TW200951391A - Plasma cooling heat sink - Google Patents

Plasma cooling heat sink

Info

Publication number
TW200951391A
TW200951391A TW097121426A TW97121426A TW200951391A TW 200951391 A TW200951391 A TW 200951391A TW 097121426 A TW097121426 A TW 097121426A TW 97121426 A TW97121426 A TW 97121426A TW 200951391 A TW200951391 A TW 200951391A
Authority
TW
Taiwan
Prior art keywords
heat sink
plasma
assembly
gas flow
cooling heat
Prior art date
Application number
TW097121426A
Other languages
English (en)
Chinese (zh)
Inventor
Chien Ouyang
Original Assignee
Chien Ouyang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chien Ouyang filed Critical Chien Ouyang
Publication of TW200951391A publication Critical patent/TW200951391A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/16—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying an electrostatic field to the body of the heat-exchange medium

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW097121426A 2007-06-09 2008-06-09 Plasma cooling heat sink TW200951391A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US93404707P 2007-06-09 2007-06-09

Publications (1)

Publication Number Publication Date
TW200951391A true TW200951391A (en) 2009-12-16

Family

ID=40094779

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097121426A TW200951391A (en) 2007-06-09 2008-06-09 Plasma cooling heat sink

Country Status (3)

Country Link
US (1) US20080302514A1 (fr)
TW (1) TW200951391A (fr)
WO (1) WO2008153988A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102238856A (zh) * 2010-04-28 2011-11-09 宏碁股份有限公司 散热系统与散热方法
TWI418972B (zh) * 2010-04-14 2013-12-11 Acer Inc 散熱系統與散熱方法

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JP4314307B1 (ja) * 2008-02-21 2009-08-12 シャープ株式会社 熱交換装置
US8411435B2 (en) * 2008-11-10 2013-04-02 Tessera, Inc. Electrohydrodynamic fluid accelerator with heat transfer surfaces operable as collector electrode
US20100155025A1 (en) * 2008-12-19 2010-06-24 Tessera, Inc. Collector electrodes and ion collecting surfaces for electrohydrodynamic fluid accelerators
JP4927152B2 (ja) * 2009-11-09 2012-05-09 シャープ株式会社 熱交換装置
US20110137152A1 (en) * 2009-12-03 2011-06-09 General Electric Company System and method for cooling components of a surgical navigation system
US8624503B2 (en) * 2009-12-10 2014-01-07 Panasonic Precision Devices Co., Ltd. Collector-radiator structure for an electrohydrodynamic cooling system
AU2011205254B2 (en) * 2010-01-13 2015-09-17 Clearsign Combustion Corporation Method and apparatus for electrical control of heat transfer
SG173932A1 (en) * 2010-02-25 2011-09-29 United Technologies Corp Repair of a coating on a turbine component
US8807204B2 (en) * 2010-08-31 2014-08-19 International Business Machines Corporation Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array
US20130153199A1 (en) * 2011-12-14 2013-06-20 International Business Machines Corporation Performance and noise control for a heat sink air mover
US9408287B2 (en) 2012-11-27 2016-08-02 General Electric Company System and method for controlling plasma induced flow
US20150114608A1 (en) * 2013-10-30 2015-04-30 Forcecon Technology Co., Ltd. Electrostatic air-cooled heat sink
EP3419540A4 (fr) * 2016-02-26 2020-02-19 Chiscan Holdings, LLC Émetteurs de plasma non thermique et leurs dispositifs de commande
CN106020398A (zh) * 2016-06-17 2016-10-12 广东工业大学 一种cpu散热装置
CN112805826A (zh) * 2018-10-05 2021-05-14 日产自动车株式会社 冷却装置
SE543734C2 (en) * 2019-03-11 2021-07-06 Apr Tech Ab Cooling of electronic components with an electrohydrodynamic flow unit
KR20210030778A (ko) * 2019-09-10 2021-03-18 엘지전자 주식회사 방열기능을 갖는 전자장치

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI418972B (zh) * 2010-04-14 2013-12-11 Acer Inc 散熱系統與散熱方法
CN102238856A (zh) * 2010-04-28 2011-11-09 宏碁股份有限公司 散热系统与散热方法

Also Published As

Publication number Publication date
WO2008153988A1 (fr) 2008-12-18
US20080302514A1 (en) 2008-12-11

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