TWI385745B - Wafer splitting device - Google Patents

Description

Wafer splitting and leveling device

The present invention relates to a wafer splitting and leveling device, and more particularly to a wafer splitting and leveling device for use in a wafer splitting machine for providing wafer leveling function when the wafer is split.

The manufacturing process of the semiconductor component is mainly to divide the wafer into a plurality of crystal grains by means of cutting or splitting, and then fix the crystal grains on the carrier for circuit layout, and finally form a package by encapsulating the die with the encapsulant. A semiconductor component with a specific function. In this process, the wafer dicing process mainly pre-cuts the wafer to be divided, so that the wafer surface forms a plurality of criss-cross shallow trenches and is placed on the wafer. On the stage of the machine, after the alignment is correct, the impact device disposed above the carrier is driven to impact the file, thereby giving the wafer an impact force to cause the wafer to split from the pre-cut shallow groove.

In the wafer manufacturing and processing process, unevenness of the wafer, such as micro-convex or warpage, is often caused by processing errors or slight deformation of the material, which causes the boring tool to be inaccurate during the wafer splitting process. The ground is aligned with the pre-cut line, and the verticality of the surface of the wafer contacting the wafer is lowered, thereby causing unevenness of the cracked surface of the wafer, affecting the quality of the crystal grain, and reducing the yield of the semiconductor element.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a wafer splitting and leveling device, which is designed to improve the unevenness of the split surface during splitting due to microbumping or warpage of the wafer.

In order to achieve the above, the wafer splitting and leveling device of the present invention is mounted on a movable susceptor that can be driven to move up and down in a wafer splitting machine, and is located on the side of the wafer trowel, the crystal The circular splitting leveling device comprises: a linear guide comprising a movable end movable linearly up and down with respect to the movable base; and a pressing member mounted on the movable end of the linear guide.

The invention reduces the wafer micro-convex or warpage by pressing the pressure-clamping component which can move up and down linearly with respect to the movable base by pressing the gravity of the component itself to press the wafer before the wafer is split. In this case, the file can be more precisely aligned with the pre-cut line and the contact perpendicularity of the file to the wafer is increased, thereby making the split surface of the wafer smoother.

According to a second object of the present invention, the linear guide member further includes two fixing bases, and the two fixing bases are oppositely disposed on two sides of the movable base, and the two fixing bases are respectively provided with a straight line up and down The movable guide rods are formed at the bottom end of each of the guide rods; the pressing member comprises two connecting blocks and two weighting blocks, and the two connecting blocks are disposed on two sides of the file, one of the links The block is fixed to the two movable ends of the side of the movable base, and the other connecting block is fixed to the two movable ends of the side of the movable base. The two weights are respectively locked to the bottom end of the two connecting blocks. .

By setting two connecting blocks and two weighting blocks on both sides of the file, and simultaneously pressing against both sides of the wafer splitting position, the wafer is prevented from being lifted at one end; and by being separable from the connecting block The weight is such that the force against the wafer can be adjusted by adjusting the weight of the weight, and the weight can be flexibly replaced as needed to achieve the most appropriate leveling effect.

Another object of the present invention is to cause the wafer splitting and leveling device to further include a second light group, the two light groups are located outside the two connecting blocks, and each of the light groups includes a lamp holder, and one of the lamp groups The socket is disposed on the movable base, and the lamp holder of the other lamp group is fixed on the connecting block away from the side of the movable base. The bottom ends of the two lamp holders are respectively provided with a plurality of light-emitting diodes arranged in a line, and the bottom ends of the lamp holders are illuminated. A light guide plate is disposed outside the diode, and the bottom ends of the two light guide plates each form a chamfered surface facing the connecting block.

By the illumination of the two groups of lights, the operator can conveniently check and grasp the condition of the platform during the cleaving and leveling process, and the chamfered surface at the bottom end of the light guide plate can refract the light to enhance the effect of the concentrated illumination. .

Referring to FIG. 1 to FIG. 4 , a preferred embodiment of the wafer splitting and leveling device of the present invention is mounted on a wafer splitting machine, and the wafer splitting machine comprises a power driven device. The movable base (10) moving up and down, and a file (5) disposed on the bottom side of the movable base (10), the wafer splitting and leveling device of the present invention is mounted on the movable base ( 10) above and located on the side of the file (5), the wafer splitting and leveling device comprises a linear guide (2) and a pressing assembly (3), or further comprising a second light group ( 4).

The linear guide (2) may include two fixing seats (21), the two fixing seats (21) are oppositely disposed on the left and right sides of the movable base (10) near the bottom end, and the two fixing seats (21) Each of the front and rear sides is provided with a through hole (23) penetrating vertically and vertically, and each of the through holes (23) is respectively provided with a guiding rod (22) which can move up and down linearly, and the four guiding rods (22) form a near bottom end. The movable end portion (221), the top side of each guide rod (22) may further form a flange (222), and the outer diameter of each flange (222) is larger than the aperture of the through hole (23), thereby limiting the guide rod (22) ) The decline of the trip.

The pressing component (3) may comprise two connecting blocks (31) and two weighting blocks (32). Please cooperate with the fourth figure, the two connecting blocks (31) are arranged on both sides of the file (5). One of the connecting blocks (31) is fixed to the two movable ends (221) on the side of the movable base (10), and the other connecting block (31) is fixed to the two movable ends away from the side of the movable base (10). In the portion (221), the two weights (32) may be members made of a transparent material, and are respectively locked to the bottom ends of the two connecting blocks (31).

The two light groups (4) are located outside the two connecting blocks (31), and each of the light groups (4) comprises a lamp holder (40), and the lamp holder (40) of one of the lamp groups (4) is disposed on the movable base (10) The lamp holder (40) of the other lamp group (4) is fixed to the connecting block (31) away from the side of the movable base (10), and the bottom ends of the two lamp holders (40) are arranged in a straight line. a plurality of light-emitting diodes (41), a light-guiding light guide plate (42) is disposed outside the bottom light-emitting diode (41) of each of the lamp holders (40), and the bottom ends of the two light-source light guide plates (42) respectively form a connecting block The chamfered surface of the direction (421).

When the wafer splitting and leveling device of the present invention is actuated, please refer to the fifth figure, and the movable base (10) is driven downward by a power source such as a motor, a pneumatic cylinder, etc., and is driven to be fixed. The two fixing bases (21) of the movable base (10), the guide rods (22) are moved downward by the flanges (222) on the top side thereof, and are moved downwards to make the links The pressing member (3) of each guiding rod (22) is moved downward, and the movable base (10), the two fixing bases (21), the four guiding rods (22) and the pressing assembly (3) are moved together. Move down; please refer to the sixth and seventh figures, when the movable base (10) is moved down to the pressing assembly (3) against the wafer (6), by being movable relative to the movable base ( 10) And the four guide rods (22) of the fixed seat (21) moving linearly up and down, the pressing assembly (3) stops moving, and the wafer (6) is pressed by the weight of the pressing assembly (3) itself.

The invention can be vertically moved up and down with respect to the movable base (10) Pressing the component (3), flattening the wafer (6) slightly convex or warped, so that the file (5) can be more accurately aligned with the pre-cut line, and the boring tool (5) and the wafer (6) The perpendicularity of the contact surface, so that the split surface of the wafer (6) can be more flat and accurate; secondly, by placing the weight (32) which can be separated from the joint block (31), the wafer is pressed against the wafer ( 6) The force can be adjusted by adjusting the weight of the weight (32) to achieve the most appropriate leveling effect; in addition, the setting of the two light groups (4) facilitates the operator to check the splitting and During the leveling process, the beveled surface (421) at the bottom end of the light guide plate (42) concentrates the light to the cracked position of the wafer to enhance the effect of the concentrated illumination.

(10) ‧‧‧ activity base

(2) ‧‧‧linear guides

(21)‧‧‧ Fixed seat

(22) ‧ ‧ guides

(221) ‧‧‧ activities end

(222) ‧‧‧Flange

(23)‧‧‧through holes

(3) ‧ ‧ PRESSURE ASSEMBLY

(31)‧‧‧Connecting blocks

(32)‧‧‧weights

(4) ‧‧‧Lights

(40)‧‧‧ lamp holder

(41)‧‧‧Lighting diodes

(42)‧‧‧Light source light guide

(421)‧‧‧ Oblique cut surface

(5)‧‧‧劈

(6) ‧‧‧ Wafer

The first figure is an exploded perspective view of a wafer splitting machine according to a preferred embodiment of the wafer splitting and leveling device of the present invention.

Second: A perspective view of a preferred embodiment of the wafer splitting and leveling device of the present invention mounted on a wafer splitting machine.

Third: A cross-sectional view of a wafer splitting machine mounted on a wafer splitting apparatus in accordance with a preferred embodiment of the wafer splitting and leveling apparatus of the present invention.

The fourth figure is a schematic diagram of the combination of the lamp set and the connecting block of the preferred embodiment of the wafer splitting and leveling device of the present invention.

Fig. 5 is a schematic view showing a state in which the wafer is not pressed against the wafer in the preferred embodiment of the wafer splitting and leveling device of the present invention.

Figure 6 is a schematic view showing the state of pressing the wafer against the preferred embodiment of the wafer splitting and leveling device of the present invention.

Figure 7 is a side view of the preferred embodiment of the sixth diagram.

(10) ‧‧‧ activity base

(2) ‧‧‧linear guides

(21)‧‧‧ Fixed seat

(22) ‧ ‧ guides

(221) ‧‧‧ activities end

(222) ‧‧‧Flange

(23)‧‧‧through holes

(3) ‧ ‧ PRESSURE ASSEMBLY

(31)‧‧‧Connecting blocks

(32)‧‧‧weights

(4) ‧‧‧Lights

(40)‧‧‧ lamp holder

(41)‧‧‧Lighting diodes

(42)‧‧‧Light source light guide

(5)‧‧‧劈

Claims (4)

A wafer splitting and leveling device for mounting on a movable susceptor that can be driven to move up and down in a wafer splitting machine, and on the side of the wafer boring tool, the wafer splitting and leveling device The utility model comprises: a linear guide comprising two fixing seats, the two fixing seats are oppositely disposed on two sides of the bottom end of the movable base, and the two fixing seats are respectively provided with two guiding rods which are linearly movable relative to the upper and lower sides thereof a movable end portion is formed at a near bottom end of each of the guide rods; and a pressing member includes two connecting blocks and two weighting blocks, the two connecting blocks are disposed on two sides of the file, and one connecting block is fixed on the connecting block Two movable ends on the side of the movable base are fixed, and the other connecting block is fixed on the two movable ends away from the side of the movable base. The two weights are respectively fixed to the bottom ends of one side of the two connecting blocks. The wafer splitting and leveling device according to the first aspect of the invention, wherein the two fixing seats each form a two-way hole penetrating from the top end thereof, wherein the four guiding rods are respectively disposed in the through holes, and The top sides of the four guiding rods each form a flange, and the outer diameter of each flange is larger than the diameter of the corresponding through hole. The wafer splitting and leveling device according to claim 1 or 2, wherein the wafer splitting and leveling device further comprises a second light group, the two light groups are located outside the two connecting blocks, each of the lamps The set includes a lamp holder, the lamp holder of one of the lamp sets is disposed on the movable base, and the lamp holder of the other lamp set is fixed on the connection block away from the side of the movable base, and the bottom ends of the two lamp holders are respectively provided with straight lines Arranged complex LEDs. The wafer splitting and leveling device according to claim 3, wherein a light guide plate is disposed outside the bottom of the light-emitting diode of each of the lamp holders, and the bottom ends of the two light guide plates are formed toward a connecting block. Oblique cut surface The weight of the pressing member is a transparent member.