TWI416610B - A method of controlling the splitting of a wafer by a wafer splitting machine - Google Patents

Description

Method for controlling wafer splitting to split a wafer

The invention relates to a wafer splitting method, in particular to a control wafer splitting machine which utilizes a specific splitting sequence to uniformly apply the impact force of the file to the wafer, thereby improving the flatness of the wafer split surface. A method of splitting a wafer.

The semiconductor process mainly involves a wafer splicing process to make it into a plurality of dies, and then placing the dies on the carrier for packaging, and using the special material properties of the semiconductor to form a specific functional electronic circuit component, wherein The pros and cons of wafer dicing operations will determine the grain quality, which in turn dominates the yield of semiconductor components. Therefore, the wafer splicing process is a very important part of the semiconductor process.

Referring to the eighth to tenth drawings, the conventional wafer splitting process is to paste a layer (40) on the bottom surface of the wafer (30) and pre-cut the number of wafers (30) in parallel. The shallow trench is cut, and the pre-cut shallow trench is a predetermined splitting position, that is, the pre-cut surface (S), and then the wafer (30) is transported to the stage in the wafer splitting machine by the conveyor belt (50). The stage (50) has a groove (51). The face (S) is placed on the groove (51) of the stage (50), and the boring tool (20) is placed against the pre-cut surface (S) of the wafer (30), and the wafer splitting machine is used. The impact device in the middle gives the file (20) an impact force, which in turn splits the wafer (30).

However, the conventional wafer is split by one end from the end of the wafer (30) to the other end. Please refer to the ninth and tenth figures to define the wafer pre-cut surface (S) on both sides. The splitting portion (32) and the unsplit portion (31) due to the splitting The width of the portion (32) is extremely short. From a microscopic point of view, when the file (30) is applied to the wafer (30) during the splitting process, the free end of the portion to be split (32) is slightly generated. The lifting phenomenon causes the wafers (30) on both sides of the pre-cut surface (S) to have different degrees of undercut, so that the impact force of the trowel (20) is not uniformly applied to the wafer (30), causing the wafer to split. The surface is deformed such as a missing corner, which reduces the grain quality which is produced by the cleaving method in the future, thereby affecting the yield of the semiconductor element.

The main object of the present invention is to provide a method for controlling the splitting of a wafer by a wafer splitting machine, thereby designing and improving the cleaving process of the conventional boring tool, because the degree of undercut of the wafer on both sides of the pre-cut surface is different. The impact of the trowel is not applied evenly to the wafer, causing a crack in the surface.

In order to achieve the above, the method for controlling the wafer splitting machine to split the wafer includes the following steps: sequentially defining the plurality of pre-cut positions on the wafer from one side to the other side as the first pre-cut surface. The second pre-cut surface...the n-th pre-cut surface; the order of defining the wafer splitting device to split the wafer is: alternately performing a spacer splitting step and a middle splitting step, in the interval splitting step The middle part splits the xth pre-cut surface of the wafer, and splits the x-1 pre-cut surface of the wafer in the middle splitting step, wherein the splitting step and the middle split in each round In the splitting step, the same x value is substituted, and x is substituted into the even positive integer of 2, 4, 6, ...

The wafer splitting machine is controlled to split the wafer by a control device in accordance with the defined cleaving sequence.

The wafer splitting sequence of the present invention can be divided into a splitting and splitting step and a middle splitting and splitting step, and the interval splitting step refers to the advancement of the file. Skipping the odd pre-cut surface and cleaving the next even pre-cut surface, thereby dividing the wafer into the splitting portion including the two pre-cut segments and the un-cracking portion, wherein the splitting step refers to The splitting portion of the wafer is split from the pre-cut position in the middle into a splitting section.

When the interval cleaving step is performed, since the width of the portion to be cleaved is twice that of the conventional cleaving portion, the lifting action of the free end of the cleaving portion is less obvious than when the blade is applied to the wafer. The wafers on both sides of the pre-cut surface are similar in degree of depression, and the impact force of the file can be applied to the wafer more evenly, thereby obtaining a flattened split surface; and when the splitting step is performed, Since the cleaving is performed by the intermediate position of the cleaved portion, the wafers on both sides of the pre-cut surface are recessed to the same extent, and the impact force of the file can be applied to the wafer evenly to obtain a good effect. The method for controlling the wafer splitting machine to split the wafer can reduce the defect of the wafer split surface due to the uneven application force without changing the order of the wafer. The situation, in turn, improves the flatness of the wafer split surface.

Referring to the first figure, a block diagram of a method for controlling a wafer splitting machine to split a wafer according to the present invention includes the following steps: first, as shown in the second and third figures, the crystal is first defined. The plurality of pre-cut positions on the circle (10) are sequentially from the one side to the other side as the first pre-cut surface ( S ₁ ), the second pre-cut surface ( S ₂ ), and the n-th pre-cut surface ( S _n ), Among them, the odd pre-cut faces are indicated by solid lines, and the even pre-cut faces are indicated by broken lines.

The order of the wafer splitting machine splitting wafer (10) is as follows: alternately performing a spacer splitting step and a middle splitting step, in the interval splitting step, the xth pre-cut surface of the wafer Performing a split, in the middle splitting step The x-1 pre-cut surface of the wafer is cleaved, wherein the same x value is substituted in each of the interval cleaving step and the middle splitting step, and x is sequentially substituted into 2, 4, 6, ... The even number of positive integers, where: see the second and third figures, according to the order defined above, the detailed order of each split is as follows:

The first split: the xth pre-cut surface of the split wafer, x is substituted by 2, that is, the second pre-cut (S ₂ ) is split.

The second split: the x-1 pre-cut surface of the split wafer, x is substituted by 2, that is, the first pre-cut surface (S ₁ ) is split.

The third split: the xth pre-cut surface of the split wafer, x is substituted by 4, that is, the fourth pre-cut (S ₄ ) is split.

The fourth split: the x-1 pre-cut surface of the split wafer, x is substituted by 4, that is, the third pre-cut (S ₃ ) is split.

The fifth split: the x-1 pre-cut surface of the split wafer, x is substituted by 6 into the sixth pre-cut surface (S ₆ ).

The sixth split: the x-1 pre-cut surface of the split wafer, x is substituted by 6 into the fifth pre-cut surface (S ₅ ).

The wafer splitting machine is controlled to split the wafer (10) by a control device in accordance with the defined cleaving sequence until all pre-cut faces are cleaved.

The above-mentioned wafer splitting sequence can be divided into a gap splitting step and a middle splitting step step, as shown in the second, fourth and fifth figures, wherein the interval splitting step refers to The file (20) advances over the odd pre-cut surface ( S _m ) and splits the next even pre-cut surface ( S _{m +1} ), thereby dividing the wafer (10) into two pre-cut segments (121) For the splitting portion (12a) and the unsplit portion (11), please refer to the third, sixth and seventh figures, wherein the splitting step refers to the wafer (10) The splitting portion (12a) is split from the odd pre-cut surface ( S _m ) in the middle into a splitting section (121a).

Please cooperate with the fourth and fifth figures. When the interval splitting step is performed, since the to-be-cleaved portion (12) includes two pre-cut segments (121), the width of the portion to be split (12) is known. Twice, the support surface provided by the stage (50) to the wafer (10) is relatively large, so that when the file (10) is applied to the wafer (10) with a contact force, the free end of the beating portion (12) (122) The lift phenomenon is not obvious, so that the wafers (10) on both sides of the pre-cut surface ( S _{m +1} ) are similar in degree of depression, and the impact force of the file (20) can be applied to the average The wafer (10), in turn, obtains a flattened split surface to improve the quality of the splitting operation; please cooperate with the sixth and seventh figures, and when performing the splitting step, the stage (50) The spacing is slightly adjusted, and the spacing is slightly smaller than the width of the fourth and fifth figures during the splitting operation, so that the force at both ends of the supporting surface is the same, since the splitting is performed by the intermediate position of the splitting portion (12a), so that the The wafers (10) on both sides of the cut surface ( S _m ) have the same degree of undercut, and the impact force of the trowel (20) can be naturally applied to the wafer (10) evenly, and the effect of the present invention is controlled. Wafer splitting machine The method of splitting the wafer can change the order of the cracking of the wafer (10) without changing the order of the wafer, thereby reducing the occurrence of defects due to uneven application of the cracked surface of the wafer, thereby enhancing the crystal. The flatness of the split surface.

(10) ‧‧‧ Wafer

(11) ‧‧‧Unsplit

(12) ‧ ‧ to be split

(12a) ‧ ‧ cleavage

(121) ‧ ‧ pre-cut

(121a) ‧‧‧ cracking section

(122)‧‧‧Free end

(20)‧‧‧劈

(30) ‧‧‧ Wafer

(31) ‧‧‧Unsplit

(32) ‧ ‧ to be split

(40) ‧ ‧ 胶 layer

(50) ‧‧‧ stage

(51) ‧‧‧ trench

(S) ‧ ‧ pre-cut

( S ₁ )‧‧‧First pre-cut

( S ₂ )‧‧‧Second precut

( S ₃ )‧‧‧ Third pre-cut

( S ₄ )‧‧‧Four pre-cut

( S _n-3 ) (n-3) ‧ ‧ pre-cut

( S _{n -2} ) (n-2) ‧ ‧ pre-cut

( S _n-1 ) (n-1) ‧ ‧ pre-cut

( S _n )‧‧‧n n pre-cut

The first figure is a block flow diagram of a method for controlling a wafer splitting machine to split a wafer according to the present invention.

Second: The method for controlling the wafer splitting machine to split the wafer according to the present invention includes an even number of pre-cut surfaces.

The third figure: the wafer splitting machine of the present invention controls the wafer splitting The method includes a schematic diagram of an odd number of pre-cut faces.

The fourth figure is a schematic diagram of the method of controlling the splitting and splitting of the wafer by the wafer splitting machine in the method of cleaving.

Figure 5: Schematic diagram of the splitting step of the fourth figure after the splitting.

Fig. 6 is a schematic view showing the splitting step before the splitting in the method for controlling the splitting of the wafer by the wafer splitting machine of the present invention.

Figure 7: Schematic diagram of the splitting step in the sixth figure after splitting.

Figure 8: Schematic diagram of the splitting sequence of the conventional wafer splitting method.

Figure IX: Schematic diagram of the conventional wafer splitting method before splitting.

Figure 10: Schematic diagram of the conventional wafer splitting method after splitting.

Claims (1)

A method for controlling a wafer splitting machine to split a wafer, comprising the steps of: sequentially defining a plurality of pre-cut locations on the wafer from one side to the other side as a first pre-cut surface and a second pre-cut surface ..., the nth pre-cut surface; the cleaving order of the wafer splitting machine is defined as: alternately performing a spacer splitting step and a middle splitting step, in the interval cleaving step, the xth portion of the wafer The pre-cut surface is cleaved, and the x-1 pre-cut surface of the wafer is cleaved in the middle splitting step, wherein the same x is substituted in the splitting step and the splitting step in each round Value, and x is substituted into an even positive integer of 2, 4, 6, ...; the wafer splitting machine is used to control the wafer splitting according to a defined splitting sequence.