CN103192460A

CN103192460A - Cutting device and method

Info

Publication number: CN103192460A
Application number: CN2012100188191A
Authority: CN
Inventors: 郑瑞槐; 吴朝晴
Original assignee: Wecon Automation Co ltd
Current assignee: JIUYUAN ELECTRONIC CO Ltd
Priority date: 2012-01-05
Filing date: 2012-01-20
Publication date: 2013-07-10
Anticipated expiration: 2032-01-20
Also published as: CN103192460B; TWI455200B; JP2013140921A; TW201330075A

Abstract

The present invention provides a cutting device and method for semiconductor elements, which are used to split and separate a semiconductor element. The cutting device includes a supporting mechanism and a hob mechanism. The supporting mechanism includes a first supporting member and a first supporting member. A second supporting member of the supporting member. The first supporting member and the second supporting member are used to support semiconductor components. The hob mechanism includes a roller that can roll and split along a cutting part of the semiconductor component. a knife member, and the hob member has a sharp edge splitting portion, wherein the hob member is driven by the hob mechanism to translate the axis of the hob member along a cutting direction of the semiconductor element, and makes the hob member The sharp edge splitting part performs rolling splitting on the cutting part.

Description

Cutter sweep and method

Technical field

The present invention relates to a kind of semiconductor element splitting design of separation facility, relate in particular to a kind of cutter sweep and method that promotes wafer cutting yield.

Background technology

Along with the progress in epoch, for the product consumption of IC and the lifting day by day of quality, promoted the flourish of electronic industry.And the continuous development evolution of electronic manufacturing technology, under the requirement of integrated circuit (IC) wafer " light, thin, short, little, high function ", also make the structure packing technique of electronic industry constantly weed out the old and bring forth the new, wherein wafer cutting and separating technology is along with difference and the thinning of material, for obtaining high yield and keep due productivity effect, thus the control ability of cutting splitting mechanism real be one of successful key factor of quality.

Again, light emitting diode (LED) upstream is earlier from the substrate of single-chip as growth usefulness, and the various building crystal to grow method of recycling is made wafer of heap of stone, and gives middle reaches these wafers of heap of stone and make electrode, wafer is built in cutting after carrying out the platform etching, will build wafer at last again and break down into single crystal grain.

The cutting splitting of crystal grain is semiconductor or the very important processing procedure of photoelectricity industry always, after crystal grain is gone through complicated processing procedure, if can't keep high yield or because of the original characteristic of die separation method affect crystal grain in the stage of die separation, or the speed of cutting causes cost too high excessively slowly, can cause quite the production of whole crystal grain to seriously influence.

In transparency carrier crystal grain cutting processing procedure, carry out splitting after generally can utilizing laser or diamond cutter cutting cut, to separate crystal grain.The right splitting processing mode that uses at present often becomes big because of, the possibility that causes cutting back splitting yield significantly to decay because of the device substrate size.

The splitting device of knowing at present, be to treat that the splitting wafer is positioned over the precalculated position of high speed wafer splitting device below, make the rotation of servo motor driven screw rod again, and then driving chopper seat descends, and when dropping to desired height position, make splitting actuator broadsword v.broadsword impose active force, make the precalculated position of chopper impact wafer and split disconnected, after the wafer splitting, by the reverse rotation of servo motor driven screw rod, rise to drive the chopper seat, afterwards again, make the wafer lateral displacement, the splitting operation of another splitting position of wafer of continuing again.Along with science and technology and development of technology, crystallite dimension is done littler and littler, and wafer is done bigger and bigger, wafer from 2 o'clock, 4 o'clock more and then rise at 6 o'clock, the splitting degree of difficulty also becomes with wafer size and increases greatly, yield is decline thereupon also.

Summary of the invention

The technical problem that institute of the present invention desire solves

Though aforementioned wafer splitting machine can reach the purpose of carrying out wafer splitting operation, but, the wafer splitting device of aforementioned wafer splitting machine is to utilize the servo motor driven screw rod to drive chopper seat " lifting " and drive splitting actuator broadsword v.broadsword to impose an active force, when implementing, the execution speed of its wafer splitting is slow, so that the not good shortcoming of operating efficiency is arranged.In addition, utilize this kind cutting mode be easily produce at the cut surface of wafer that fracture is discontinuous, burr or peel off problem such as situation, especially when the blade passivation of splitting cutter, might cause the cut surface of wafer to produce to break and damage, cause damage.

Edge this, purpose of the present invention namely provides a kind of cutter sweep and method, in order to improve the shortcoming that existing wafer splitting operation has.

The technological means that the present invention deals with problems

The present invention is to be a kind of cutter sweep for the technological means that the solution prior art problems adopts, and in order to cut semiconductor element, it includes a bearing mechanism and a hobboing cutter mechanism.Bearing mechanism includes one first bearing member and second a bearing member with respect to the first bearing member, and the first bearing member and the second bearing member are in order to the bearing semiconductor element.Hobboing cutter mechanism includes a hobboing cutter member that can cut along a cutting position of semiconductor element, and the hobboing cutter member has a sharp edge splitting portion, wherein hobboing cutter mechanism and/or bearing mechanism are through driving and relative displacement, so that the sharp edge splitting portion of hobboing cutter member carries out the roll extrusion splitting to a cutting position of semiconductor element.

In one embodiment of this invention, hobboing cutter mechanism also includes the drive member of a connection hobboing cutter member, and the hobboing cutter member drives the axle center of hobboing cutter member and is cut the direction translation along one of semiconductor element via drive member.

In one embodiment of this invention, bearing mechanism also includes the drive member of connection first a bearing member and the second bearing member, and the first bearing member and the second bearing member drive via drive member and make one of semiconductor element be cut direction along the axle center translation of hobboing cutter member.

In one embodiment of this invention, include also that a hobboing cutter member along with hobboing cutter mechanism moves and the image of displacement is inspected mechanism, it is to move along with a translation direction of hobboing cutter member that the image that image is inspected mechanism is inspected direction, and it is cutting part corresponding to semiconductor element that the image that image is inspected mechanism is inspected, with the image state of cutting part after bearing the roll extrusion splitting of inspecting semiconductor element.

In one embodiment of this invention, bearing mechanism is a bearing board, and is to have an interstice coverage corresponding to the cutting part of semiconductor element between the first bearing member and the second bearing member.

Moreover, the present invention is to be a kind of cutting method for the technological means that the solution prior art problems adopts, be in order to cutting semiconductor element, this cutting method includes and earlier the semiconductor element bearing is fixed on the second bearing member of one first bearing member and with respect to the first bearing member of a bearing mechanism; Then, a hobboing cutter member of a hobboing cutter mechanism is corresponded to a cutting position of semiconductor element; Then, hobboing cutter mechanism and/or bearing mechanism are through driving and relative displacement, so that a sharp edge splitting portion of hobboing cutter member carries out the roll extrusion splitting to a cutting position of semiconductor element.

The present invention contrasts the effect of prior art

Via the technology used in the present invention means, the hobboing cutter member of hobboing cutter mechanism is to adopt via the contact wafer to move and with the mode splitting semiconductor crystal wafer of hobboing cutter mechanism with respect to the semiconductor crystal wafer in the bearing mechanism, wherein the roll extrusion splitting mode that produces on semiconductor crystal wafer of hobboing cutter member of the present invention is to belong to the splitting of some contact, to not change the stressed influence to some extent of wafer splitting because of the wafer size size, and the mode of roll extrusion splitting of the present invention is compared tradition splitting cutting from top to bottom more can reduce the skew that causes because of the splitting action, reduce because cutting sth. askew and collapsing the smile phenomenon that the angle produces, and then promote yield on this processing procedure, again, hobboing cutter member of the present invention in the cutting operation of each time because moving the splitting degree of depth that can effectively control on semiconductor crystal wafer with parallel direction and stressed it being kept evenly, do not have the discontinuous and cut surface of fracture and produce burr or situation such as peel off, so can effectively promote the precision that is cut and the stability of semiconductor crystal wafer.

In addition, image of the present invention is inspected mechanism and can be moved and displacement along with the hobboing cutter member of hobboing cutter mechanism, and inspected the image state of cutting part after bearing the roll extrusion splitting of semiconductor element by interstice coverage, judging whether successful splitting and have flaw of cutting part, and then improve its yield rate on production capacity.

Specific embodiment of the present invention will be further described by following embodiment and appended accompanying drawing.

Description of drawings

Fig. 1 is the element schematic diagram of cutter sweep of the present invention.

Fig. 2 is the element schematic diagram at another visual angle of cutter sweep of the present invention.

The schematic diagram of the semiconductor element that Fig. 3 cuts for the present invention.

Fig. 4 is the flow chart of cutting method of the present invention.

Fig. 5 is the element schematic diagram of another embodiment of cutter sweep of the present invention.

Fig. 6 is the flow chart of another embodiment of cutting method of the present invention.

The main element symbol description

100,100a cutter sweep

1,1a bearing mechanism

11, the 11a first bearing member

12, the 12a second bearing member

The 13a drive member

2,2a hobboing cutter mechanism

21,21a hobboing cutter member

211,211a point edge splitting portion

22 drive member

3 images are inspected mechanism

31 image acquisition lens

The C semiconductor element

The C1 cutting part

The D1 image is inspected direction

The D2 translation direction

D3 is cut direction

The G interstice coverage

The R1 direction of rotation

The specific embodiment

Consult Fig. 1 to shown in Figure 3, Fig. 1 is the element schematic diagram that shows cutter sweep of the present invention, and Fig. 2 is the element schematic diagram that shows another visual angle of cutter sweep of the present invention, and Fig. 3 is the schematic diagram of the semiconductor element that shows that the present invention cuts.

Cutter sweep 100 of the present invention is in order to the wafer splitting is separated into default shape in the back-end process of semiconductor crystal wafer, and wherein cutter sweep 100 includes a bearing mechanism 1, a hobboing cutter mechanism 2 and an image and inspects mechanism 3.As shown in the figure, bearing mechanism 1 is a bearing board, comprising one first bearing member 11 and second a bearing member 12 with respect to the first bearing member 11 are arranged, the first bearing member 11 and the second bearing member 12 are to fix semiconductor element C in order to bearing, and between the first bearing member 11 and the second bearing member 12 be have one corresponding to semiconductor element C one the cutting position C1 interstice coverage G, in the present embodiment, semiconductor element C is a blue-ray LED wafer, meaning i.e. a blue-ray LED photoelectric cell, those of ordinary skill in any this field can learn that all it simply comprises a P type layer, one N-type layer and be coated with a fractal film, and have the delineation trace of diamond cutter or laser on the opposed surface of its relative fractal film.

Hobboing cutter mechanism 2 includes the drive member 22 that a hobboing cutter member 21 and drives 21 translations of hobboing cutter member, hobboing cutter member 21 has just like the sharp edge splitting portion 211 shown in the figure, its function is can carry out the roll extrusion splitting along the cutting position C1 of semiconductor element C when operation, and the drive member 22 that connects hobboing cutter member 21 is in order to drive 21 translations of hobboing cutter member, in the present embodiment, the sharp edge splitting portion 211 of hobboing cutter member 21 is not limited with shape shown in Figure 1, the shape of its sharp edge splitting portion 211 also can be required and different according to actual processing procedure, at this, only show with a most preferred embodiment.

Image is inspected mechanism 3 and is included an image acquisition lens 31, its following side space that is arranged on the interstice coverage G between the first bearing member 11 and the second bearing member 12 as shown in the figure, in the present invention, be to make image inspect mechanism 3 by the annexation of mechanism configuration and image acquisition lens 31 can move and displacement along with the hobboing cutter member 21 of hobboing cutter mechanism 2, the image that image is inspected the image acquisition lens 31 of mechanism 3 is inspected direction D1 and is moved along with a translation direction D2 of hobboing cutter member 21, and it is cutting part C1 corresponding to semiconductor element C that its image is inspected, with the image state of cutting part C1 after bearing the roll extrusion splitting of inspecting semiconductor element C.

In the present invention, the semiconductor element C (blue-ray LED wafer) that will be provided with a plurality of delineation lines in FEOL arranges and is fixed in the bearing mechanism 1, wherein being covered with that face of fractal film is that bearing is on the first bearing member 11 and the second bearing member 12, and cutting part C1 is corresponding interstice coverage G between the first bearing member 11 and the second bearing member 12, hobboing cutter member 21 (for example moves with the constant speed translation via the driving of the drive member 22 of hobboing cutter mechanism 2, each second 250mm), and the axle center of hobboing cutter member 21 is to be cut direction D3 and translation and keeping same direction and moving along one of semiconductor element C, and the sharp edge splitting portion 211 of hobboing cutter member 21 will produce the constant speed rotation and carry out the roll extrusion splitting because of contact wafer cutting part C1.In addition, the present invention adopts the mode splitting semiconductor element C of contact wafer constant speed revolving-rolling splitting, hobboing cutter member 21 performed roll extrusion splitting mode on semiconductor element C belongs to a contact splitting, with not because of the change of wafer size size to the stressed influence to some extent of wafer splitting, and the mode of single-pathway rotation cutting of the present invention is compared tradition splitting cutting from top to bottom can also reduce the skew that causes because of the splitting action, reduce because cutting sth. askew and collapsing the smile phenomenon that the angle produces, and then promote yield on this processing procedure, again, hobboing cutter member 21 in the cutting operation of each time because moving the splitting degree of depth that can effectively control on semiconductor element C with parallel direction and stressed it being kept evenly, do not have the discontinuous and cut surface of fracture and produce burr or situation such as peel off, so effectively promote the precision that is cut and the stability of semiconductor element C.

In addition, mechanism 3 inspected by image and image acquisition lens 31 can move and displacement along with the hobboing cutter member 21 of hobboing cutter mechanism 2, and inspected the image state of cutting part C1 after bearing the roll extrusion splitting of semiconductor element C by interstice coverage G, judging whether successful splitting or have flaw of cutting part C1, and then improve its yield rate on production capacity.

Consult shown in Figure 4ly, it is the flow chart that shows cutting method of the present invention.Cutting method of the present invention includes the first bearing member 11 that earlier semiconductor element C (semiconductor crystal wafer) bearing is fixed on bearing mechanism 1 and reaches with respect on the second bearing member 12 of the first bearing member 11 (step S1); Then, the hobboing cutter member 21 of hobboing cutter mechanism 2 is corresponded to the cutting part C1 (step S2) of semiconductor element C; Then, the axle center that the drive member of hobboing cutter mechanism 2 22 drives hobboing cutter members 21 be along semiconductor element C be cut direction D3 and translation, and sharp edge splitting 211 couples of cutting part C1 of portion of hobboing cutter member 21 carry out roll extrusion splitting (step S3).And image is inspected the image of the image acquisition lens 31 of mechanism 3 and is inspected direction D1 and move along with the translation direction D2 of hobboing cutter member 21, and it is cutting part C1 corresponding to semiconductor element C that its image is inspected, with the image state of cutting part C1 after bearing roll extrusion of inspecting semiconductor element C.

Consult Fig. 5, it is the element schematic diagram that shows another embodiment of cutter sweep of the present invention.The element of the cutter sweep 100a of this embodiment is similar to the above embodiments, so components identical is to indicate with the components identical numbering, as a means of correspondence.Its difference is that cutter sweep 100a includes a 1a of bearing mechanism, a 2a of hobboing cutter mechanism equally and an image is inspected mechanism 3.As shown in the figure, the 1a of bearing mechanism is the bearing board that can move through driving for, it is to include one first bearing member 11a, second a bearing member 12a with respect to the first bearing member 11a, and one drive the drive member 13a that the first bearing member 11a and the second bearing member 12a move, the first bearing member 11a and the second bearing member 12a can fix semiconductor element C in order to bearing equally, and between the first bearing member 11a and the second bearing member 12a be have one corresponding to semiconductor element C one the cutting position C1 interstice coverage G.

The 2a of hobboing cutter mechanism includes a hobboing cutter member 21a, hobboing cutter member 21a has just like the sharp edge splitting 211a of portion shown in the figure, the 2a of hobboing cutter mechanism arranges to be fixed on the relatively-movable bearing 1a of mechanism top, and the function of hobboing cutter member 21a is to carry out splitting along the cutting position C1 of semiconductor element C equally.In the present embodiment, the sharp edge splitting 211a of portion of hobboing cutter member 21a is not limited with shape shown in Figure 5, and the shape of its sharp edge splitting 211a of portion also can be required and different according to actual processing procedure, at this, only shows with a most preferred embodiment.

In the present embodiment, the first bearing member 11a and the second bearing member 12a move with the constant speed translation via the driving of drive member 13a, and the cutting position C1 of semiconductor element C is along the axle center of hobboing cutter member 21a and translation and keeping same direction and moving, and the sharp edge splitting 211a of portion of hobboing cutter member 21a will carry out splitting because of contact wafer cutting part C1, because its splitting principle and start are almost similar with above-described embodiment, so do not add to give unnecessary details at this.

Consult shown in Figure 6ly, it is the flow chart that shows another embodiment of cutting method of the present invention.The cutting method of present embodiment includes the first bearing member 11a that earlier semiconductor element C (semiconductor crystal wafer) bearing is fixed on the 1a of bearing mechanism and goes up (step S1 ') with respect to the second bearing member 12a of the first bearing member 11a; Then, the hobboing cutter member 21a of the 2a of hobboing cutter mechanism is corresponded to the cutting part C1 (step S2 ') of semiconductor element C; Then, the drive member 13a of the 1a of bearing mechanism drives the first bearing member 11a and the second bearing member 12a moves, and make semiconductor element C be cut direction D3 along the axle center translation of hobboing cutter member 21a, the cutting part C1 of the sharp edge splitting 211a of portion of hobboing cutter member 21a carries out roll extrusion splitting (step S3 ').

By above embodiment as can be known, the value on the true tool industry of cutter sweep provided by the present invention and method was so the present invention had accorded with the important document of patent already.Only above narration only is preferred embodiment explanation of the present invention, and all those skilled in the art are when doing other all improvement according to above-mentioned explanation, and only these change in the claim that still belongs to invention spirit of the present invention and define.

Claims

1. A cutting device for cutting a semiconductor element, the cutting device comprising:

A receiving mechanism, including a first receiving member and a second receiving member opposite to the first receiving member, the first receiving member and the second receiving member are used for receiving the semiconductor element;

A hob mechanism comprising a hob member capable of cutting along a cutting portion of the semiconductor element, and the hob member has a sharp edge splitting portion,

Wherein the hob mechanism and/or the supporting mechanism are driven to be relatively displaced, so that the sharp edge splitting portion of the hob member performs rolling splitting on a cut portion of the semiconductor element.

2. The cutting device according to claim 1, wherein the hob mechanism further comprises a drive member connected to the hob member, and the hob member drives the axis of the hob member along the semiconductor via the drive member. A cut direction translation of the component.

3. The cutting device according to claim 1, wherein the receiving mechanism further comprises a driving member connecting the first receiving member and the second receiving member, the first receiving member and the second receiving member The component is driven by the driving component to make a cutting direction of the semiconductor element translate along the axis of the hob component.

4. The cutting device according to claim 1, further comprising an image inspection mechanism that is displaced along with the movement of the hob member of the hob mechanism, an image inspection direction of the image inspection mechanism follows a direction of the hob member It moves in the translation direction, and an image inspection of the image inspecting mechanism is corresponding to the cutting part of the semiconductor element, so as to inspect an image state of the cutting part of the semiconductor element after undergoing rolling splitting.

5. The cutting device according to claim 1, wherein the holding mechanism is a holding machine table, and there is a cutting position corresponding to the semiconductor element between the first holding member and the second holding member void area.

6. A cutting method for cutting a semiconductor element, the cutting method comprises the following steps:

(a) placing and fixing the semiconductor element on a first receiving member of a receiving mechanism and a second receiving member corresponding to the first receiving member;

(b) corresponding a hob member of a hob mechanism to a cutting site of the semiconductor element;

(c) The hob mechanism and/or the supporting mechanism are driven to be displaced relative to each other, so that a sharp edge splitting portion of the hob member performs rolling splitting on a cut portion of the semiconductor element.

7. The cutting method according to claim 6, wherein in step (b), the hob mechanism further comprises a drive member connected to the hob member, and the hob member drives the hob member via the drive member The axis is translated along a cutting direction of the semiconductor element.

8. The cutting method according to claim 6, wherein in step (c), it also includes an image inspection mechanism that is displaced along with the movement of the hob member of the hob mechanism, and an image inspection direction of the image inspection mechanism is Moving along with a translation direction of the hob member, and an image inspection of the image inspection mechanism corresponds to the cutting part of the semiconductor element, so as to inspect an image state of the cutting part of the semiconductor element after undergoing rolling splitting .

9. The cutting method according to claim 6, wherein in step (a), the bearing mechanism is a bearing machine table, and there is a correspondence between the first bearing member and the second bearing member In the void area of the cutting part of the semiconductor element.

10. The cutting method according to claim 6, wherein in step (b), the bearing mechanism further comprises a driving member connecting the first bearing member and the second bearing member, the first bearing The component and the second receiving component are driven by the driving component to make a cutting direction of the semiconductor element translate along the axis of the hob component.