201044483 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種載台清潔器以及具備其之描繪裝置及 基板處理裝置。 【先前技術】 '於光罩相關領域，例如描繪及曝光步驟、平坦度測定、 座標測定等’被指出將空白光罩或光罩、或其基板保持於 載台時只要有稍微歪斜，就會導致位置偏差之不良及測定 ^ 精度之不良。 即，於光罩之製造中，使用電子束或雷射將特定之設計 圖案描繪於空白光罩之描繪步驟，或使用特定之光罩於被 轉印體之基板進行曝光之曝光步驟中，若保持於載台之空 白光罩或作為被轉印體之基板有歪斜，則圖案將產生位置 偏差。又，於光罩之平坦度測定或座標測定時，若保持於 載σ之光罩有歪斜現象’則測定精度將下降。 〇 料於載台之狀態之光罩或被轉印基板歪斜之原因，係 考慮載台表面之歪斜與載台上之異物。因此，先前，不會 產生歪斜地保持基板之基板保持裝置已開發問世。 曰本特開2005-101226號公報（專利文獻1}中，記載有一 種基板保持裝置，其構成係於載台之上面具備凸部與用於 向基板之下面吹送氣體之噴出孔，凸部具有局部地載置基 板之載置面與保持基板之保持機構，且向基板之下面吹送 之氣體係朝水平方向排氣。藉由該構成，從下方朝基板吹 送氣體，可減少因本身重量所產生之基板之撓曲。又，因 146082.doc 201044483 凸 介 由 部之故與基板之接觸面積減小，可 入垃圾等異物而造成基板撓曲之問題。基板之間 又，用於除去載台上之異物之載台表面之清潔 作業者以手工作業進行。 、先别係 【發明内容】 專利文所記載之技術m上有異物存 在…藉由減少基板與載台之接觸㈣，雖可減少該里物 對空白先罩等歪斜所造成之影響，但並非減少該異物本身 者。料，前料利讀法巾，料料基板於水 平之空氣吹送之控制並不容易。 、又’伴隨近年之光罩之大型化’描搶裝置或檢查褒置之 载σ亦大型化’以手卫作業充分潔淨載台變得有困難。此 外，因以手工作業潔淨廣大範圍，作業者係親身作業，故 亦存在因其作業姿勢而自作業者處產生異物卩而污染載 台之問題。 另外，近年，液晶顯示裝置等顯示裝置製造用光罩（所 明FPD光罩）正朝大型化發展，#此之光罩之製造及檢查所 使用之裝置本體亦顯著大型化。例如，基板之大小即使為 一邊超過1 m之矩形之情形亦不少見，為對應於各種各樣 尺寸别述名置之載台有必要為例如一邊為1 · 5 m以上 之狀態。 ;如此大之載台載置基板，圖案之描繪或形成之圖案的 座標位置精度之測定等乃成為必要。但，於廣大之載台上 有異物附著時’描繪時會發生因異物所造成之圖案位置精 146082.doc 201044483 度異常，又，於座標位置精度測定時，也會發生檢測出座 標移位異常等問題。除此之外，因異物而於基板背面產生 裂紋及損傷之機率也比先前更高，故品質管理上亦成為一 大問題。 , 如此之狀況下，以沾吸有洗淨液之布類等藉由人手清潔 之方法不僅困難，且不確實、不穩定。 本發明之目的在於提供一種能確實地減少描繪裝置或檢 4裝置等基板處理裝置所使用之載台上的異物之載台清潔 器。 ’、 為達成前述目的，本發明人等專心研究高效率確實地除 去載台上之異物之方法，結果發想出一種基板處理裝置， 其使用載台清潔器可除去載台上之異&，該载台清潔器具 備’具有與載台之基板載置面對向的平滑平面之清潔板、 使：述清潔板於前述载台上上浮特定高度之上浮機構、及 Ο 使別述清潔板於平行於前述载台之基板載置面之面内移動 之驅動機構。 卜又發心到藉由该載台清潔器向板狀之清潔板盥载 台之間送人空氣等氣體，使之存在特定壓力之氣體，藉此 保持板狀構件與載台之㈣於—定，藉由於該狀態下使板 狀構件移動，而以板狀構件之端部除去載台上之異物。 :、，本發明之-態樣之載台清潔器，係具備具有至少一 二通孔之板狀構件、及經由前述貫通孔從前述板狀構件 -面侧向另—面側給送氣體之送風制，心除去載台 上之’、物者’其係在使前述载台表面與前述另一面對 1460S2.doc 201044483 =由前述送風機構送風之狀態下，將前述板 =-面與前述載台表面隔以特定間隔之方，二 使别述板狀構件於與前述 精由 前述载台表面上之之面⑽動，而將 而除去。 〃物精由前述板狀構件之端部予以推出 下’較好的是進—步具有調節從 氣體之送風詈之详！ΪΤ袖β 叹傅、‘0运之 ^ 、调卽機構，藉由以前述送風調節| Μ 調節前述送風詈，而姻…、， 列即機構 而調即珂述特定間隔之大小。此 通孔亦可形成於前述板 卜，貫 狀構件之中心，貫通孔亦可複數报 成於距離前述板狀構件之中心等距離之位置。 ， 本么月之另-恶樣之載台清潔器係具備 一個第1貫通孔及至少— '、’’ 個弟2貝通孔之板狀構件、纽 述第1貫通孔從前述板狀構件之一面 /由則 體之送風機構、及…… 另一面側給送氣 二 則述第2貫通孔從前述板狀構件之 月1J述·另 面側向lifr 4ilf ~n 、， ]〇別述—面側吸引氣體之吸氣機構者；政你 在使前述載台表面盥前 ’、糸 n B ^ ^引述另一面對向，由前述送風機構送 、冓及乳之狀態下，將前述板狀構件以前 ’L 〜刖述載台表面隔以特定間隔之方式配置 ί前述板狀構件於與前述載台表面平行之面内移動，^ 月ό述載台表面上之昱物難 > 、 ”物糟由則；4板狀構件之端部 而除去。 催出 忒情形下’較好的是進一步具有調節從送風機構送風之 氣體之达風量或由吸氣機構吸氣之㈣Μ氣量中之ρ 方之調即機構’藉由以前述調節機構調節前述送風量或 146082.doc 201044483 前述吸氣量中之至少一方，而士苗二、j_、& & 乃而D周即刖述特定間隔之大小。 又，第ί貫通孔或第2貫通孔中之任意—方亦可形成於前述 板狀構件之中心，第！貫通孔或第2貫通孔亦可複數形成於 ㈣前述板狀構件之中心等距離之位置。此外，較好的是 進而具備用於吸引異物之第3貫通孔。 又’於前述载台清潔器，較好的是板狀構件之端部之至 少一個具有彎曲狀凹陷之部分。 〇 本發明又提供—種具備前述載台清潔器之描繪裝置，前 述載台清潔器可於前述描繪裝置之载台表面之垂直方向移 此外，本發明還提供以下之基板處理裝置。 ❹ 一種基板處理裝置’其係、於載台上載置基板，於該狀態 下對基板實施處理者；具有除去前述載台上之異物之載台 清潔器，前述載台清潔器具備：具有與載台之基板載置: 對向的平滑平面之清潔板、使前述清潔板於前述载台上上 洋特定高度之上浮機構及使前述清潔板於平行於前述載台 之基板載置面之面内移動之驅動機構。 則述上浮機構’宜為控制前述清潔板於前述載台上上浮 1〜之高度。較好為卜⑽㈣，更好的是卜5〇叫。 别述/月潔板為平板狀，其·τ面側之端部宜為9〇。以 下之角度，形成為直角或銳角。更好的是7〇〜9〇。。 别述上浮機構，係於前述清潔板與前述載台之基板載置 ，對向之狀態下’藉由使氣體從設於前述清潔板下面側之 孔體送風孔喷出，而使前述清潔板上浮特定高度者。該孔 146082.doc 201044483 可為貫通板之貫通孔。 前述上浮機構係可使氣體從前述送風孔噴出，且從設於 前述清潔板下面側之吸氣孔吸氣，藉由控制氣體之喷出量 與吸氣量’使前述清潔板上浮特定高度者。該吸氣孔亦可 為板之貫通孔。 前述基板處理裝置之用途並無特殊限制，例如，若為具 備用於對前述基板描繪特定設計圖案資料之描繪頭者時， 本發明之效果尤為顯著。 或者，亦可為具有對於前述基板，測定形成於基板上之 特定轉印圖案之形狀，或測定任意點之距離之敎機構之 檢查裝置。 本發明之載台清潔器，因藉由向板狀構件與載台之間給 送氣體，而保持板狀構件與載台之間隙於—定，藉由於該 狀態下使板狀才冓件㈣而以板狀構件之端冑除去載台上： 異物，故可高效率確實地除去載台上之異物。 #據本發月，彳使用板狀構件與載台之間之間隙物 理性除去異物，此外，#由控制氣流之供給與吸氣 制間隙間@ ’具有可將欲除去之異物之大小定量化而除: 之優點。因此，可古丄今.玄.α认丄，必 異物 J円效率地除去判斷為影響到製品性能之 【實施方式】 明 非 以下，使用圖式 。又，該等圖式 限制本發明之範 、實施例等對本發明之實施形態進行說 、實施例等及說明係例示本發明者，並 圍者。毫無疑問，與本發明之主旨—致 146082.doc 201044483 之其他實施形態亦屬於本發明之範_。 圖1係用於說明本發明之實施形態之载台清潔器之圖。 圖1⑷係顯示配置於載台1〇上之載台清潔器之平面圖。裁 . 纟清潔11係包含具有貫通孔11之板狀構件（以7亦稱為扣 . 4清潔板)12、與使板上浮特定量之上浮機構，上浮機構 具備從貫通孔11給送空氣之送風機構（未圖示）。貫通孔^ 實質性地形成於板12之中央。圖1(b)係圖1⑷之祕剖面 〇 之剖面圖。於圖1⑷及⑻中，箭頭表示空氣之送風方向。 於圖1(b)中，藉由未圖示之送風機構，從貫通孔^之上給 送空氣，空氣通過貫通孔n，送至板12之下側，並等向性 地擴散於板12之下面與载台1〇之上面之間。圖！⑷之箭頭 表不給送之空氣於板12之下面與載台10之上面之間等向性 擴散之態樣。藉由該送風機構之送風，保持板12之下面距 離载台表面一定間隔（以下亦稱為由空氣層形成之間 隙）4氣層形成之間隙於圖1(b)中以g表示4氣層形成 ◎ 之間隙§之大小雖根據作為目的之異物而改變，作宜為 1〜5〇〇μιη，較好為，更好為^50^^。 ’ 又’由該貫通孔送風之空氣宜經過渡成不包含異物等粒 子，較好為過遽至不包含〇.! μηι以上，更好為不包含_ μη^以上之異物。又，由該貫通孔送風之空氣之溫度，宜 以不於板U產生溫度分布而造成變形之方式，相對於板Η =後之環境溫度\維持在㈣以下之差。此外較好為 •以下之差。每疋因為’雖亦根據板12所使用之材料 之線膨脹係數與板12之尺寸或力^狀而定，但送風之空 I46082.doc 201044483 氣所通過之間隙面與其相反側之面的溫度差較 下，溫度所造成之膨脹量於各面不同，而將會於: 歪斜。 i玍 例如，於載台表面上存在異物13之情形下，如圖 所示’若使板於與載台10表面平行之面内，朝向異物二 =向移動’則板12之端部接觸於異物13。該狀態下持續 移動板U，異物13將從載台1〇表面上被推出而除去。又，、 =物即使不完全除去亦可，例如亦存在如圖i⑷所示，藉 反12端部削取異物13 ’尸、將削取部分14推出、除去之产 形下，殘存之異物15係以具有與空氣層所形成： ，、问度g相同之高度，而殘存於载台1〇表面上。但， 台10上之異物’於其上載置有空白料等之情 =響到描繪或曝光時有必要除去，但影響以、到幾乎不 二隙則t除去之必要。因此，若藉由調節空氣層所形成 光B之w度g ’使殘存異物15之高度為不影響描繪或曝 問之高度，則該殘存異物15即使殘留於载台10上亦無 則述板之於水平面内之移動，係藉由驅動機構進行及控 列如’可述載台清潔器於搭載於騎裝置之情形下， 裝=與將描繪頭於平面上X方向及Υ方向驅動之ΧΥ驅動 叙動之方式安裝。又’载台清潔器之板，宜以容許上 移動之方式安裝以可作上浮之動作。 異:據圖1戶:δ兄明之載台清潔器，可確實地除去載台上之 τ確實地減少例如描綠裝置或檢查裂置之載台上之 J4^2.d〇c •10- 201044483 異物所造成之對描”驟或曝光步驟之圖案精度之影響。 又’因向板12與載台1()之間給送氣體，可保持板12與載台 10之間隙於—定，故即使載台10存在微小之歪斜亦可保持 間隙於-定’不會使板12與載㈣接觸而損傷載台10表 面。 〇 〇 又，板12係使用至少下面（與載台10對應之面）加工成平 滑平面之”等或花岗^也可為氧化料具有緻密面之 陶竟’或可為多孔質之陶竟。至少板之下面側，宜由適度 剛性之素材構成。或是，亦可使用硬紹或其他銘合金^ 剛性金屬，其平面易加工成平滑，且因揚氏模數亦高之 故，使用中因某些原因變形之虞較少。 以上材料可分別組合使用。與載台對面之側，係使用可 容易地獲得平滑面，且剛性高之H切物等，背面因有 必要進行連翻於吸排氣之管，或將板12本身固定於以 之故，有必要進行精細加工’因此亦可為加工性高之金屬 之合金。 板ί下面側端部除推出異物整體外，亦可只推出異物之 :定南度以上之部分。因此，下面側端部之形狀，宜為直 角或銳角，例如為70〜90度。 貫通孔，非只限定於板12之中央部當為複數之貫通 孔U且對於各個貫通孔11等量送風之情形下，複數之貫通 孔11宜以使板12於水平方向取得 貝通 離板12之中央部等距離之位置）。、/配置（例如距 又，亦可進—步具備調節送風機構之氣體之送風量之送 146082.doc 11 201044483 風調節機構。藉由送風調節機構調節氣體 節氣體層形成之間隙之高度g，使板上浮。 飞調 又’載台10係例如於描繪裝置或檢查裝置等之十將* 白光罩或基板載置固定於其上者。 二 其次，使用圖2說明本發明之另一實施形態。於圖2,對 與圖1相同者標以相同符號。 圖2係用於說明本發明之另—實施形態之載台m之 圖。圖2⑷係顯示配置於载台1〇上之載台清潔器之平面 圖。載台清潔器係包含且古势，奇2 匕否具有第1貫通孔丨“與彳個第2貫通孔 W之板12、從第1貫通孔⑽送空氣之送風機構（未圖 示)/及從第2貫通孔⑽吸入空氣之吸氣機構（未圖示）。 第1貫通孔11 a係實皙卜花（士、& > ,。 /成於板12之中央。圖2(b)係圖 =现爛面之剖面圖。於叫）及附，箭頭係表 不工範之达風方向。於圖2⑻中’自未圖示之送風機構從 第1貫通孔ila之上給送空氣’空氣將通過^貫通孔山送 至板12之下側，且等向性地擴散於板12之下面與載台1〇之 上面之間。圖2⑷之箭頭表示給送之空氣於板以下面與 載台10之上面之間等向性地擴散之態樣。 第2貫通孔m以包圍第】貫通孔lla之方式形成4個等 向性地擴散於板12之下面與載台1〇之上面之間的空氣，係 經由第2貫通孔lib藉由未圖示之吸氣機構吸氣。 藉由該送風機構之空氣之送風量，與吸氣機構之六氣之 吸氣量之平衡’將板12之下面與載台1〇表面間維持一定間 Μ空氣層形成之間隙）並予保持。空氣層形成之間隙㈣ 146082.doc -12- 201044483 2(b)中係以g表示。空氣層形成之間隙g之大小雖根據用途 而改變’但如第1態樣所述，可為1〜500 μηι 〇 載台10表面上有異物之情形下，藉由使板12於與載台1〇 表面平行之面内’向異物方向移動，而利用板12之端部將 異物從載台1 〇表面上推出或削取之動作，係與使用圖丨（b)_ (d)之前述說明之情況相同。 根據以圖2說明之載台清潔器，可確實地除去載台上之 異物，可確實地減少例如描繪裝置或檢查裝置中載台上之 異物所造成之對描繪步驟或曝光步驟中之圖案精度之影 響又’因藉由將氣體給送於板12與載台1 〇之間，保持板 12與載台10之間隙於一定，故即使載台1〇有微小之歪斜亦 可保持間隙於一定，不會使板12與載台1〇接觸而損傷載台 1 〇表面。 又，板12係採用至少下面（與載台1〇對應之面）經平坦加 工之陶瓷等之方面，亦與前述相同。201044483 VI. Description of the Invention: [Technical Field] The present invention relates to a stage cleaner, a drawing device provided therewith, and a substrate processing apparatus. [Prior Art] 'In the field of photomasks, such as drawing and exposure steps, flatness measurement, coordinate measurement, etc.' is pointed out that as long as there is a slight skew, the blank mask or mask or its substrate is held on the stage. Defects in positional deviation and measurement accuracy. That is, in the manufacture of the photomask, a specific design pattern is drawn by the electron beam or laser in the drawing step of the blank mask, or in the exposure step in which the specific mask is used to expose the substrate of the transfer body, When the blank mask held on the stage or the substrate as the transfer target is skewed, the pattern will be displaced. Further, in the measurement of the flatness of the mask or the measurement of the coordinates, if the mask of the σ is held, the measurement accuracy is lowered. The reason why the mask or the substrate to be transferred is skewed in the state of the stage is to consider the skew of the surface of the stage and the foreign matter on the stage. Therefore, in the past, a substrate holding device which does not cause a substrate to be skewed has been developed. JP-A-2005-101226 (Patent Document 1) discloses a substrate holding device having a convex portion and a discharge hole for blowing a gas to the lower surface of the substrate, and the convex portion has a convex portion. The mounting surface of the substrate and the holding mechanism of the holding substrate are partially placed, and the gas system blown to the lower surface of the substrate is exhausted in the horizontal direction. With this configuration, the gas is blown from the bottom toward the substrate, thereby reducing the weight due to its own weight. The deflection of the substrate. Moreover, since the contact area between the substrate and the substrate is reduced due to the 146082.doc 201044483, the substrate can be deflected by foreign matter such as garbage, and the substrate is used to remove the stage. The cleaning operation of the surface of the foreign object on the surface of the stage is performed by hand. The first part of the invention is based on the invention. The technique described in the patent document has foreign matter on the m. By reducing the contact between the substrate and the stage (4), it can be reduced. The effect of the lining on the skew of the blank hood, but not the reduction of the foreign object itself. It is not easy to control the air blow of the material substrate in the front material. In addition, with the large-scale reticle of the recent years, the slashing device or the sputum of the inspection device is also large-sized, and it becomes difficult to fully clean the stage with the hand-held work. In addition, the work is cleaned by manual work. In addition, in recent years, there has been a problem that the carrier is contaminated by the foreign matter caused by the operator's work posture. In recent years, the mask for manufacturing a display device such as a liquid crystal display device (the FPD mask) is facing a large size. The development of the device, the device body used for the manufacture and inspection of the mask is also significantly larger. For example, it is not uncommon for the size of the substrate to be a rectangle of more than 1 m on one side, which corresponds to various sizes. It is necessary for the stage to be placed, for example, to have a state of 1 · 5 m or more. It is necessary to mount the substrate on such a large stage, and to determine the coordinate position accuracy of the pattern drawing or the formed pattern. When there is foreign matter on the large stage, the position of the pattern caused by the foreign object will be abnormal when drawing, and the accuracy will be measured when the coordinate position is measured. In addition, the problem of abnormal displacement of the coordinates is detected. In addition, the probability of cracks and damage on the back surface of the substrate due to foreign matter is higher than before, so quality management is also a major problem. Under such circumstances, It is not only difficult, but also unreliable and unstable to clean by hand, such as a cloth having a cleaning liquid. It is an object of the present invention to provide a substrate processing apparatus such as a drawing device or a detection device that can be reliably used. In order to achieve the above object, the inventors of the present invention have intensively studied a method of efficiently removing foreign matter on the stage with high efficiency, and as a result, have conceived a substrate processing apparatus using a stage. The cleaner can remove the difference on the stage, and the stage cleaner is provided with a cleaning plate having a smooth plane facing the substrate of the stage, so that the cleaning plate floats on the stage to a certain height. The floating mechanism and the drive mechanism for moving the cleaning plate in a plane parallel to the substrate mounting surface of the stage. Bu is also worried that by the stage cleaner, a gas such as air is sent between the plate-shaped cleaning plate and the stage, so that there is a gas of a specific pressure, thereby maintaining the plate-like member and the stage (4)- In this state, the plate-shaped member is moved in this state, and the foreign matter on the stage is removed at the end of the plate-shaped member. The stage cleaner according to the aspect of the invention includes a plate-shaped member having at least one through hole, and the gas is supplied from the side of the plate member to the other side through the through hole. In the air supply system, the heart is removed from the stage, and the object is placed in the state in which the surface of the stage and the other surface face 1460S2.doc 201044483 = air is blown by the air blowing mechanism, and the plate = surface is formed as described above. The surface of the stage is separated by a specific interval, and the plate-like member is moved away from the surface (10) on the surface of the stage. The sputum is pushed out from the end of the aforementioned plate-like member. The better one is that the step has the details of adjusting the air supply from the gas! ΪΤ β β 叹 、 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The through hole may be formed in the center of the plate, the center of the through member, and the through hole may be plurally reported at a distance from the center of the plate member. In addition to the month of the month, the stage cleaner of the month has a first through hole and at least a plate member of the '2' passhole, and a first through hole from the plate member. One side/the air supply mechanism of the body, and the other side of the air supply two, the second through hole is described from the side of the plate-shaped member to the other side, to the other side, lifr 4ilf ~n, The suction mechanism that attracts the gas on the surface side; the politician cites the front surface of the stage, and 糸n B ^ ^ quotes the other direction, and the board is fed by the air supply mechanism, the sputum and the milk. The member is disposed in a manner that the surface of the stage is separated by a predetermined interval. The plate-like member moves in a plane parallel to the surface of the stage, and it is difficult to describe the surface of the stage. "The object is removed; 4 the end of the plate-like member is removed. In the case of the sputum, it is better to further adjust the amount of gas that is supplied from the air supply mechanism or the amount of gas that is inhaled by the suction mechanism. The adjustment of the ρ side means the mechanism 'by adjusting the aforementioned air supply amount by the aforementioned adjustment mechanism or 146082.d Oc 201044483 At least one of the aforementioned inspiratory quantities, and Shimiao II, j_, && and the D week is a description of the size of the specific interval. Also, any of the ί through holes or the second through holes Further, the first through hole or the second through hole may be formed at a position equidistant from the center of the fourth plate member. Further, it is preferable to further provide a foreign object for attracting foreign matter. Further, in the stage cleaner, it is preferable that at least one of the end portions of the plate-like member has a curved recessed portion. The present invention further provides a drawing device including the above-described stage cleaner. The above-described stage cleaner can be moved in the vertical direction of the surface of the stage of the drawing device. The present invention also provides the following substrate processing apparatus. A substrate processing apparatus is configured to mount a substrate on the stage. A substrate cleaner is disposed on the substrate; the stage cleaner having the foreign matter on the stage is removed, and the stage cleaner is provided with a cleaning plate that is placed on the substrate of the stage: a smooth flat surface facing the front The cleaning plate is mounted on the stage at a specific height above the floating mechanism and a driving mechanism for moving the cleaning plate in a plane parallel to the substrate mounting surface of the stage. The floating mechanism is preferably for controlling the cleaning plate. The height of the height of 1~ is preferably raised on the above-mentioned stage. Preferably, it is a cloth (10) (four), and more preferably a cloth is called a squeak. The slab is a flat plate, and the end of the τ surface side is preferably 9 〇. The angle is formed at a right angle or an acute angle. More preferably, it is 7 〇 to 9 〇. The floating mechanism is mounted on the substrate of the cleaning plate and the stage, and in the opposite state, by making the gas The hole air supply hole provided on the lower side of the cleaning plate is ejected to float the cleaning plate to a certain height. The hole 146082.doc 201044483 may be a through hole of the through plate. The floating mechanism is configured to allow gas to be ejected from the air blowing hole, and to inhale from an air suction hole provided on a lower surface side of the cleaning plate, and to control the gas discharge amount and the air intake amount to make the cleaning plate float to a certain height. . The suction hole may also be a through hole of the plate. The use of the substrate processing apparatus is not particularly limited. For example, the effect of the present invention is particularly remarkable when it is a drawing head having a specific design pattern for drawing the substrate. Alternatively, it may be an inspection device having a meandering mechanism for measuring the shape of a specific transfer pattern formed on the substrate or measuring the distance of an arbitrary point on the substrate. In the stage cleaner of the present invention, the gap between the plate member and the stage is maintained by feeding gas between the plate member and the stage, and the plate member (4) is obtained in this state. Further, the end of the plate-shaped member removes the foreign matter on the stage, so that the foreign matter on the stage can be reliably removed with high efficiency. #According to this month, 彳 physically removes foreign matter by using the gap between the plate-shaped member and the stage, and #, by controlling the supply of airflow and the gap between the suction systems, there is a quantification of the size of the foreign matter to be removed. And except: the advantages. Therefore, it is possible to remove the judgement to affect the performance of the product. [Embodiment] The following is used. In addition, the drawings and the embodiments of the present invention are intended to limit the scope of the embodiments of the present invention. It goes without saying that other embodiments of the invention, 146082.doc 201044483, are also within the scope of the invention. Fig. 1 is a view for explaining a stage cleaner according to an embodiment of the present invention. Fig. 1 (4) is a plan view showing a stage cleaner disposed on the stage 1 .纟 . 11 11 11 系 系 系 系 系 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 Air supply mechanism (not shown). The through hole ^ is substantially formed in the center of the board 12. Fig. 1(b) is a cross-sectional view of the secret section 〇 of Fig. 1(4). In Figs. 1 (4) and (8), the arrows indicate the air blowing direction of the air. In FIG. 1(b), air is supplied from the through hole ^ by a blower mechanism (not shown), and air is sent to the lower side of the plate 12 through the through hole n, and is equally diffused to the plate 12 The lower side is between the upper surface of the stage 1 . Figure! (4) The arrow indicates that the air to be fed is anisotropically diffused between the lower surface of the plate 12 and the upper surface of the stage 10. By the air blowing by the air blowing mechanism, the gap between the lower surface of the holding plate 12 and the surface of the stage (hereinafter also referred to as the gap formed by the air layer) is formed by the gap of the gas layer in FIG. 1(b), and the gas layer is represented by g in FIG. 1(b). The size of the gap § formed ◎ varies depending on the foreign matter to be used, and is preferably 1 to 5 μm ηη, preferably, more preferably ^50^^. The air that is blown by the through-holes is preferably converted into particles that do not contain foreign matter, and is preferably a ruthenium or a ruthenium containing no more than _ μηι or more. Further, the temperature of the air blown by the through holes is preferably such that the temperature is not deformed by the plate U, and the ambient temperature of the plate Η = is maintained at (4) or less. In addition, it is better to have the following difference. Each 疋 is determined by the linear expansion coefficient of the material used for the plate 12 and the size or force of the plate 12, but the temperature of the air gap I46082.doc 201044483 passes through the gap surface and the opposite side. The difference is that the amount of expansion caused by the temperature is different on each side, and will be: skewed. i玍, for example, in the case where foreign matter 13 is present on the surface of the stage, as shown in the figure, 'If the plate is moved in a plane parallel to the surface of the stage 10, moving toward the foreign object 2, the end of the plate 12 is in contact with Foreign body 13. In this state, the board U is continuously moved, and the foreign matter 13 is pushed out from the surface of the stage 1 to be removed. Further, if the object is not completely removed, for example, as shown in Fig. i (4), the foreign matter 13 is removed by the end portion of the reverse 12, and the scraped portion 14 is pushed out and removed, and the remaining foreign matter 15 It has the same height as the air layer: , and the degree of g, and remains on the surface of the stage 1 . However, the foreign matter on the stage 10 is placed on the blank material, etc., and it is necessary to remove it when it is drawn or exposed, but it is necessary to remove it until it is almost no gap. Therefore, if the height of the residual foreign matter 15 is such that the height of the residual foreign matter 15 is not affected by the height of the drawing or the exposure by adjusting the w degree g' of the light B formed by the air layer, the remaining foreign matter 15 does not remain on the stage 10. The movement in the horizontal plane is carried out by the drive mechanism and controlled, such as the case where the stage cleaner is mounted on the riding device, and the driving head is driven in the X direction and the Υ direction on the plane. Drive the way to install. Further, the plate of the stage cleaner should be installed so as to allow upward movement. Different: According to Figure 1 household: δ brother Ming's stage cleaner, can reliably remove the τ on the stage to really reduce the J4^2.d〇c •10- on the stage of the green device or the inspection 201044483 The effect of the foreign matter on the pattern accuracy of the drawing or exposure step. In addition, because the gas is supplied between the plate 12 and the stage 1 (), the gap between the plate 12 and the stage 10 can be maintained. Therefore, even if the stage 10 has a slight skew, the gap can be maintained until the plate 12 is brought into contact with the carrier (4) to damage the surface of the stage 10. Further, the board 12 is used at least below (corresponding to the stage 10) The surface is processed into a smooth flat surface or the like, or the granite can also be a ceramic material having a dense surface for the oxidized material or a porous ceramic. At least the lower side of the board should be composed of moderately rigid materials. Alternatively, you can use hard or other alloys, rigid metal, the plane is easy to process into smooth, and because of the high Young's modulus, there are fewer deformations in use for some reasons. The above materials can be used in combination separately. On the side opposite to the stage, it is possible to use a H-cut that can easily obtain a smooth surface and has a high rigidity, and the back surface is required to be connected to the pipe for suction and exhaust, or to fix the plate 12 itself. It is necessary to carry out fine processing', so it can also be a metal alloy with high workability. In addition to the introduction of the foreign body as a whole, the lower end of the plate ί can also be introduced only by the foreign matter: the part above the south. Therefore, the shape of the lower side end portion is preferably a right angle or an acute angle, for example, 70 to 90 degrees. The through hole is not limited to the central portion of the plate 12 as a plurality of through holes U and the same amount of air is supplied to each of the through holes 11. The plurality of through holes 11 are preferably such that the plate 12 is horizontally aligned with the Beton off plate. The position of the center of 12 is equidistant). / / configuration (for example, the distance can also be advanced) to adjust the air supply volume of the air supply mechanism to send air 146082.doc 11 201044483 wind adjustment mechanism. The air supply adjustment mechanism adjusts the height g of the gap formed by the gas node gas layer, The fly-on is also mounted on the stage 10, for example, in a drawing device or an inspection device, etc. The white cover or the substrate is mounted thereon. Second, another embodiment of the present invention will be described using FIG. 2, the same reference numerals are given to the same as in Fig. 1. Fig. 2 is a view for explaining a stage m according to another embodiment of the present invention, and Fig. 2(4) shows a stage placed on the stage 1 A plan view of the cleaner. The stage cleaner includes and has an ancient potential, and has a first through hole 丨 "a plate 12 that is adjacent to the second through hole W and a blower that supplies air from the first through hole (10) ( (not shown) / and an air intake means (not shown) for taking in air from the second through hole (10). The first through hole 11 a is a solid 皙 ( ( ( ( ( ( ( ( ( ( Central. Figure 2 (b) is a cross-sectional view of the current rotten surface. In the direction of the wind, in Fig. 2 (8), 'air is supplied from the first through hole ila from the air blowing mechanism (not shown). The air is sent to the lower side of the plate 12 through the through hole, and is isotropically diffused. The lower surface of the plate 12 is interposed between the upper surface of the stage 1 and the upper surface of the stage 1. The arrow of Fig. 2 (4) indicates that the air to be fed is equally diffused between the lower surface of the plate and the upper surface of the stage 10. The second through hole m is The air that is isotropically diffused between the lower surface of the plate 12 and the upper surface of the stage 1 is formed so as to be surrounded by the through hole 11a, and is sucked by the suction mechanism (not shown) through the second through hole lib. By the air supply amount of the air blowing mechanism, the balance of the air intake amount of the six airs of the air suction mechanism is 'the gap between the lower surface of the plate 12 and the surface of the stage 1 is maintained at a certain interval between the air layer layers and Hold. Air gap formation gap (4) 146082.doc -12- 201044483 2(b) is indicated by g. The size of the gap g formed by the air layer varies depending on the application, but as described in the first aspect, 1 to 500 μηι 〇 In the case where there is foreign matter on the surface of the stage 10, by making the plate 12 parallel to the surface of the stage 1 The movement of the surface in the direction of the foreign matter, and pushing or cutting the foreign matter from the surface of the stage 1 by the end portion of the plate 12 is the same as the above description using the drawings (b)_(d). According to the stage cleaner described with reference to Fig. 2, the foreign matter on the stage can be reliably removed, and the pattern accuracy in the drawing step or the exposure step caused by foreign matter on the stage in the drawing device or the inspection device can be surely reduced, for example. The influence is also caused by the fact that the gap between the plate 12 and the stage 10 is constant by feeding the gas between the plate 12 and the stage 1 ,, so that even if the stage 1 has a slight skew, the gap can be kept constant. The plate 12 is not brought into contact with the stage 1 to damage the surface of the stage 1 . Further, the plate 12 is also the same as described above in that at least the lower surface (the surface corresponding to the stage 1) is flat-processed ceramic or the like.
又，前述說明中，雖以將第丨貫通孔lla配置於板12之中 央’將第2貫通孔Ub以包圍貫通孔Ua之方式複數地配 置為例示，但亦可相反。只要藉由經由第丨貫通孔丨“之送 風與經由第2貫通孔Ub之吸氣，可使板12於水平方向取得 平衡之方式配置即可。第！貫通孔Ua及第2貫通孔爪亦; 均為複數。第1貫通孔Ua或/及第2貫通孔Ub為複數之情形 下，較好為配置於距離板之中央部等距離之位置。 ' ，或吸氣機 藉由調節機 又，亦可具有調節送風機構之氣體之送風量 構之氣體之吸氣量中之至少一方之調節機構。 146082.doc 201044483 構調節送風量及/戎叨名θ 次及軋1，可調節氣體層形成之間隙之 高度。 複數配置之第2 | ϋ π , 1 u μ 孔lib’可精由調節通過該各貫通孔 之氣體之流量，調整相對於載台ι〇之板以平行度。例如 =2貫通孔吸入氣體時，藉由增加吸氣量，可使增加吸氣 量之貫通孔周邊之間隙變窄。如此經由調節各貫通孔之氣 體之流量，不僅板U之相對於載台1〇之間隙量，平行度之 微調整亦成為可能。以，因可容易地使㈣與載台之間 隙於板i2之全周相同，故可使板⑵斤具有之所有邊緣具有 同等：異物除去能力。因此，複數配置之第2貫通孔之 t，宜至少-個以上，較好為其中2個以上，更好地為每 個均具有可調節流量之機構。 又’板12會有因其質量、與載台1()之介隔以間隙而接觸 的部分之面積及形狀、空氣之吹出量等關係，而共振、產 ^振動之情形。該振動會使間隙量不穩定，使異物之除去 能力下降。振動大時亦有板12本身接觸於載台1〇，而造成 損傷之情事。X ’即使板12不直接接觸載㈣該振動之 振幅最大時亦會捲入可進入間隙内之尺寸之異物，振幅最 小時’而將異物夾於載台10與板12之間，最惡劣之情形 下，該異物會對載台造成損傷#損害。為防止該等問題， 不使對載台10有造成損害之虞之尺寸大且硬度高之異物進 入板12與載台1〇之間，有必要依下述關係調整間隙盘振動 之振幅。 間隙量+振動之最大振幅Xl/2$異物尺寸(式” 146082.doc -14- 201044483 此處之間隙量係指振動為〇時之板面内與載台之平 離。 α 又’複數配置之該等第2貫通孔亦具有抑制空氣噴出所 ， 造成之板12之振動的效果，於㈣產生共振時，藉由第2 ㈣孔調整吸氣量，可使共振狀態之平衡崩潰，避免此振 狀態而有抑制振動之效果。又為使該等效果有效化，亦^ 須考慮板12之平坦度。關於板12之平坦度，以下之關 立。 Ο 曰 間隙板平坦度誤差5異物尺寸...（式2) 此處，板平坦度誤差係間隙量與板12面内各點與載台距離 之差。因此，板平坦度誤差大之情形下，將容許比間隙量 大之異物進入間隙内，而因板12行經載台上，將使異物爽 入平坦度誤差較少之部分，而有對载台1G造成損害之虞。 因此，為使板平坦度誤差較少，板之平坦度宜為比在面内 板12與載台10之作為最小間隙之值的j叫更小之值。又， ❹ U上係假定載台為理想平面之情形求得關係式，但實際之 載台10與板12同樣具有平坦度誤差。因此，載台ι〇亦宜在 與板12相同面積之範圍内平坦度為丨μιη以下。 ^ 以下’使用圖3⑷、（b)對本發明之其他實施形態進行說 月於圖3(a) (b)中’對與圖2相同之構成標以相同符 號。圖3⑷係顯示配置於載台1〇上之載台清潔器之平面 圖。圖3(b)係圖3⑷之iIIb_„Ib剖面之剖面圖。於圖3⑷、 (b)中，與圖2(a)、（b)不同者只有板12之端部31之形狀，其 他所有均與圖2⑷、（b)相同。因&，只對端部以形狀進 146082.doc -15- 201044483 仃说明。本實施形態中，板12之端部31如圖3(昀所示，係 作彎曲狀凹陷。若為該形狀，與端部為直線狀之情形比 較，可更確實地推出、收集異物13。於圖3(a)、（b)中，雖 顯不對於圖2之構成使端部彎曲而成之構成，但於圖丨之構 成中使端部凹陷成彎曲狀之構成亦可獲得同樣效果。 以下’使用圖4(a)、（b)對本發明之其他實施形態進行說 明:於圖4(a)、⑻中，對與圖3⑷、（b)相同之構成標以相 冋符號。圖4⑷顯示配置於載台1〇上之載台清潔器之平面 圖。圖4(b)顯示圖4⑷之IVb_IVb剖面之剖面圖。於圖 =)、（b)中，與圖3⑷、（b)不同者，只有形成於板^之端 ^附近之第3貫通孔32，及第3貫通孔32與端部31之間之 ^度’其他所有均與圖3⑷、（b)相同。因此，只對該 口P刀進仃說明。 貝通孔32係歸吸引異物之貫通孔，連接於未圖7 二:構。第3貫通孔32與端部31之間之板之厚度4 (=，與其他部分相比較薄。即，只於該部分，力 之下面與載台1 〇表面間之間 通過至第Π… 變大。此係用於使異物1 該構成中’因以第3貫通孔可吸引異彩 故可確貫地除去異物13。 3之構成() (b)十，雖顯示於贗 成，二 成，但亦可適用於圖2之賴 取 』獲件同樣效果。 將來自壓：：有厂“ 4中’ ^風機構係可藉由壓縮機、 肘水目壓縮機之壓縮氣體減壓之 電磁閥等，而八 °°正态及啟動停止送風之 而以公知之方法實施。同樣地吸氣機構亦可使 146082.doc • 16 - 201044483 用真空泵及電磁閥等以公知之方法實施。 其次顯示將前述载台清潔 益°又置於作為一種基板處理裝 置之描繪裝置，並使之動你* v , 動作之例。百先圖5係描繪裝置之 概念圖，圖5(a)係描繪裝置 衣罝之+面圖（由上方觀察之圖 圖5(b)係側視圖（由橫向顴究 … 门規察之圖）。描繪裝置中係於基座 早元41上設置有載台42。基座s + 丞厓皁兀41上進而以跨越基座單 元41之方式設置有橋接部43， 千 於橋接部43設置有描繪頭 Ο Ο (描、會機構）44。載台42可於爲座置一 於基座早兀41上於圖5(a)、（b)中 左右方向移動。描繪頭44可、、,L抵& 了 橋接部43於圖5(a)尹於上下 方向（平行於載台42表面之面内）移動。 又，圖5係描繪裝置之概冬 %、圖，例如，省略向描繪頭輸 入欲描繪資料之機構及供給 構等。 屯于束等用於描繪之能量之機 該描繪裝置通常係於空白氺 故t 白先罩描繪轉印圖案者，此時， 將附光阻劑之空白光罩配置 κ 、戟σ 42上，使描繪頭44一面 於圖5之上下方向掃描— ^ ^ 撝繪於待描繪位置，且藉由使 載口 42於圖5⑷、（b)之左右 必要位置描緣。 ㈣’對空白先罩全面於 於圖6(a)〜（c)顯示將本發明 I月之載台清潔器設置於前述描 繪裝置之例。圖6(a)係描繪裝 阁图 之千面圖’圖6(b)係側視 圖。圖6(c)係用於說明動作 π 千面圖。對圖6(a)〜(c)中與圖 5相同之構成標以相同符號。 ^ ^ ^ w > 4 ^ 圖6(a)〜(c)亦與圖5相同，係 描繪裝置之概念圖，例如， ^ 4iu Q %'向私繪頭輸入欲描繪資料 之機構及供給電子束或 貝丁寸 田耵孝用於描繪之能量之機構等。 146082.doc •17· 201044483 台42、橋接部43及描繪 圖6(a)〜(c)中，因基座單元々I '載 頭44與圖5相同，故省略說明。 么，中，於橋接部43設置有本發明之载台清潔器Μ。載 口〉月潔器51與描繪頭彻㈣橋接勒可於平行於载W ^面之面内（圖6⑷之上下方向）移動。又，心清_51 ”以了於垂直於載台42表面之方向（圖咐)之上下方向）彈 性移動之狀態，設置於橋接部43。 例如，設置以圖1說明之載台清潔器時，根據送風機構 之空现之送風量，使載台清潔器51之板可於上下方向彈性 移動。調整送風量，而將空氣層形成之間隙調節成所希望 之高度之狀態下，例如空白光罩未載於載台42上之狀離 下，使載台清潔器從圖6(a)之載台42之左上角朝下方向: 動’移動至載台42之左下角| ’使橋接部“向右挪移，再 度使載台清潔器51向上移動。藉由重覆該動作，可掃除載 台42之全部表面。圖6(c)係表示該動作之途中之狀態。於 圖6(c)中，區域52係清掃結束之區域。 ^ 、 將於前述描繪裝置中以載台清潔器5丨清掃之載台42表面 之異物，在斜光照明下目視觀察、計數。事先散布之擬似 塵埃（異物），清掃後每10 cm2為〇個。 本實施形態中，因將載台清潔器5丨設置於描繪裝置故 載台42表面以載台清潔器5丨清掃後，可立即將空白光罩嗖 置於載台42上開始描繪步驟，可有效減少载台表面上之異 物對描繪步驟造成之影響。 前述例中，係顯示將圖1所說明之載台清潔器設置於描 146082.doc -18· 201044483 繪裝置之例，但圖i至圖4說明之載台清潔器均可以與前述 同樣之方法設置於描繪裝置。又，除描繪裝置以外，亦可 設置於檢查裝置等具有載台之裝置，與描緣裝置同樣，可 有效除去異物。 又，刖述基板處理裝置，除為具有描繪頭之描繪裝置 外，亦可為檢查形成於光罩上之圖案之座標位置精度之檢 查裝置’或可為其他基板處理裝置。 〇 ®6⑷〜⑷中，雖省略將載台清潔心之板設置成可於 上下方向彈性移動之機構，但可藉由使用彈性附屬裝置等 通常之方法實施。 又，本發明並非局限於前述實施形態，可適當變更後實 月J述實施升）癌中之材料、尺寸、處理順序等係二 例’可進行各種變更而實施。 【圖式簡單說明】 圖UaHd)係用於說明本發明之實施形態之載台清潔器 〇 之圖； 圖（a) (b)係用於說明本發明之另一實施形態之載台产 潔器之圖； Θ 圖3(a)、（b)係用於說明本發明之又另一實施形態之栽台 •清潔器之圖； ° 圖4(a) (b)係用於說明本發明之其他實施形態之栽台生 潔器之圖； 圖5(a) (b)係用於說明具備本發明之實施形態之載台 潔器之描繪叢置之一例之圖；及 彳 146082.doc -19- 201044483 圖6(a)-(c)係用於說明具備本發明之實施形態之載台清 潔器之描繪裝置之另一例之圖。 【主要元件符號說明】 10 載台 11 貫通孔 11a 第1貫通孔 lib 第2貫通孔 12 板 13 異物 14 削取部分 15 殘存異物 31 端部 32 第3貫通孔 41 基座單元 42 載台 43 橋接部 44 描繪頭 51 載台清潔器 52 區域 g 間隙 146082.doc -20-In the above description, the second through hole Ub is disposed in plural in the middle of the plate 12 so as to surround the through hole Ua, but may be reversed. It is only necessary to arrange the plate 12 in the horizontal direction by the air blow through the second through hole 丨 and the air suction through the second through hole Ub. The through hole Ua and the second through hole claw are also provided. When the first through hole Ua or/and the second through hole Ub are plural, it is preferably placed at a distance from the center of the plate. ' , or the aspirator is adjusted by the adjusting machine Further, it may have an adjustment mechanism for adjusting at least one of the air intake amount of the gas supplied by the air blowing means of the air blowing means. 146082.doc 201044483 Adjusting the air supply amount and /anonymous θ times and rolling 1, the adjustable gas layer The height of the gap formed. The 2nd ϋ π , 1 u μ hole lib' can adjust the flow rate of the gas passing through the through holes, and adjust the parallelism with respect to the plate of the stage ι. (2) When the gas is sucked into the through hole, the gap around the through hole that increases the amount of intake can be narrowed by increasing the amount of intake air. Thus, by adjusting the flow rate of the gas of each through hole, not only the plate U is opposed to the stage 1 The amount of clearance, the fine adjustment of parallelism is also possible Therefore, since the gap between the (4) and the stage can be easily made the same as the entire circumference of the board i2, all the edges of the board (2) can be made equal: foreign matter removing ability. Therefore, the second through hole of the plurality of configurations Preferably, at least one or more, preferably two or more thereof, more preferably each having an adjustable flow rate. Further, the plate 12 may have a gap with the stage 1() due to its mass. The area and shape of the contact portion, the amount of air blown, etc., and the resonance, the vibration of the product. The vibration will make the amount of the gap unstable, and the ability to remove the foreign matter is reduced. When the vibration is large, the plate 12 itself is also in contact. At the stage of the stage, the damage is caused. X 'even if the plate 12 is not directly in contact with the load (4), the amplitude of the vibration is the largest, and it will be caught in the foreign matter of the size that can enter the gap. When the amplitude is the smallest, the foreign object is clamped to Between the stage 10 and the board 12, in the worst case, the foreign object may cause damage to the stage. In order to prevent such problems, the size of the board 10 is not damaged and the hardness is high. The foreign matter enters between the board 12 and the stage 1 The amplitude of the gap disk vibration should be adjusted according to the following relationship: The amount of the gap + the maximum amplitude of the vibration Xl/2$ The size of the foreign object (Formula 146082.doc -14- 201044483 The amount of the gap here refers to the inside of the board when the vibration is 〇 The second through-holes of the α-'multiple-numbered arrangement also have the effect of suppressing the vibration of the plate 12 caused by the air ejection, and (4) adjusting the suction by the second (four) hole when resonance occurs. The amount can make the balance of the resonance state collapse, avoid the vibration state and have the effect of suppressing vibration. In order to make these effects effective, the flatness of the board 12 must also be considered. Regarding the flatness of the board 12, the following Ο 曰 Gap plate flatness error 5 Foreign object size... (Formula 2) Here, the plate flatness error is the difference between the gap amount and the distance between the points in the plane of the plate 12 and the stage. Therefore, in the case where the plate flatness error is large, foreign matter larger than the gap amount is allowed to enter the gap, and since the plate 12 passes through the stage, the foreign matter is cooled to a portion where the flatness error is small, and the stage is provided. 1G causes damage. Therefore, in order to make the plate flatness error less, the flatness of the plate is preferably smaller than the value of the minimum value of the in-plane 12 and the stage 10 as the minimum gap. Further, the relationship between the U and the U is assumed to be an ideal plane, but the actual stage 10 has the same flatness error as the plate 12. Therefore, it is preferable that the stage ι is also less than 丨μηη in the range of the same area as the plate 12. In the following, the other embodiments of the present invention will be described with reference to Figs. 3 (4) and (b). The same components as those of Fig. 2 are denoted by the same reference numerals in Figs. 3(a) and 3(b). Fig. 3 (4) is a plan view showing the stage cleaner disposed on the stage 1 . Figure 3 (b) is a cross-sectional view of the iIIb_Ib section of Figure 3 (4). In Figures 3 (4) and (b), unlike the Figures 2 (a) and (b), only the shape of the end portion 31 of the plate 12 is present. It is the same as Fig. 2 (4) and (b). Because of &, only the end portion is shaped into 146082.doc -15- 201044483. In the present embodiment, the end portion 31 of the plate 12 is as shown in Fig. 3 (昀, In this case, the foreign matter 13 can be pushed out and collected more reliably than in the case where the end portion is linear. Although it is not shown in Fig. 3 (a) and (b), The configuration in which the end portion is curved is formed, but the same effect can be obtained by forming the end portion into a curved shape in the configuration of the drawing. Hereinafter, another embodiment of the present invention will be described using FIGS. 4(a) and 4(b). 4(a) and (8), the same components as those of Figs. 3 (4) and (b) are denoted by reference numerals. Fig. 4 (4) shows a plan view of the stage cleaner disposed on the stage 1A. (b) showing a cross-sectional view taken along the line IVb_IVb of Fig. 4 (4). In Fig. 3) and (b), only the third through hole 32 formed in the vicinity of the end ^ of the board ^ is different from Fig. 3 (4) and (b), and Third The other degrees between the through hole 32 and the end portion 31 are the same as those of Figs. 3(4) and (b). Therefore, only the port P is described. The beacon hole 32 is a through hole for attracting foreign matter, and is connected. The thickness of the plate between the third through hole 32 and the end portion 31 is 4 (=, thinner than the other portions. That is, only in this portion, the force is below the surface of the stage 1 The passage between the passages and the passages is increased. This is used to make the foreign matter 1 in the configuration. 'Because the third through-holes can attract foreign objects, the foreign matter can be reliably removed. 13. Composition () (b) Although it is displayed in Yucheng, 20%, it can also be applied to the same effect as the one obtained in Figure 2. Will come from pressure:: There is a factory "4" 'Wind mechanism can be compressed by compressor, elbow water The solenoid valve for depressurizing the compressed gas of the machine, etc., is carried out by a known method in an eight-degree normal state and starting to stop the air supply. Similarly, the suction mechanism can also use a vacuum pump, a solenoid valve, etc. for 146082.doc • 16 - 201044483. It is carried out in a known manner. Secondly, it is shown that the above-mentioned stage cleaning benefit is again placed as a drawing device as a substrate processing apparatus. And let you move you * v , the example of action. Bai Xian Figure 5 is a conceptual diagram depicting the device, Figure 5 (a) depicts the + face of the device ( (Figure 5 (b) from the top Side view (viewed by the lateral view). The drawing device is provided with a stage 42 on the base element 41. The base s + 丞 兀 兀 进而 上 上 跨越 跨越 跨越 跨越 跨越The bridge portion 43 is provided in a manner, and the bridge portion 43 is provided with a drawing head Ο (drawing mechanism) 44. The stage 42 can be seated on the pedestal 41 in Fig. 5(a), b) Move in the left and right direction. The drawing head 44 is movable, and the bridge portion 43 is moved in the up-and-down direction (in the plane parallel to the surface of the stage 42) in Fig. 5(a). Further, Fig. 5 is a diagram showing the % of the device and the figure. For example, the mechanism, the supply mechanism, and the like for inputting the data to be drawn to the drawing head are omitted. The drawing device is usually used to draw a transfer pattern, such as a bundle, and the like, and the blank mask with the photoresist is placed on the κ and 戟 σ 42 at this time. The drawing head 44 is scanned in the upper and lower directions of FIG. 5 - ^ ^ 撝 is drawn at the position to be drawn, and the carrier port 42 is drawn at a necessary position on the left and right sides of FIGS. 5 (4) and (b). (4) The example in which the blank cover is provided in the above-described drawing device is shown in Figs. 6(a) to (c). Fig. 6(a) is a side view of Fig. 6(b) showing a schematic view of the gimbal diagram. Fig. 6(c) is a diagram for explaining the action π thousand plane. The same components as those in Fig. 5 in Figs. 6(a) to 6(c) are denoted by the same reference numerals. ^ ^ ^ w > 4 ^ Figure 6 (a) ~ (c) is also the same as Figure 5, is a conceptual diagram depicting the device, for example, ^ 4iu Q % 'into the private drawing head to input the information to be drawn and supply electronics A bundle or a bedding that is used by Debbie Otaru to describe the energy. 146082.doc •17· 201044483 Table 42, bridge portion 43 and drawing. In Figs. 6(a) to 6(c), the base unit 々I' carrier 44 is the same as that of Fig. 5, and therefore its description is omitted. In the middle, the stage cleaner 43 of the present invention is provided in the bridge portion 43. The port>the moon cleaner 51 and the drawing head (4) bridge can be moved parallel to the plane of the W-face (upward and downward in Fig. 6(4)). Further, the heart _51" is elastically moved in a direction perpendicular to the direction of the surface of the stage 42 (Fig. 咐), and is provided in the bridge portion 43. For example, when the stage cleaner described with reference to Fig. 1 is provided According to the air supply amount of the air blowing mechanism, the plate of the stage cleaner 51 can be elastically moved in the up and down direction. The air supply amount is adjusted, and the gap formed by the air layer is adjusted to a desired height, for example, blank light. The cover is not loaded on the stage 42 and the stage cleaner is moved downward from the upper left corner of the stage 42 of Fig. 6(a): moving 'to the lower left corner of the stage 42|' to make the bridge "Move to the right and move the stage cleaner 51 up again. By repeating this action, the entire surface of the stage 42 can be swept away. Fig. 6(c) shows the state in the middle of the operation. In Fig. 6(c), the area 52 is the area where the cleaning is completed. ^, the foreign matter on the surface of the stage 42 which is cleaned by the stage cleaner 5 in the drawing device described above is visually observed and counted under oblique illumination. Pre-distributed dust (foreign matter), every 10 cm2 after cleaning. In the present embodiment, since the stage cleaner 5 is placed on the drawing device, the surface of the stage 42 is cleaned by the stage cleaner 5, and the blank mask can be immediately placed on the stage 42 to start the drawing step. Effectively reduce the influence of foreign matter on the surface of the stage on the drawing step. In the above example, the stage cleaner described in FIG. 1 is shown in the example of the drawing device of 146082.doc -18·201044483, but the stage cleaner described in FIGS. i to 4 can be the same as the above. Set in the drawing device. Further, in addition to the drawing device, it is also possible to provide a device having a stage such as an inspection device, and it is possible to effectively remove foreign matter as in the case of the edge device. Further, the substrate processing apparatus may be a inspection apparatus for inspecting the positional accuracy of the pattern formed on the mask, or may be another substrate processing apparatus, in addition to the drawing apparatus having the drawing head. In 〇6(4) to (4), the mechanism for arranging the stage cleaning core plate to be elastically movable in the vertical direction is omitted, but it can be carried out by a usual method such as using an elastic attachment. In addition, the present invention is not limited to the above-described embodiment, and two types of materials, such as materials, sizes, and processing procedures, which can be appropriately changed, can be implemented by various modifications. BRIEF DESCRIPTION OF THE DRAWINGS Fig. UaHd) is a diagram for explaining a stage cleaner according to an embodiment of the present invention; and Figs. (a) and (b) are diagrams for explaining the stage of cleaning according to another embodiment of the present invention. Figure 3 (a), (b) is a diagram for explaining a table and a cleaner according to still another embodiment of the present invention; ° Figure 4 (a) (b) is for explaining the present invention FIG. 5(a) and FIG. 5(b) are diagrams for explaining an example of a drawing arrangement of a stage cleaner according to an embodiment of the present invention; and 彳146082.doc -19- 201044483 FIGS. 6(a)-(c) are views for explaining another example of a drawing device including a stage cleaner according to an embodiment of the present invention. [Main component code description] 10 Stage 11 Through hole 11a First through hole lib Second through hole 12 Plate 13 Foreign material 14 Cleaved portion 15 Residual foreign matter 31 End portion 32 Third through hole 41 Base unit 42 Stage 43 Bridge Portion 44 Drawing Head 51 Stage Cleaner 52 Area g Clearance 146082.doc -20-