TW201102240A - Method for directly forming knife mold through one-time etching and knife mold formed by such a method - Google Patents

Method for directly forming knife mold through one-time etching and knife mold formed by such a method Download PDF

Info

Publication number
TW201102240A
TW201102240A TW098122864A TW98122864A TW201102240A TW 201102240 A TW201102240 A TW 201102240A TW 098122864 A TW098122864 A TW 098122864A TW 98122864 A TW98122864 A TW 98122864A TW 201102240 A TW201102240 A TW 201102240A
Authority
TW
Taiwan
Prior art keywords
metal plate
blade
corrosion
die
line
Prior art date
Application number
TW098122864A
Other languages
English (en)
Chinese (zh)
Other versions
TWI357376B (enExample
Inventor
Lai-Ju Cai
Original Assignee
Lai-Ju Cai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lai-Ju Cai filed Critical Lai-Ju Cai
Priority to TW098122864A priority Critical patent/TW201102240A/zh
Priority to JP2009186588A priority patent/JP2011016217A/ja
Priority to US12/550,071 priority patent/US20110006187A1/en
Publication of TW201102240A publication Critical patent/TW201102240A/zh
Application granted granted Critical
Publication of TWI357376B publication Critical patent/TWI357376B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22Removing surface-material, e.g. by engraving, by etching
    • B44C1/227Removing surface-material, e.g. by engraving, by etching by etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44BMACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/02Dies; Accessories
    • B44B5/026Dies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • ing And Chemical Polishing (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW098122864A 2009-07-07 2009-07-07 Method for directly forming knife mold through one-time etching and knife mold formed by such a method TW201102240A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW098122864A TW201102240A (en) 2009-07-07 2009-07-07 Method for directly forming knife mold through one-time etching and knife mold formed by such a method
JP2009186588A JP2011016217A (ja) 2009-07-07 2009-08-11 一回のエッチングによりダイカットを直接形成する方法及びその方法により形成されたダイカット
US12/550,071 US20110006187A1 (en) 2009-07-07 2009-08-28 Method of forming a knife mold by etching once and the knife mold formed by the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098122864A TW201102240A (en) 2009-07-07 2009-07-07 Method for directly forming knife mold through one-time etching and knife mold formed by such a method

Publications (2)

Publication Number Publication Date
TW201102240A true TW201102240A (en) 2011-01-16
TWI357376B TWI357376B (enExample) 2012-02-01

Family

ID=43426770

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098122864A TW201102240A (en) 2009-07-07 2009-07-07 Method for directly forming knife mold through one-time etching and knife mold formed by such a method

Country Status (3)

Country Link
US (1) US20110006187A1 (enExample)
JP (1) JP2011016217A (enExample)
TW (1) TW201102240A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014052296A1 (en) * 2012-09-25 2014-04-03 Rubicon Technology, Inc. Method for creating atomically sharp edges on objects made of crystal material
CN104827792A (zh) * 2015-06-04 2015-08-12 上海希尔彩印制版有限公司 一种电子标签中的天线图案制作方法
CN105196771A (zh) * 2015-08-25 2015-12-30 广德竹之韵工艺品厂 一种手工竹刻工艺
CN110497473A (zh) * 2019-07-26 2019-11-26 深圳市三利谱光电科技股份有限公司 一种异形刀模及其制备方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2190236A (en) * 1939-11-08 1940-02-13 King Bernard Compressing mold for ground meat or the like
US2823468A (en) * 1954-11-23 1958-02-18 Mora Antonio Paper holder and stylus for producing raised characters of the braille system
US3618438A (en) * 1968-11-06 1971-11-09 Walter A Simson Cutting
US3850059A (en) * 1973-01-08 1974-11-26 Chempar Corp Die and method for cutting labels and the like
DE3047886A1 (de) * 1979-12-20 1981-10-29 The Fujikura Cable Works, Ltd., Tokyo Verfahren zur herstellung eines stanzwerkzeugs und nach diesem verfahren hergestelltes stanzwerkzeug
US5181464A (en) * 1990-04-10 1993-01-26 Ncm International, Inc. Unitary paper impression device
JPH0813164A (ja) * 1994-06-30 1996-01-16 Toppan Printing Co Ltd 金属板のパターンエッチング方法
JP3477254B2 (ja) * 1994-09-19 2003-12-10 株式会社タカノ機械製作所 抜き型の製造方法および抜き型
US5722319A (en) * 1995-07-07 1998-03-03 Atena Corporation Embossed pattern stamping apparatus
JPH1133999A (ja) * 1997-07-22 1999-02-09 Yuukoushiya:Kk ラベル打ち抜き用刃型とその製造方法
JP2000294535A (ja) * 1999-04-08 2000-10-20 Sony Corp 気相加工方法及びその装置
MXPA02002495A (es) * 1999-09-09 2004-09-10 Universal Engraving Inc Estampas de impresion de artes graficas laminadas no-ferrosas/ferromagneticas y metodo para producir las mismas.
US6270122B1 (en) * 1999-10-22 2001-08-07 Timer Technologies, Llc Irreversible thin film display with clearing agent
CN1264660C (zh) * 2000-12-28 2006-07-19 株式会社塚谷刃物制作所 柔性模具及其制造方法
US6994024B2 (en) * 2002-09-16 2006-02-07 Ellison Educational Equipment, Inc. Embossing system to be used with a die press
US7127987B2 (en) * 2004-08-09 2006-10-31 W+D Machinery Company, Inc. Two-piece die for simultaneously cutting and embossing
TWM274261U (en) * 2005-02-03 2005-09-01 Chia-Shun Lee Mold set for paper embossment
US7435316B2 (en) * 2005-06-08 2008-10-14 The Procter & Gamble Company Embossing process including discrete and linear embossing elements
US7104192B1 (en) * 2005-10-07 2006-09-12 Ellison Educational Equipment, Inc. Hinged cover for a cutting and embossing die set

Also Published As

Publication number Publication date
JP2011016217A (ja) 2011-01-27
TWI357376B (enExample) 2012-02-01
US20110006187A1 (en) 2011-01-13

Similar Documents

Publication Publication Date Title
JP3222100B2 (ja) パーフオーレーション及びスリッティング用ダイスシートの製法及びそれにより作られた紙製品
ES2289257T3 (es) Procedimiento de huecograbado en acero para la fabricacion de un documento de seguridad, asi como placa de huecograbado en acero y producto semiacabado para la misma, y procedimiento para su fabricacion.
TW524736B (en) Flexible die and method for its manufacture
TW201102240A (en) Method for directly forming knife mold through one-time etching and knife mold formed by such a method
CN101419402B (zh) 一种硬质合金冲压模具的制作方法
CN108048841A (zh) 一种铭牌加工方法
CN101942660A (zh) 利用一次蚀刻直接形成刀模的方法及该方法所形成的刀模
US7469634B2 (en) Apertured media embellishing template and system and method using same
JP3159438U (ja) ベース基材付押圧加工用型
CN201610035U (zh) 刀模、刀模组及一种可移位重组的刀模组
US5843250A (en) Method of forming an image pattern on a die plate
JP3155349U (ja) ダイカッター及びダイカッターセット
US20040020328A1 (en) Method for manufacturing cutter mold
US20110303105A1 (en) Multi-Tiered Non-Apertured Media Embossing and Cutting Template
JP7847739B2 (ja) 押圧加工用版の製造方法、及び、その製造方法により製造された押圧加工用版を用いて被加工物を加工する被加工物の加工方法
JP2004268552A (ja) 微細エンボス加工方法及び装置
JP4319765B2 (ja) ミシン刃の製造方法
JP5005663B2 (ja) フレキシブルダイ
JP6323891B1 (ja) 金属製の装飾用シールとその製造法
WO2014065847A2 (en) Multi-function media embellishing die
JP6299201B2 (ja) 伝票
TW490379B (en) Method for making moulds having stereoscopic patterns
JP2010030040A (ja) 打抜機のカッティングプレートへの面版の取り付け方法及びこの方法に使用される転移位置決め治具
JPH1133999A (ja) ラベル打ち抜き用刃型とその製造方法
JP2023043119A (ja) 押圧加工用版の製造方法、及び、その製造方法により製造された押圧加工用版、並びに、その押圧加工用版を用いて被加工物を加工する加工方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees