TW201032998A - Copper clad laminate and method of manufacturing the same - Google Patents

Copper clad laminate and method of manufacturing the same Download PDF

Info

Publication number
TW201032998A
TW201032998A TW098123200A TW98123200A TW201032998A TW 201032998 A TW201032998 A TW 201032998A TW 098123200 A TW098123200 A TW 098123200A TW 98123200 A TW98123200 A TW 98123200A TW 201032998 A TW201032998 A TW 201032998A
Authority
TW
Taiwan
Prior art keywords
resin
prepreg
foil substrate
copper foil
copper
Prior art date
Application number
TW098123200A
Other languages
English (en)
Chinese (zh)
Inventor
Sang-Jun Yoon
Jun-Rok Oh
Geum-Hee Yun
Choon-Keun Lee
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW201032998A publication Critical patent/TW201032998A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW098123200A 2009-03-12 2009-07-09 Copper clad laminate and method of manufacturing the same TW201032998A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090021227A KR101077392B1 (ko) 2009-03-12 2009-03-12 동박 적층판 및 그 제조방법

Publications (1)

Publication Number Publication Date
TW201032998A true TW201032998A (en) 2010-09-16

Family

ID=42974273

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098123200A TW201032998A (en) 2009-03-12 2009-07-09 Copper clad laminate and method of manufacturing the same

Country Status (3)

Country Link
JP (1) JP4954246B2 (ko)
KR (1) KR101077392B1 (ko)
TW (1) TW201032998A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015180206A1 (zh) * 2014-05-27 2015-12-03 广东生益科技股份有限公司 一种热固性树脂夹心预浸体、制备方法及覆铜板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106604545B (zh) * 2015-10-16 2020-02-07 健鼎（无锡）电子有限公司 铜箔基板的制作方法
TWI554175B (zh) * 2015-10-22 2016-10-11 健鼎科技股份有限公司 銅箔基板的製作方法
KR102173113B1 (ko) * 2017-08-24 2020-11-02 주식회사 엘지화학 금속 박 적층판의 제조 방법
CN109796706B (zh) * 2019-01-30 2021-05-14 常州中英科技股份有限公司 一种聚多巴胺改性的含氟树脂混合物及其制备的半固化片和覆铜板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2663596B2 (ja) * 1988-12-26 1997-10-15 日立化成工業株式会社 銅張積層板
JPH06246871A (ja) * 1993-03-01 1994-09-06 Sumitomo Chem Co Ltd エポキシ樹脂銅張り積層板
JP2001199009A (ja) 2000-01-21 2001-07-24 Risho Kogyo Co Ltd 銅張り積層板
JP4957552B2 (ja) * 2005-09-30 2012-06-20 住友ベークライト株式会社 プリント配線板用キャリア付きプリプレグの製造方法、プリント配線板用キャリア付きプリプレグ、プリント配線板用薄型両面板の製造方法、プリント配線板用薄型両面板、及び多層プリント配線板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015180206A1 (zh) * 2014-05-27 2015-12-03 广东生益科技股份有限公司 一种热固性树脂夹心预浸体、制备方法及覆铜板
CN105172270A (zh) * 2014-05-27 2015-12-23 广东生益科技股份有限公司 一种热固性树脂夹心预浸体、制备方法及覆铜板

Also Published As

Publication number Publication date
JP4954246B2 (ja) 2012-06-13
KR20100102917A (ko) 2010-09-27
KR101077392B1 (ko) 2011-10-26
JP2010214939A (ja) 2010-09-30

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