WO2012058926A1

WO2012058926A1 - Thermal conductive pad

Info

Publication number: WO2012058926A1
Application number: PCT/CN2011/075403
Authority: WO
Inventors: 彭耀锋; 施健; 胡卫峰; 杨波
Original assignee: 聚信科技有限公司
Priority date: 2010-11-04
Filing date: 2011-06-07
Publication date: 2012-05-10
Also published as: CN102142407A; CN102142407B; CN102903685B; CN102903685A

Abstract

A thermal conductive pad includes a top surface(1), a bottom surface(2) and a elastic part(3) made of metal; the top surface(1) connected with the bottom surface(2) by a bending part(4), the top surface(1) and the bottom surface(2) are paralleled with each other; the spring part(3) located between the top surface(1) and the bottom surface(2) and elastically contacted with them respectively.

Description

Thermal pad

The present application claims priority to Chinese Patent Application No. 201010532188.6, the entire disclosure of which is hereby incorporated by reference in its entirety in its entirety in its entirety in TECHNICAL FIELD The present invention relates to the field of heat dissipation, and more particularly to a thermal pad.

Background technique

In an electronic device, in order to save the cost of the heat sink device, generally, a plurality of adjacent chips are used to heat the plurality of chips simultaneously. Since the height of the chip in the board is different, the 'J, so in order to absorb the heat of the chip when it is transferred to the heat sink, the commonly used method is to add a thermal pad between the chip and the heat sink. This allows heat from different chips of the same heat sink to be transferred to the heat sink. Among them, the thermal pad having a good thermal conductivity is composed of a metal foil having a high thermal conductivity in the elastic silicone material.

In the process of practicing the present invention, the inventors have found that since the main component of the thermal pad in the prior art is a silicone material, since the silicone is in a high-temperature sealed environment, the volatilized silicone oil is volatilized. After contact with electronic components, some components in the silicone oil may chemically react with some electronic components, which may cause the failure of the electronic components. Therefore, the thermal pad in the prior art shortens the service life of the electronic device.

Summary of the invention

In view of this, the present invention provides a thermal pad to solve the problem that the thermal pad of the prior art affects the service life of the electronic device.

The embodiment of the invention is implemented as follows: A thermal pad comprises: a top surface, a bottom surface and an elastic member which are all made of metal; the top surface and the bottom surface are connected by a bent portion, the top surface and the bottom surface are parallel to each other; and the surface is elastically contacted.

It can be seen from the above technical solutions that the material used in the embodiment of the present invention is a metal elastic member, so that no volatile matter is generated due to high temperature, thereby avoiding the inclusion of the silicone material used in the prior art thermal pad. Silicone oil that volatilizes at high temperatures, causing certain components in the silicone oil to chemically react with certain electronic components, causing failure of electronic components. In the embodiment of the present invention, an elastic member is disposed between a top surface contacting the chip requiring heat dissipation and a bottom surface contacting the heat sink, thereby

Therefore, when a plurality of chips of different heights are used with the same heat sink, after the thermal pad is disposed between each chip and the heat sink, the heat conductive pad can fully contact the chip and the heat sink, and each chip can pass its own The thermal pad conducts heat to the heat sink.

BRIEF DESCRIPTION OF THE DRAWINGS In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, and obviously, in the following description The drawings are only some of the embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative work.

1 is a schematic structural view of the thermal pad according to an embodiment of the present invention;

2 is another schematic structural view of the thermal pad in the embodiment of the present invention;

3 is a schematic structural view of the thermal pad according to still another embodiment of the present invention;

4 is a schematic structural view of the thermal pad according to still another embodiment of the present invention;

FIG. 5 is a schematic structural view of the thermal pad according to still another embodiment of the present invention; FIG. 6 is a schematic structural view of the thermal pad according to still another embodiment of the present invention;

FIG. 7 is a schematic structural view of the thermal pad according to still another embodiment of the present invention.

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. example. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without the creative work are all within the scope of the present invention.

In order to solve the problem in the prior art, since the thermal pad contains volatilized silicone oil at a high temperature, some components in the silicone oil may chemically react with some electronic components, thereby causing failure of the electronic component, the present invention is implemented. The example discloses a thermal pad. The specific structure is as shown in FIG. 1 , including: a top surface 1 of a metal material, a bottom surface 2 and an elastic member 3; the top surface 1 and the bottom surface 1 are connected by a bent portion 4, and the top surface 1 The bottom surface 2 is parallel to each other; the elastic member 3 is located between the top surface 1 and the bottom surface 2 and is in elastic contact with the top surface 1 and the bottom surface 2, respectively.

In the practical application, the thermal pad in the embodiment of the invention is installed between the chip and the heat sink that need to be dissipated. For example, when using a heat sink to dissipate heat for two chips at the same time, each chip is equipped with a thermal pad, and the top surface 1 of each thermal pad is in contact with the respective chip, and then the heat sink is simultaneously pressed in two The bottom surface 2 of the thermal pad is such that the heat generated by the chip is conducted to the heat sink through the thermal pad, and then the heat sink dissipates heat, thereby cooling the chip.

In order to be able to sufficiently contact the chip, the contact surface of the top surface 1 of the thermal pad in the embodiment of the present invention is planar with the chip, and the top surface 1 is connected to the bottom surface 2 of the same planar contact surface through the bent portion 4; The elastic force between the top surface 1 and the bottom surface 2 is enhanced to make the top surface 1 and the bottom surface 2 of the thermal pad firmly contact with the chip and the heat sink respectively. In the embodiment of the invention, the elastic between the top surface 1 and the bottom surface 2 is provided. Part 3;

Thus, when the thermal pad is squeezed between the chip and the heat sink, the top surface 1 and the bottom surface 2 of the thermal pad are in close and firm contact with the chip under the elastic force of the elastic member 3, due to the thermal pad The material is metal and has good thermal conductivity, so the heat generated by the chip can be transferred to the heat sink. Further, the heat is dissipated through the heat sink, and finally functions to cool the chip. Moreover, since the materials used in the embodiments of the present invention are all made of metal and do not contain silicone oil, they do not volatilize in a high temperature environment. Things. Therefore, the embodiment of the present invention solves the problem in the prior art that the silicone oil is contained in the material, and the volatile oil generated by the silicone oil in a high temperature environment may chemically react with the electronic component to cause damage of the electronic component. Therefore, the embodiment of the invention can effectively extend the service life of the electronic component.

Further, in the embodiment of the present invention, the top surface 1, the bottom surface 2 and the elastic member 3 may be bent from a single piece of plate material.

Since the material used in the embodiment of the present invention is metal and has good ductility, it can be easily formed by bending, and the method of bending and forming the metal plate is used to process not only the thermal pad. More convenient and simple. Moreover, the elasticity can be better maintained between the various portions of the metal formed by bending, so that the top surface 1 and the bottom surface 2 can be better contacted with the chip and the heat sink, respectively.

In the metal, the thermal conductivity of the copper is relatively high, the elasticity of the copper material itself is relatively good, and the price is relatively cheap. Therefore, in the embodiment of the invention, the components of the thermal pad include the top surface 1, the bottom surface 2 and the elastic member 3. The material used can be copper.

The specific method may be that the two sides of a copper plate may be bent downward respectively, the top surface 1 of the thermal pad is formed between the two bending portions of the copper plate, and the bent portion forms the bottom surface 2 of the thermal pad, respectively. The bottom surface 2 of one side may also be bent toward the top surface 1 to form an elastic member 3, and the elastic member 3 is elastically contacted with the top surface 1; thus, when the thermal pad is pressed, the elastic member 3 may be on the top surface. 1 and the bottom surface 2 play an elastic support role, so that the top surface 1 and the bottom surface 2 of the thermal pad are in tight and stable contact with the chip and the heat sink, respectively.

Further, in the embodiment of the present invention, the elastic member 3 is bent toward the top surface 1 and, after elastic contact with the top surface 1, is also bent toward the bottom surface 3 and elastically contacts the bottom portion.

Since the elastic member 3 is bent toward the bottom surface 2 after being elastically contacted with the top surface 1, the elastic member 3 is entirely inverted V-shaped, so that the elastic support between the top surface 1 and the bottom surface 3 by the elastic member 3 is increased. Therefore, the elastic force of the elastic member 3 can be effectively enhanced, so that the contact between the top surface 1 and the bottom surface 2 of the thermal pad and the chip and the heat sink can be made more tight and stable.

As shown in FIG. 3, FIG. 4 and FIG. 5, in the embodiment of the invention, the top surface, the bottom surface and the elastic component can be It is formed by bending a whole piece of plate, and there may be another embodiment, specifically:

The bottom surface includes a left bottom surface 21 and a right bottom surface 22; the elastic member includes a left elastic member 32 and a right elastic member 31;

The left bottom surface 31 is formed by bending from the left side of the top surface 11, and the left elastic member 31 is extended from the left bottom surface and bent toward the top surface 11, and the left elastic member 31 is elastically contacted with the top surface 11;

The right bottom surface 22 is formed by bending the right side of the top surface 11, and the right elastic member 32 is extended from the right bottom surface and bent toward the top surface 11, and the right elastic member 32 is elastically contacted with the top surface 11.

In the embodiment of the present invention, although the bottom surface of the thermal pad is divided into two parts, the top surface 11 is still one, and the entire thermal pad is also composed of a metal plate, for example, a copper plate is taken as an example; For:

Before forming the thermal pad as shown in FIG. 3, the copper plate may be first cut into a shape as shown in FIG. 5, wherein when the left extension portion 41 and the right extension portion 42 are bent, the left bottom surface 21 and the left elastic member may be respectively formed. 32, and the right bottom surface 22 and the right elastic member 31; the intermediate portion 43 forms the top surface 11.

Further, in the embodiment of the present invention, one end of the elastic member in contact with the top surface may also be a curved surface. In order to reduce the friction when the elastic member is in contact with the top surface, the elastic member can be smoothly slid at the contact portion of the top surface to provide effective elastic support between the bottom surface and the top surface. In the embodiment of the invention, the elastic member and the top portion are provided. The end of the surface contact is designed as a curved surface to prevent the elastic member from being excessively rubbed due to contact with the top surface, so that the top surface and the bottom surface cannot be squeezed. Preferably, in the embodiment of the present invention, the curved surface may be formed by bending one end of the elastic member in contact with the top surface; thus, as long as one end of the elastic member contacting the top surface is bent, a curved surface may be formed. This method is not only simple and effective.

The embodiment of the present invention further provides a thermal pad, as shown in FIG. 6 and FIG. 7, comprising: a top surface 51 of a metal material, a bottom surface 52 and an elastic member 53;

The top surface 51 and the bottom surface 52 are wedge-shaped metal blocks, and the bottom surface 52 is two. The top surface is disposed in the middle of the two bottom surfaces, and the bottom surface 52 is matched with the slope surface of the top surface 51;

The elastic member 53 includes a screw and a pressure spring sleeved on the screw, and the bottom surface 51 and the top surface 52 are provided with through holes through which the screw can pass; the pressure spring is disposed between one end of the screw and a bottom surface adjacent to the end.

In the embodiment of the present invention, when the screw passing through the top surface 51 and the two bottom surfaces 52 is provided with a pressure spring, The pressure spring generates a thrust force on the bottom surface 52 in contact therewith, and the bottom surface 52 transmits the thrust force to form a pressing force on the top surface 51. Since the top surface 51 between the middle surface and the bottom surface 52 of the two sides are in inclined contact, the top surface 51 is provided. It will be displaced upward; since the screw passes through the through hole provided by the top surface 51 and the bottom surface 52, the upward displacement of the top surface 51 will be limited by the screw passing through the top surface 51, that is, when the screw is penetrated by the bottom surface 52 When the upper edge is blocked, it is the highest point of the displacement.

Thus, when the top surface 51 and the bottom surface portion 52 of the thermal pad in the embodiment of the present invention are pressed by the chip 54 and the heat sink 55, an elastic force is generated, so that the top surface 51 and the bottom surface 52 are respectively associated with the chip 54 and the heat sink 55. The tight and stable contact can transfer the heat generated by the chip 54 to the heat sink 55 through the thermal pad, and then dissipate the heat through the heat sink 55, thereby finally acting as a heat sink for the chip 54.

Further, in the embodiment of the present invention, in order to further enhance the elasticity of the thermal pad, a pressure spring may be disposed at both ends of the screw, so that the thermal pad is more elastic, and thus the thermal pad and the chip are The contact of the radiator is more tight and stable.

Preferably, in the embodiment of the present invention, the wedge-shaped metal block may be a wedge-shaped aluminum block; in the embodiment of the present invention, the aluminum block has better thermal conductivity and the cost of the aluminum material is lower and easier to process. A wedge-shaped aluminum block is used as the top and bottom surfaces.

The various embodiments in the present specification are described in a progressive manner, and each embodiment focuses on differences from other embodiments, and the same similar parts between the various embodiments may be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant part can be referred to the method part.

The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments are obvious to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded to the broadest scope of the principles and novel features disclosed herein.

Claims

Rights request

What is claimed is: 1. A thermal pad comprising: a top surface, a bottom surface, a bent portion, and a resilient member made of a metal material;

The top surface and the bottom surface are connected by the bent portion, and the top surface and the bottom surface are parallel to each other; the surface is in elastic contact.

2. The thermal pad according to claim 1, wherein the top surface, the bottom surface and the elastic member are bent from a single piece of sheet material.

The thermal pad according to claim 2, wherein the elastic member is a metal plate extendingly connected to the bottom surface; the elastic member is bent toward the top surface and is in elastic contact with the top surface .

The thermal pad according to claim 3, wherein the elastic member is bent toward the top surface and is elastically contacted with the top surface, and is bent toward the bottom surface and elastically contacts the bottom portion.

The thermal pad according to claim 2, wherein the bottom surface comprises a left bottom surface and a right bottom surface; the elastic member comprises a left elastic member and a right elastic member;

The left bottom surface is formed by bending a left side extension of the top surface, the left elastic member is extended from a left bottom surface and is bent toward a top portion, and the left elastic member is elastically contacted with the top surface;

The right bottom surface is formed by bending a right side of the top surface, and the right elastic member is formed by a right bottom surface and bent toward the top portion, and the right elastic member is elastically contacted with the top surface.

The thermal pad according to claim 5, wherein one end of the elastic member in contact with the top surface is a curved surface.

The thermal pad according to claim 6, comprising: the arc surface formed by bending one end of the elastic member in contact with the top surface.

8. The thermal pad of claim 7, comprising: said metal being copper.

9. A thermal pad, comprising: a top surface, a bottom surface, and an elastic member made of a metal material; the top surface and the bottom surface are wedge-shaped metal blocks, the bottom surface is two, and the top surface is disposed on two In the middle of the bottom surface, the bottom surface is adapted to the slope of the top surface;

The elastic member includes a screw and a pressure spring sleeved on the screw, the bottom surface and the top surface A through hole is provided through the screw; the pressure spring is disposed between an end of the screw and a bottom surface adjacent to the end.

10. The thermal pad according to claim 9, wherein a pressure spring is disposed between the other end of the screw and the bottom surface adjacent to the end.

The thermal pad according to claim 10, wherein the wedge-shaped metal block is a wedge-shaped aluminum block.