200903610 九、發明說明： 【發明所屬之技術領域】 本發明係有關於晶圓加工處理裝置，尤其是有關於用 於劈裂晶圓之晶圓劈裂機。 【先前技術】 請參閱「第1圖」與「第2圖」所示，晶圓劈裂機用 於將晶圓1劈裂為一粒粒的晶粒，以進行後續的封裝作 業，晶圓1在進行劈裂之前，會先用雷射切割出橫向與縱 f 向的預切線2，接著將晶圓1貼附一藍片3加以保護後， 藉一固定夾具4送入一晶圓劈裂機進行劈裂作業。 晶圓劈裂機包含一工作台5、一劈刀6、一劈裂台7 與一影像擷取系統8，該工作台5夾置該固定夾具4,並 可作平面方向的移動與轉動，該劈刀6與該劈裂台7係對 設於該晶圓1的上下兩側，以讓該晶圓1抵壓該劈裂台7 並藉該劈刀6的沖壓進行劈裂作業，該影像擷取系統8則 用於截取該晶圓1的影像，並藉該預切線2得知該晶圓1 k 的位置。 據而該晶圓1可藉該工作台5的位移與該影像擷取系 統8的偵測而進行定位，而在定位完成之後，即可藉該劈 刀6的上下位移與該工作台5的定量位移，對多個預切線 2連續進行劈裂，而該影像擷取系統8則在連續劈裂過程 中監控該晶圓1的定位是否偏移，以視偏移的程度重新進 行定位，而當橫向與縱向的預切線2皆被劈裂之後即完成 劈裂作業。 5 200903610 此習知的晶圓劈裂機，其在劈裂的過程中，晶圓1會 產生不可忽視的翅曲，當連續劈裂多次時，其麵曲嚴重會 導致該影像擷取系統8失焦，而當失焦時必須手動壓制晶 圓1，使晶圓1影像重新被該影像擷取系統8抓取定位， 其不但造成相當的危險且易損壞晶圓，因而其產量難以提 高，且會降低生產良率，而不符合生產所需。 【發明内容】 爰此，本發明之主要目的在於提供一種晶圓劈裂壓板 機構，以降低晶圓在劈裂時所產生的翹曲程度。 本發明係一種晶圓劈裂壓板機構，其架設於一晶圓劈 裂機上’並用於壓制'一晶圓，該晶圓猎'一固定爽具固定在 該晶圓劈裂機的一工作台上，其包含一作動機件、一懸臂 桿與一壓制元件，該作動機件固定在該晶圓劈裂機上，該 懸臂桿與該作動機件連接並受該作動機件帶動而移動，而 該壓制元件設於該懸臂桿的一端，且該壓制元件依據該懸 臂桿的移動位置而具壓制該晶圓與不壓制該晶圓的二種 狀態。 據此，本發明在晶圓劈裂的過程中可以藉該壓制元件 壓制晶圓，因而可減少晶圓的翹曲程度，故可減少重新定 位次數，讓連續劈裂的次數增加，據而提高產量並提高生 產良率。 【實施方式】 為俾使貴委員對本發明之特徵、目的及功效，有著 6 200903610 更加深入之瞭解與認同，茲列舉較佳實施例並配合圖式說 明如后： 請參閱「第3圖」、「第4圖」與「第5圖」所示，本 發明為一種晶圓劈裂麗板機構，其包含一作動機件10、一 懸臂桿20與一壓制元件30,其中該懸臂桿20與該作動機 件10連接並受該作動機件10帶動而移動，該作動機件10 可以為轉動元件，因而該作動機件10可帶動該懸臂桿20 r 上下些微擺動，如「第4圖」所示為懸臂桿20些微上擺 的示意圖，另該壓制元件30設於該懸臂桿20的一端，且 該壓制元件30設有複數滾動元件31，該壓制元件30可以 為轴桿且兩端跨接在該懸臂桿20上，該複數滾動元件31 為軸套且滾動套合在該壓制元件30上，又該壓制元件30 可設有一劈裂口 32，並讓該複數滾動元件31分設在該劈 裂口 32的兩側。 請再參閱「第6圖」與「第7圖」所示，本發明供架 , 設於一晶圓劈裂機90上，該晶圓劈裂機90包含一劈刀 91、一劈裂台92、一影像擷取系統93與一工作台94，並 用於壓制一晶圓80，該晶圓80用雷射形成有預切線81， 並包覆藍片82加以保護，該晶圓80藉一固定夾具70固 定在該晶圓劈裂機90的工作台94上，其中該工作台94 可乘載該晶圓80移動，而該壓制元件30的複數滾動元件 31於該工作台94的移動方向具滚動自由度，該作動機件 10固定在該晶圓劈裂機90上，且該壓制元件30依據該懸 7 200903610 臂桿20上下擺動時的移動位置而具壓制該晶圓80與不壓 制該晶圓8 0的二種狀恶。 又該壓制元件30與該劈裂台92分列於該晶圓80之 兩側，該劈裂台92用於頂制該晶圓80，該劈裂台92具有 一裂缝921，該裂缝921與該劈刀91正對該劈裂口 32， 而該影像擷取系統93擷取該晶圓80的影像，並依據該晶 圓80的預切線81判定該晶圓80的位置。 請再參閱「第8-1圖」與「第8-2圖」所示，本發明 晶圓80劈裂壓板機構在使用時，先準備晶圓80，該晶圓 80先用雷射預切好預切線81，並包覆藍片82加以保護， 接著讓該晶圓80藉固定夾具70固定在該晶圓劈裂機90 的工作台94上，接著移動該工作台94並藉該影像擷取系 統93讓該晶圓80最邊緣的預切線81 (最邊緣需要劈裂位 置）對準該劈裂台92的裂缝921，此時該壓制元件30仍處 於不壓制該晶圓80的狀態。 接著藉該作動機件10讓該壓制元件30處於壓制該晶 圓80的狀態，此時即可讓劈刀91下移至劈裂該晶圓80 後再回復，接著持續讓該壓制元件30處於壓制該晶圓80 的狀態並藉該工作台94橫移一預設量讓下一個預切線 81 (需要劈裂處）對準該劈裂台92的裂缝921，接著讓劈刀 91再次下移至劈裂該晶圓80後再回復，重覆此一動作直 至所有預切線81皆被劈裂為止，而「第8-1圖」與「第 8-1圖」所示，該工作台94在不同位置預備進行劈裂的示 8 200903610 意圖，且為圖示的方便，並未將劈刀91繪上。 接著該工作台94轉動90度，以繼續執行晶圓80另 一方向的劈裂動作。在連續劈裂的過程中，該影像擷取系 統93可以處於開啟持續監測的狀態，其用於監控預切線 81是否對準該劈裂台92的裂缝921，當有所偏移時，即 可藉該工作台94重新定位。 如上所述，本發明藉由該壓制元件30壓制該晶圓80, 因而可以減少該晶圓80的翹曲度，據而可以增加連續劈 t 裂的次數，並避免因晶圓80翹曲而導致該影像擷取系統 93失焦，減少重新定位次數，故可以提高產量並提高生產 良率。 綜上所述僅為本發明的較佳實施例而已，並非用來限 定本發明之實施範圍，即凡依本發明申請專利範圍之内容 所為的等效變化與修飾，皆應為本發明之技術範疇。 【圖式簡單說明】 ， 第1圖，係習知晶圓劈裂裝置之局部結構示意圖。 第2圖，係習知待劈裂晶圓之結構示意圖。 第3圖，係本發明晶圓劈裂壓板機構之前視圖。 第4圖，係本發明晶圓劈裂壓板機構之動作示意圖。 第5圖，係本發明晶圓劈裂壓板機構之俯視圖。 第6圖，係本發明用於劈裂晶圓之安裝後前視圖。 第7圖，係本發明用於劈裂晶圓之安裝後俯視圖。 第8-1圖，係本發明劈裂晶圓之動作示意圖一。 9 200903610 第8-2圖，係本發明劈裂晶圓之動作示意圖二。 【主要元件符號說明】 習知 1 .晶圓 2 :預切線 3 :藍片 4:固定夾具 5 :工作台 6 :劈刀 7 :劈裂台 8:影像擷取系統 本發明 10 :作動機件 20 :懸臂桿 30 :壓制元件 31 :滾動元件 32 :劈裂口 70 :固定夾具 80 .晶圓 81 :預切線 82 :藍片 90 :晶圓劈裂機 91 :劈刀 200903610 92 :劈裂台 921 :裂缝 93 :影像擷取系統 94 :工作台 C £ K. 11200903610 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to wafer processing apparatus, and more particularly to wafer splitting machines for use in splitting wafers. [Prior Art] Please refer to "Figure 1" and "Figure 2". The wafer splitting machine is used to split the wafer 1 into a grain of grain for subsequent packaging operations. 1 Before the splitting, the pre-tangent line 2 of the horizontal and vertical directions is cut by laser, and then the wafer 1 is attached with a blue piece 3 to be protected, and then sent to a wafer by a fixing fixture 4. The splitting machine performs the splitting operation. The wafer splitting machine comprises a working table 5, a boring tool 6, a splitting table 7 and an image capturing system 8 which sandwiches the fixing fixture 4 and can move and rotate in a plane direction. The boring tool 6 and the cleavage table 7 are disposed on the upper and lower sides of the wafer 1 to press the wafer 1 against the cleavage table 7 and perform a splitting operation by punching of the trowel 6 The image capturing system 8 is configured to intercept an image of the wafer 1 and use the pre-cut line 2 to know the position of the wafer 1 k. The wafer 1 can be positioned by the displacement of the table 5 and the detection by the image capturing system 8, and after the positioning is completed, the up and down displacement of the file 6 can be utilized with the table 5 Quantitative displacement, continuously splitting a plurality of pre-cut lines 2, and the image capturing system 8 monitors whether the positioning of the wafer 1 is offset during the continuous cleaving process, and repositions according to the degree of the offset, and When both the transverse and longitudinal pre-cut lines 2 are cleaved, the splitting operation is completed. 5 200903610 The conventional wafer splitting machine, in the process of splitting, the wafer 1 will produce non-negligible wing curvature. When the continuous splitting is repeated many times, the surface curvature will seriously lead to the image capturing system. 8 is out of focus, and when the focus is out of focus, the wafer 1 must be manually pressed, so that the image of the wafer 1 is repositioned by the image capturing system 8 , which not only causes considerable danger but also damages the wafer, so that the output is difficult to increase. And will reduce production yield and not meet production needs. SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide a wafer splitting platen mechanism to reduce the degree of warpage of the wafer during splitting. The invention relates to a wafer splitting press plate mechanism which is mounted on a wafer splitting machine and is used for pressing a wafer, and the wafer hunting is fixed on a work of the wafer splitting machine. On the stage, comprising a motive member, a cantilever rod and a pressing member fixed to the wafer splitting machine, the cantilever rod is connected to the motive member and moved by the motive member, The pressing member is disposed at one end of the cantilever rod, and the pressing member has two states of pressing the wafer and not pressing the wafer according to the moving position of the cantilever rod. Accordingly, the present invention can suppress the warpage of the wafer by the pressing component during the process of splitting the wafer, thereby reducing the degree of warpage of the wafer, thereby reducing the number of repositionings and increasing the number of continuous splitting, thereby increasing Yield and increase production yield. [Embodiment] In order to give your members a better understanding and recognition of the features, purposes and effects of the present invention, 6 200903610, the preferred embodiment is illustrated with the following description: Please refer to "Figure 3", As shown in FIG. 4 and FIG. 5, the present invention is a wafer splitting slab mechanism including a movable member 10, a cantilever rod 20 and a pressing member 30, wherein the cantilever rod 20 and the The actuating member 10 is coupled and moved by the actuating member 10. The actuating member 10 can be a rotating member, so that the actuating member 10 can drive the cantilever lever 20r to swing up and down slightly, as shown in Fig. 4. Shown as a schematic diagram of the micro-swing of the cantilever rod 20, the pressing member 30 is disposed at one end of the cantilever rod 20, and the pressing member 30 is provided with a plurality of rolling elements 31, which can be shaft rods and bridged at both ends On the cantilever rod 20, the plurality of rolling elements 31 are sleeves and are rolled onto the pressing member 30, and the pressing member 30 can be provided with a crotch opening 32, and the plurality of rolling elements 31 are disposed on the crucible Both sides of the split 32. Please refer to FIG. 6 and FIG. 7 again. The present invention is provided on a wafer splitting machine 90. The wafer splitting machine 90 includes a file 91 and a splitting table. 92. An image capturing system 93 and a working table 94 are used to press a wafer 80. The wafer 80 is formed with a pre-tangent line 81 by laser, and is covered with a blue chip 82 for protection. The fixing jig 70 is fixed to the table 94 of the wafer splitting machine 90, wherein the table 94 can be loaded by the wafer 80, and the plurality of rolling elements 31 of the pressing member 30 move in the moving direction of the table 94. With the rolling degree of freedom, the actuator 10 is fixed on the wafer splitting machine 90, and the pressing member 30 presses the wafer 80 according to the moving position of the boom 7 200903610 when the arm 20 swings up and down. The two kinds of defects of the wafer 80 are suppressed. Further, the pressing member 30 and the splitting table 92 are arranged on both sides of the wafer 80. The splitting table 92 is used for molding the wafer 80. The splitting table 92 has a crack 921, and the crack 921 is The boring tool 91 is facing the cleavage port 32, and the image capturing system 93 captures the image of the wafer 80, and determines the position of the wafer 80 based on the pre-cut line 81 of the wafer 80. Please refer to "8-1" and "8-2" again. In the wafer 80 splitting and pressing plate mechanism of the present invention, the wafer 80 is prepared first, and the wafer 80 is first pre-cut with a laser. The pre-cut line 81 is well protected by the blue sheet 82, and then the wafer 80 is fixed to the table 94 of the wafer splitting machine 90 by a fixing jig 70, and then the table 94 is moved and the image is taken. The take-up system 93 aligns the pre-tangent 81 of the edge of the wafer 80 (the edge requires the splitting position) with the crack 921 of the splitting block 92, at which time the pressing element 30 is still in a state where the wafer 80 is not pressed. Then, the pressing member 10 is placed in the state of pressing the wafer 80, and then the boring tool 91 is moved down to split the wafer 80 and then resumed, and then the pressing member 30 is continuously placed. The state of the wafer 80 is pressed and traversed by the table 94 by a predetermined amount so that the next pre-cut line 81 (requires a splitting) is aligned with the crack 921 of the splitting table 92, and then the file 91 is moved down again. After the wafer 80 is cracked and then recovered, the action is repeated until all the pre-cut lines 81 are cleaved, and the table 94 is shown in "8-1" and "8-1". The intent of splitting 8 200903610 is prepared at different locations, and for the convenience of illustration, the file 91 is not drawn. The table 94 is then rotated 90 degrees to continue the splitting action in the other direction of the wafer 80. In the process of continuous splitting, the image capturing system 93 can be in a state of continuous monitoring, which is used to monitor whether the pre-cut line 81 is aligned with the crack 921 of the splitting table 92, and when offset, Relocate by the workbench 94. As described above, the present invention compresses the wafer 80 by the pressing member 30, thereby reducing the warpage of the wafer 80, thereby increasing the number of consecutive cracks and avoiding warping of the wafer 80. As a result, the image capturing system 93 is out of focus and reduces the number of repositionings, so that the yield can be increased and the production yield can be improved. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent changes and modifications of the content of the patent application of the present invention should be the technology of the present invention. category. [Simple description of the drawing], Fig. 1 is a schematic view showing a partial structure of a conventional wafer splitting device. Fig. 2 is a schematic view showing the structure of a wafer to be split. Figure 3 is a front elevational view of the wafer splitting platen mechanism of the present invention. Fig. 4 is a schematic view showing the operation of the wafer splitting platen mechanism of the present invention. Figure 5 is a plan view of the wafer splitting platen mechanism of the present invention. Figure 6 is a front view of the mounting of the present invention for a split wafer. Figure 7 is a top plan view of the present invention for mounting a split wafer. Figure 8-1 is a schematic view of the operation of the split wafer of the present invention. 9 200903610 Figure 8-2 is a schematic diagram 2 of the action of the split wafer of the present invention. [Main component symbol description] Convention 1. Wafer 2: Pre-cut line 3: Blue sheet 4: Fixing jig 5: Table 6: Sickle 7: Splitting table 8: Image capturing system The present invention 10: Actuating member 20: Cantilever rod 30: Pressing member 31: Rolling member 32: Splitting port 70: Fixing jig 80. Wafer 81: Pre-cut line 82: Blue sheet 90: Wafer splitting machine 91: Sickle 200903610 92: Splitting table 921 : Crack 93: Image capture system 94: Workbench C £ K. 11