200923352 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種電路圖案檢查聚置，其可非接觸式地檢 查在通過被固定的感測器部之基板上㈣㈣的導 是否良好。 7 【先前技術】 之置:取:=管(陰極射線管)等真_示裝置 液晶顯示ίΐ:雷將板上使用液晶的顯刪 .形成的電路佈線之導電圖 製造步驟巾，J *顯7^裝置成為主流。在該賴示裳置之 宁於作為玻璃基板上 案’檢線或短路。 作為目前〜如 載的接觸式4電圖案之檢查方法，有如專利文獻1所記 接腳前端依:：f法（接腳接觸方式)’其係使檢查探針之 檢查信號，檢導電圖案之兩端，從—檢查探針施加直流 據檢查信號之/另—檢查探針所傳輸的直流檢查信號，根 無檢查是否有斷線或者短路。 作為不同撿杳 至少兩個法亦有專利文獻2所記載的方法，其係使 結合之狀熊〜衣針與導電圖案之兩端在以非接觸方式電容 0. , ^ 邊移動，一邊從一檢查探針施加交流檢查信 派，田力一檢省 ~~ 根據檢測信銳〜*斜檢測經導電圖案傳輸的交流檢查信號。 路。 』之波形變化，檢查導電圖案中是否有斷線及短 097136410 200923352 (專利文獻1)日本專利特開昭62-269075號公報 (專利文獻2)曰本專利特開2〇〇4_191381號公報 【發明内容】 (發明所欲解決之問題） 上述液晶顯示裝置，因使用者之需要，由於製造技術之進 步而實現顯示晝面之大型化和像素之精細化^而且，製造廠 商為了對應產量的增加或者降低每單位產品的製造成本，建 構出採用對應於大録板之製造裝置的生產線以可在-次 製造步驟中盡可能製造大量之製品。因此，在電路圖案檢查 裝置中’亦需要可對應於大型基板之構成。 尤“在像素精細化的電子電路之檢查裝置中，由於接腳 接觸方式之檢查裝置係針對每個製品製作㈣隙狹窄之多 個檢查探針所構成的探針卡，_使製造成本提高。更進一 ''接腳接觸到線寬狹窄極小的導電圖案而造成損傷， 亦不免在之後製造步驟中成為不良發生之原因，難謂適 圖案檢查之檢查裝置。由於上述理由，較佳者是使 欢一探針與導電圖案非接觸式電容結合之檢查裝置。 中，腳接觸而是湘非㈣式的電容結合之檢查裂置 於二二探針離開導電圖案而相對向’接受從導電圖i戶;傳 號’鳴⑽編铺。為了提高撿 ^‘ Ή檢測到的交流檢查信號之整體波動，並 不良處之信號變化顯目。 並使 097136410 200923352 因此’在通過所排列的導電圖案上方時，保持相同的電容 結合之狀‘態、即’檢查騎與導電圖案間之距離保持數十微 米單位極為重要。 然而’如圖8所示，作為檢查對象之大型玻璃基板4，其 厚度比其大小甚薄，因此其容易受4力影響，又載置的檢查 台52表面之高度差（M、h2)亦會大幅影響。而且，由於 製程處理中的加熱，雖然極少惟亦有整频曲發生的情況。 更進一步，在檢查探針51之移動機構中，由於使其在數米 之四方玻璃基板上移動，因此移動機構之構成亦趨於複雜。 為了解決因此種的大型基板所產生之問題，而需要製造平 坦之檢查台、及一種無檢查時玻璃檢查基板不朝上浮起之吸 附且無尚度（檢查探針與基板之距離）變動的移動機構。要 «之對大型基板欲達成目前之檢查精度甚至更高檢查精 度，其技術難度高且製造成本亦會大幅提高。 因此，本發明目的在於提供一種電路圖案檢查裝置，可維 持相對向之導電圖案與檢查探針間一定距離，係適用於大型 基板上所形成導電圖案之斷線及短路檢查裝置。 (解決問題之手段） 為了達到上述目的，本發明提供一種電路圖案檢查裝置， 八具有.感測器部，對於被搬送的基板上所形成的多列導電 圖案’以電容結合之非接觸式施加交流檢查信號，非接觸式 地檢測㈣導電圖案傳輸的上述交流檢查信號·，檢查台，與 097136410 200923352 上述感測if部離開對向，由導電體所構成；搬送機構，搬送 上述基板使其通過上述感測器部和上述檢查台間；基板位置 調整機構，被設置在上述檢查台中與上述感測器部對向面 側，使通過的上述基板維持在—歧離之空氣上浮狀態；判 斷部’將由上述感測器部連續獲得的上述檢查信號有發生各 劇振幅變化的導電圖案判斷為不良情況。 w (發明效果） 根據本發明，可提供一種電路圖案檢查裝置，其可將對向 的導電圖案與檢查探針間維持—定轉，適㈣大型基板上 所形成的導電圖案之斷線及短路檢查。 【實施方式】 下面’參照圖式詳細說明本發明之實施形離。 本發明之電路圖案檢查裝置，係檢查在玻璃製基板表面上 為形成點矩陣顯示面板而以—定間隔成列形成的導電圖案 是否良好。本實施形態中，導電圖案的圖案寬度大致相同， 各圖案的間隔亦大致相同。“，在感測器部不移動時，若 為-對感測器對向於相同導電圖案兩端部的圖案，則即使導 電圖案之中間寬度變化、或各圖案間隔不相同，其亦可施以 檢查。 圖1表不本發明電路圖案檢錢置構成之方塊構成例，圖 2表示檢測彳§號處理部之構成例。 該電路圖案檢查裝置大致由以下所構成：感測器部卜對 097136410 200923352 作為檢查對象之導電圖案進行非接觸檢查；檢查台5，離開 並對向於感測器部1，在檢查時維持離開距離（高度）；搬 送機構7，搬送檢查對象之基板4使其通過感測器部1與檢 查台5間；及控制部8，控制整個裝置，根據從感測器部1 獲得的檢測信號，判斷基板4上所形成的多個導電圖案19 有無斷線及短路。 更進一步，作為週邊機器其設置有鍵盤或觸摸面板等之輸 入部11、顯示設定條件或檢查條件等之顯示部12。又，亦 可設置用於遠端管理或監視之主機裝置15。亦可從主機裝 置15輸入檢查條件等。 又，圖3和圖4表示電路圖案檢查裝置之外觀構成例。 本實施形態由以下所構成：底座部（架台）31，為比檢查 對象之基板寬度還長的矩形形狀；支柱32，分別設置於底 座部31兩端；導引部33,橫架在支柱間；多個導引執道33a， 設置在導引部33上面；感測器支撐構件34，被設置為可在 導引軌道33a上滑動；感測器部1，懸吊在感測器支撐構件 34 ;及檢查台7，設置於感測器部1下方對向位置處。更進 一步，在底座部31上具有：搬送架台35，沿著與導引部33 正交的基板搬送方向設置；制動器構件36，可在搬送架台 35上移動，卡止基板4的前端和終端；多個搬送用輥37， 在搬送架台35上隔檢查台7在搬送方向上游側和下游側均 勻設置。此外，在下面說明中，對於所排列的導電圖案之寬 097136410 200923352 度方向（圖3中的χ方向、或基板的搬送方向），稱為感測 益部的各探針的長度’而在檢查台中亦同樣稱為檢查台之長 度。 在此種構成中，在感測器部丄跃直有至少—對施加探針 la和檢測探針lb。本實施形態之兩探針無接腳，為根據所 對向的檢查對象物面積具有一定面積（因設計而定，例如對 於導電體圖案而言，為—個圖案或兩個圖案的程度）的電極 板。從檢測信號供給部2朝施加探針la供給交流波形檢查 #號’透過電容結合將該檢查信號施加在作為檢查對象之導 電圖案19。檢測探針叫立於作為相同檢查對象之導電 19上方’接檢測）經電容結合在導電圖案二 查信號。檢測探針lb檢測作為檢查對象之導電 不良情況。*奋说π台^ π电间系断線 _9二::：：::^ :的=短。其原因是此可容_定不良的導電圖= 而貫際上，即使檢測探針化對著兩、 : 於施加探針la和檢測探針lb之各中 —電圖案，由 而亦可根據檢測出的信號—良的;= 檢測探針lb之附近也可以位於與作導電圖案。又，在 ㈣接的導電圖案上方方式配置第2如^ =導電圖案 以檢測作為檢查對象之導電圖 短:針(未圖示)’ 097136410 因此’若只檢嫩，㈣―物^在檢查短路 36410 ^ 200923352 之情況下，最好為一 適當選擇設置即可 探針〗a和兩個檢測探針〗b，其 積）的檢測探針^。，又’若^具有兩個導電圖案19寬度（面 短路有血。更進一則由一個檢測探針】b即可檢測斷路和 ，圖:===檢查 個導電圖案距離之位置亦可=:上方而一開數BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit pattern inspection arranging which can non-contactly check whether the conductance on the substrate (4) (4) passing through the fixed sensor portion is good. 7 [Prior Art] Set: Take: = tube (cathode ray tube) and other true device liquid crystal display ΐ ΐ: Lei will use the liquid crystal on the board to delete and delete. Form the circuit wiring conductive pattern manufacturing step towel, J * display The 7^ device became the mainstream. In the case of the display, it is better to check the line or short circuit as a glass substrate. As a method of inspecting a contact type electric pattern of the present invention, as described in Patent Document 1, the front end of the pin is in accordance with the :f method (pin contact method), which is used to check the inspection signal of the probe, and to detect the conductive pattern. At both ends, from the inspection probe to apply the DC test signal / the other - check the DC test signal transmitted by the probe, the root is not checked for broken or short circuit. There are also at least two methods of the method described in Patent Document 2, in which the ends of the bonded bear-needle and the conductive pattern are moved in a non-contact manner with a capacitance of 0., ^ while moving from one side. Check the probe to apply the AC inspection letter, Tian Liyi inspection ~~ According to the detection letter sharp ~ * oblique detection of the AC inspection signal transmitted through the conductive pattern. road. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> Contents (Problems to be Solved by the Invention) In the liquid crystal display device described above, the size of the display surface and the refinement of the pixels are realized by the advancement of the manufacturing technology by the user, and the manufacturer increases the output or By reducing the manufacturing cost per unit of product, a production line using a manufacturing apparatus corresponding to a large recording board is constructed to make as many articles as possible in the manufacturing process. Therefore, it is also necessary to correspond to the configuration of a large substrate in the circuit pattern inspection device. In particular, in the inspection apparatus for electronic circuits in which the pixels are refined, the inspection apparatus for the contact method of the contacts is to manufacture a probe card composed of a plurality of inspection probes having a narrow gap for each product, thereby increasing the manufacturing cost. Further, the ''foot contacts the conductive pattern with a narrow line width and causes damage, and it is also a cause of failure in the subsequent manufacturing steps. It is difficult to refer to an inspection device for pattern inspection. For the above reasons, it is preferable to make A test device that combines a probe with a conductive pattern non-contact capacitor. The medium and the foot contact are combined with the capacitance of the non-contact type (C). The split crack is placed on the two-two probe to leave the conductive pattern and the opposite direction is received from the conductive pattern i. User; the code 'Ming (10) is edited. In order to improve the overall fluctuation of the AC check signal detected by 捡^' 并, and the signal change of the bad place is conspicuous. And make 097136410 200923352 therefore 'before passing the arranged conductive pattern It is extremely important to maintain the same capacitance combined state, that is, to check the distance between the ride and the conductive pattern to maintain tens of micrometer units. However, as shown in Figure 8, The large-sized glass substrate 4 to be inspected is thinner than its size, so that it is easily affected by the four forces, and the height difference (M, h2) of the surface of the inspection table 52 placed thereon is also greatly affected. Moreover, due to the process In the process of heating, although there is very little, there is a case where a whole frequency chord occurs. Further, in the moving mechanism of the inspection probe 51, since it is moved on a square glass substrate of several meters, the composition of the moving mechanism also tends to In order to solve the problems caused by the large-sized substrate of this kind, it is necessary to manufacture a flat inspection table, and a non-inspection glass inspection substrate does not float upward and is not suitable (check the distance between the probe and the substrate) The moving mechanism of the change. The large-scale substrate is required to achieve the current inspection accuracy and even higher inspection accuracy, and the technical difficulty is high and the manufacturing cost is also greatly improved. Therefore, the present invention aims to provide a circuit pattern inspection device that can be maintained. The relative distance between the conductive pattern and the inspection probe is suitable for the disconnection and short circuit inspection of the conductive pattern formed on the large substrate. Means for Solving the Problems In order to achieve the above object, the present invention provides a circuit pattern inspection device, which has a sensor portion for capacitively bonding non-contacts of a plurality of columns of conductive patterns formed on a substrate to be conveyed. The alternating current inspection signal is applied, and the alternating current inspection signal transmitted by the conductive pattern is detected non-contactly, and the inspection table is separated from the sensing if portion by 097136410 200923352, and is composed of a conductor; and the conveying mechanism transports the substrate The substrate position adjustment mechanism is disposed between the sensor table and the inspection table; the substrate position adjustment mechanism is disposed on the opposite side of the inspection table and the sensor portion, and the passing substrate is maintained in a distracted air floating state; The determination unit 'determines that the conductive pattern continuously changed by the sensor unit has a conductive pattern in which the amplitude of each of the amplitudes changes. w (Effect of the Invention) According to the present invention, it is possible to provide a circuit pattern inspection device which can maintain a constant rotation between an opposite conductive pattern and an inspection probe, and is suitable for (4) disconnection and short circuit of a conductive pattern formed on a large substrate. an examination. [Embodiment] Hereinafter, the embodiment of the present invention will be described in detail with reference to the drawings. In the circuit pattern inspection apparatus of the present invention, it is checked whether or not the conductive pattern formed in a line at a predetermined interval on the surface of the glass substrate for forming the dot matrix display panel is good. In the present embodiment, the pattern widths of the conductive patterns are substantially the same, and the intervals of the respective patterns are also substantially the same. "When the sensor portion does not move, if the sensor is opposite to the pattern of the opposite ends of the same conductive pattern, even if the intermediate width of the conductive pattern changes, or the pattern intervals are different, Fig. 1 shows an example of a block configuration of a circuit pattern check structure of the present invention, and Fig. 2 shows a configuration example of a process unit for detecting a mark. The circuit pattern check device is basically composed of the following: 097136410 200923352 Non-contact inspection is performed on the conductive pattern to be inspected; the inspection table 5 is separated from the sensor unit 1, and the distance (height) is maintained during the inspection; the transport mechanism 7 transports the substrate 4 to be inspected. Between the sensor unit 1 and the inspection table 5; and the control unit 8, the entire device is controlled, and based on the detection signal obtained from the sensor unit 1, it is judged whether or not the plurality of conductive patterns 19 formed on the substrate 4 are broken or short-circuited. Further, as the peripheral device, an input unit 11 such as a keyboard or a touch panel, a display unit 12 for displaying setting conditions or inspection conditions, and the like are provided. Further, it may be provided for remote management or monitoring. The host device 15 can also input inspection conditions and the like from the host device 15. Further, Fig. 3 and Fig. 4 show an example of the external configuration of the circuit pattern inspection device. This embodiment is composed of the following: a base portion (stand) 31, which is a ratio a rectangular shape having a long substrate width; the pillars 32 are respectively disposed at two ends of the base portion 31; the guiding portion 33 is transversely disposed between the pillars; and a plurality of guiding lanes 33a are disposed on the guiding portion 33; The sensor support member 34 is disposed to be slidable on the guide rail 33a; the sensor portion 1 is suspended from the sensor support member 34; and the inspection table 7 is disposed opposite the sensor portion 1 Further, the base portion 31 has a transport stand 35 which is provided along the substrate transport direction orthogonal to the guide portion 33, and the brake member 36 is movable on the transport stand 35 to lock the front end of the substrate 4. And a plurality of transport rollers 37, which are uniformly disposed on the transport rack 35 on the upstream side and the downstream side in the transport direction. Further, in the following description, the width of the arranged conductive pattern is 097136410 200923352 degrees ( Figure 3 The direction or the transport direction of the substrate, which is called the length of each probe of the sensory portion, is also referred to as the length of the inspection table in the inspection table. In this configuration, the sensor portion is eagerly alive. At least the pair of probes la and the detection probe lb are applied. The two probes of the present embodiment have no pins, and have a certain area according to the area of the object to be inspected (depending on the design, for example, for the conductor pattern) An electrode plate which is a pattern or a pattern of two patterns. The AC signal is supplied from the detection signal supply unit 2 to the application probe 1a, and an AC waveform check ##' is transmitted through the capacitance to apply the inspection signal to the conductive pattern 19 to be inspected. The detection probe is called to stand on the conductive 19 as the same inspection object and is connected to the conductive pattern to check the signal. The detection probe lb detects a poor conduction condition as an inspection object. * Fen said π Taiwan ^ π electric system is broken _9 two::::::^ : = short. The reason for this is that the conductive pattern can be determined to be inferior. On the other hand, even if the detection probe is opposite to the two, the electro-pattern is applied to each of the probe la and the detection probe lb. The detected signal is good; = the vicinity of the detection probe lb can also be located in a conductive pattern. Further, a second conductive pattern is disposed on the conductive pattern (4) to detect the shortness of the conductive pattern to be inspected: a needle (not shown) 097136410. Therefore, if only the tenderness is detected, (4) - the object is inspected for a short circuit. In the case of 36410 ^ 200923352, it is preferable to set the detection probe ^ of the probe a and the two detection probes b, which are appropriately selected. , 'If ^ has two conductive patterns 19 width (the surface is short-circuited with blood. Further by a detection probe) b can detect the open circuit and, Figure: === check the position of the conductive pattern distance can also =: Above and open
該等探針對之IB 可依形成在基板4的導電圖荦群細r制 品中構成一個顯 守电α茱群組(製 所不的例子中，為了同時檢查兩個群組，而設置 有2、、且探針對。該探針對的數目由基板的規格所蚊，不使 用的奴針對退離至導引部33中基板檢查範圍之外。 更進一步，在本實施形態中設置有：高度位置調整機構 1 〇由匕制部8之控制而調整感測器部1和檢查台5間之對 向距離（高度位置）；與退離機構9，使感測器部1沿與基 板4的搬送方向垂直的方向移動，退離到既定位置。 退離機構9由導引部33和設置在感測器部1或導引部犯 之驅動部（未圖示）所構成。在感測器部1未使用時、裝置 停止時及檢查時等，退離機構9使感測器部丨在導引部33 上移動’使其退離到基板檢查範圍外面。若使用該退離機構 9,亦可沿著導電圖案19之形成方向移動，對於經判斷為不 良之導電圖案19，為了檢測不良處存在於圖案之那個位 置，其亦可兼用作為使感測器部1沿著導電圖案之形成方向 097136410 200923352 移動的移動機構。此外，對該導電圖案中不良處的位置檢 測，亦可另外設置移動機構。 又，在檢查台5或感測器部1之附近設置有距離測定感測 器13，用於測定基板4與檢查台5間之距離及檢查台5與 感測器部1間之距離。距離測定感測器13，例如可以使用 雷射光，照射至基板4，根據其微小反射光檢測基板4與檢 查台5間之距離。或者，亦可照射至基板4上之導電圖案 19，根據其反射光檢測距離，減去基板4之厚度而算出基板 4與檢查台5間之距離。同樣地，檢查台5或感測器部1間 之距離亦可根據反射光來測定。 更進一步，在感測器部1之附近設置對基板4之導電圖案 19進行攝像的攝像部14，根據所拍攝到的影像定位檢查開 始位置。又，其亦可附設在感測器部1上而一體移動，對檢 測到的圖案上不良處進行攝像，而顯示成影像。 檢查台5由導電體所構成，如圖5(a)所示，其寬度L2特 別是相對於感測器部1之檢測探針lb之寬度L1而言，為相 同寬度至2倍以下之寬度。又，如圖5(b)所示，於檢查台5 上面設置有基板位置調整機構6。 本實施形態之基板位置調整機構6，例如由以下所構成： 空氣吐出部61，為圓盤形狀並由多孔材料形成；吸引口 62， 被設置在圓盤中央或附近處；空氣供給部63，由朝空氣吐 出部61供給空氣的壓縮機等構成；及空氣吸引部64，由從 097136410 10 200923352 吸引口 62進行吸氣的泵等構成。在本實施形態中，於圖5(b) 概念性圖示4個空氣吐出部61，但其並不受限於此，只要 設置之個數可使通過感測器部1與檢查台6間之基板以一定 距離（離檢查台一定距離或離感測器部一定距離之任一者均 可）維持空氣上浮狀態即可。因此，亦可將空氣吐出部Μ 配置成多列。另外，本實施形態中空氣吐出部61在俯視下 呈圓形，但其並不受限於此，亦可為矩形之矩陣配置或適杏 偏離設置。更進一步，亦可將空氣吐出部61形成為六角形， 成為蜂巢形狀配置。 此外，基板位置調整機構6亦可利用習知的氣浮機構。由 於在空氣供給部63中必須供給一定流量之空氣，因此例如 亦可使用質量流量控制器來控制。另外，不限定於空氣，亦 可使用氮氣或惰性氣體。更進一步，若由於製造步驟之關係 在¥電圖案成膜不久後進行檢查，亦可調整上浮吐出的氣體 級度（降低酿度），一併對基板4進行冷卻（c〇〇i丨呢）處理等。 在該構成中，空氣吐出部61從整個表面均勻吐出經由多 孔材料之空氣。又’吸引口 以某種程度吸引所吐出的空 乳。在此種構成中，當藉由增減空氣吐出量和吸引量之比率 而將玻璃等基板4置於檢查台5上時，則基板4 -邊因所吐 出的二氣上浮，一邊由於吸引而被限制上浮之距離。即，該 才双查σ上方之基板4，在上浮距離經調整的位置處成為空中 停止之狀態。在本實施形態中，若為基板4可維持在離檢查 097136410 200923352 台5以一定距離上浮之狀態之構成，則該上浮機構不受限於 上述構成。 又，本實施形態中，在檢查時，因檢查台5和感測器部1 被固定住，而設置有搬送機構7以搬送基板4通過檢查台5 與感測器部1間。 搬送機構7在搬送方式上可使用各種習知機構，例如，有 帶式搬送機構、設置有多個輥的輥搬送機構、使用線性馬達 的馬達滑動搬送機構、採用空氣上浮方式之空氣上浮搬送 等，亦可為該等組合之構成。本實施形態中，如圖3.及圖4 所示，係以被配置在檢查台5的搬送方向上游側和下游側並 分別使用多個輥37而構成的輥搬送機構為例。本實施形態 中，配置為隔著檢查台7分斷為上游側和下游側，且與制動 器部之一部分重合。於該等親37設置有未圖示之旋轉驅動 機構，由控制部8之控制進行旋轉，搬送所載置的基板4。 此外，若基板4在適當搬送的範圍内，則不必在全部輥37 設置驅動機構。 本實施形態中，例如，基板4的前端側和後端侧分別緊貼 設置有制動器部36。於制動器部36設置有在搬送方向以一 定速度滑動移動的滑動機構。該等制動器部36在由輥37 搬送基板4時，被控制為以一定速度搬送基板4。又，在輥 37未設置驅動機構的自由狀態、或取代輥37而使用空氣上 浮機構之上浮狀態下，藉由使制動器部36在搬送方向滑 097136410 12 200923352 動，亦可進行基板搬送。 更進-步’作為變形例，例如，亦可採 (belt⑽¥啊)的帶式搬送機構。帶式運送機如 開檢查台7之帶式執道即可4即 二有避 在檢查台7前，先往下沉，穿過檢查台^方=運送機 在該構成中，由於隔檢查台7的上游側和下游側之基人3逆 速度相同，因此搬送速度容易控制。更進—步，於帶式= 機有多個小孔開π，内部設置有風扇等，藉由從内側笔 可在基板4吸附在帶式運送機的狀態下進行搬送，而可防止 搬送途中基板之偏離。 又、，檢測信號處理部3由以下所構成：放大電路Μ，將 從感測器冑1輪出的微小類比檢測信號放大到既定電壓位 準（可判斷是否良好之位準）；帶通滤波器22,從經放大電 路21放大的檢測信號中去除雜訊成分，使其通過必要之帶 ::整流:路23 ’將來自帶通濾波器22之檢測信號全波整 抓，及平24 ’將全;皮錢後的檢測彳f mx平流處 進行王波整流的整流電路23及使檢測信號平流 的平流電路24並非為必備要件。 控制部8具有：巾央處理ll(GPU)16，根據㈣或設定的 運算條件進行運算處理；記憶部 17，記憶CPU 16所使用的 程式、控制參數及檢查結果等；及判斷部18，根據CPU16 所5又疋的判斷基準，判斷檢查對象之導電圖案是否有斷線不 097136410 13 200923352 良情況或短路不良情況。 又，檢測彳S旒供給部2，產生例如交流2〇〇KHz、2〇〇v之 正弦波信號作為檢查信號，供給到施加探針la。在此種情 況下’由於f通據波器22檢測出的檢查信號亦為2〇〇KHz， 所以使$通$ 20GKHz之帶通領域的滤波器。此外，檢查信 號不限定於正弦波信號’若為有娜的信號即可，矩形波或 者脈波亦可。 其次，忒明如此構成的本實施形態之電路圖案檢查裝置之 檢查過程。 首先，起動時，由檢查者輸入裝置内各構成部分之初始設 定、輸入檢查參數（由檢查對象之基板及導電圖案所規定的 檢查參數）’設定檢查條件。檢查條件中作為預設檢查參數 而由檢查對象之基板及導電圖案所規定的數值、例如，檢查 對象之基板大小及厚度等之設定、感測器部相對於導電圖案 的對位4，係根據一般例規而設定。此時，亦可使用虛擬基 板等而進行條件設定及試驗性的檢查也可以。 此時’檢查對象之基板4由基板位置調整機構6從檢查台 5開始調整為例如上浮3〇//m距離之狀態。又，由高度位置 調整機構10進行高度（z方向）之調整，使感測器部1之 施加探針1 a及檢測探針〗b與基板4上之導電圖案的距離為 適合施加及檢測檢查信號之距離◊此一調整亦可在實際對導 電圖案施加/檢測信號時進行。又，感測器部丨之施加 097136410 14 200923352 抹針la及檢測探針lb非接觸式被定位在導電圖案之兩端上 方。 其次’於上游側之搬送機構7供給檢查對象之基板4。此 時’在搬送用親37上，制動器部36緊貼在基板4之前端和 後端。在確涊到感測器部丨之位置調整後，由搬送機構7 將基板4搬送到檢查開始位置。此時，例如，藉由攝像部 14所拍攝到的影像來確認開始位置。 根據來自控制部8之實施檢查指令，由搬送機構7搬送基 板4 ’當置於檢查台5上，則由感測器部1往導電圖案施加 檢查佗號，並檢測經導電圖案傳輸的檢查信號。檢測信號被 輸入到檢測信號處理部3。 檢測信號處理部3如圖2所示，首先由放大電路21將輸 入的檢測信號放大到必要位準。其次，放大的檢測信號由只 允許檢查信號之頻帶域通過的帶通濾波器22除去雜訊成 分。然後’通過帶通纽器22之檢測信號由整流電路Μ 全波整流。更進-步，全波整流後的檢測信號經平流電路 24進行平流，生成為檢剛t號。該檢測錢由控制器8中 之未圖不A/D轉換部施以數位化處理。 CPU 16變換為被A/D變換後之數位檢測信說，而傳輸至 判斷部18。判斷部18檢測所讀取到的檢測信號中是否有瞬 間急劇變化，由該等變化之正負方向，判斷是否有斷線或短 路。 097136410 200923352 具體而言，對於由感測器部1連續檢測的檢測信號，判斷 相對於之前檢測信號之信號值而發生急劇變化（具有峰值並 恢復到原信號值附近的信號值振幅變化）之導電圖案是否有 存在短路或斷線等不良情況。此外，來自本實施形態感測器 部1之檢測信號係以一定的電壓位準推移，例如在檢測到的 檢測信號的電位位準中即使發生波動等之上下變動，亦可進 行上述判斷。即，對於信號值之急劇變化，預先設定判斷位 準，而對從之前信號值開始超過該判斷位準的急劇變化判斷 為不良情況，而對於波動等較平緩檢測信號之電位位準變 化，則不進行良好/不良情況之判斷。因此，判斷基準對於 信號值之隨時變化，在正負方向與判斷位準（信號值）重疊， 經常地根據之前的檢測信號值或預設的期間内平均的檢測 信號值之正負某個範圍（以檢測信號值為中心之寬度）進行 判斷，對於檢測出在該範圍之上限或下限外的檢測信號，則 判斷該檢查對象之導電圖案為不良。此外’預設期間内之平 均檢測信號值，可為該期間整體（累計值）之平均，亦可為 在該期間中多個取得的檢測信號值之平均值。又，若檢測信 號值為a，判斷位準為b，關於檢測信號值之正負某個範圍 的上限或下限中，判斷是否良好之範圍上限為a+b，範圍下 限為a-b。 圖6表示針對檢查部和檢查台之檢查說明的概念。如圖6 所示，搬送中的基板4經常地由檢查台5維持上浮30//m 097136410 16 200923352 之狀態。因此，即使基板4發生翹曲或歪斜，由於其可對基 板4之檢查對象區域進行位置調整，因此感測器部丨與導電 圖案之距離保持一定。 圖7表示基板4之移動距離和從感測器部丨之輸出信號 (其中，放大處理後）之一例。本實施形態基板位置調整機 構6調整基板4之位置後的結果A是推移一定之〇. 3V。另 一方面，不使基板位置調整機構6作動，不進行基板4之位 置調整的結果B，由於基板4之高度變動，感測器部i導電 圖案間之距離變化，因此在大約〇. 12V至大約〇, 19V的範圍 内變化。在大約24mm、大約53mm之位置處均同樣檢測出不 良處。此外，以往係利用軟體而對輸出結果之波動進行補 正。在本實施形態中，則由於可直接利用硬體輸出結果進行 判斷’因此不需要為了平坦化而以軟體處理，如此而可實現 裝置構成之簡單化及判斷快速化。 如以上所說明’根據本實施形態，由於感測器部中的施加 才木針和檢測探針與導電圖案係非接觸者，因此即使實施檢查 亦可消除接觸導電圖案之損傷，而可防止表面損傷或剝離 等。 又田檢查時，感測器部與檢查台間之距離被固定，其間 基板通過檢查台上方之一定位置。因此，感測器部與基板上 之導電圖案之距離保持—定，而可防止檢測信號發生電位位 準波動等之上下變動。 097136410 17 200923352 更進-步，由於基板在感測H部和檢查台間進行位置調整 而通過規定位置，因此即使搬送中發生上下變動或基板麵曲 或歪斜，其對檢測結果亦不會有問題。因此，本發明可不要 求高精度之搬送機構，而可使用簡單的搬送機構。因此，其 不僅可降低裝置之製造成本，亦可使用各種構成作為搬送機 構。 又，在本實施形態中，由於其非為載置固定基板的習知檢 查台，因此不會因為基板之大小而需要較高平面精度之台 面，檢查台之製造則不需要高度熟練的技術。更進一步，其 非為感測H部在基板±移動的構成，因此其*需要用於移動 檢查的感測器移動機構，而只需要檢查前進行高度調整即可 以簡單小型之調整機構來實現。 又’由於對作為檢查對象之基板寬度於設計階段考慮感測 器部之數目和設置感測器部之導引部長度，因此即使是大小 不同的基板，只要將感測器部配合基板在導引部上移動，則 對於各種尺寸間基板可進行相同的檢查，而具有高通用性。 又，其亦可構成為使感測器部之數量增減，而使使用者玎容 易因應基板檢查所要求之規格。 又，由於感測器部與導電圖案之距離保持—定，被結合的 靜電容量無上下變動之電位位準波動，因此其不需要軟體處 理，不減少控制部之處理能力，而可使結果處理簡單化，直 使檢測時間等之回應性提高小其可容易判斷不良處之信 097136410 18 200923352 號位準變化，而可抑制錯誤判斷發生。 本發明於導引部設置有使感測器部沿基板上形成的導電 圖案之圖案方向進行退離移動的退離機構，因此其在發現導 電圖案存在不良之情況時，可利用退離機構使感測器部沿著 導電圖案移動，而可檢測出導電圖案之不良處的位置。 【圖式簡單說明】 圖1表示本發明一實施形態的電路圖案檢查裝置之方塊 構成例。 圖2表示圖1所示檢測信號處理部之構成例。 圖3表示從斜上方觀看本實施形態電路圖案檢查裝置的 外觀構成例。 圖4表示從上方觀看本實施形態電路圖案檢查裝置的外 觀構成例。 圖5(a)為檢查台與感測器部之大小之說明圖，圖5(b)為 表示設置在檢查台上面的基板位置調整機構。 圖6為用於說明用本實施形態構成之檢查部與檢查台之 檢查的概念圖。 圖7說明基板之移動距離與感測器部之輸出信號之關係。 圖8說明將大型基板載置於載台而使感測器部移動的構 成。 【主要元件符號說明】 感測器部 097136410 19 200923352 la 施加探針 lb 檢測探針 2 檢測信號供給部 ' 3 檢測信號處理部 - 4 基板（玻璃基板） 5 檢查台 6 基板位置調整機構 / 7 搬送機構 8 控制部 9 退離機構 10 高度位置調整機構 11 輸入部 12 顯示部 13 距離測定感測器 "14 攝像部 15 主機裝置 16 中央處理部（CPU) 17 記憶部 18 判斷部 19 導電圖案 21 放大電路 22 帶通濾波器 097136410 20 200923352 23 整流電路 24 平流電路 31 裝置底座部（架台） 32 支柱 33 導引部 33a 導引軌道 34 感測器支撐構件 35 搬送架台 36 制動器構件 37 搬送用輥 61 空氣吐出部 62 吸引口 63 空氣供給部 64 空氣吸引部 097136410 21These probe pairs IB can form a stagnation power 茱 group according to the conductive pattern 细 group fine r products formed on the substrate 4 (in the example of the system, in order to simultaneously check two groups, 2 And the pair of probes. The number of the probe pairs is determined by the specification of the substrate, and the unused slaves are excluded from the substrate inspection range in the guiding portion 33. Further, in the present embodiment, the height position is set. The adjustment mechanism 1 adjusts the opposing distance (height position) between the sensor unit 1 and the inspection table 5 under the control of the clamping unit 8; and the retracting mechanism 9 causes the sensor unit 1 to be transported along the substrate 4 The direction moves in the vertical direction and retreats to a predetermined position. The retreating mechanism 9 is composed of a guiding portion 33 and a driving portion (not shown) provided in the sensor portion 1 or the guiding portion. 1 when not in use, when the device is stopped, during inspection, etc., the retracting mechanism 9 moves the sensor portion 丨 on the guiding portion 33 to retreat to the outside of the substrate inspection range. If the retreating mechanism 9 is used, It is movable along the forming direction of the conductive pattern 19, and is a conductive pattern judged to be bad. 19. In order to detect that the defective portion exists at the position of the pattern, it may also serve as a moving mechanism for moving the sensor portion 1 along the forming direction of the conductive pattern 097136410 200923352. Further, the position detection of the defective portion in the conductive pattern Further, a moving mechanism may be separately provided. Further, a distance measuring sensor 13 is provided in the vicinity of the inspection table 5 or the sensor unit 1, for measuring the distance between the substrate 4 and the inspection table 5, and the inspection table 5 and sensing. The distance measuring device 13 can be irradiated to the substrate 4 using laser light, for example, and the distance between the substrate 4 and the inspection table 5 can be detected based on the minute reflected light. Alternatively, the distance between the substrate 4 and the inspection table 5 can be detected. The conductive pattern 19 calculates the distance between the substrate 4 and the inspection table 5 based on the reflected light detection distance and the thickness of the substrate 4. Similarly, the distance between the inspection table 5 or the sensor portion 1 can also be based on the reflected light. Further, an imaging unit 14 that images the conductive pattern 19 of the substrate 4 is provided in the vicinity of the sensor unit 1, and the inspection start position is positioned based on the captured image. Further, it may be attached to The sensor unit 1 is integrally moved, and the detected pattern is imaged and displayed as an image. The inspection table 5 is composed of a conductor, and as shown in Fig. 5(a), the width L2 is particularly relative. The width L1 of the detecting probe 1b of the sensor unit 1 is the width of the same width to 2 times or less. Further, as shown in FIG. 5(b), the substrate position adjusting mechanism 6 is provided on the upper surface of the inspection table 5. The substrate position adjusting mechanism 6 of the present embodiment is configured, for example, by an air discharge portion 61 having a disk shape and formed of a porous material, and a suction port 62 provided at or near the center of the disk; the air supply portion 63 The compressor is configured to supply air to the air discharge unit 61, and the air suction unit 64 is configured by a pump that sucks air from the suction port 62 of 097136410 10 200923352. In the present embodiment, the four air ejection portions 61 are conceptually illustrated in FIG. 5(b), but the present invention is not limited thereto, and the number of the passages may be passed between the sensor portion 1 and the inspection table 6. The substrate may be maintained at a certain distance (any distance from the inspection table or a certain distance from the sensor portion) to maintain the air floating state. Therefore, the air discharge portion 亦可 can also be arranged in a plurality of rows. Further, in the present embodiment, the air discharge portion 61 has a circular shape in plan view. However, the air discharge portion 61 is not limited thereto, and may be arranged in a rectangular matrix or offset from the apricot. Further, the air discharge portion 61 may be formed in a hexagonal shape and arranged in a honeycomb shape. Further, the substrate position adjusting mechanism 6 can also utilize a conventional air floating mechanism. Since it is necessary to supply a certain amount of air in the air supply unit 63, it can be controlled, for example, using a mass flow controller. Further, it is not limited to air, and nitrogen or an inert gas may also be used. Furthermore, if the inspection is performed shortly after the film formation of the electric pattern by the manufacturing process, the gas level of the floating discharge can be adjusted (reduced the degree of brewing), and the substrate 4 can be cooled (c〇〇i丨). Processing and so on. In this configuration, the air discharge portion 61 uniformly discharges air passing through the porous material from the entire surface. Also, the suction port attracts the empty milk that is spit out to some extent. In such a configuration, when the substrate 4 such as glass is placed on the inspection table 5 by increasing or decreasing the ratio of the amount of air discharged and the amount of suction, the substrate 4 is lifted by the two gases that are discharged. The distance that is restricted from floating up. That is, it is necessary to double check the substrate 4 above the σ to be in a state of being stopped in the air at the position where the floating distance is adjusted. In the present embodiment, the floating mechanism is not limited to the above configuration, so that the substrate 4 can be maintained in a state of being floated at a certain distance from the inspection 097136410 200923352. Further, in the present embodiment, at the time of inspection, the inspection table 5 and the sensor unit 1 are fixed, and the transport mechanism 7 is provided to transport the substrate 4 between the inspection table 5 and the sensor unit 1. The transport mechanism 7 can use various conventional mechanisms for the transport method, for example, a belt transport mechanism, a roller transport mechanism provided with a plurality of rollers, a motor slide transport mechanism using a linear motor, and an air floating transport using an air floating method. It can also be the composition of these combinations. In the present embodiment, as shown in Fig. 3 and Fig. 4, a roller conveying mechanism configured by using a plurality of rollers 37 on the upstream side and the downstream side in the conveying direction of the inspection table 5 is used as an example. In the present embodiment, it is arranged to be separated into the upstream side and the downstream side via the inspection table 7, and overlaps with one of the brake portions. The parent 37 is provided with a rotary drive mechanism (not shown), and is rotated by the control unit 8 to transport the mounted substrate 4. Further, if the substrate 4 is within the range of proper conveyance, it is not necessary to provide a drive mechanism for all of the rollers 37. In the present embodiment, for example, the brake portion 36 is provided in close contact with the front end side and the rear end side of the substrate 4, respectively. The brake unit 36 is provided with a slide mechanism that slides at a certain speed in the transport direction. When the substrate portion 4 is transported by the roller 37, the brake portion 36 is controlled to transport the substrate 4 at a constant speed. Further, in the free state in which the roller 37 is not provided with the driving mechanism, or in the floating state in which the air floating mechanism is used instead of the roller 37, the substrate portion can be transported by sliding the brake portion 36 in the conveying direction by 097136410 12 200923352. Further, as a modification, for example, a belt conveyance mechanism of (belt (10) ¥ ah) may be employed. If the belt conveyor is to open the inspection platform 7, the belt can be used as the 4th, and the second is to avoid the inspection platform 7, before sinking, passing through the inspection platform ^ square = conveyor in this configuration, due to the inspection platform Since the base 3 of the upstream side and the downstream side of 7 has the same reverse speed, the transport speed is easily controlled. Further, in the belt type, the machine has a plurality of small holes to open π, and a fan or the like is provided inside, and the inner side pen can be transported while being sucked on the belt conveyor in the substrate 4, thereby preventing the middle of the transport. Deviation of the substrate. Further, the detection signal processing unit 3 is configured by an amplification circuit Μ that amplifies the micro analog detection signal that is rotated from the sensor 胄1 to a predetermined voltage level (it can be judged whether or not the level is good); band pass filtering The device 22 removes the noise component from the detection signal amplified by the amplification circuit 21, and passes the necessary band: rectification: the path 23' sweeps the detection signal from the bandpass filter 22 to the full wave, and the flat 24' It is not necessary to perform the rectification circuit 23 for rectifying the wave of the wave and the advection circuit 24 for advancing the detection signal. The control unit 8 includes a processing unit 11 (GPU) 16 that performs arithmetic processing in accordance with (4) or the set calculation condition; the storage unit 17 stores a program used by the CPU 16, a control parameter, an inspection result, and the like; and the determination unit 18 The CPU 16 determines the reference level of the object to be inspected, and determines whether the conductive pattern of the inspection object is broken or not. 097136410 13 200923352 Good condition or short circuit failure. Further, the 彳S旒 supply unit 2 is detected, and a sine wave signal of, for example, an alternating current of 2 〇〇 KHz and 2 〇〇 v is generated as an inspection signal, and supplied to the application probe 1a. In this case, since the check signal detected by the f-pass filter 22 is also 2 〇〇 KHz, the pass-through filter of $20 GKHz is made. Further, the inspection signal is not limited to the sinusoidal signal ’, and may be a signal of a sinusoidal wave, or a rectangular wave or a pulse wave. Next, the inspection process of the circuit pattern inspection apparatus of the present embodiment thus constituted will be described. First, at the time of starting, the inspection conditions are set by the initial setting of each component in the examiner input device, and the input of the inspection parameters (the inspection parameters defined by the substrate to be inspected and the conductive pattern). The value specified by the substrate and the conductive pattern to be inspected as the preset inspection parameter in the inspection condition, for example, the setting of the substrate size and thickness of the inspection target, and the alignment of the sensor portion with respect to the conductive pattern are based on Set by general rules. In this case, condition setting and experimental inspection may be performed using a virtual substrate or the like. At this time, the substrate 4 to be inspected is adjusted from the inspection table 5 by the substrate position adjusting mechanism 6 to, for example, a state in which the distance is 3 ft/m. Further, the height position adjusting mechanism 10 adjusts the height (z direction) so that the distance between the probe 1 a and the detecting probe B of the sensor unit 1 and the conductive pattern on the substrate 4 is suitable for application and detection. The distance of the signal can also be adjusted when the signal is actually applied/detected to the conductive pattern. Further, the application of the sensor portion 097136410 14 200923352 The wiper la and the detecting probe lb are non-contactly positioned above both ends of the conductive pattern. Next, the substrate 4 to be inspected is supplied to the transport mechanism 7 on the upstream side. At this time, the brake portion 36 is in close contact with the front end and the rear end of the substrate 4 on the transfer member 37. After the position of the sensor unit is adjusted, the substrate 4 is transported to the inspection start position by the transport mechanism 7. At this time, for example, the start position is confirmed by the image captured by the imaging unit 14. According to the inspection command from the control unit 8, when the substrate 4' is transported by the transport mechanism 7 and placed on the inspection table 5, the sensor portion 1 applies an inspection nickname to the conductive pattern, and detects the inspection signal transmitted through the conductive pattern. . The detection signal is input to the detection signal processing unit 3. As shown in Fig. 2, the detection signal processing unit 3 first amplifies the input detection signal to a necessary level by the amplification circuit 21. Next, the amplified detection signal is removed from the noise component by a band pass filter 22 that allows only the frequency band of the inspection signal to pass. Then, the detection signal passing through the band-pass connector 22 is full-wave rectified by the rectifying circuit. Further, the full-wave rectified detection signal is advected by the advection circuit 24, and is generated as a check t number. This detection money is subjected to digitization processing by the unillustrated A/D conversion unit in the controller 8. The CPU 16 converts the digital detection signal into A/D-converted signal and transmits it to the judging unit 18. The judging unit 18 detects whether or not there is a sudden change in the instantaneous detection signal, and determines whether there is a disconnection or a short circuit from the positive and negative directions of the changes. 097136410 200923352 Specifically, for the detection signal continuously detected by the sensor unit 1, it is determined that the detection is abruptly changed with respect to the signal value of the previous detection signal (the amplitude of the signal value having a peak value and restored to the vicinity of the original signal value) Whether the pattern has a short circuit or a broken line. Further, the detection signal from the sensor unit 1 of the present embodiment is shifted at a constant voltage level, and for example, even if fluctuations such as fluctuations occur in the potential level of the detected detection signal, the above determination can be made. In other words, the determination level is set in advance for the abrupt change of the signal value, and the abrupt change from the previous signal value exceeding the determination level is judged to be a bad condition, and for the fluctuation of the potential level of the gradual detection signal, etc., No judgment of good/bad conditions is made. Therefore, the judgment criterion overlaps with the judgment level (signal value) in the positive and negative directions for the change of the signal value at any time, and is often based on the previous detection signal value or a certain range of the average detection signal value in the preset period (in terms of The detection signal value is determined as the width of the center. When the detection signal outside the upper limit or the lower limit of the range is detected, it is determined that the conductive pattern of the inspection object is defective. Further, the average detection signal value in the predetermined period may be an average of the total (accumulated value) of the period, or may be an average value of the plurality of detection signal values obtained during the period. Further, if the detection signal value is a, the determination level is b, and in the upper or lower limit of a certain range of positive and negative detection signal values, it is judged whether the upper limit of the range is a+b, and the lower limit of the range is a-b. Fig. 6 shows the concept of inspection description for the inspection unit and the inspection table. As shown in Fig. 6, the substrate 4 being conveyed is constantly maintained by the inspection table 5 in a state of floating up to 30//m 097136410 16 200923352. Therefore, even if the substrate 4 is warped or skewed, since the position of the inspection target region of the substrate 4 can be adjusted, the distance between the sensor portion 丨 and the conductive pattern is kept constant. Fig. 7 shows an example of the moving distance of the substrate 4 and the output signal from the sensor portion 其中 (after the amplification processing). In the embodiment, the substrate position adjusting mechanism 6 adjusts the position of the substrate 4, and the result A is a constant change of 3V. On the other hand, without the substrate position adjusting mechanism 6 being actuated, the result B of the position adjustment of the substrate 4 is not performed, and the distance between the conductive patterns of the sensor portion i changes due to the height variation of the substrate 4, so that it is about 〇12 V to About 〇, the range of 19V varies. Defects were also detected at approximately 24 mm and approximately 53 mm. In addition, in the past, software used to correct fluctuations in output results. In the present embodiment, the hardware output can be directly determined by the result of the hardware output. Therefore, it is not necessary to perform the processing for the flattening, so that the simplification of the device configuration and the rapid determination can be achieved. As described above, according to the present embodiment, since the wooden needle and the detecting probe are not in contact with the conductive pattern in the sensor portion, even if the inspection is performed, the damage of the contact conductive pattern can be eliminated, and the surface can be prevented. Damage or peeling, etc. When the field is inspected, the distance between the sensor unit and the inspection table is fixed, and the substrate passes through a certain position above the inspection table. Therefore, the distance between the sensor portion and the conductive pattern on the substrate is kept constant, and the up-and-down variation of the potential level fluctuation of the detection signal can be prevented. 097136410 17 200923352 Further, since the substrate passes the predetermined position by adjusting the position between the sensing H portion and the inspection table, there is no problem with the detection result even if the vertical movement or the substrate curvature or skew occurs during the conveyance. . Therefore, the present invention can eliminate the need for a high-precision conveying mechanism and can use a simple conveying mechanism. Therefore, it is possible to reduce not only the manufacturing cost of the apparatus but also various configurations as the transport mechanism. Further, in the present embodiment, since it is not a conventional inspection table on which a fixed substrate is placed, a table having a high plane accuracy is not required because of the size of the substrate, and the manufacture of the inspection table does not require a highly skilled technique. Further, it is not a configuration for sensing the movement of the H portion on the substrate. Therefore, it is required to use a sensor moving mechanism for moving inspection, and it is only necessary to perform height adjustment before inspection to realize a simple and small adjustment mechanism. In addition, since the number of the sensor portions and the length of the guide portion of the sensor portion are considered in the design stage of the substrate width as the inspection object, even if the substrate is of a different size, the sensor portion is fitted to the substrate. When the guide is moved, the same inspection can be performed for the substrates of various sizes, and the versatility is high. Further, it may be configured to increase or decrease the number of the sensor portions, so that the user can easily adapt to the specifications required for the substrate inspection. Moreover, since the distance between the sensor portion and the conductive pattern is kept constant, the potential of the combined electrostatic capacitance does not fluctuate, so that it does not require software processing, and the processing capability of the control unit is not reduced, and the result processing can be performed. Simplification, so that the responsiveness of the detection time and the like is small, it is easy to judge the position change of the letter 097136410 18 200923352, and the error judgment can be suppressed. According to the present invention, the guiding portion is provided with a retreating mechanism for retreating and moving the sensor portion along the pattern direction of the conductive pattern formed on the substrate. Therefore, when the conductive pattern is found to be defective, the retracting mechanism can be used. The sensor portion moves along the conductive pattern, and the position of the defective portion of the conductive pattern can be detected. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram showing an example of a block configuration of a circuit pattern inspection device according to an embodiment of the present invention. Fig. 2 shows an example of the configuration of the detection signal processing unit shown in Fig. 1. Fig. 3 is a view showing an example of the external configuration of the circuit pattern inspection device of the embodiment as seen obliquely from above. Fig. 4 is a view showing an external configuration example of the circuit pattern inspection device of the embodiment as seen from above. Fig. 5(a) is an explanatory view showing the size of the inspection table and the sensor unit, and Fig. 5(b) is a view showing the substrate position adjusting mechanism provided on the upper surface of the inspection table. Fig. 6 is a conceptual diagram for explaining inspection of an inspection unit and an inspection table constructed in the present embodiment. Figure 7 illustrates the relationship between the moving distance of the substrate and the output signal of the sensor portion. Fig. 8 is a view showing a configuration in which a large substrate is placed on a stage to move the sensor portion. [Description of main component symbols] Sensor unit 097136410 19 200923352 la Application probe lb Detection probe 2 Detection signal supply unit ' 3 Detection signal processing unit - 4 Substrate (glass substrate) 5 Inspection table 6 Substrate position adjustment mechanism / 7 Transfer Mechanism 8 Control unit 9 Evacuation mechanism 10 Height position adjustment mechanism 11 Input unit 12 Display unit 13 Distance measurement sensor "14 Imaging unit 15 Host device 16 Central processing unit (CPU) 17 Memory unit 18 Judging unit 19 Conductive pattern 21 Amplifying circuit 22 band pass filter 097136410 20 200923352 23 Rectifier circuit 24 Rectifier circuit 31 Device base portion (stand) 32 Pole 33 Guide portion 33a Guide rail 34 Sensor support member 35 Transport stand 36 Brake member 37 Transfer roller 61 Air discharge portion 62 suction port 63 air supply portion 64 air suction portion 097136410 21