TW201014148A - Bipolar pulsed power supply and power supply consisting of multiple bipolar pulse power supplies - Google Patents

Bipolar pulsed power supply and power supply consisting of multiple bipolar pulse power supplies Download PDF

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Publication number
TW201014148A
TW201014148A TW098117293A TW98117293A TW201014148A TW 201014148 A TW201014148 A TW 201014148A TW 098117293 A TW098117293 A TW 098117293A TW 98117293 A TW98117293 A TW 98117293A TW 201014148 A TW201014148 A TW 201014148A
Authority
TW
Taiwan
Prior art keywords
output
power supply
switching
circuit
bipolar pulse
Prior art date
Application number
TW098117293A
Other languages
English (en)
Chinese (zh)
Inventor
Yoshikuni Horishita
Shinobu Matsubara
Atsushi Ono
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW201014148A publication Critical patent/TW201014148A/zh

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
    • H02M7/53871—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration with automatic control of output voltage or current
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/493—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode the static converters being arranged for operation in parallel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Inverter Devices (AREA)
  • Physical Vapour Deposition (AREA)
TW098117293A 2008-05-26 2009-05-25 Bipolar pulsed power supply and power supply consisting of multiple bipolar pulse power supplies TW201014148A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008137077A JP5124344B2 (ja) 2008-05-26 2008-05-26 バイポーラパルス電源及び複数のバイポーラパルス電源からなる電源装置並びに出力方法

Publications (1)

Publication Number Publication Date
TW201014148A true TW201014148A (en) 2010-04-01

Family

ID=41376970

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098117293A TW201014148A (en) 2008-05-26 2009-05-25 Bipolar pulsed power supply and power supply consisting of multiple bipolar pulse power supplies

Country Status (6)

Country Link
US (1) US8467211B2 (enExample)
JP (1) JP5124344B2 (enExample)
KR (1) KR101190138B1 (enExample)
CN (1) CN102027667B (enExample)
TW (1) TW201014148A (enExample)
WO (1) WO2009145091A1 (enExample)

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TWI646867B (zh) * 2013-10-01 2019-01-01 德商創富許廷格有限及兩合公司 在電漿製程中監控放電的裝置及方法
US10290477B2 (en) 2014-02-07 2019-05-14 Trumpf Huettinger Sp. Z O. O. Monitoring a discharge in a plasma process
TWI748401B (zh) * 2019-04-10 2021-12-01 北京航空航天大學 從靶材泵出離子的新型脈動等離子體的電源及使用該電源之磁控濺射系統和空間推進器

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JP5124345B2 (ja) * 2008-05-26 2013-01-23 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP5186281B2 (ja) * 2008-05-26 2013-04-17 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP5339965B2 (ja) * 2009-03-02 2013-11-13 株式会社アルバック スパッタリング装置用の交流電源
JP5363281B2 (ja) * 2009-11-25 2013-12-11 株式会社アルバック 電源装置
JP2011146251A (ja) * 2010-01-14 2011-07-28 Fuji Mach Mfg Co Ltd プラズマ化ガス発生装置
WO2012023276A1 (ja) * 2010-08-18 2012-02-23 株式会社アルバック 直流電源装置
US9685297B2 (en) 2012-08-28 2017-06-20 Advanced Energy Industries, Inc. Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system
DE102016012460A1 (de) 2016-10-19 2018-04-19 Grenzebach Maschinenbau Gmbh Vorrichtung und Verfahren zur Herstellung definierter Eigenschaften von Gradientenschichten in einem System mehrlagiger Beschichtungen bei Sputter - Anlagen
EP3396700A1 (en) * 2017-04-27 2018-10-31 TRUMPF Hüttinger GmbH + Co. KG Power converter unit, plasma processing equipment and method of controlling several plasma processes
TWI872423B (zh) 2017-11-17 2025-02-11 新加坡商Aes 全球公司 用於在空間域和時間域上控制基板上的電漿處理之系統和方法,及相關的電腦可讀取媒體
US12505986B2 (en) 2017-11-17 2025-12-23 Advanced Energy Industries, Inc. Synchronization of plasma processing components
US11437221B2 (en) 2017-11-17 2022-09-06 Advanced Energy Industries, Inc. Spatial monitoring and control of plasma processing environments
JP6657535B2 (ja) * 2017-12-26 2020-03-04 キヤノントッキ株式会社 スパッタ成膜装置およびスパッタ成膜方法
KR102773804B1 (ko) 2018-05-06 2025-02-26 에이이에스 글로벌 홀딩스 피티이 리미티드 크레이징을 감소시키기 위한 장치, 시스템 및 방법
CN109811324B (zh) * 2019-03-14 2021-02-09 哈尔滨工业大学 基于异质双靶高功率脉冲磁控溅射制备掺杂类薄膜的装置及方法
US11887812B2 (en) 2019-07-12 2024-01-30 Advanced Energy Industries, Inc. Bias supply with a single controlled switch
CN114424447A (zh) 2019-07-29 2022-04-29 先进工程解决方案全球控股私人有限公司 用于多个负载的脉冲驱动的具有通道偏移的多路复用功率发生器输出
SG10201913413YA (en) * 2019-12-26 2021-07-29 Zero2 5 Biotech Pte Ltd System and device for air purification
WO2021181295A1 (en) * 2020-03-10 2021-09-16 Slovenská Technická Univerzita V Bratislave Connection of high-performance pulse discharge plasma generator, especially for magnetron sputtering
US12125674B2 (en) 2020-05-11 2024-10-22 Advanced Energy Industries, Inc. Surface charge and power feedback and control using a switch mode bias system
CN114134466B (zh) * 2020-09-04 2023-06-30 长鑫存储技术有限公司 用于物理气相沉积工艺的靶材初始处理方法与控制器
US20230050841A1 (en) * 2021-08-13 2023-02-16 Advanced Energy Industries, Inc. Configurable bias supply with bidirectional switch
US12046448B2 (en) 2022-01-26 2024-07-23 Advanced Energy Industries, Inc. Active switch on time control for bias supply
US11670487B1 (en) 2022-01-26 2023-06-06 Advanced Energy Industries, Inc. Bias supply control and data processing
US11942309B2 (en) 2022-01-26 2024-03-26 Advanced Energy Industries, Inc. Bias supply with resonant switching
US11978613B2 (en) 2022-09-01 2024-05-07 Advanced Energy Industries, Inc. Transition control in a bias supply
CN115811303B (zh) * 2022-12-05 2026-04-17 华中科技大学 一种电感储能型脉冲功率电源
US12567572B2 (en) 2023-07-11 2026-03-03 Advanced Energy Industries, Inc. Plasma behaviors predicted by current measurements during asymmetric bias waveform application
US12700578B2 (en) 2024-02-29 2026-08-04 Advanced Energy Industries, Inc. Plasma processing based on bias supply reporting

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JP4513376B2 (ja) * 2004-03-26 2010-07-28 パナソニック電工株式会社 高圧放電灯点灯装置及び照明器具
PL1864313T3 (pl) * 2005-03-24 2013-05-31 Oerlikon Trading Ag Próżniowy generator plazmowy
JP5429771B2 (ja) * 2008-05-26 2014-02-26 株式会社アルバック スパッタリング方法
JP5124345B2 (ja) * 2008-05-26 2013-01-23 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP5186281B2 (ja) * 2008-05-26 2013-04-17 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI646867B (zh) * 2013-10-01 2019-01-01 德商創富許廷格有限及兩合公司 在電漿製程中監控放電的裝置及方法
US10181392B2 (en) 2013-10-01 2019-01-15 Trumpf Huettinger Gmbh + Co. Kg Monitoring a discharge in a plasma process
US10290477B2 (en) 2014-02-07 2019-05-14 Trumpf Huettinger Sp. Z O. O. Monitoring a discharge in a plasma process
TWI748401B (zh) * 2019-04-10 2021-12-01 北京航空航天大學 從靶材泵出離子的新型脈動等離子體的電源及使用該電源之磁控濺射系統和空間推進器

Also Published As

Publication number Publication date
WO2009145091A1 (ja) 2009-12-03
US20110038187A1 (en) 2011-02-17
US8467211B2 (en) 2013-06-18
KR20110010820A (ko) 2011-02-07
JP2009284732A (ja) 2009-12-03
CN102027667A (zh) 2011-04-20
KR101190138B1 (ko) 2012-10-12
JP5124344B2 (ja) 2013-01-23
CN102027667B (zh) 2014-02-12

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