TW200924569A - Circuit member connecting structure - Google Patents

Circuit member connecting structure Download PDF

Info

Publication number
TW200924569A
TW200924569A TW97128438A TW97128438A TW200924569A TW 200924569 A TW200924569 A TW 200924569A TW 97128438 A TW97128438 A TW 97128438A TW 97128438 A TW97128438 A TW 97128438A TW 200924569 A TW200924569 A TW 200924569A
Authority
TW
Taiwan
Prior art keywords
circuit
conductive particles
electrode
circuit member
connection
Prior art date
Application number
TW97128438A
Other languages
English (en)
Chinese (zh)
Inventor
Kazuyoshi Kojima
Kouji Kobayashi
Motohiro Arifuku
Nichiomi Mochizuki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200924569A publication Critical patent/TW200924569A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Multi-Conductor Connections (AREA)
TW97128438A 2007-07-27 2008-07-25 Circuit member connecting structure TW200924569A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007195764 2007-07-27
JP2008144852 2008-06-02

Publications (1)

Publication Number Publication Date
TW200924569A true TW200924569A (en) 2009-06-01

Family

ID=40304233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97128438A TW200924569A (en) 2007-07-27 2008-07-25 Circuit member connecting structure

Country Status (5)

Country Link
JP (1) JPWO2009017001A1 (ja)
KR (1) KR20100039419A (ja)
CN (1) CN101690425A (ja)
TW (1) TW200924569A (ja)
WO (1) WO2009017001A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009013826A1 (de) * 2009-03-18 2011-03-10 Michalk, Manfred, Dr. Schaltungsanordnung, Verfahren zum elektrischen und/oder mechanischen Verbinden und Vorrichtung zum Aufbringen von Verbindungselementen
JP5375374B2 (ja) * 2009-07-02 2013-12-25 日立化成株式会社 回路接続材料及び回路接続構造体
JP5796232B2 (ja) * 2010-12-21 2015-10-21 デクセリアルズ株式会社 導電性粒子、異方性導電材料及び接続構造体
JP2012155950A (ja) * 2011-01-25 2012-08-16 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
TWI778971B (zh) * 2016-08-08 2022-10-01 日商積水化學工業股份有限公司 導通檢查裝置用構件及導通檢查裝置
WO2018168627A1 (ja) * 2017-03-14 2018-09-20 パナソニックＩｐマネジメント株式会社 タッチセンサ
CN114371578A (zh) * 2021-12-23 2022-04-19 长沙惠科光电有限公司 显示面板及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000171823A (ja) * 1998-12-03 2000-06-23 Casio Comput Co Ltd 液晶表示素子
JP2000340926A (ja) * 1999-05-26 2000-12-08 Process Lab Micron:Kk 金属・プラスチックハイブリッド構造印刷版の製造方法
JP5247968B2 (ja) * 2003-12-02 2013-07-24 日立化成株式会社 回路接続材料、及びこれを用いた回路部材の接続構造
JP2007242307A (ja) * 2006-03-06 2007-09-20 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料

Also Published As

Publication number Publication date
JPWO2009017001A1 (ja) 2010-10-21
CN101690425A (zh) 2010-03-31
KR20100039419A (ko) 2010-04-15
WO2009017001A1 (ja) 2009-02-05

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