TW201014148A - Bipolar pulsed power supply and power supply consisting of multiple bipolar pulse power supplies - Google Patents

Bipolar pulsed power supply and power supply consisting of multiple bipolar pulse power supplies Download PDF

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Publication number
TW201014148A
TW201014148A TW098117293A TW98117293A TW201014148A TW 201014148 A TW201014148 A TW 201014148A TW 098117293 A TW098117293 A TW 098117293A TW 98117293 A TW98117293 A TW 98117293A TW 201014148 A TW201014148 A TW 201014148A
Authority
TW
Taiwan
Prior art keywords
output
power supply
switching
circuit
bipolar pulse
Prior art date
Application number
TW098117293A
Other languages
English (en)
Chinese (zh)
Inventor
Yoshikuni Horishita
Shinobu Matsubara
Atsushi Ono
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW201014148A publication Critical patent/TW201014148A/zh

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Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
    • H02M7/53871Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration with automatic control of output voltage or current
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/493Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode the static converters being arranged for operation in parallel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • Inverter Devices (AREA)
TW098117293A 2008-05-26 2009-05-25 Bipolar pulsed power supply and power supply consisting of multiple bipolar pulse power supplies TW201014148A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008137077A JP5124344B2 (ja) 2008-05-26 2008-05-26 バイポーラパルス電源及び複数のバイポーラパルス電源からなる電源装置並びに出力方法

Publications (1)

Publication Number Publication Date
TW201014148A true TW201014148A (en) 2010-04-01

Family

ID=41376970

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098117293A TW201014148A (en) 2008-05-26 2009-05-25 Bipolar pulsed power supply and power supply consisting of multiple bipolar pulse power supplies

Country Status (6)

Country Link
US (1) US8467211B2 (enExample)
JP (1) JP5124344B2 (enExample)
KR (1) KR101190138B1 (enExample)
CN (1) CN102027667B (enExample)
TW (1) TW201014148A (enExample)
WO (1) WO2009145091A1 (enExample)

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TWI646867B (zh) * 2013-10-01 2019-01-01 德商創富許廷格有限及兩合公司 在電漿製程中監控放電的裝置及方法
US10290477B2 (en) 2014-02-07 2019-05-14 Trumpf Huettinger Sp. Z O. O. Monitoring a discharge in a plasma process
TWI748401B (zh) * 2019-04-10 2021-12-01 北京航空航天大學 從靶材泵出離子的新型脈動等離子體的電源及使用該電源之磁控濺射系統和空間推進器

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JP5124345B2 (ja) * 2008-05-26 2013-01-23 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP5186281B2 (ja) * 2008-05-26 2013-04-17 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP5339965B2 (ja) 2009-03-02 2013-11-13 株式会社アルバック スパッタリング装置用の交流電源
JP5363281B2 (ja) * 2009-11-25 2013-12-11 株式会社アルバック 電源装置
JP2011146251A (ja) * 2010-01-14 2011-07-28 Fuji Mach Mfg Co Ltd プラズマ化ガス発生装置
KR101421483B1 (ko) * 2010-08-18 2014-07-22 가부시키가이샤 알박 직류 전원 장치
US9685297B2 (en) 2012-08-28 2017-06-20 Advanced Energy Industries, Inc. Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system
DE102016012460A1 (de) * 2016-10-19 2018-04-19 Grenzebach Maschinenbau Gmbh Vorrichtung und Verfahren zur Herstellung definierter Eigenschaften von Gradientenschichten in einem System mehrlagiger Beschichtungen bei Sputter - Anlagen
EP3396700A1 (en) * 2017-04-27 2018-10-31 TRUMPF Hüttinger GmbH + Co. KG Power converter unit, plasma processing equipment and method of controlling several plasma processes
US11437221B2 (en) 2017-11-17 2022-09-06 Advanced Energy Industries, Inc. Spatial monitoring and control of plasma processing environments
CN111788655B (zh) 2017-11-17 2024-04-05 先进工程解决方案全球控股私人有限公司 对等离子体处理的离子偏置电压的空间和时间控制
JP6657535B2 (ja) * 2017-12-26 2020-03-04 キヤノントッキ株式会社 スパッタ成膜装置およびスパッタ成膜方法
EP3791420B1 (en) * 2018-05-06 2024-06-12 AES Global Holdings, Pte. Ltd. Deposition system to reduce crazing
CN109811324B (zh) * 2019-03-14 2021-02-09 哈尔滨工业大学 基于异质双靶高功率脉冲磁控溅射制备掺杂类薄膜的装置及方法
JP7603649B2 (ja) 2019-07-12 2024-12-20 エーイーエス グローバル ホールディングス, プライベート リミテッド 単一制御型スイッチを伴うバイアス供給装置
CN114424447A (zh) 2019-07-29 2022-04-29 先进工程解决方案全球控股私人有限公司 用于多个负载的脉冲驱动的具有通道偏移的多路复用功率发生器输出
SG10201913413YA (en) * 2019-12-26 2021-07-29 Zero2 5 Biotech Pte Ltd System and device for air purification
JP2023518170A (ja) * 2020-03-10 2023-04-28 スロベンスカ テクニッカ ウニベラヂッタ べ ブラチスラバ 特にマグネトロン・スパッタリングのための高性能パルス放電プラズマ発生器の接続物
US12125674B2 (en) 2020-05-11 2024-10-22 Advanced Energy Industries, Inc. Surface charge and power feedback and control using a switch mode bias system
US20220074043A1 (en) * 2020-09-04 2022-03-10 Changxin Memory Technologies, Inc. Initial treatment method for target material for physical vapor deposition process, and controller
US20230050841A1 (en) * 2021-08-13 2023-02-16 Advanced Energy Industries, Inc. Configurable bias supply with bidirectional switch
US11942309B2 (en) 2022-01-26 2024-03-26 Advanced Energy Industries, Inc. Bias supply with resonant switching
US12046448B2 (en) 2022-01-26 2024-07-23 Advanced Energy Industries, Inc. Active switch on time control for bias supply
US11670487B1 (en) 2022-01-26 2023-06-06 Advanced Energy Industries, Inc. Bias supply control and data processing
US11978613B2 (en) 2022-09-01 2024-05-07 Advanced Energy Industries, Inc. Transition control in a bias supply

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US5773799A (en) * 1996-04-01 1998-06-30 Gas Research Institute High-frequency induction heating power supply
DE19651615C1 (de) * 1996-12-12 1997-07-10 Fraunhofer Ges Forschung Verfahren zum Aufbringen von Kohlenstoffschichten durch reaktives Magnetron-Sputtern
DE19651811B4 (de) * 1996-12-13 2006-08-31 Unaxis Deutschland Holding Gmbh Vorrichtung zum Belegen eines Substrats mit dünnen Schichten
JP3829233B2 (ja) * 1999-05-24 2006-10-04 富士電機ホールディングス株式会社 高周波電源の制御方法
JP4513376B2 (ja) * 2004-03-26 2010-07-28 パナソニック電工株式会社 高圧放電灯点灯装置及び照明器具
EP1864313B1 (de) * 2005-03-24 2012-12-19 Oerlikon Trading AG, Trübbach Vakuumplasmagenerator
JP5186281B2 (ja) * 2008-05-26 2013-04-17 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP5124345B2 (ja) * 2008-05-26 2013-01-23 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP5429771B2 (ja) * 2008-05-26 2014-02-26 株式会社アルバック スパッタリング方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI646867B (zh) * 2013-10-01 2019-01-01 德商創富許廷格有限及兩合公司 在電漿製程中監控放電的裝置及方法
US10181392B2 (en) 2013-10-01 2019-01-15 Trumpf Huettinger Gmbh + Co. Kg Monitoring a discharge in a plasma process
US10290477B2 (en) 2014-02-07 2019-05-14 Trumpf Huettinger Sp. Z O. O. Monitoring a discharge in a plasma process
TWI748401B (zh) * 2019-04-10 2021-12-01 北京航空航天大學 從靶材泵出離子的新型脈動等離子體的電源及使用該電源之磁控濺射系統和空間推進器

Also Published As

Publication number Publication date
KR20110010820A (ko) 2011-02-07
US20110038187A1 (en) 2011-02-17
JP2009284732A (ja) 2009-12-03
CN102027667A (zh) 2011-04-20
JP5124344B2 (ja) 2013-01-23
US8467211B2 (en) 2013-06-18
KR101190138B1 (ko) 2012-10-12
CN102027667B (zh) 2014-02-12
WO2009145091A1 (ja) 2009-12-03

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