TW201012377A - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

Info

Publication number
TW201012377A
TW201012377A TW97135041A TW97135041A TW201012377A TW 201012377 A TW201012377 A TW 201012377A TW 97135041 A TW97135041 A TW 97135041A TW 97135041 A TW97135041 A TW 97135041A TW 201012377 A TW201012377 A TW 201012377A
Authority
TW
Taiwan
Prior art keywords
hole
elastic piece
heat
absorbing plate
heat absorbing
Prior art date
Application number
TW97135041A
Other languages
Chinese (zh)
Other versions
TWI411388B (en
Inventor
Rung-An Chen
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW97135041A priority Critical patent/TWI411388B/en
Publication of TW201012377A publication Critical patent/TW201012377A/en
Application granted granted Critical
Publication of TWI411388B publication Critical patent/TWI411388B/en

Links

Abstract

A heat dissipation device includes a heat absorber, a heat sink and a heat pipe thermally connecting with the heat absorber and the heat sink. The heat absorber includes a first and a second resilient flakes at opposite sides, respectively. The first resilient flake includes a locking portion and two connecting portions at two opposite ends of the locking portion, respectively. The locking portion defines a first hole therein. Each of the connecting portions defines a second hole. The first resilient flake is mounted on the heat absorber via the second hole. The second resilient flake defines a first hole and at least a second hole. The second resilient flake is mounted on the heat absorber via the second hole. The heat absorber is mounted on a printed circuit board via the first holes of the first and second resilient flakes.

Description

201012377 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種散熱裝置，尤係涉及一種用於對發 熱電子元件進行散熱之散熱裝置。 【先前技術】 隨著電子資訊產業之快速發展，中央處理器等發熱電 子元件南速、高頻及集成化使其發熱量劇增’如不及時排 ❹除該等熱量’將引起發熱電子元件自身溫度之升高，進而 導致發熱電子元件之損壞或其性能之降低。故，需要對發 熱電子元件進行散熱。目前，業者常用之散熱方式係在發 熱電子元件表面裝設一散熱裝置。 該散熱裝置包括一吸熱板、一散熱器及將該吸熱板與 散熱器熱連接之一熱管，該吸熱板與電路板上之發熱電子 元件貼合，其四個角上各設有一套管，該套管垂直吸熱板 設置，每一套管内設有一彈簧螺釘’在安裝該散熱裝置時， 罾該吸熱板藉由四顆彈簧螺釘固定於電路板上，以使吸熱板 與發熱電子元件緊密接觸。 然而，上述散熱裝置安裝時需要四顆螺釘才可將該亨 熱板固定於電路板上，需要螺釘之數量較多，安裝過 為繁，’不利於節約成本’同時，電路板上相應之亦要言 四個女裝孔’這亦導致了電路板走線之難度增大，而若这 用更少之螺釘’會導致螺釘與吸熱板之施力點減少，不截 將吸熱板穩固地固定至發熱電子元件上。 6 201012377 【發明内容】 有鑒於此， 裝置。 有必要提供一種安裝簡便以及穩固之散熱 也也為種散熱裝置包括一吸熱板、-散熱器及將吸埶板 與散熱器熱連接之-熱管，該吸熱板上設有第一；:二 Ά所述第一、第二彈片分別設於所述吸熱板之兩相對侧 上所述第-彈片包括一鎖合部及分別設於所 兩端之兩結合部，所述鎖合部上只設有―個第—通孔，戶: 述兩結合部上各設有—個第二通孔，所述第—彈片藉由第 二通孔固定於吸熱板上，所述第二彈片只設有―個第一通 孔及至少-個第二通孔，所述第二彈片藉由第二通孔固定 於吸熱板上，所述第―、第二彈片之第—通孔用於將所述 吸熱板固定於一電路板上。 一種散熱裝置’包括吸熱板及分別連接在吸熱板相對 之兩侧上之第-彈片與第二彈片，該第一彈片與吸熱板藉 φ由至少兩個施力點連接，該第二彈片與吸熱板藉由至少一 個施力點連接’該第一彈片與第二彈片上分別只設置一個 鎖固點而用於將該吸熱板固定至與發熱電子元件接觸。 與習知技術相比，本發明中之散熱裝置安裝時，僅需 要兩個螺釘，使散熱裝置之安裝更加簡便，電路板上對應 亦只兩要δ免置兩個安裝孔，安裝孔數量較少，從而降低了 電路板走線之難度，但同時並沒有減少第一、第二彈片與 吸熱板之施力點個數，保證吸熱板之安裝穩固性不受影響。 【實施方式】 201012377 下面參照附圖結备實施例對本發明作進一步說明。 請參照圖1，本發明第一實施例之散熱裝置10包括一 吸熱板30、一散熱器60、將該吸熱板30與散熱器60熱連 接之一熱管20及將該吸熱板30固定之第一彈片4〇與第二 彈片50。 八 如圖2所示，該吸熱板30為一方形片體’其係由導熱 性良好之金屬製成，如銅、鋁等。該吸熱板3〇之上表面於 四個角之内侧各設有一銷釘31，以用於固定所述第一彈片 響40與第二彈片5〇。 該熱管20包括一冷凝端21及一蒸發端22,該冷凝端 21與該散熱器6G結合，該蒸發端22焊接於該吸熱板3〇 之上表面之中部。 該第一彈片40與第二彈片5〇均為平板狀且結構相 同’ U下以第-彈片4〇為例進行說明。第一彈片包括201012377 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component. [Prior Art] With the rapid development of the electronic information industry, the south speed, high frequency and integration of the heat-generating electronic components such as the central processing unit have caused a sudden increase in the amount of heat generated. If the heat is not removed in time, it will cause the heat-generating electronic components. The increase in self temperature causes damage to the heat-generating electronic components or a decrease in their performance. Therefore, heat dissipation of the heating electronic components is required. At present, the heat dissipation method commonly used by the industry is to install a heat sink on the surface of the heating electronic component. The heat dissipating device comprises a heat absorbing plate, a heat sink and a heat pipe thermally connecting the heat absorbing plate and the heat sink. The heat absorbing plate is attached to the heat generating electronic component on the circuit board, and each of the four corners is provided with a sleeve. The sleeve is vertically heat absorbing plate, and each sleeve is provided with a spring screw. When the heat sink is installed, the heat absorbing plate is fixed on the circuit board by four spring screws, so that the heat absorbing plate is in close contact with the heat generating electronic component. . However, the above-mentioned heat dissipating device requires four screws to fix the heat-reinforcing plate to the circuit board, and the number of screws needs to be large, and the installation is complicated, which is not conducive to cost saving, and correspondingly on the circuit board. It is said that the four women's holes' also lead to an increase in the difficulty of circuit board routing, and if this uses fewer screws', the force points of the screws and the heat absorbing plate will be reduced, and the heat absorbing plate will be firmly fixed without cutting. To the heating electronic components. 6 201012377 SUMMARY OF THE INVENTION In view of this, the device. It is necessary to provide an easy-to-install and stable heat dissipation. Also, the heat sink includes a heat absorbing plate, a heat sink, and a heat pipe that thermally connects the suction plate to the heat sink. The heat absorbing plate is provided with a first; The first and second elastic pieces are respectively disposed on opposite sides of the heat absorbing plate, and the first elastic piece includes a locking portion and two joint portions respectively disposed at the two ends, and the locking portion is only provided There is a first through hole, and each of the two joint portions is provided with a second through hole, and the first elastic piece is fixed on the heat absorbing plate by the second through hole, and the second elastic piece is only provided a first through hole and at least one second through hole, wherein the second elastic piece is fixed to the heat absorbing plate by the second through hole, and the first through hole of the first and second elastic pieces is used for The heat absorbing plate is fixed on a circuit board. A heat dissipating device includes a heat absorbing plate and a first elastic piece and a second elastic piece respectively connected to opposite sides of the heat absorbing plate, wherein the first elastic piece and the heat absorbing plate are connected by at least two force applying points, and the second elastic piece is connected with The heat absorbing plate is connected by at least one force applying point. The first elastic piece and the second elastic piece are respectively provided with only one locking point for fixing the heat absorbing plate to contact with the heat generating electronic component. Compared with the prior art, when the heat dissipating device of the present invention is installed, only two screws are needed, so that the mounting of the heat dissipating device is more convenient, and only two mounting holes are required for the circuit board, and the number of mounting holes is relatively small. Less, thus reducing the difficulty of the circuit board routing, but at the same time does not reduce the number of points of the first and second shrapnel and the heat absorbing plate, to ensure that the installation stability of the heat absorbing plate is not affected. [Embodiment] 201012377 The present invention will be further described below with reference to the accompanying drawings. Referring to FIG. 1 , a heat dissipating device 10 according to a first embodiment of the present invention includes a heat absorbing plate 30 , a heat sink 60 , a heat pipe 20 for thermally connecting the heat absorbing plate 30 and the heat sink 60 , and a heat insulating plate 30 . A spring 4 〇 and a second elastic piece 50. As shown in Fig. 2, the heat absorbing plate 30 is a square piece which is made of a metal having good thermal conductivity such as copper, aluminum or the like. The upper surface of the heat absorbing plate 3 is provided with a pin 31 on the inner side of the four corners for fixing the first elastic piece 40 and the second elastic piece 5''. The heat pipe 20 includes a condensation end 21 and an evaporation end 22, and the condensation end 21 is coupled to the heat sink 6G, and the evaporation end 22 is welded to the upper portion of the upper surface of the heat absorption plate 3A. The first elastic piece 40 and the second elastic piece 5〇 are both flat and have the same structure. The first elastic piece 4〇 is taken as an example. The first shrapnel includes

::合部41 #兩結合部42。該鎖合部41 i長條狀，並於 其中間部位設有-第—通孔43。該兩結合部^均大致呈 f ’其由該鎖合部41之兩端分別向其同側垂直延伸 另一端’二部42之—端與鎖合部41之端部垂直連接， 自由端，該兩結合部42之自由端相對設置且間 二二:：一結合部42之自由端設有-第二通孔… 通孔44與吸熱板3G上之銷針31對應。 別晉二裝Γ ’將第一彈片40與第二彈片5〇之鎖合部41分 使一對相對侧邊之外側(如圖1所示），並 與第二彈片50上之第二通孔44分別對應吸 8 201012377 .力點，防二: 以使吸熱板30之四角各形成-施 為力 …、板3〇兩端翹起，從而保證吸熱板30均勻 :藉由第强在安裝該散熱裝置1〇時，只需要兩顆螺釘分 二=一彈片40與第二彈片5〇之第一通孔43 : ^裝置1G固定於—電路板上（圖未示），使吸埶板^ 施：路板上之發熱電子元件接觸，在保證具有足夠數量之 響程，並節約了成本。其次 以了女裝過 只設有一個第一通孔43，即相當於只設:個彈鎖片固:上 少==只需要設置兩個安裝孔，安裝孔數量較 而降低了電路板走線之難度。 請^續參照圖3’其為本發明第二實施例之散熱裳置 ^，該散熱裝置10a與第一實施例之散_ ι〇類似， 二：同之處在於··該散熱裝置1〇a包括一第一彈片術及 彈片50a’該第-彈片術與第二彈片池安裝在吸 j 30a之相對兩側’該第-彈片4〇a與第一實施例之散 熱^ 1〇中之第—彈片40之結構與安裝方式相同，該第 =片他呈條形，其垂直於第—彈片術及吸熱板3如， 該第二彈片5〇a 一端設有一第一通孔Η，另一端設有一第 二通孔52,該吸祕30a 一側邊之中部對應該第二通孔^ 設有一銷釘3la，該第二彈片50a先藉由該第二通孔52固 定於吸熱板30a上，使設有第一通孔51之端部垂直於吸献 板3〇a且突伸於吸熱板30a之外，再藉由該第一通孔51將 9 .201012377 定於一電路板上，採用第-彈片術與 二Τ5使用之方式，亦僅需在電路板上設置兩 個女装孔’时可以增大該散熱裝置恤之空間適用性。 -彈Γ:大為月第三實施例中之第一彈片條，該第 ㈣框狀’㈣於將本發Μ第一實施 例：之第-彈片40之兩結合部42之自由端相對延伸並連 接為-體，使其兩結合部42之間形成一增強部^，再於該 增強部45上增設兩第二通孔她，如此，可以增二 之強度，同時增加第一彈片働與吸熱板3〇之間之 細力點，比如在本實施例中可提供多達四個施力點，使吸 ::30彈之Λ1更為均勻’本實施例中之第二彈片(圖未示) 與第一彈片40b之結構及安裝方式相同。 圖5所示為本發明第四實施例中之彈片，其中第 片撕與第二彈片5〇c之間藉由一連接件47連接起來。該 術與第二彈片服位於同一平面内且結構相 同，以下以第一彈片條為例，該第-彈片40c大致呈一 矩形框狀，相當於將本發明第—實施例中之第—彈片扣之 兩結合部42之自由端相對延伸並連接為—體，使其兩結合 部42之間形成一增強部45c。該連接件㈣一條形片體且 與第一彈片4〇C及第二彈片5〇c所在之平面平行，其在高 度方向上位於上方且與第一彈片條及第二彈片5〇c間隔 一定距離，該連接件47與第一彈片4〇c及第二彈片5〇c之 牦強邛45c垂直，該連接件47之兩端垂直向下延伸分別與 第彈片4〇c及第二彈片5〇c之增強部a之外側中部連 201012377 =使第-彈片40c與第二彈片5〇c對稱連接於該連接件 之兩端。此種結構，可以使彈片之取放更方便，並且不 易造成元件之丟失。 絲上所述，本發明符合發明專利之要件，羞依法提出 專利申請。惟以上所述者僅為本發明之較佳實施例，舉凡 熟悉本#技藝之人士，在爰依本發明精神所狀等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明第一實施例之散熱裝置之立體組裴圖。 圖2係圖1所示散熱裝置之立體分解圖。 圖3係本發明第二實施例之散熱裝置之立體圖。 圖4係本發明第三實施例中之彈片之立體圖。 圖5係本發明第四實施例中之彈片之立體圖。 【本發明主要元件符號說明】 散熱裝置 10 熱管 20 冷凝端 21 蒸發端 22 吸熱板 30、 30a 銷釘 31、 31a 第一彈片 40、 40a、40b、40c 鎖合部 41 結合部 42 第一通孔 43、 51 第二通孔 44、 44b、 52 增強部 45、 45c 連接件 47 第二彈片 50、 50a、 50c 散熱器 60 11:: Joint portion 41 #two joint portion 42. The locking portion 41 i is elongated and has a - through hole 43 at a middle portion thereof. The two joint portions are substantially f', and the two ends of the lock portion 41 extend perpendicularly to the same side thereof, and the other end of the two portions 42 are perpendicularly connected to the end portion of the lock portion 41, and the free end is The free ends of the two joint portions 42 are oppositely disposed and the second end of the joint portion 42 is provided with a second through hole. The through hole 44 corresponds to the pin 31 on the heat absorbing plate 3G. The second elastic piece 40 and the second elastic piece 5〇 of the locking portion 41 are divided into a pair of opposite side outer sides (as shown in FIG. 1), and the second opening on the second elastic piece 50 The holes 44 respectively correspond to the suction 8 201012377. The force point, the anti-two: so that the four corners of the heat absorbing plate 30 are formed - the force is applied... the two sides of the plate 3 are tilted up, thereby ensuring that the heat absorbing plate 30 is uniform: by the strong installation When the heat dissipating device is 1 ,, only two screws are required to be divided into two: one elastic piece 40 and the first elastic piece 5 〇 first through hole 43 : ^ device 1G is fixed on the circuit board (not shown), so that the suction plate ^ Application: The contact of the heating electronic components on the road board ensures a sufficient number of sound paths and saves costs. Secondly, there is only one first through hole 43 in the women's clothing, which is equivalent to only one: one spring lock piece solid: less on == only need to set two mounting holes, the number of mounting holes is lower and the circuit board is lowered The difficulty of the line. Referring to FIG. 3, which is a heat dissipation device according to a second embodiment of the present invention, the heat dissipation device 10a is similar to the dispersion of the first embodiment, and the second point is that the heat dissipation device 1〇 a includes a first shrapnel and shrapnel 50a' the first shrapnel and the second shrapnel pool are mounted on opposite sides of the suction j 30a 'the first shrapnel 4〇a and the heat sink of the first embodiment The structure of the first elastic piece 40 is the same as that of the mounting method. The first piece has a strip shape, and is perpendicular to the first elastic piece and the heat absorbing plate 3. For example, the second elastic piece 5〇a has a first through hole at one end, and the other A second through hole 52 is disposed at one end, and a second through hole is disposed in the middle of the side of the absorbing member 30a. The second elastic piece 50a is first fixed to the heat absorbing plate 30a by the second through hole 52. The end portion of the first through hole 51 is perpendicular to the suction plate 3〇a and protrudes out of the heat absorbing plate 30a, and the first through hole 51 is used to fix the 9.201012377 on a circuit board. With the use of the first-elastic and the second-inch 5, it is only necessary to set two women's holes on the circuit board to increase the space suitability of the heat sink.- magazine: the first spring strip in the third embodiment of the month, the fourth (four) frame shape '(four) is opposite to the free end of the two joint portions 42 of the first-spring piece 40 of the first embodiment of the present hairpin And connecting the body to form a reinforcing portion between the two joint portions 42, and adding two second through holes to the reinforcing portion 45, so that the strength can be increased, and the first elastic piece is increased. The fine points between the heat absorbing plates 3〇, for example, can provide up to four force application points in the present embodiment, so that the suction: 30 elastic Λ 1 is more uniform 'the second elastic piece in this embodiment (Fig. The structure and installation of the first elastic piece 40b are the same. Fig. 5 shows a spring piece according to a fourth embodiment of the present invention, wherein the first piece tearing and the second elastic piece 5〇c are connected by a connecting member 47. The first elastic strip is exemplified in the same plane as the second elastic piece. The first elastic piece 40c is substantially in the shape of a rectangular frame, which is equivalent to the first elastic piece in the first embodiment of the present invention. The free ends of the two joint portions 42 are oppositely extended and connected to each other such that a reinforcing portion 45c is formed between the two joint portions 42. The connecting member (4) has a strip-shaped body and is parallel to a plane in which the first elastic piece 4〇C and the second elastic piece 5〇c are located, and is located above the height direction and spaced apart from the first elastic piece strip and the second elastic piece 5〇c The connecting member 47 is perpendicular to the first elastic piece 4〇c and the second elastic piece 5〇c, and the two ends of the connecting piece 47 extend vertically downwardly to the first elastic piece 4〇c and the second elastic piece 5, respectively. The outer side of the reinforcing portion a of the 〇c is connected to the central portion of the connecting member 201012377. The first elastic piece 40c and the second elastic piece 5〇c are symmetrically connected to both ends of the connecting member. This structure makes it easier to pick and place the shrapnel and is less likely to cause loss of components. As stated on the silk, the invention complies with the requirements of the invention patent and is ashamed to file a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations of the present invention in the spirit of the present invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a heat dissipating device according to a first embodiment of the present invention. 2 is an exploded perspective view of the heat sink shown in FIG. 1. Figure 3 is a perspective view of a heat sink according to a second embodiment of the present invention. Figure 4 is a perspective view of a shrapnel in a third embodiment of the present invention. Figure 5 is a perspective view of a shrapnel in a fourth embodiment of the present invention. [Description of main components of the present invention] Heat sink 10 Heat pipe 20 Condensing end 21 Evaporating end 22 Heat absorbing plate 30, 30a Pins 31, 31a First elastic piece 40, 40a, 40b, 40c Locking portion 41 Bonding portion 42 First through hole 43 , 51 second through holes 44, 44b, 52 reinforcements 45, 45c connecting members 47 second elastic pieces 50, 50a, 50c heat sink 60 11

Claims (1)

201012377 十、申請專利範園： 玉.一種散熱裝置，包括一吸埶柘、 埒㈣勒、“ 板散熱器及將吸熱板與 後—银 …g具改良在於：該吸熱板上設有 敎板之L—彈片’所述第―、第二彈片分職於所述吸 …板之兩相對侧邊上，所述第—彈 ΓΠ述鎖合部兩端之兩結合部，所述鎖 ❹ 孔，：、ί通孔，所述兩結合部上各設有-個第二通 第-强Γ第—彈片藉由第二通孔111定於吸熱板上，所述 料個第-通孔及至少—個第二通孔，所 =第一彈片藉由第二通孔以於吸熱板上，所述第一、 f-彈片之第-通孔用於將所述吸熱板固定於—電路板 上0 利範圍第1項所述之散熱裝置，其中所述鎖合 邛位於所述吸熱板之外側。 _ Hi專利範圍第1項所述之散熱裝置’其中所述鎖合 中pq ^條狀所述第一彈片之第一通孔設於該鎖合部之 部位’所述兩結合料所述鎖合部之_向其同侧 延伸形成。 J ::二：利範圍第3項所述之散熱裝置，其中每一結合 ^其端與鎖合部之端部垂直連接，另一端 足：、、、自由端，該兩結合部之自由端相對設置且間隔一定 離所述第一彈片之第二通孔設於該兩結合部之自由 12 201012377 • 1申請專職㈣4項所述之散熱裝置’其中該兩結合 .。之自由端相對延伸並連接為-體，使兩結合部之間形 成一增強部，從而使第一彈片呈矩形框狀。 6. 如申請專㈣圍第5項所狀散熱裝置，其中所述增強 部上設有至少一個第二通孔。 7. 如申請專利範圍第5項所述之散熱裝置，其中所述第一、 第二彈片之結構相同且位於同一平面内，所述第一、第 ❹二彈片之增強部之外侧中部藉由一連接件連接起來。 8·如申請專㈣圍第7項所狀憾裝置，其中所述連接 $為一條形片體且與所述第一、第二彈片所在之平面平 行，其在高度方向上位於上方且與所述第一、第二彈片 間隔一定距離。 9. 如申請專利範圍第1項所述之散熱裝置，其中所述第二 彈片呈條形，其一端設有所述第一通孔，另一端設有所 述第二通孔，所述第二彈片藉由第二通孔固定於所述吸 • 熱板一侧邊之中部，所述第二彈片設有第一通孔之端部 垂直於吸熱板突伸於吸熱板之外。 10. 一種散熱裝置’包括吸熱板及分別連接在吸熱板相對之 兩側上之第一彈片與第二彈片，其改良在於：該第一彈 片與吸熱板藉由至少兩個施力點連接，該第二彈片與吸 熱板藉由至少一個施力點連接，該第一彈片與第二彈片 上分別只設置一個鎖固點而用於將該吸熱板固定至與發 熱電子元件接觸。 13 201012377 ㈣1G項料之㈣裝置，其㈣述第 合部所:鎖::r:r:r鎖合部兩端之兩結 部上各設有—㈣有-㈣—通孔，所述兩結合 所述第一彈片藉由第二通孔 固疋於吸熱板上，所述讯 至少一個笫-、基如 .弹片，、叹有一個第一通孔及 吸埶杯卜—、，所述第二彈片藉由第二通孔固定於 吸執所述第—、第"彈片之第—通孔用於將所述 及熱板固疋於一電路板上。 12人如^Γ/所 1 職第11項所述之散熱裝置，其中所述鎖 σ。卩位於所述吸熱板之外侧。 13人範圍第11項所述之散熱裝置，其中所述鎖 =呈長條狀，所述第-彈片之第—通孔設於該鎖合部 侧:=:所述兩結合部由所述鎖合部之兩端向其同 14.如申凊專利範圍第13項所述之散熱裝置，其中每一結 合部呈L”开>，其一端與鎖合部之端部垂直連接，另一 、J為自由為，該兩結合部之自由端相對設置且間隔一 定距離’所述第-彈片之第二通孔設於該兩結合部之自 由端。 15人如申請專利範圍帛14項所述之散熱裝置，其中該兩結 5部之自由端相對延伸並連接為一體，使兩結合部之間 形成一增強部，從而使第一彈片呈矩形框狀。 16.如申請專利範圍第15項所述之散熱裝置，其中所述增 14 •201012377 強部上設有至少一個第二通孔。 17.如申請專利籍 -、第二彈， 項所述之散熱襄置’其中所述第 r 4之結構相同且位於同-平面内，所述第一、 之增㈣之外财部藉由—連接件連接起來。 接η賴狀散熱裝置，其巾所述連 牛為—條形片體且與所述第―、第二彈片所在之平面 平行，其在高度方向上位於上方且與所述第一、第二彈 片間隔一定距離。 19.如申請專利範圍第η項所述之散熱裝置其中所述第 二彈片呈條形，其一端設有所述第一通孔，另一端設有 所述第二通孔，所述第二彈片藉由第二通孔固定於所述 吸熱板一侧邊之中部，所述第二彈片設有第一通孔之端 部垂直於吸熱板突伸於吸熱板之外。 15201012377 X. Application for Patent Park: Jade. A heat sink consisting of a suction 埶柘, 埒(四)勒, “plate heatsink and heat absorbing plate and post-silver...g improvement: the heat sink has a seesaw The first and second elastic pieces of the L-spring piece are divided on two opposite sides of the suction plate, and the first elastic part of the two ends of the locking part, the locking hole , : , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , At least one second through hole, the first elastic piece is passed through the second through hole to the heat absorbing plate, and the first through hole of the first f-elastic piece is used for fixing the heat absorbing plate to the circuit board The heat dissipating device of the above item, wherein the lock ring is located on the outer side of the heat absorbing plate. The heat dissipating device described in the first item of the above-mentioned patent range, wherein the lock is in the pq ^ strip shape a first through hole of the first elastic piece is disposed at a portion of the locking portion, and the two binding materials extend toward the same side of the locking portion J:2: The heat dissipating device according to item 3, wherein each end of the joint is perpendicularly connected to the end of the lock portion, and the other end is a free end, and the free end of the joint portion Relatively disposed and spaced apart from the second through hole of the first elastic piece, the free connection provided at the two joint portions 12 201012377 • 1 applies for the heat dissipation device described in the full-time (4) item 4, wherein the free ends of the two joints are relatively extended and The connection is a body, and a reinforcing portion is formed between the two joint portions, so that the first elastic piece has a rectangular frame shape. 6. The heat dissipation device according to Item 5 of the application (4), wherein the reinforcement portion is provided with at least The heat dissipation device of claim 5, wherein the first and second elastic pieces are identical in structure and located in the same plane, and the first and second elastic pieces are enhanced. The middle portion of the outer side of the portion is connected by a connecting member. 8. If the device is designed to be used in the fourth item, the connecting device is a piece of the sheet and the plane of the first and second pieces is located. Parallel, it is above the height direction The heat dissipating device of the first aspect of the invention, wherein the second elastic piece has a strip shape, and the first through hole is provided at one end thereof. The other end is provided with the second through hole, the second elastic piece is fixed to the middle of one side of the heat absorbing plate by the second through hole, and the second elastic piece is provided with the end of the first through hole Vertically protruding from the heat absorbing plate and protruding outside the heat absorbing plate. 10. A heat dissipating device includes a heat absorbing plate and a first elastic piece and a second elastic piece respectively connected to opposite sides of the heat absorbing plate, wherein the first elastic piece and the first elastic piece are The heat absorbing plate is connected by at least two force applying points, and the second elastic piece and the heat absorbing plate are connected by at least one force applying point, and only one locking point is respectively disposed on the first elastic piece and the second elastic piece for using the heat absorbing point The board is secured to contact with the heat generating electronic components. 13 201012377 (4) The apparatus of (4) of the 1G item, (4) the section of the first part: lock::r:r:r is provided on each of the two ends of the locking part - (iv) with - (four) - through hole, the two The first elastic piece is fixed to the heat absorbing plate by the second through hole, and the signal is at least one 笫-, the base is like a spring piece, and the first through hole and the suction cup are sighed. The second elastic piece is fixed to the first through hole of the first and second elastic sheets by the second through hole for fixing the hot plate to a circuit board. A heat sink as described in item 11 of the above, wherein the lock σ. The crucible is located on the outer side of the heat absorbing plate. The heat dissipating device of claim 11, wherein the lock is in the form of a strip, and the first through hole of the first elastic piece is disposed on the side of the lock portion: =: the two joint portions are The heat dissipating device according to claim 13, wherein each of the joint portions is L" open", one end of which is perpendicularly connected to the end portion of the lock portion, and 1. J is free, the free ends of the two joints are oppositely disposed and spaced apart by a distance. The second through hole of the first elastic piece is disposed at the free end of the two joint portions. 15 persons apply for patent scope 帛 14 items The heat dissipating device, wherein the free ends of the two knots 5 are oppositely extended and connected integrally, so that a reinforcing portion is formed between the two joint portions, so that the first elastic piece has a rectangular frame shape. The heat dissipating device of claim 15, wherein the at least one second through hole is provided on the strong portion of the increased length of the first and second ends. The structure of the r 4 is the same and is located in the same plane, the first, the increase (four) outside the Ministry of Finance Connected by the connecting member. The ribbed heat dissipating device has a continuous strip-shaped strip and is parallel to the plane of the first and second elastic sheets, and is located above the height direction and The first and second elastic pieces are spaced apart by a certain distance. 19. The heat dissipating device according to claim n, wherein the second elastic piece has a strip shape, one end of which is provided with the first through hole, and the other end is provided The second through hole is fixed to the middle of one side of the heat absorbing plate by the second through hole, and the second elastic piece is provided with the end of the first through hole perpendicular to the heat absorbing plate Stretch out of the heat absorbing plate. 15
TW97135041A 2008-09-12 2008-09-12 Heat dissipation device TWI411388B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97135041A TWI411388B (en) 2008-09-12 2008-09-12 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97135041A TWI411388B (en) 2008-09-12 2008-09-12 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW201012377A true TW201012377A (en) 2010-03-16
TWI411388B TWI411388B (en) 2013-10-01

Family

ID=44828981

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97135041A TWI411388B (en) 2008-09-12 2008-09-12 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI411388B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI611749B (en) * 2011-03-11 2018-01-11 Huang Chong Xian Radiator assembly

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5932925A (en) * 1996-09-09 1999-08-03 Intricast, Inc. Adjustable-pressure mount heatsink system
US6816375B2 (en) * 2001-08-03 2004-11-09 Texas Instruments Incorporated Heat sink attachment
US6724632B2 (en) * 2002-07-18 2004-04-20 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly with adjustable clip
TWM265688U (en) * 2004-10-15 2005-05-21 Inventec Corp Heat sink assembly device for display card and chipset
TWM265692U (en) * 2004-10-22 2005-05-21 Inventec Corp Heat sink module for electronic device
JP2008198864A (en) * 2007-02-14 2008-08-28 Toshiba Corp Electronic equipment and semiconductor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI611749B (en) * 2011-03-11 2018-01-11 Huang Chong Xian Radiator assembly

Also Published As

Publication number Publication date
TWI411388B (en) 2013-10-01

Similar Documents

Publication Publication Date Title
US7916485B2 (en) Fin-type heat sink and electronic device using same
US20090168356A1 (en) Memory module assembly with heat dissipation device
US6545871B1 (en) Apparatus for providing heat dissipation for a circuit element
JP2002261476A (en) Structure and method for grounding cooling module and electronic apparatus having that structure
JP5051255B2 (en) Piezoelectric fan and cooling device
JP4207755B2 (en) Electronic equipment
US7697298B2 (en) Heat dissipation apparatus
TW201012377A (en) Heat dissipation device
TW201302005A (en) Chip card hold structure and electronic device using same
JP2008192657A (en) Electronic equipment
JP4679492B2 (en) contact
JP2001068607A (en) Cooling structure for electronic component
TWI530661B (en) Heat dissipation device
JP2003111415A (en) Ac adapter
CN105575932B (en) Electronic component, system and method
JPH1098289A (en) Radiation structure of electronic component
JPH11220264A (en) On-vehicle electronic device
CN101056525B (en) Heat radiator
JP2003523620A (en) Heat sink with integrated components pressed against equipment
JP4380061B2 (en) Heat dissipation structure
TW201820073A (en) Heat dissipation device and thermal conducting assembly thereof
KR100264370B1 (en) Heat sink
TWI413889B (en) Heat dissipation device
JP2009176990A (en) Electronic device unit
JP2002141688A (en) Device for dissipating heat from circuit element

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees