TWI611749B - Radiator assembly - Google Patents
Radiator assembly Download PDFInfo
- Publication number
- TWI611749B TWI611749B TW100108317A TW100108317A TWI611749B TW I611749 B TWI611749 B TW I611749B TW 100108317 A TW100108317 A TW 100108317A TW 100108317 A TW100108317 A TW 100108317A TW I611749 B TWI611749 B TW I611749B
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- heat
- heat source
- heat pipe
- contact surface
- metal support
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Description
本發明係為一種散熱器總成,尤指一種利用熱管直觸熱源提升熱傳導效率之散熱器總成。The invention relates to a heat sink assembly, in particular to a heat sink assembly which utilizes a heat pipe to directly contact a heat source to improve heat transfer efficiency.
請參閱第一圖至第三圖,一種習知散熱裝置,其包括一熱管a、一固定座b、二鎖固簧片d以及一均熱板e,該固定座b設有一凹槽c,將該熱管a以錫膏焊接的方式固定於該固定座b之凹槽c內;二鎖固簧片d係結合於該固定座b的兩側;均熱板e將該均熱板e以錫膏焊接的方式設置于該熱管a與該固定座b的底部。該散熱裝置係利用螺絲f穿過該鎖固簧片d將該散熱裝置鎖固於設有熱源之板體上,並藉由該均熱板e與熱源做接觸,使熱藉由該均熱板e導熱至該熱管a,以達成散熱之功效。如前述習知的散熱裝置主要有下述兩缺點:1、熱源的熱須透過均熱板導熱至該熱管,熱的傳導較差且增加散熱裝置整體的重量;2、固定座與熱管間的結合係以錫膏焊接的方式結合,不僅會影響熱的傳導外,加工上亦較為複雜。Referring to the first to third figures, a conventional heat dissipating device includes a heat pipe a, a fixing base b, two locking springs d, and a heat equalizing plate e. The fixing seat b is provided with a groove c. The heat pipe a is fixed in the groove c of the fixing seat b by solder paste bonding; the two locking springs d are coupled to both sides of the fixing seat b; the heat equalizing plate e is used to heat the heat equalizing plate e Solder paste is disposed on the bottom of the heat pipe a and the fixing base b. The heat dissipating device locks the heat dissipating device to the plate body provided with the heat source through the locking spring d, and makes contact with the heat source by the heat equalizing plate e, so that the heat is heated by the soaking The board e is thermally conducted to the heat pipe a to achieve heat dissipation. The heat dissipating device as described above mainly has the following two disadvantages: 1. The heat of the heat source is transmitted to the heat pipe through the heat equalizing plate, the heat conduction is poor and the overall weight of the heat dissipating device is increased; 2. The combination between the fixing seat and the heat pipe The combination of solder paste soldering not only affects the heat conduction, but also is complicated in processing.
本發明主要目的在於提供一種重量輕、成本低、加工簡便且可提高熱傳導性的散熱器總成。The main object of the present invention is to provide a heat sink assembly which is light in weight, low in cost, simple in processing, and capable of improving thermal conductivity.
為實現上述之目的,本發明採取如下技術方案:In order to achieve the above object, the present invention adopts the following technical solutions:
一種散熱器總成,包括:一熱管、複數金屬支撐件以及一固定簧片;該熱管,設有一第一熱源接觸面;該複數金屬支撐件,分別設有一第二熱源接觸面;該固定簧片包括:一熱管結合部,以無錫緊配的方式與該熱管結合;複數支撐部,該每一支撐部分別與一該金屬支撐件結合;以及複數固定部,用以固定於一設有熱源之基座上;其中,該熱管與該固定簧片結合後,該熱管之第一熱源接觸面會突出於該固定簧片,且該金屬支撐件之第二熱源接觸面係與該熱管之第一熱源接觸面在同一水平面上。A heat sink assembly comprising: a heat pipe, a plurality of metal support members and a fixed reed; the heat pipe is provided with a first heat source contact surface; the plurality of metal support members are respectively provided with a second heat source contact surface; the fixed spring The sheet comprises: a heat pipe joint portion, which is coupled with the heat pipe in a tight fitting manner; the plurality of support portions are respectively combined with a metal support member; and the plurality of fixing portions are fixed to a heat source The first heat source contact surface of the heat pipe protrudes from the fixed spring, and the second heat source contact surface of the metal support is the same as the heat pipe. A heat source contact surface is on the same level.
本發明之散熱器總成,不僅可使熱源的熱直接傳至熱管提升熱的傳導效果外,且因少了均熱板的設置使散熱裝置的重量亦隨之降低;此外,在加工上因採無錫緊配的方式,不僅可降低成本,加工上亦較為簡單。The heat sink assembly of the invention not only can directly transfer the heat of the heat source to the heat transfer effect of the heat pipe, but also reduces the weight of the heat sink device due to the lack of the setting of the heat equalizing plate; The method of adopting Wuxi tightly fits not only reduces the cost, but also makes the processing simpler.
為了使 貴審查委員能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。The detailed description of the present invention and the accompanying drawings are to be understood by the accompanying claims .
請參閱第四圖至第九圖所示,一種散熱器總成,包括熱管1、二金屬支撐件2、一固定簧片3,其中:熱管1,設有一第一熱源接觸面11;二金屬支撐件2,分別設有一第二熱源接觸面21;以及固定簧片3,該固定簧片3包括熱管結合部31,較佳的係呈一倒錐形缺口,並以無錫緊配的方式與該熱管結合;二支撐部32,該每一支撐部32分別與一該金屬支撐件結合2;以及四固定部33,用以固定於一設有熱源9之基座91上;所述固定簧片3並非完全包覆該熱管1,使該熱管1與該固定簧片3結合後,該熱管1之第一熱源接觸面11會突出於該固定簧片3,且該金屬支撐件2之第二熱源接觸面21係與該熱管1之第一熱源接觸面在11同一水平面上。Referring to the fourth to ninth drawings, a heat sink assembly includes a heat pipe 1, a metal support member 2, and a fixed spring plate 3, wherein: the heat pipe 1 is provided with a first heat source contact surface 11; The support member 2 is respectively provided with a second heat source contact surface 21; and a fixed reed 3, which comprises a heat pipe joint portion 31, preferably a reverse tapered notch, and is matched with a tin-free manner. The heat pipe is combined; the two supporting portions 32 are respectively combined with a metal supporting member 2; and the four fixing portions 33 are fixed on a base 91 provided with a heat source 9; The sheet 3 does not completely cover the heat pipe 1. After the heat pipe 1 is combined with the fixing spring 3, the first heat source contact surface 11 of the heat pipe 1 protrudes from the fixing spring 3, and the metal support 2 is The two heat source contact surfaces 21 are on the same level as the first heat source contact surface of the heat pipe 1.
本發明之散熱器總成係將該金屬支撐件2之第二熱源接觸面21與該熱管1之第一熱源接觸面11直觸所欲散熱之熱源9表面,再利用複數螺絲8將該固定簧片3之四個固定部33鎖固於設有熱源9之基座91上;藉此,可使熱管1直觸熱源9,提升熱的傳導效果,且因採無錫緊配的方式,加工上亦較為便利。The heat sink assembly of the present invention directly contacts the second heat source contact surface 21 of the metal support member 2 and the first heat source contact surface 11 of the heat pipe 1 to the surface of the heat source 9 to be dissipated, and then fixes the plurality of screws 8 with a plurality of screws 8 The four fixing portions 33 of the reed 3 are locked on the base 91 provided with the heat source 9; thereby, the heat pipe 1 can directly contact the heat source 9, thereby improving the heat conduction effect, and processing by adopting a tin-free fitting method. It is also more convenient.
另,為增加該固定簧片3之支撐力,較佳的可於該固定簧片3之熱管結合部31與支撐部32間設置複數個肋部34。In addition, in order to increase the supporting force of the fixing spring 3, a plurality of ribs 34 are preferably disposed between the heat pipe joint portion 31 of the fixing spring 3 and the support portion 32.
另,該金屬支撐件2不僅可用來做為支撐使用,更有均溫導熱之功效,較佳的係將該金屬支撐件2與該熱管1相接觸,如此還可輔助固定該熱管1。In addition, the metal support member 2 can be used not only as a support but also as a function of uniform temperature and heat conduction. Preferably, the metal support member 2 is in contact with the heat pipe 1, and thus the heat pipe 1 can be assisted.
另,為達到最佳的導熱效果,較佳的,該金屬支撐件2之第二熱源接觸面21之面積與該熱管1之第一熱源接觸面11之面積總合應大於所欲散熱之熱源9表面。In addition, in order to achieve an optimal heat conduction effect, preferably, the area of the second heat source contact surface 21 of the metal support member 2 and the area of the first heat source contact surface 11 of the heat pipe 1 should be greater than the heat source for heat dissipation. 9 surface.
另,該固定簧片3與該金屬支撐件2的結合方式,係可選用一體成型的方式或鉚接的方式做結合。In addition, the manner in which the fixed reed 3 and the metal support 2 are combined may be combined by means of integral molding or riveting.
另,該固定簧片3較佳的係為不銹鋼之固定簧片;該金屬支撐件2較佳的係為鋁材、銅材或其它金屬導熱材之支撐件;該固定簧片3之頂部厚度較佳的係控制在0.5mm以內。In addition, the fixed reed 3 is preferably a stainless steel fixed reed; the metal support 2 is preferably a support member of aluminum, copper or other metal heat conductive material; the top thickness of the fixed reed 3 Preferably, it is controlled within 0.5 mm.
綜上所述,本發明確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合發明專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。In summary, the present invention can achieve the intended use purpose, and solve the lack of the conventional, and because of the novelty and progress, fully meet the requirements of the invention patent application, and apply according to the patent law, please check and The patent in this case is granted to protect the rights of the inventor.
惟以上所述僅為本發明之較佳可行實施例,非因此即拘限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之等效技術、手段等變化,均同理皆包含於本發明之範圍內,合予陳明。However, the above description is only a preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, and the equivalent techniques and means, etc., which are used in the description of the present invention and the contents of the drawings, are the same. It is included in the scope of the present invention and is combined with Chen Ming.
a...熱管a. . . Heat pipe
b...固定座b. . . Fixed seat
c...凹槽c. . . Groove
d...鎖固簧片d. . . Locking reed
e...均熱板e. . . Soaking plate
f...螺絲f. . . Screw
1...熱管1. . . Heat pipe
11...第一熱源接觸面11. . . First heat source contact surface
2...金屬支撐件2. . . Metal support
21...第二熱源接觸面twenty one. . . Second heat source contact surface
3...固定簧片3. . . Fixed reed
31...熱管結合部31. . . Heat pipe joint
32...支撐部32. . . Support
33...固定部33. . . Fixed part
34...肋部34. . . Rib
8...螺絲8. . . Screw
9...熱源9. . . Heat source
91...基座91. . . Pedestal
第一圖是習式散熱裝置之仰視圖。The first figure is a bottom view of a conventional heat sink.
第二圖是習式散熱裝置之側視圖。The second picture is a side view of a conventional heat sink.
第三圖是習式散熱裝置之側視分解圖。The third figure is a side exploded view of the conventional heat sink.
第四圖是本發明散熱器總成之側視圖。The fourth figure is a side view of the heat sink assembly of the present invention.
第五圖是本發明散熱器總成之側視分解圖。Figure 5 is a side elevational view of the heat sink assembly of the present invention.
第六圖是本發明散熱器總成之俯視圖。Figure 6 is a plan view of the heat sink assembly of the present invention.
第七圖是本發明散熱器總成之仰視圖。Figure 7 is a bottom plan view of the heat sink assembly of the present invention.
第八圖是本發明散熱器總成之具使用狀態說明圖(一)。The eighth drawing is an explanatory view (I) of the use state of the heat sink assembly of the present invention.
第九圖是本發明散熱器總成之具使用狀態說明圖(二)。The ninth drawing is an explanatory view (2) of the use state of the heat sink assembly of the present invention.
1...熱管1. . . Heat pipe
11...第一熱源接觸面11. . . First heat source contact surface
2...金屬支撐件2. . . Metal support
21...第二熱源接觸面twenty one. . . Second heat source contact surface
31...熱管結合部31. . . Heat pipe joint
32...支撐部32. . . Support
33...固定部33. . . Fixed part
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100108317A TWI611749B (en) | 2011-03-11 | 2011-03-11 | Radiator assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100108317A TWI611749B (en) | 2011-03-11 | 2011-03-11 | Radiator assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201238458A TW201238458A (en) | 2012-09-16 |
TWI611749B true TWI611749B (en) | 2018-01-11 |
Family
ID=47223405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100108317A TWI611749B (en) | 2011-03-11 | 2011-03-11 | Radiator assembly |
Country Status (1)
Country | Link |
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TW (1) | TWI611749B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108770295A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | A kind of electronic equipment and radiating subassembly |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7562696B2 (en) * | 2006-05-16 | 2009-07-21 | Cpumate, Inc. | Juxtaposing structure for heated ends of heat pipes |
TW201012377A (en) * | 2008-09-12 | 2010-03-16 | Foxconn Tech Co Ltd | Heat dissipation device |
US20100236756A1 (en) * | 2009-03-21 | 2010-09-23 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module |
-
2011
- 2011-03-11 TW TW100108317A patent/TWI611749B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7562696B2 (en) * | 2006-05-16 | 2009-07-21 | Cpumate, Inc. | Juxtaposing structure for heated ends of heat pipes |
TW201012377A (en) * | 2008-09-12 | 2010-03-16 | Foxconn Tech Co Ltd | Heat dissipation device |
US20100236756A1 (en) * | 2009-03-21 | 2010-09-23 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module |
Non-Patent Citations (6)
Title |
---|
Budynas Nisbett, "Mechanical Enginnering Design", McGRAW-HILL Book Company, Inc., 2008. * |
Ferdinad P. Beer, E. Russel Johnston, Jr., John T. Dewolf, David F. Mazurek, "Mechanics of Materials", McGRAW-HILL Book Company, Inc., 2002. * |
J. T. Black, Ronald A. Kohser, "Materials and Processes in Manufacturing", John Wiley & Sons, Inc., 2007. * |
Jack M. Walker, "Handbook of Manufacturing Engineering", Marcel Dekker, Inc., 1996. * |
James G. Bralla, "Handbook of Manufacturing Processes", Insdustrial Press, Inc., 2007. * |
James M. Gere, "Mechanics of Materials", Tomson Learning Inc., 2004. * |
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Publication number | Publication date |
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TW201238458A (en) | 2012-09-16 |
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