CN112276784A - Wafer chuck cleaning device - Google Patents

Wafer chuck cleaning device Download PDF

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Publication number
CN112276784A
CN112276784A CN201910672534.1A CN201910672534A CN112276784A CN 112276784 A CN112276784 A CN 112276784A CN 201910672534 A CN201910672534 A CN 201910672534A CN 112276784 A CN112276784 A CN 112276784A
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CN
China
Prior art keywords
wafer chuck
grinding disc
particles
mechanical arm
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910672534.1A
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Chinese (zh)
Inventor
纠松涛
罗曙霖
向森
王松
高涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Manufacturing International Shanghai Corp
Semiconductor Manufacturing International Beijing Corp
Original Assignee
Semiconductor Manufacturing International Shanghai Corp
Semiconductor Manufacturing International Beijing Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Manufacturing International Shanghai Corp, Semiconductor Manufacturing International Beijing Corp filed Critical Semiconductor Manufacturing International Shanghai Corp
Priority to CN201910672534.1A priority Critical patent/CN112276784A/en
Publication of CN112276784A publication Critical patent/CN112276784A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The embodiment of the invention provides a wafer chuck cleaning device. In an embodiment of the invention, a wafer chuck cleaning device comprising a friction rotating mechanism, a mechanical arm, an exhaust pipeline and a control component is provided. The grinding disc on the friction rotating mechanism rubs the wafer chuck through the control component, and then particles are sucked and removed through the exhaust pipeline. The wafer chuck cleaning device provided by the embodiment of the invention is used for removing particles on the wafer chuck, so that the cleaning time can be shortened, and the WPH of equipment can be improved. Meanwhile, pollution caused by external particles entering the equipment can be avoided, and the risk of equipment failure caused by errors generated by artificial cleaning is reduced. The cleanliness of the wafer chuck can be ensured.

Description

Wafer chuck cleaning device
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer chuck cleaning device.
Background
With the continuous development of semiconductor manufacturing processes, the integration level of semiconductor devices is higher and higher, and the feature sizes of semiconductor devices are also gradually reduced, so that the technical requirements on various links of the semiconductor manufacturing processes are higher and higher. Therefore, it is important to ensure the cleanliness of the manufacturing equipment.
Disclosure of Invention
In view of this, an embodiment of the present invention provides a wafer chuck cleaning apparatus to improve cleanliness of a device, including:
the friction rotating mechanism is provided with a through hole and is configured to be attached to the wafer chuck for rotating friction;
the mechanical arm is used for moving the friction rotating mechanism;
the exhaust pipeline is arranged at a preset position and used for absorbing and removing particles;
and the control component is used for controlling the mechanical arm to move the friction rotating mechanism to a position attached to the wafer chuck for rotating and rubbing to remove the particles adhered to the wafer chuck.
Further, the friction rotation mechanism includes:
the grinding disc is used for rubbing the wafer chuck so as to separate the particles adhered on the wafer chuck from the wafer chuck;
the first end of the first motor is connected to the grinding disc and used for controlling the grinding disc to rotate.
Further, the grinding disc is provided with a plurality of through holes, and the particles enter the air exhaust mechanism through the through holes.
Further, the friction rotation mechanism further includes:
a grinding disc position sensor for determining a displacement signal of the grinding disc;
and the pneumatic device is used for attaching the grinding disc to the wafer chuck.
Further, one end of the mechanical arm is connected with the friction rotating mechanism.
Further, the robot arm includes:
a plurality of knuckle arms and a plurality of second motors between the knuckle arms;
the second motor is used for controlling the displacement of the mechanical arm in different directions.
Further, the robot arm further includes:
a mechanical arm position sensor for determining a displacement signal of the mechanical arm.
Further, the exhaust duct includes:
the first end of the exhaust pipe is connected with the exhaust main body, and the second end of the exhaust pipe is arranged above the wafer chuck;
wherein, the air exhaust main body is used for generating suction.
Further, the inner wall of the second end of the exhaust pipe is connected with the periphery of the grinding disc.
Further, the wafer chuck cleaning device is used in a stepping photoetching machine.
Further, the abrasive disk is substantially the same size as the wafer chuck.
In an embodiment of the invention, a wafer chuck cleaning device comprising a friction rotating mechanism, a mechanical arm, an exhaust pipeline and a control component is provided. The grinding disc on the friction rotating mechanism rubs the wafer chuck through the control component, and then particles are sucked and removed through the exhaust pipeline. The wafer chuck cleaning device provided by the embodiment of the invention is used for removing particles on the wafer chuck, so that the cleaning time can be shortened, and the WPH of equipment can be improved. Meanwhile, pollution caused by external particles entering the equipment can be avoided, and the risk of equipment failure caused by errors generated by artificial cleaning is reduced. The cleanliness of the wafer chuck can be ensured.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
FIGS. 1-3 are schematic structural views of an embodiment of the present invention;
FIG. 4 is a schematic diagram of a control component of an embodiment of the present invention;
FIG. 5 is a schematic view of a robot arm control unit of an embodiment of the present invention;
fig. 6 is a flowchart of a robot arm control unit controlling a robot arm according to an embodiment of the present invention;
FIG. 7 is a schematic view of a frictional rotation control unit of an embodiment of the present invention;
FIG. 8 is a flow chart of a robot control unit controlling a polishing pad according to an embodiment of the present invention;
FIG. 9 is a schematic view of the number of particles on the wafer chuck before being cleaned by the wafer chuck cleaning apparatus according to the embodiment of the present invention;
fig. 10 is a schematic view of the number of particles on the wafer chuck after being cleaned by the wafer chuck cleaning device according to the embodiment of the present invention.
Detailed Description
The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth. It will be apparent to one skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, components and circuits have not been described in detail so as not to obscure the present invention.
Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to". In the description of the present invention, "multi-layer" means two or more layers unless otherwise specified.
It will be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it can be directly on, adjacent to, connected or coupled to the other elements or layers or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers present. Spatial relationship terms such as "below …", "below", "lower", "above …", "above", and the like may be used herein for ease of description to describe the relationship of one element or feature to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may assume other orientations (rotated 90 degrees or at other orientations) and the spatial relationship descriptors used herein interpreted accordingly.
During the chip manufacturing process, the process environment needs to be checked continuously, including the flatness of the wafer chuck. The flatness of the wafer chuck is mainly judged by whether particles exist on the wafer chuck.
When the existence of particles on the wafer chuck is detected to be beyond a predetermined range, the particles need to be removed first to continue the machining process. In one comparative example, the wafer chuck was manually cleaned of particles using a manual clean method. Specifically, the operator removes the baffle of the apparatus and wipes the wafer chuck with alcohol and a dust-free cloth to remove particles from the wafer chuck. However, the method of comparative example causes impurities such as particles in the environment to enter the inside of the apparatus, resulting in secondary pollution. Meanwhile, the manual operation may have errors, such as damage to other parts in the device. Meanwhile, the baffle is removed, the problem of long operation time exists in operation, manual cleaning is performed, whether cleaning is successful or not is difficult to judge by naked eyes, the situation that particles on the Wafer chuck exceed the standard still exists after cleaning, the baffle needs to be removed repeatedly, the manual cleaning process greatly reduces production efficiency, and Wafer throughput Per Hour (Wafer Per Hour, WPH) is reduced.
In view of this, the embodiment of the invention provides a wafer chuck cleaning device, which can avoid secondary pollution and reduce cleaning time. In the embodiment of the present invention, a wafer chuck applied in a stepper is taken as an example for description, and it should be understood that the wafer chuck cleaning apparatus of the embodiment of the present invention can also be used for cleaning various components in other apparatuses.
Fig. 1 is a schematic view of a wafer chuck cleaning apparatus according to an embodiment of the present invention. As shown in fig. 1, the apparatus includes: friction rotary mechanism 1, arm 2 and exhaust pipe 3. One end of the mechanical arm 2 is connected with the friction rotating mechanism 1.
The friction rotating mechanism 1 is provided with a through hole configured to be attached to the wafer chuck for rotating friction.
Fig. 2 and 3 are a bottom view and a front view of the area a of fig. 1, respectively, and as shown in fig. 2 and 3, the friction rotation mechanism 1 includes: a grinding disc 11 and a first motor 12.
The abrasive disk 11 is used to rub the wafer chuck X to separate particles adhered on the wafer chuck X from the wafer chuck X. The grinding disc is attached to the wafer chuck X, and the particles adhered to the wafer chuck X are not adhered to the wafer chuck X any more by forming friction force.
Specifically, the grinding disk 11 may be made of a wear-resistant material such as ceramic or cemented carbide.
Further, a through hole 11a is provided in the polishing disk 11. The grinding disc is provided with a through hole, so that the particles under friction can be removed from the grinding disc through the through hole 11a in time while the grinding disc rotates. If the grinding disc has no through holes, the particles can be removed only after the grinding disc stops rotating and leaves the wafer chuck. The through holes arranged on the grinding disc 11 can remove particles while the grinding disc rotates, and cleaning efficiency can be improved.
Further, the grinding disc 11 has the same size as the wafer chuck X or substantially the same size as the wafer chuck X, and specifically, the grinding disc 11 may be slightly larger than the wafer chuck X. If the polishing disc 11 is smaller than the wafer chuck X, the polishing disc 11 needs to move back and forth in a direction parallel to the wafer chuck X to rub the entire upper surface of the wafer chuck X, which results in low cleaning efficiency, and if the polishing disc 11 is significantly larger than the wafer chuck X, the energy consumption is wasted. Therefore, it is appropriate to set the size of the polishing disk 11 to be substantially the same as that of the wafer chuck X.
The first end 121 of the first motor 12 is connected to the grinding disc 11 for controlling the rotation of the grinding disc 11.
Specifically, the first motor 12 is a rotary driving motor, the first motor 12 is disposed on the grinding disc 11, a rotating shaft of the first motor is perpendicular to the grinding disc, and the rotating shaft of the first motor is connected to the central hole 11b of the grinding disc 11. In an alternative implementation, the rotating shaft of the first motor 12 may be in interference fit with the central hole 11b of the grinding disk, and the grinding disk 11 may rotate with the rotating shaft of the first motor.
The second end 122 of the first motor 12 is connected to one end of the robot arm, and specifically, the non-rotating part of the first motor 12 may be directly connected to one end of the robot arm, or the first motor may be fixed to one end of the robot arm through other components.
The friction rotation mechanism 1 further includes a grinding disc position sensor and a pneumatic device.
The grinding disc position sensor is used for determining a displacement signal of the grinding disc. In particular, a disk position sensor may be located at the bottom of the polishing disk for determining whether the wafer chuck has a wafer and other obstructions, etc.
And the pneumatic device is used for attaching the grinding disc to the wafer chuck. Specifically, the pneumatic device may include a solenoid valve, an air cylinder, and the like.
The robot arm 2 is used to move the frictional rotation mechanism 1.
Fig. 1 is a schematic structural diagram of an embodiment of the present invention. As shown in fig. 1, the robot arm 2 includes a plurality of joint arms 21 and a plurality of second motors 22 between the joint arms 21. Wherein the second motor 22 is used for controlling the displacement of the mechanical arm in different directions. Specifically, the second motor 22 may be a stepper motor. The step motor is an open-loop control motor which converts an electric pulse signal into angular displacement or linear displacement, under the condition of non-overload, the rotating speed and the stopping position of the motor only depend on the frequency and the pulse number of the pulse signal and are not influenced by load change, when a step driver receives a pulse signal, the step driver drives the step motor to rotate by a fixed angle in a set direction, namely a step angle, and the rotation of the step motor runs step by the fixed angle. The angular displacement can be controlled by controlling the number of pulses, so that the aim of accurate positioning is fulfilled; meanwhile, the rotating speed and the rotating acceleration of the motor can be controlled by controlling the pulse frequency, so that the aim of speed regulation is fulfilled. In an alternative implementation, the robot arm 2 comprises 3 pitch arms 21 and 3 second motors 22. Wherein, 3 second motors 22 can respectively rotate with coordinate axis x, coordinate axis y and coordinate axis z as the axis to control the position of the grinding disc. The second motor 22 receives the pulse signal and controls the movement speed and the movement direction of the mechanical arm.
A mechanical arm position sensor for determining a displacement signal of the mechanical arm. Specifically, the robot arm position sensor may be plural, and the robot arm position sensor may be provided on the knuckle arm.
The exhaust duct 3 is provided at a predetermined position for sucking out particles. As shown in fig. 1, the exhaust duct 3 is provided in the etching apparatus.
The exhaust duct 3 may include an exhaust duct 31, an exhaust electromagnetic gas valve 32, and a gas flow amount detection sensor.
In an optional implementation manner, a first end of the exhaust duct 31 is connected to the exhaust main body, and a second end of the exhaust duct 31 is disposed above the wafer chuck. The exhaust main body is used for generating suction. The air exhaust main body can be a device which forms suction force by generating air pressure outside the wafer detection device. The closer to the second end of the exhaust pipe, the larger the suction force is, the second end of the exhaust pipe is arranged above the wafer chuck, the particles on the wafer chuck can be sucked and removed,
further, the inner wall of the second end of the exhaust pipe is connected with the periphery of the grinding disc. The second end of the exhaust pipe is connected with the periphery of the grinding disc, so that the separated particles can be prevented from diffusing to other parts in the etching equipment. Meanwhile, the second end of the exhaust pipe is connected with the periphery of the grinding disc, so that particles can be attracted by larger suction force, and the particles separated from the wafer chuck can be removed more conveniently.
The air exhaust electromagnetic air valve is arranged in the air exhaust pipe and used for receiving a starting or stopping signal and controlling whether the air exhaust pipe is communicated with the air exhaust main body or not.
The air flow detection sensor is also arranged in the exhaust duct and used for determining the suction force in the exhaust pipeline.
Fig. 4 is a schematic diagram of a control component of an embodiment of the present invention. As shown in fig. 4, the control section includes a central information processing system, a robot arm control unit, a frictional rotation control unit, and an exhaust duct control unit. The control component is used for controlling the mechanical arm to move the friction rotating mechanism to a position attached to the wafer chuck for rotating and rubbing to remove particles adhered to the wafer chuck.
Specifically, the central information processing system can be a main circuit board of a single chip microcomputer microprocessor, and received signals are converted into signals of the mechanical arm control unit, signals of the friction rotation control unit and signals of the exhaust pipeline control unit through the circuit board.
Further, the robot arm control unit controls the second motor to drive the robot arm to move.
Fig. 5 is a schematic diagram of a robot arm control unit of an embodiment of the present invention. As shown in fig. 5, the robot arm control unit 402 receives a signal from the central information processing system 401, and controls the second motor 22 and the robot arm position sensor 23.
In an alternative implementation, the robot control unit 402 is configured with a TB6600 stepper motor drive board. The TB6600 stepping motor drive board receives the common positive voltage, the pulse signal and the direction signal of the main circuit board, and converts the received signals into the rotating speed, the rotating angle and the like of the motor winding. Thereby controlling the movement speed and direction of the mechanical arm.
Fig. 6 is a flowchart of the robot arm control unit controlling the robot arm according to the embodiment of the present invention. As shown in fig. 6, the controlling unit controlling the position of the robot arm includes the steps of:
and step S601, controlling the second motor to rotate.
Specifically, the arm control unit 402 receives a start signal from the central information processing system 401, and controls the second motor to rotate.
Step S602, receiving a sensor signal.
The robot arm control unit 402 receives a sensor signal including the robot arm position fed back by the robot arm position sensor 23.
Step S603, determine whether to stop.
Specifically, the robot arm control unit 402 determines whether to stop the second motor based on the received sensor signal. If "yes", step S604 is performed. If not, execution continues with step S601. For example, in response to the received sensor signal being an abnormal signal or in response to the received sensor signal reaching a predetermined position, it is determined to stop the second motor.
And step S604, stopping the second motor.
Fig. 7 is a schematic diagram of a frictional rotation control unit of an embodiment of the present invention. As shown in fig. 7, the friction rotation control unit 403 controls the first motor according to the signal received from the central information processing system 401, so as to drive the first motor to rotate the polishing disc. At the same time, the frictional rotation control unit 403 also controls the abrasive disk position sensor 14 and the pneumatic device 13.
Fig. 8 is a flowchart of a frictional rotation control unit controlling a polishing disc according to an embodiment of the present invention. As shown in fig. 8, the frictional rotation control unit controlling the position of the robot arm includes the steps of: step S801, receiving a sensor signal.
Specifically, the frictional rotation control unit receives a signal of the abrasive disc position sensor.
Step S802, judging whether the signal is abnormal.
Specifically, the frictional rotation control unit determines whether the signal is abnormal based on the signal of the sensor, and if "yes", it performs step S808, and if "no", it transmits error information to the central information processing system, and if "no", it performs step S803.
Step S803, the pneumatic device is started.
Specifically, the friction rotation control unit starts the pneumatic device to enable the grinding disc and the wafer chuck to be attached.
And step S804, starting the first motor.
Specifically, the frictional rotation control unit sends a start signal to the first motor to start the first motor.
Step S805, receiving a stop signal.
Specifically, after the first motor is operated for a certain period of time, the frictional rotation control unit receives a stop signal of the central information processing system.
And step 806, stopping the first motor.
Specifically, the frictional rotation control unit controls the first motor to stop operating.
And step S807, closing the pneumatic device.
Specifically, the friction rotation control unit controls the pneumatic device to be closed, and the grinding disc is restored to the position where the pneumatic device is located before being started.
And step S808, sending abnormal information.
Specifically, when the friction rotation control unit determines that the signal of the position sensor is an abnormal signal, it sends abnormal information to the central information processing system.
The exhaust pipeline control unit is used for controlling the opening and closing of the exhaust electromagnetic air valve so as to control the opening or closing of the exhaust pipeline. Meanwhile, the exhaust pipeline control unit also controls the airflow detection sensor.
In an optional implementation manner, the central information processing system receives an instruction for starting cleaning and then outputs a pulse signal to the mechanical arm motion control unit, and the mechanical arm control unit drives the second motor of the mechanical arm to move the grinding disc above the wafer chuck. And the central information processing system receives a signal fed back by the mechanical arm position sensor and determines that the grinding disc reaches a preset position. And then receives a signal fed back by a grinding disc position sensor to confirm that the wafer chuck does not have wafers and other obstacles and the like. And starting the pneumatic device to enable the grinding disc to be attached to the wafer chuck. Thereafter, the frictional rotation control unit controls the first motor to rotate the abrasive disk, thereby completing cleaning of the wafer chuck. When the grinding disc rotates, the exhaust pipeline control unit receives a starting instruction, the exhaust electromagnetic air valve is opened, the exhaust pipeline suction device starts to work, and the abraded particles are removed to the outside of the etching equipment through the small circular holes in the grinding disc through the exhaust pipe. And the central information processing system receives the stop command, and controls the mechanical arm and the grinding disc to return to the initial positions, so that the wafer chuck is cleaned once.
Fig. 9 is a schematic view of the number of particles on the wafer chuck before being cleaned by the wafer chuck cleaning device according to the embodiment of the present invention. Fig. 10 is a schematic view of the number of particles on the wafer chuck after being cleaned by the wafer chuck cleaning device according to the embodiment of the present invention. In fig. 9 and 10, the darker the color region represents the greater the number of particles in the region. As shown in fig. 9, the number of particles in the region 10 before cleaning is significantly out of the standard range. As shown in fig. 10, after being cleaned by the cleaning apparatus of the embodiment of the invention, the number of particles on the wafer chuck is effectively reduced.
Meanwhile, the wafer chuck cleaning device provided by the embodiment of the invention can shorten the cleaning time, the manual cleaning method is 20-30 minutes compared with the conventional method, and the cleaning can be completed in only 5 minutes in the embodiment of the invention, so that the equipment halt time is shortened, and the WPH of the equipment can be improved. Meanwhile, the embodiment of the invention does not need to disassemble the baffle of the equipment, can avoid pollution caused by external particles entering the equipment, and reduces the risk of equipment failure caused by errors generated by artificial cleaning. Compared with a comparative example, the cleaning device provided by the embodiment of the invention has the advantages of convenience, safety, economy and the like.
In an embodiment of the invention, a wafer chuck cleaning device comprising a friction rotating mechanism, a mechanical arm, an exhaust pipeline and a control component is provided. The grinding disc on the friction rotating mechanism rubs the wafer chuck through the control component, and then particles are sucked and removed through the exhaust pipeline. The wafer chuck cleaning device provided by the embodiment of the invention is used for removing particles on the wafer chuck, so that the cleaning time can be shortened, and the WPH of equipment can be improved. Meanwhile, pollution caused by external particles entering the equipment can be avoided, and the risk of equipment failure caused by errors generated by artificial cleaning is reduced. The cleanliness of the wafer chuck can be ensured.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (11)

1. A wafer chuck cleaning apparatus, the apparatus comprising:
the friction rotating mechanism is provided with a through hole and is configured to be attached to the wafer chuck for rotating friction;
the mechanical arm is used for moving the friction rotating mechanism;
the exhaust pipeline is arranged at a preset position and used for absorbing and removing particles;
and the control component is used for controlling the mechanical arm to move the friction rotating mechanism to a position attached to the wafer chuck for rotating and rubbing to remove the particles adhered to the wafer chuck.
2. The device of claim 1, wherein the frictional rotation mechanism comprises:
the grinding disc is used for rubbing the wafer chuck so as to separate the particles adhered on the wafer chuck from the wafer chuck;
the first end of the first motor is connected to the grinding disc and used for controlling the grinding disc to rotate.
3. The apparatus of claim 2, wherein the abrasive disk is provided with a plurality of through holes through which the particles enter the air-moving mechanism.
4. The device of claim 1, wherein the frictional rotation mechanism further comprises:
a grinding disc position sensor for determining a displacement signal of the grinding disc;
and the pneumatic device is used for attaching the grinding disc to the wafer chuck.
5. The apparatus of claim 1, wherein one end of the robotic arm is coupled to the frictional rotation mechanism.
6. The apparatus of claim 1, wherein the robotic arm comprises:
a plurality of knuckle arms and a plurality of second motors between the knuckle arms;
the second motor is used for controlling the displacement of the mechanical arm in different directions.
7. The apparatus of claim 1, wherein the robotic arm further comprises:
a mechanical arm position sensor for determining a displacement signal of the mechanical arm.
8. The apparatus of claim 2, wherein the exhaust line comprises:
the first end of the exhaust pipe is connected with the exhaust main body, and the second end of the exhaust pipe is arranged above the wafer chuck;
wherein, the air exhaust main body is used for generating suction.
9. The apparatus of claim 8, wherein an inner wall of the second end of the exhaust duct is connected to an outer periphery of the abrasive disk.
10. The apparatus of claim 1, wherein the wafer chuck cleaning apparatus is used in a stepper.
11. The apparatus of claim 1, wherein the abrasive disk is substantially the same size as the wafer chuck.
CN201910672534.1A 2019-07-24 2019-07-24 Wafer chuck cleaning device Pending CN112276784A (en)

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Cited By (4)

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Publication number Priority date Publication date Assignee Title
CN113363198A (en) * 2021-06-03 2021-09-07 长鑫存储技术有限公司 Wafer processing device
CN113752146A (en) * 2021-09-08 2021-12-07 武汉新芯集成电路制造有限公司 Chuck cleaning device, chuck bearing surface detection method and bonding equipment
CN114012596A (en) * 2021-10-29 2022-02-08 长江存储科技有限责任公司 Wafer thinning equipment and method
CN117038531A (en) * 2023-10-09 2023-11-10 宁波润华全芯微电子设备有限公司 Exhaust device and control method thereof

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113363198A (en) * 2021-06-03 2021-09-07 长鑫存储技术有限公司 Wafer processing device
CN113363198B (en) * 2021-06-03 2022-11-01 长鑫存储技术有限公司 Wafer processing device
CN113752146A (en) * 2021-09-08 2021-12-07 武汉新芯集成电路制造有限公司 Chuck cleaning device, chuck bearing surface detection method and bonding equipment
CN114012596A (en) * 2021-10-29 2022-02-08 长江存储科技有限责任公司 Wafer thinning equipment and method
CN117038531A (en) * 2023-10-09 2023-11-10 宁波润华全芯微电子设备有限公司 Exhaust device and control method thereof
CN117038531B (en) * 2023-10-09 2024-02-02 宁波润华全芯微电子设备有限公司 Control method of exhaust device

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