TW201105710A - Heat resistant resin, composition thereof, resin/metal laminate and circuit board - Google Patents

Heat resistant resin, composition thereof, resin/metal laminate and circuit board Download PDF

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Publication number
TW201105710A
TW201105710A TW098142929A TW98142929A TW201105710A TW 201105710 A TW201105710 A TW 201105710A TW 098142929 A TW098142929 A TW 098142929A TW 98142929 A TW98142929 A TW 98142929A TW 201105710 A TW201105710 A TW 201105710A
Authority
TW
Taiwan
Prior art keywords
group
resistant resin
compound
bis
heat
Prior art date
Application number
TW098142929A
Other languages
English (en)
Chinese (zh)
Inventor
Katsunori Nishiura
Kazuyuki Fukuda
Masahiro Toriida
Toshihiko Takaki
Masanobu Ajioka
chao-bin He
Yang Xiao
Khine Yi Mya
Mohammad Abdul Wahab
Original Assignee
Mitsui Chemicals Inc
Agency Science Tech & Res
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc, Agency Science Tech & Res filed Critical Mitsui Chemicals Inc
Publication of TW201105710A publication Critical patent/TW201105710A/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02Phosphorus compounds
    • C07F9/547Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom
    • C07F9/6564Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms
    • C07F9/6581Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and nitrogen atoms with or without oxygen or sulfur atoms, as ring hetero atoms
    • C07F9/65812Cyclic phosphazenes [P=N-]n, n>=3
    • C07F9/65815Cyclic phosphazenes [P=N-]n, n>=3 n = 3
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/5399Phosphorus bound to nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
TW098142929A 2009-08-07 2009-12-15 Heat resistant resin, composition thereof, resin/metal laminate and circuit board TW201105710A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/003813 WO2011016094A1 (fr) 2009-08-07 2009-08-07 Résine thermorésistante, sa composition, stratifié résine/métal et carte de circuit imprimé

Publications (1)

Publication Number Publication Date
TW201105710A true TW201105710A (en) 2011-02-16

Family

ID=43544018

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098142929A TW201105710A (en) 2009-08-07 2009-12-15 Heat resistant resin, composition thereof, resin/metal laminate and circuit board

Country Status (2)

Country Link
TW (1) TW201105710A (fr)
WO (1) WO2011016094A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103467525B (zh) * 2012-06-07 2016-06-22 北京理工大学 双氧水氧化法制备六(4-羧基-苯氧基)-环三磷腈的方法
CN109679133A (zh) * 2018-12-10 2019-04-26 沈阳化工大学 一种阻燃型高性能聚酰亚胺气凝胶的制备方法
CN109679097A (zh) * 2018-12-25 2019-04-26 内蒙合成化工研究所 一种基于环磷腈的高阻燃性聚酰亚胺气凝胶的制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2980359B2 (ja) * 1990-04-16 1999-11-22 富士通株式会社 感光性耐熱樹脂組成物とそれを用いたパターン形成方法
JP2002265773A (ja) * 2001-03-15 2002-09-18 Canon Inc 熱可塑性樹脂組成物
JP2005047995A (ja) * 2003-07-30 2005-02-24 Kaneka Corp 難燃性を向上させた耐熱性樹脂組成物およびその利用
JP2006077064A (ja) * 2004-09-08 2006-03-23 Kaneka Corp 新規ポリイミド、ポリイミド樹脂組成物、およびそれを用いた難燃性樹脂組成物、並びにポリアミド酸
JP2006124685A (ja) * 2004-09-29 2006-05-18 Ube Ind Ltd Cof用ポリイミドフィルムおよび積層体
JP5170510B2 (ja) * 2007-03-30 2013-03-27 株式会社伏見製薬所 反応性基含有環状ホスファゼン化合物およびその製造方法
JP5289309B2 (ja) * 2007-05-11 2013-09-11 三井化学株式会社 樹脂組成物、ドライフィルム、およびそれから得られる加工品

Also Published As

Publication number Publication date
WO2011016094A1 (fr) 2011-02-10

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