TW201032931A - Laser patterning method and laser patterning device - Google Patents

Laser patterning method and laser patterning device Download PDF

Info

Publication number
TW201032931A
TW201032931A TW098145091A TW98145091A TW201032931A TW 201032931 A TW201032931 A TW 201032931A TW 098145091 A TW098145091 A TW 098145091A TW 98145091 A TW98145091 A TW 98145091A TW 201032931 A TW201032931 A TW 201032931A
Authority
TW
Taiwan
Prior art keywords
substrate
laser
pattern
glass substrate
line data
Prior art date
Application number
TW098145091A
Other languages
English (en)
Chinese (zh)
Inventor
Masanori Tao
Tomoo Uchikata
Naoyoshi Hamakawa
Hiromitsu Wada
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW201032931A publication Critical patent/TW201032931A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Photovoltaic Devices (AREA)
TW098145091A 2009-01-19 2009-12-25 Laser patterning method and laser patterning device TW201032931A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009008341A JP2010162586A (ja) 2009-01-19 2009-01-19 レーザ加工方法及びレーザ加工装置

Publications (1)

Publication Number Publication Date
TW201032931A true TW201032931A (en) 2010-09-16

Family

ID=42579202

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098145091A TW201032931A (en) 2009-01-19 2009-12-25 Laser patterning method and laser patterning device

Country Status (3)

Country Link
JP (1) JP2010162586A (ko)
KR (1) KR20100084985A (ko)
TW (1) TW201032931A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495531B (zh) * 2010-09-16 2015-08-11 Panasonic Corp Laser processing device and laser processing method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101221093B1 (ko) * 2010-08-17 2013-01-17 (주)엔에스 디스플레이 패널용 박막필름의 재단장치
WO2012050405A2 (ko) * 2010-10-16 2012-04-19 엘지전자 주식회사 디지털 수신기 및 디지털 수신기에서의 3d 컨텐트 처리방법
DE102011052444A1 (de) * 2011-08-05 2013-02-07 Jenoptik Automatisierungstechnik Gmbh Verfahren zur linearen Strukturierung eines beschichteten Substrats zur Herstellung von Dünnschicht-Solarzellenmodulen
JP6019892B2 (ja) 2012-07-30 2016-11-02 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
KR101221095B1 (ko) * 2012-08-07 2013-01-16 (주)엔에스 디스플레이 패널용 박막필름의 재단방법
JP2014082418A (ja) * 2012-10-18 2014-05-08 Disco Abrasive Syst Ltd レーザー加工装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007048835A (ja) * 2005-08-08 2007-02-22 Shibaura Mechatronics Corp レーザ加工装置及びそれを用いた太陽電池基板のパターニング方法
GB0622232D0 (en) * 2006-11-08 2006-12-20 Rumsby Philip T Method and apparatus for laser beam alignment for solar panel scribing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495531B (zh) * 2010-09-16 2015-08-11 Panasonic Corp Laser processing device and laser processing method

Also Published As

Publication number Publication date
JP2010162586A (ja) 2010-07-29
KR20100084985A (ko) 2010-07-28

Similar Documents

Publication Publication Date Title
TW201032931A (en) Laser patterning method and laser patterning device
TW201006600A (en) Laser-scribing platform and hybrid writing strategy
JP2004115356A (ja) メカニカルスクライブ装置
TWI462792B (zh) Lightning scribing method and mine scribing device for brittle material substrate
JP2010155258A (ja) 基板処理装置
TW200844029A (en) Method for adhering optical members and apparatus using the same
TW201032935A (en) Method of working thin layer on work and thin layor working apparatus
CN103433619B (zh) 激光熔覆打印机及线路板的制作方法
JP2009044044A (ja) 電子部品実装方法及び装置
TW201117902A (en) Latitudinal iso-line scribe, stitching, and simplified laser and scanner controls
JP3571243B2 (ja) プロキシミティ露光方法及び装置
TW201136693A (en) Laser processing method, laser processing device and solar panel manufacturing method
TW200900251A (en) Liquid droplet discharge device, manufacturing method of electrooptical device, electrooptical device and electronic device
TW201032934A (en) Substrate processing equipment
JP4534248B2 (ja) ガラス板の製造方法及びその装置
JPH097968A (ja) レーザ光照射方法及びレーザ光照射装置
JP2007290304A (ja) 脆性シート材分断方法及びその装置
TW201214022A (en) Photomask, laser beam annealing apparatus and exposure apparatus therewith
JP2007281285A (ja) 基板搬送装置
JP6309220B2 (ja) 搬送システム
JP2010157640A (ja) 基板受渡し装置およびその方法
JP2008306109A (ja) 露光装置用基板搬送機構
JP4147963B2 (ja) 電子部品搭載装置および電子部品搭載方法
JP4713287B2 (ja) 電子部品の実装装置及び実装方法
JP2007223854A (ja) 基板分割方法、基板分割装置、レーザスクライブ装置、電気光学装置、電子機器