peeling of the workpiece 11 is provided on a surface 86a of the cover sheet 86 opposite to the holding surface 60 a.
The peeling accelerator used in the layer 86b is, for example, a fluororesin typified by polytetrafluoroethylene. By providing the layer 86b containing such a peeling accelerator on the surface 86a of the cover sheet 86, the work 11 can be peeled off from the cover sheet 86 without hindering the holding of the work 11.
For example, the holding surface 60a of the holding base 60 may be larger than the upper surface of the workpiece 11. Further, for example, a pattern made of a conductive material may be formed on the surface of the cover sheet. In this case, the generation of static electricity accompanying the deformation of the cover sheet can be suppressed. Further, as the fluid supplied from the fluid supply source, a liquid such as water may be used. The holding mechanism of the present invention can be used for a chuck table of a machining apparatus.
The structures, methods, and the like according to the above-described embodiments and modified examples can be modified and implemented as appropriate without departing from the scope of the object of the present invention.

Claims (4)

1. A holding mechanism for a workpiece, comprising:
a holding base having a holding surface whose shape and size correspond to a workpiece containing a ferromagnetic material;
a magnet provided on the holding surface of the holding base, the magnet generating an attractive force between the magnet and the workpiece; and
a releasing member for applying a force in a direction away from the holding surface to the workpiece held on the holding surface side of the holding base by an attractive force generated between the releasing member and the magnet,
the release member has:
a cover sheet covering the holding surface; and
a fluid supply portion that supplies fluid between the holding surface and the lid plate,
a surface of the cover sheet on the side opposite to the holding surface is provided with a concavo-convex structure for suppressing adsorption of the cover sheet to the object to be processed or a layer containing a peeling accelerator for accelerating peeling of the object to be processed from the cover sheet,
the processed object is held by the attraction force generated between the processed object and the magnet via the cover sheet, and the cover sheet is expanded by the fluid supplied from the fluid supply unit to generate a force in a direction in which the processed object is separated from the holding surface.
2. The workpiece holding mechanism according to claim 1,
the release member further has:
a 1 st flow path connecting the holding surface and the fluid supply unit;
a valve provided in the 1 st flow path;
a 2 nd flow path branched from the 1 st flow path via the valve; and
an ejector having a suction port connected to the 1 st channel at a position closer to the holding surface side than the valve, a supply port connected to the 2 nd channel, and a discharge port for discharging the fluid supplied from the supply port,
the valve switches between a 1 st state in which fluid is supplied between the holding surface and the cover plate through the 1 st flow path and a 2 nd state in which fluid is supplied to the supply port of the ejector through the 2 nd flow path to generate a negative pressure in the suction port.
3. A processing apparatus, comprising:
a chuck table for holding a workpiece including a ferromagnetic material;
a machining unit that machines the workpiece held by the chuck table; and
a conveying member that carries the workpiece into and out of the chuck table,
the conveying member includes:
a holding base having a holding surface whose shape and size correspond to the workpiece;
a magnet provided on the holding surface of the holding base, the magnet generating an attractive force between the magnet and the workpiece; and
a releasing member for applying a force in a direction away from the holding surface to the workpiece held on the holding surface side of the holding base by an attractive force generated between the releasing member and the magnet,
the release member has:
a cover sheet covering the holding surface; and
a fluid supply portion that supplies fluid between the holding surface and the lid plate,
a surface of the cover sheet on the side opposite to the holding surface is provided with a concavo-convex structure for suppressing adsorption of the cover sheet to the object to be processed or a layer containing a peeling accelerator for accelerating peeling of the object to be processed from the cover sheet,
the carrying member holds the workpiece via the cover sheet by an attractive force generated between the workpiece and the magnet, and generates a force in a direction in which the workpiece is separated from the holding surface by expanding the cover sheet by the fluid supplied from the fluid supply unit.
4. The processing device according to claim 3,
the release member further has:
a 1 st flow path connecting the holding surface and the fluid supply unit;
a valve provided in the 1 st flow path;
a 2 nd flow path branched from the 1 st flow path via the valve; and
an ejector having a suction port connected to the 1 st channel at a position closer to the holding surface side than the valve, a supply port connected to the 2 nd channel, and a discharge port for discharging the fluid supplied from the supply port,
the valve switches between a 1 st state in which fluid is supplied between the holding surface and the cover plate through the 1 st flow path and a 2 nd state in which fluid is supplied to the supply port of the ejector through the 2 nd flow path to generate a negative pressure in the suction port.
CN202110527385.7A 2020-05-22 2021-05-14 Workpiece holding mechanism and machining device Pending CN113707592A (en)

Applications Claiming Priority (2)

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JP2020-089668 2020-05-22
JP2020089668A JP7463032B2 (en) 2020-05-22 2020-05-22 Workpiece holding mechanism and processing device

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Publication number Priority date Publication date Assignee Title
JP2004200440A (en) 2002-12-19 2004-07-15 Disco Abrasive Syst Ltd Substrate holding system
JP5947010B2 (en) 2011-09-15 2016-07-06 株式会社ディスコ Splitting device
JP2014116486A (en) 2012-12-11 2014-06-26 Disco Abrasive Syst Ltd Laser processing device
JP6371579B2 (en) 2014-05-12 2018-08-08 株式会社ディスコ Chuck table
US20160052145A1 (en) 2014-08-19 2016-02-25 GM Global Technology Operations LLC Conformable holding device
JP6441737B2 (en) 2015-04-28 2018-12-19 株式会社ディスコ Cutting equipment
JP6571379B2 (en) 2015-04-28 2019-09-04 株式会社ディスコ Cutting equipment
JP6707227B2 (en) 2016-06-02 2020-06-10 国立大学法人東京工業大学 Adsorption device, flying robot
JP6765751B2 (en) 2016-06-21 2020-10-07 株式会社ディスコ Work piece holding mechanism and processing equipment
JP7175628B2 (en) 2018-04-26 2022-11-21 株式会社ディスコ chuck table

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