CN102027667B - 双极脉冲电源以及由多个双极脉冲电源构成的电源装置 - Google Patents

双极脉冲电源以及由多个双极脉冲电源构成的电源装置 Download PDF

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Publication number
CN102027667B
CN102027667B CN200980116930.0A CN200980116930A CN102027667B CN 102027667 B CN102027667 B CN 102027667B CN 200980116930 A CN200980116930 A CN 200980116930A CN 102027667 B CN102027667 B CN 102027667B
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China
Prior art keywords
power supply
output
bipolar pulse
switching
aforementioned
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CN200980116930.0A
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English (en)
Chinese (zh)
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CN102027667A (zh
Inventor
堀下芳邦
松原忍
小野敦
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Ulvac Inc
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Ulvac Inc
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
    • H02M7/53871—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration with automatic control of output voltage or current
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/493—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode the static converters being arranged for operation in parallel

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Inverter Devices (AREA)
  • Physical Vapour Deposition (AREA)
CN200980116930.0A 2008-05-26 2009-05-20 双极脉冲电源以及由多个双极脉冲电源构成的电源装置 Active CN102027667B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008137077A JP5124344B2 (ja) 2008-05-26 2008-05-26 バイポーラパルス電源及び複数のバイポーラパルス電源からなる電源装置並びに出力方法
JP2008-137077 2008-05-26
PCT/JP2009/059271 WO2009145091A1 (ja) 2008-05-26 2009-05-20 バイポーラパルス電源及び複数のバイポーラパルス電源からなる電源装置

Publications (2)

Publication Number Publication Date
CN102027667A CN102027667A (zh) 2011-04-20
CN102027667B true CN102027667B (zh) 2014-02-12

Family

ID=41376970

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CN200980116930.0A Active CN102027667B (zh) 2008-05-26 2009-05-20 双极脉冲电源以及由多个双极脉冲电源构成的电源装置

Country Status (6)

Country Link
US (1) US8467211B2 (enExample)
JP (1) JP5124344B2 (enExample)
KR (1) KR101190138B1 (enExample)
CN (1) CN102027667B (enExample)
TW (1) TW201014148A (enExample)
WO (1) WO2009145091A1 (enExample)

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JP5124345B2 (ja) * 2008-05-26 2013-01-23 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP5186281B2 (ja) * 2008-05-26 2013-04-17 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP5339965B2 (ja) 2009-03-02 2013-11-13 株式会社アルバック スパッタリング装置用の交流電源
JP5363281B2 (ja) * 2009-11-25 2013-12-11 株式会社アルバック 電源装置
JP2011146251A (ja) * 2010-01-14 2011-07-28 Fuji Mach Mfg Co Ltd プラズマ化ガス発生装置
KR101421483B1 (ko) * 2010-08-18 2014-07-22 가부시키가이샤 알박 직류 전원 장치
US9685297B2 (en) 2012-08-28 2017-06-20 Advanced Energy Industries, Inc. Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system
DE102013110883B3 (de) * 2013-10-01 2015-01-15 TRUMPF Hüttinger GmbH + Co. KG Vorrichtung und Verfahren zur Überwachung einer Entladung in einem Plasmaprozess
EP2905801B1 (en) 2014-02-07 2019-05-22 TRUMPF Huettinger Sp. Z o. o. Method of monitoring the discharge in a plasma process and monitoring device for monitoring the discharge in a plasma
DE102016012460A1 (de) * 2016-10-19 2018-04-19 Grenzebach Maschinenbau Gmbh Vorrichtung und Verfahren zur Herstellung definierter Eigenschaften von Gradientenschichten in einem System mehrlagiger Beschichtungen bei Sputter - Anlagen
EP3396700A1 (en) * 2017-04-27 2018-10-31 TRUMPF Hüttinger GmbH + Co. KG Power converter unit, plasma processing equipment and method of controlling several plasma processes
US11437221B2 (en) 2017-11-17 2022-09-06 Advanced Energy Industries, Inc. Spatial monitoring and control of plasma processing environments
CN111788655B (zh) 2017-11-17 2024-04-05 先进工程解决方案全球控股私人有限公司 对等离子体处理的离子偏置电压的空间和时间控制
JP6657535B2 (ja) * 2017-12-26 2020-03-04 キヤノントッキ株式会社 スパッタ成膜装置およびスパッタ成膜方法
EP3791420B1 (en) * 2018-05-06 2024-06-12 AES Global Holdings, Pte. Ltd. Deposition system to reduce crazing
CN109811324B (zh) * 2019-03-14 2021-02-09 哈尔滨工业大学 基于异质双靶高功率脉冲磁控溅射制备掺杂类薄膜的装置及方法
CN110138362B (zh) * 2019-04-10 2020-10-27 北京航空航天大学 一种从靶材泵出离子的新型脉动等离子体的电源
JP7603649B2 (ja) 2019-07-12 2024-12-20 エーイーエス グローバル ホールディングス， プライベート リミテッド 単一制御型スイッチを伴うバイアス供給装置
CN114424447A (zh) 2019-07-29 2022-04-29 先进工程解决方案全球控股私人有限公司 用于多个负载的脉冲驱动的具有通道偏移的多路复用功率发生器输出
SG10201913413YA (en) * 2019-12-26 2021-07-29 Zero2 5 Biotech Pte Ltd System and device for air purification
JP2023518170A (ja) * 2020-03-10 2023-04-28 スロベンスカ テクニッカ ウニベラヂッタ べ ブラチスラバ 特にマグネトロン・スパッタリングのための高性能パルス放電プラズマ発生器の接続物
US12125674B2 (en) 2020-05-11 2024-10-22 Advanced Energy Industries, Inc. Surface charge and power feedback and control using a switch mode bias system
US20220074043A1 (en) * 2020-09-04 2022-03-10 Changxin Memory Technologies, Inc. Initial treatment method for target material for physical vapor deposition process, and controller
US20230050841A1 (en) * 2021-08-13 2023-02-16 Advanced Energy Industries, Inc. Configurable bias supply with bidirectional switch
US11942309B2 (en) 2022-01-26 2024-03-26 Advanced Energy Industries, Inc. Bias supply with resonant switching
US12046448B2 (en) 2022-01-26 2024-07-23 Advanced Energy Industries, Inc. Active switch on time control for bias supply
US11670487B1 (en) 2022-01-26 2023-06-06 Advanced Energy Industries, Inc. Bias supply control and data processing
US11978613B2 (en) 2022-09-01 2024-05-07 Advanced Energy Industries, Inc. Transition control in a bias supply

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US6063245A (en) * 1996-12-12 2000-05-16 International Business Machines Corporation Magnetron sputtering method and apparatus utilizing a pulsed energy pattern
US6096174A (en) * 1996-12-13 2000-08-01 Leybold Systems Gmbh Apparatus for coating a substrate with thin layers
CN1939100A (zh) * 2004-03-26 2007-03-28 松下电工株式会社 高压放电灯照明设备和照明器材

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JP3829233B2 (ja) * 1999-05-24 2006-10-04 富士電機ホールディングス株式会社 高周波電源の制御方法
EP1864313B1 (de) * 2005-03-24 2012-12-19 Oerlikon Trading AG, Trübbach Vakuumplasmagenerator
JP5186281B2 (ja) * 2008-05-26 2013-04-17 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP5124345B2 (ja) * 2008-05-26 2013-01-23 株式会社アルバック バイポーラパルス電源及びこのバイポーラパルス電源を複数台並列接続してなる電源装置
JP5429771B2 (ja) * 2008-05-26 2014-02-26 株式会社アルバック スパッタリング方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6063245A (en) * 1996-12-12 2000-05-16 International Business Machines Corporation Magnetron sputtering method and apparatus utilizing a pulsed energy pattern
US6096174A (en) * 1996-12-13 2000-08-01 Leybold Systems Gmbh Apparatus for coating a substrate with thin layers
CN1939100A (zh) * 2004-03-26 2007-03-28 松下电工株式会社 高压放电灯照明设备和照明器材

Also Published As

Publication number Publication date
KR20110010820A (ko) 2011-02-07
US20110038187A1 (en) 2011-02-17
JP2009284732A (ja) 2009-12-03
CN102027667A (zh) 2011-04-20
JP5124344B2 (ja) 2013-01-23
TW201014148A (en) 2010-04-01
US8467211B2 (en) 2013-06-18
KR101190138B1 (ko) 2012-10-12
WO2009145091A1 (ja) 2009-12-03

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