TW201017085A - Manufacturing method for heat pipe joining and fixing base and structure thereof - Google Patents

Manufacturing method for heat pipe joining and fixing base and structure thereof Download PDF

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Publication number
TW201017085A
TW201017085A TW097140670A TW97140670A TW201017085A TW 201017085 A TW201017085 A TW 201017085A TW 097140670 A TW097140670 A TW 097140670A TW 97140670 A TW97140670 A TW 97140670A TW 201017085 A TW201017085 A TW 201017085A
Authority
TW
Taiwan
Prior art keywords
heat pipe
heat
recess
adhesive medium
fixing seat
Prior art date
Application number
TW097140670A
Other languages
English (en)
Chinese (zh)
Other versions
TWI331205B (enExample
Inventor
Guo-Ren Lin
Huai-Ming Wang
Zhen Xiang Lin
zhi-hong Zheng
jian-cai Xu
Original Assignee
Golden Sun News Tech Co Ltd
Cpumate Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44830674&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW201017085(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Golden Sun News Tech Co Ltd, Cpumate Inc filed Critical Golden Sun News Tech Co Ltd
Priority to TW097140670A priority Critical patent/TW201017085A/zh
Priority to CN2008101712421A priority patent/CN101730441B/zh
Priority to AT08020034T priority patent/ATE474198T1/de
Priority to EP08020034A priority patent/EP2187158B1/en
Priority to DE602008001804T priority patent/DE602008001804D1/de
Priority to US12/272,045 priority patent/US8136245B2/en
Publication of TW201017085A publication Critical patent/TW201017085A/zh
Application granted granted Critical
Publication of TWI331205B publication Critical patent/TWI331205B/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D39/00—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
    • B21D39/04—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of tubes with tubes; of tubes with rods
    • B21D39/048—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of tubes with tubes; of tubes with rods using presses for radially crimping tubular elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B21D53/06—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of metal tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49364—Tube joined to flat sheet longitudinally, i.e., tube sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49373—Tube joint and tube plate structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)
  • Supports For Pipes And Cables (AREA)
  • Road Paving Structures (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW097140670A 2008-10-23 2008-10-23 Manufacturing method for heat pipe joining and fixing base and structure thereof TW201017085A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW097140670A TW201017085A (en) 2008-10-23 2008-10-23 Manufacturing method for heat pipe joining and fixing base and structure thereof
CN2008101712421A CN101730441B (zh) 2008-10-23 2008-10-27 热管结合固定座的制法及其结构
AT08020034T ATE474198T1 (de) 2008-10-23 2008-11-17 Verfahren zum kombinieren von heizrohren mit einer befestigungsunterlage und struktur damit
EP08020034A EP2187158B1 (en) 2008-10-23 2008-11-17 Method for combining heat pipes with a fixing base and structure of the same
DE602008001804T DE602008001804D1 (de) 2008-10-23 2008-11-17 Verfahren zum Kombinieren von Heizrohren mit einer Befestigungsunterlage und Struktur damit
US12/272,045 US8136245B2 (en) 2008-10-23 2008-11-17 Method for combining heat pipes with a fixing base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097140670A TW201017085A (en) 2008-10-23 2008-10-23 Manufacturing method for heat pipe joining and fixing base and structure thereof

Publications (2)

Publication Number Publication Date
TW201017085A true TW201017085A (en) 2010-05-01
TWI331205B TWI331205B (enExample) 2010-10-01

Family

ID=44830674

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097140670A TW201017085A (en) 2008-10-23 2008-10-23 Manufacturing method for heat pipe joining and fixing base and structure thereof

Country Status (6)

Country Link
US (1) US8136245B2 (enExample)
EP (1) EP2187158B1 (enExample)
CN (1) CN101730441B (enExample)
AT (1) ATE474198T1 (enExample)
DE (1) DE602008001804D1 (enExample)
TW (1) TW201017085A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10437299B2 (en) 2017-06-30 2019-10-08 Chiun Mai Communication Systems, Inc. Heat-dissipating structure of electronic device

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201015041A (en) * 2008-10-03 2010-04-16 Golden Sun News Tech Co Ltd Smoothing-manufacture method to bury the heat-pipe evaporating segment into the heat-conduction base
US8484845B2 (en) * 2009-09-18 2013-07-16 Cpumate Inc. Method of manufacturing a heat conducting structure having a coplanar heated portion
US20110179957A1 (en) * 2010-01-25 2011-07-28 Shyh-Ming Chen Method for flattening heat dissipating tube and device for performing the same
CN102218487B (zh) * 2011-03-04 2016-01-13 东莞汉旭五金塑胶科技有限公司 导热座供多热管密合排列之组配方法及其结构
US20120312508A1 (en) * 2011-06-08 2012-12-13 Shen Chih-Yeh Gapless heat pipe combination structure and combination method thereof
CN102368447A (zh) * 2011-10-24 2012-03-07 浙江海森纺机科技有限公司 一种绳编无结网绕线机上的行程开关固定座
CN103209571A (zh) * 2012-01-16 2013-07-17 奇鋐科技股份有限公司 散热基座结构及其制造方法
US20130228310A1 (en) * 2012-03-01 2013-09-05 Asia Vital Components Co., Ltd. Heat-dissipating base structure and method for manufacturing same
TWI512259B (zh) * 2013-12-17 2015-12-11 廣達電腦股份有限公司 散熱組件的製造方法
CN104093293B (zh) * 2014-04-01 2017-10-27 东莞汉旭五金塑胶科技有限公司 金属散热板与热导管的嵌合组成及其制法
US9895778B2 (en) * 2015-11-26 2018-02-20 Asia Vital Components Co., Ltd. Heat dissipation unit manufacturing method
CN110546447A (zh) * 2017-04-28 2019-12-06 株式会社村田制作所 均热板
KR102072082B1 (ko) * 2019-05-09 2020-01-31 잘만테크 주식회사 히트 파이프 및 전열 블록을 포함한 전자부품 냉각장치의 제조방법
JP6828085B2 (ja) * 2019-05-09 2021-02-10 レノボ・シンガポール・プライベート・リミテッド 熱輸送装置および電子機器
CN110856417B (zh) * 2019-11-20 2020-12-18 华为技术有限公司 热管、散热模组及终端设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6918429B2 (en) 2003-11-05 2005-07-19 Cpumate Inc. Dual-layer heat dissipating structure
US20060011329A1 (en) 2004-07-16 2006-01-19 Jack Wang Heat pipe heat sink with holeless fin module
JP4238867B2 (ja) * 2005-03-01 2009-03-18 セイコーエプソン株式会社 冷却ユニットの製造方法、冷却ユニット、光学装置、並びにプロジェクタ
US20070261244A1 (en) * 2006-05-12 2007-11-15 Chih-Hung Cheng Leveling Method for Embedding Heat Pipe in Heat-Conducting Seat
CN200965870Y (zh) * 2006-09-04 2007-10-24 曙光信息产业(北京)有限公司 一种中央处理器散热器
CN200953713Y (zh) * 2006-09-22 2007-09-26 杜建军 热管散热器
CN200973220Y (zh) * 2006-11-10 2007-11-07 鈤新科技股份有限公司 固定座及固定座与热管的组合结构
CN201119230Y (zh) * 2007-10-10 2008-09-17 奇鋐科技股份有限公司 散热模块

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10437299B2 (en) 2017-06-30 2019-10-08 Chiun Mai Communication Systems, Inc. Heat-dissipating structure of electronic device

Also Published As

Publication number Publication date
DE602008001804D1 (de) 2010-08-26
CN101730441B (zh) 2011-08-17
US20100122799A1 (en) 2010-05-20
EP2187158B1 (en) 2010-07-14
US8136245B2 (en) 2012-03-20
TWI331205B (enExample) 2010-10-01
CN101730441A (zh) 2010-06-09
EP2187158A1 (en) 2010-05-19
ATE474198T1 (de) 2010-07-15

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MC4A Revocation of granted patent