CN101056525B

CN101056525B - Heat radiator

Info

Publication number: CN101056525B
Application number: CN2006100602976A
Authority: CN
Inventors: 陈俊吉; 翁世勋; 余光; 周大远; 刘金标
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2006-04-14
Filing date: 2006-04-14
Publication date: 2010-12-29
Anticipated expiration: 2026-04-14
Also published as: CN101056525A

Abstract

A heat-scattering equipment is used for scattering heat to the electric element on the card, which comprises heat sink adhered on both sides of the card and a fixation clamp for clamping the heat sink and card. The fixation clamp has two-pin-jointed splint which has a flexible member therebetween to make the one corresponding terminal of the two-pin-jointed splint clamp two heat sink flexibly so as to obtain a stable contact of the heat sink and the electric element on the card.

Description

Heat abstractor

[technical field]

The present invention relates to a kind of heat abstractor, particularly a kind of in order to heat abstractor to electronic element radiating.

[background technology]

Along with computer industry constantly develops, electronic component running frequency and speed constantly promote, and caloric value is increasing, if untimely eliminating, accumulation of heat causes that temperature raises, and influences the normal operation of heat-generating electronic elements.

The lifting of computing power make memory bar, show that wafer capacity increases day by day on the additional integrated circuit boards such as sound card, volume is more and more littler, operating rate is piece more and more, the heat that produces in this process also constantly increases, how fast the wafer heat on these additional integrated circuit boards effectively to be distributed fast, also become the problem that present dealer need solve.

Usually industry is installed auxiliary its heat radiation of heat dissipation element on electronic component, contacts close and firm for making heat dissipation element with heater element, needs to realize that by a fastener heat dissipation element is connected with the firm of this heater element.

Yet because element gathers on the additional integrated circuit board, the space is little and adjacent integrated circuit board spacing is narrow, heat dissipation element directly is installed thereon easily is adjacent integrated circuit board and produces and interfere and operation has inconvenience more.

[summary of the invention]

In view of this, be necessary to provide a kind of installation heat abstractor easily.

A kind of heat abstractor, in order to electronic element radiating on the integrated circuit board, comprise the heating panel that is attached at the integrated circuit board both sides and two geometrical clamps of this heating panel of clip and integrated circuit board, each geometrical clamp has two clamping plate that articulate, between this second splint the folder establish a flexible member, thereby make above-mentioned two heating panels of an end resilient clamp of this second splint correspondence, in the second splint only wherein an end of clamping plate expand a plate body, two plate bodys of this two geometrical clamp are parallel to be attached at described heating panel outer surface, and make two plate bodys mutually against.

Compared with prior art, can realize above-mentioned second splint clamping two heating panels by an end of operation said fixing folder, thereby realize that heating panel contacts with the firm of electronic component on the integrated circuit board that it is convenient to install.

With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.

[description of drawings]

Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention and related elements.

Fig. 2 is the three-dimensional exploded view of geometrical clamp among Fig. 1.

Fig. 3 is the three-dimensional assembly diagram of Fig. 1.

Fig. 4 is the three-dimensional exploded view of heat abstractor of the present invention and another embodiment of related elements.

Fig. 5 is the three-dimensional assembly diagram of Fig. 4.

[embodiment]

See also Fig. 1 to Fig. 3, heat abstractor of the present invention comprises two heating panels 20 of being located at an additional card 10 both sides and a pair of geometrical clamp 30 that this two heating panel 20 is fixed to additional card 10.

Above-mentioned additional card 10 comprises a circuit board 110 and is located at some electronic components 120 on these circuit board 110 relative two side faces.The middle part of the close upper and lower two edges of this circuit board 110 respectively is provided with a through hole 111.

Above-mentioned heating panel 20 is made by Heat Conduction Material such as copper or aluminium plate.Each heating panel 20 is provided with a perforation 211 near the through hole 111 of the middle part corresponding circuits plate 110 at upper and lower edge.Two fixtures 25 pass this perforation 211 and through hole 111 as pin etc. and two heating panels 20 and circuit board 110 are fixing.The outer surface of each heating panel 20 evenly is provided with two pairs of depressions 213, and each is 213 close to each other to caving in, vertically be arranged on this outer surface.

Each geometrical clamp 30 comprises the clamping plate 310 of two relative pivot joints and is folded in a torsionspring 350 between this second splint 310.Nearly end dual-side place of each clamping plate 310 vertically extends two parallel relative pin-jointing pieces 330, and these two pin-jointing pieces, 330 correspondences are provided with pivoted hole 331.Wherein two pin-jointing pieces 330 of clamping plate 310 are folded between two pin-jointing pieces 330 of another clamping plate 310.This spring 350 comprise one between two pin-jointing pieces 330 spire (indicate) and from these spire two ends outward extending two of the second splint 310 that compresses respectively compresses arm (indicating).One pivot 370 passes the spire of the pivoted hole 331 of pin-jointing piece 330 of above-mentioned second splint 310 and spring 350 and second splint 310 and spring 350 is articulated assembling, thereby by the upper end of this geometrical clamp 30 of operation, make geometrical clamp 30 under the effect of spring 350 below pivot 370 the part pivot clip buckle and state heating panel 20.Each clamping plate 310 partly is provided with two projectioies 313 that vertical direction is arranged in the below of pivot 370, to engage with depression 213 on the heating panel 20.

During assembling, by mediating geometrical clamp 30 in pivot 370 upper sections, geometrical clamp 30 second splints open and insert and put two heating panels 20 therebetween in pivot 370 below part elasticity, the projection 313 of clamping plate 310 fastens with the depression 213 of heating panel 20, and second splint 310 compresses two heating panels 20 to additional card 10 directions.Thereby this two heating panel 20 and electronic component 120 fit tightly.Heat transferred to two heating panel 20 that produces during 120 work of this electronic component and distributing.

See also Fig. 4 and Fig. 5, it discloses the second embodiment of the present invention, this embodiment and the first embodiment difference are that geometrical clamp 30a among this embodiment wherein is extended to the plate body 320 of longitudinal extension in the bottom of a clamping plate 310a, and two plate bodys 320 of this two geometrical clamp 30a are parallel keeps out in the outer surface of a heating panel 20 wherein.

End by operation said fixing folder can be realized above-mentioned second splint clamping two heating panels, thereby realizes that heating panel contacts with the firm of electronic component on the additional card, and it is convenient to install.

Claims

1. heat abstractor, in order to electronic element radiating on the integrated circuit board, comprise the heating panel that is attached at the integrated circuit board both sides, it is characterized in that: also comprise two geometrical clamps, each geometrical clamp has two clamping plate that articulate, and folder is established a flexible member between this second splint, thereby make above-mentioned two heating panels of an end resilient clamp of this second splint correspondence, in the second splint only wherein an end of clamping plate expand a plate body, two plate bodys of this two geometrical clamp are parallel to be attached at described heating panel outer surface, and make two plate bodys mutually against.

2. heat abstractor as claimed in claim 1 is characterized in that: above-mentioned flexible member is one to be compressed in the torsionspring between above-mentioned second splint.

3. heat abstractor as claimed in claim 2, it is characterized in that: above-mentioned second splint is all from vertically extending two pin-jointing pieces near an end place, wherein two pin-jointing pieces of clamping plate are between two pin-jointing pieces of another clamping plate, above-mentioned spring comprise one between this pin-jointing piece spire and outwards compress the arm that compresses of second splint.

4. heat abstractor as claimed in claim 3 is characterized in that: the pin-jointing piece of above-mentioned second splint pivots by a pivot and connects, and this pivot passes the spire of this pin-jointing piece and above-mentioned spring.

5. as each described heat abstractor among the claim 1-4, it is characterized in that: above-mentioned clamping plate and heating panel are provided with the element of concavo-convex cooperation.

6. heat abstractor as claimed in claim 5 is characterized in that: corresponding heating panel one side of above-mentioned each clamping plate is provided with a projection, and this heating panel is corresponding to be provided with the depression that a buckle should projection.

7. as each described heat abstractor among the claim 1-4, it is characterized in that: the both sides of the edge of above-mentioned two heating panels by dowel fixes to the above-mentioned integrated circuit board.