TW201011484A - Lithographic apparatus and device manufacturing method - Google Patents
Lithographic apparatus and device manufacturing method Download PDFInfo
- Publication number
- TW201011484A TW201011484A TW98126829A TW98126829A TW201011484A TW 201011484 A TW201011484 A TW 201011484A TW 98126829 A TW98126829 A TW 98126829A TW 98126829 A TW98126829 A TW 98126829A TW 201011484 A TW201011484 A TW 201011484A
- Authority
- TW
- Taiwan
- Prior art keywords
- article
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- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title description 5
- 239000012530 fluid Substances 0.000 claims abstract description 68
- 238000000605 extraction Methods 0.000 claims abstract description 26
- 239000007791 liquid phase Substances 0.000 claims abstract description 25
- 239000012071 phase Substances 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 56
- 230000005855 radiation Effects 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 23
- 238000001459 lithography Methods 0.000 claims description 21
- 238000001704 evaporation Methods 0.000 claims description 11
- 230000008020 evaporation Effects 0.000 claims description 11
- 230000006641 stabilisation Effects 0.000 claims description 10
- 238000011105 stabilization Methods 0.000 claims description 10
- 238000005286 illumination Methods 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 4
- 230000000087 stabilizing effect Effects 0.000 claims description 3
- 230000004044 response Effects 0.000 claims description 2
- 230000003139 buffering effect Effects 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 241000283690 Bos taurus Species 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000036461 convulsion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 210000004373 mandible Anatomy 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13604608P | 2008-08-08 | 2008-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201011484A true TW201011484A (en) | 2010-03-16 |
Family
ID=41119894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98126829A TW201011484A (en) | 2008-08-08 | 2009-08-10 | Lithographic apparatus and device manufacturing method |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8994917B2 (enExample) |
| JP (1) | JP5529865B2 (enExample) |
| KR (1) | KR20110052697A (enExample) |
| CN (1) | CN102067039B (enExample) |
| NL (1) | NL2003258A1 (enExample) |
| TW (1) | TW201011484A (enExample) |
| WO (1) | WO2010015511A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101495922B (zh) * | 2006-07-28 | 2012-12-12 | 迈普尔平版印刷Ip有限公司 | 光刻系统、热消散方法和框架 |
| EP2365390A3 (en) | 2010-03-12 | 2017-10-04 | ASML Netherlands B.V. | Lithographic apparatus and method |
| JP5618588B2 (ja) * | 2010-03-24 | 2014-11-05 | キヤノン株式会社 | インプリント方法 |
| DE102011010462A1 (de) * | 2011-01-28 | 2012-08-02 | Carl Zeiss Laser Optics Gmbh | Optische Anordnung für eine EUV-Projektionsbelichtungsanlage sowie Verfahren zum Kühlen eines optischen Bauelements |
| EP2515170B1 (en) * | 2011-04-20 | 2020-02-19 | ASML Netherlands BV | Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method |
| JP5778093B2 (ja) * | 2011-08-10 | 2015-09-16 | エーエスエムエル ネザーランズ ビー．ブイ． | 基板テーブルアセンブリ、液浸リソグラフィ装置及びデバイス製造方法 |
| NL2009189A (en) | 2011-08-17 | 2013-02-19 | Asml Netherlands Bv | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method. |
| JP6244454B2 (ja) | 2013-09-27 | 2017-12-06 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィ装置のための支持テーブル、リソグラフィ装置、及び、デバイス製造方法 |
| WO2016102131A1 (en) | 2014-12-22 | 2016-06-30 | Asml Netherlands B.V. | Thermal conditionig method |
| EP3575873A1 (en) * | 2018-05-28 | 2019-12-04 | ASML Netherlands B.V. | Particle beam apparatus |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2928603B2 (ja) * | 1990-07-30 | 1999-08-03 | キヤノン株式会社 | Ｘ線露光装置用ウエハ冷却装置 |
| JP3623653B2 (ja) | 1998-03-30 | 2005-02-23 | 大日本スクリーン製造株式会社 | 熱処理装置 |
| DE19933798C2 (de) * | 1999-07-19 | 2001-06-21 | Siemens Ag | Vorrichtung und Verfahren zur Abgasnachbehandlung bei einer Brennkraftmaschine |
| KR100351049B1 (ko) | 1999-07-26 | 2002-09-09 | 삼성전자 주식회사 | 웨이퍼 가열 방법 및 이를 적용한 장치 |
| US6666949B1 (en) * | 1999-11-19 | 2003-12-23 | Thermodigm, Llc | Uniform temperature workpiece holder |
| JP3814598B2 (ja) | 2003-10-02 | 2006-08-30 | キヤノン株式会社 | 温度調整装置、露光装置及びデバイス製造方法 |
| EP1530088B1 (en) * | 2003-11-05 | 2007-08-08 | ASML Netherlands B.V. | Lithographic apparatus |
| US20060096951A1 (en) | 2004-10-29 | 2006-05-11 | International Business Machines Corporation | Apparatus and method for controlling process non-uniformity |
| JP4647401B2 (ja) * | 2005-06-06 | 2011-03-09 | 東京エレクトロン株式会社 | 基板保持台、基板温度制御装置及び基板温度制御方法 |
| US7652746B2 (en) | 2005-06-21 | 2010-01-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2007027632A (ja) | 2005-07-21 | 2007-02-01 | Nikon Corp | 光学装置及び露光装置、並びにデバイス製造方法 |
| US7679033B2 (en) | 2005-09-29 | 2010-03-16 | Rosemount Inc. | Process field device temperature control |
| US8092638B2 (en) * | 2005-10-11 | 2012-01-10 | Applied Materials Inc. | Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution |
| JP2007317828A (ja) | 2006-05-25 | 2007-12-06 | Nikon Corp | 冷却装置、移動装置及び処理装置、並びにリソグラフィシステム |
| CN101495922B (zh) | 2006-07-28 | 2012-12-12 | 迈普尔平版印刷Ip有限公司 | 光刻系统、热消散方法和框架 |
| JP5172194B2 (ja) * | 2007-04-04 | 2013-03-27 | 本田技研工業株式会社 | 燃料電池システム |
-
2009
- 2009-07-22 CN CN200980123070.3A patent/CN102067039B/zh not_active Expired - Fee Related
- 2009-07-22 KR KR1020117005438A patent/KR20110052697A/ko not_active Withdrawn
- 2009-07-22 US US12/999,512 patent/US8994917B2/en active Active
- 2009-07-22 JP JP2011521513A patent/JP5529865B2/ja not_active Expired - Fee Related
- 2009-07-22 WO PCT/EP2009/059413 patent/WO2010015511A1/en not_active Ceased
- 2009-07-22 NL NL2003258A patent/NL2003258A1/nl not_active Application Discontinuation
- 2009-08-10 TW TW98126829A patent/TW201011484A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010015511A1 (en) | 2010-02-11 |
| JP2011530804A (ja) | 2011-12-22 |
| CN102067039B (zh) | 2014-04-09 |
| US20110128517A1 (en) | 2011-06-02 |
| CN102067039A (zh) | 2011-05-18 |
| NL2003258A1 (nl) | 2010-02-09 |
| KR20110052697A (ko) | 2011-05-18 |
| US8994917B2 (en) | 2015-03-31 |
| JP5529865B2 (ja) | 2014-06-25 |
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