CN102555325B - 一种复合固定型高散热膜结构 - Google Patents
一种复合固定型高散热膜结构 Download PDFInfo
- Publication number
- CN102555325B CN102555325B CN201010618529.1A CN201010618529A CN102555325B CN 102555325 B CN102555325 B CN 102555325B CN 201010618529 A CN201010618529 A CN 201010618529A CN 102555325 B CN102555325 B CN 102555325B
- Authority
- CN
- China
- Prior art keywords
- dissipation film
- high heat
- heat dissipation
- heat
- fixed type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 36
- 230000017525 heat dissipation Effects 0.000 claims abstract description 62
- 230000001464 adherent effect Effects 0.000 claims abstract description 30
- 230000005855 radiation Effects 0.000 claims abstract description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229910002804 graphite Inorganic materials 0.000 claims description 9
- 239000010439 graphite Substances 0.000 claims description 9
- 229910021389 graphene Inorganic materials 0.000 claims description 8
- 239000012943 hotmelt Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010618529.1A CN102555325B (zh) | 2010-12-31 | 2010-12-31 | 一种复合固定型高散热膜结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010618529.1A CN102555325B (zh) | 2010-12-31 | 2010-12-31 | 一种复合固定型高散热膜结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102555325A CN102555325A (zh) | 2012-07-11 |
CN102555325B true CN102555325B (zh) | 2016-01-20 |
Family
ID=46402566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010618529.1A Expired - Fee Related CN102555325B (zh) | 2010-12-31 | 2010-12-31 | 一种复合固定型高散热膜结构 |
Country Status (1)
Country | Link |
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CN (1) | CN102555325B (zh) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060275608A1 (en) * | 2005-06-07 | 2006-12-07 | General Electric Company | B-stageable film, electronic device, and associated process |
EP1746077A1 (de) * | 2005-06-21 | 2007-01-24 | Sgl Carbon Ag | Metallbeschichtete Graphitfolie |
CN101458049A (zh) * | 2008-12-02 | 2009-06-17 | 王晓山 | 复合石墨导热散热片 |
CN201965935U (zh) * | 2010-12-31 | 2011-09-07 | 常州碳元科技发展有限公司 | 一种复合固定型高散热膜结构 |
-
2010
- 2010-12-31 CN CN201010618529.1A patent/CN102555325B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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CN102555325A (zh) | 2012-07-11 |
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C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 306 room 213122, building A, 18 Huashan Road, Xinbei District, Jiangsu, Changzhou Applicant after: TANYUAN TECHNOLOGY Co.,Ltd. Address before: 306 room 213122, building A, 18 Huashan Road, Xinbei District, Jiangsu, Changzhou Applicant before: Jiangsu carbon dollar Polytron Technologies Inc. Address after: 306 room 213122, building A, 18 Huashan Road, Xinbei District, Jiangsu, Changzhou Applicant after: Jiangsu carbon dollar Polytron Technologies Inc. Address before: 306 room 213122, building A, 18 Huashan Road, Xinbei District, Jiangsu, Changzhou Applicant before: CHANGZHOU TANYUAN TECHNOLOGY DEVELOPMENT Co.,Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: CHANGZHOU TANYUAN TECHNOLOGY DEVELOPMENT CO., LTD. TO: JIANGSU TANYUAN TECHNOLOGY CO., LTD Free format text: CORRECT: APPLICANT; FROM: JIANGSU TANYUAN TECHNOLOGY CO., LTD TO: TANYUAN SCIENCE AND TECHNOLOGY CO., LTD. |
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CB02 | Change of applicant information |
Address after: 213145 Jiangsu city of Changzhou province Wujin Economic Development Zone Lanxiang Road No. 7 Applicant after: TANYUAN TECHNOLOGY Co.,Ltd. Address before: 306 room 213122, building A, 18 Huashan Road, Xinbei District, Jiangsu, Changzhou Applicant before: TANYUAN TECHNOLOGY Co.,Ltd. |
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CB03 | Change of inventor or designer information |
Inventor after: Wang Jianhong Inventor before: Request for anonymity |
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CB03 | Change of inventor or designer information |
Inventor after: Ma Yuchen Inventor before: Wang Jianhong |
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CF01 | Termination of patent right due to non-payment of annual fee |
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