CN103192460B - Cutting device and method - Google Patents
Cutting device and method Download PDFInfo
- Publication number
- CN103192460B CN103192460B CN201210018819.1A CN201210018819A CN103192460B CN 103192460 B CN103192460 B CN 103192460B CN 201210018819 A CN201210018819 A CN 201210018819A CN 103192460 B CN103192460 B CN 103192460B
- Authority
- CN
- China
- Prior art keywords
- bearing
- component
- semiconductor element
- hobboing cutter
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims abstract description 89
- 239000004065 semiconductor Substances 0.000 claims abstract description 79
- 238000013519 translation Methods 0.000 claims description 23
- 238000001125 extrusion Methods 0.000 claims description 20
- 238000006073 displacement reaction Methods 0.000 claims description 12
- 238000005096 rolling process Methods 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 43
- 239000013078 crystal Substances 0.000 description 14
- 238000012545 processing Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 241001025261 Neoraja caerulea Species 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Abstract
The invention provides a cutting device and a method for splitting and separating a semiconductor element, the cutting device comprises a bearing mechanism and a hobbing cutter mechanism, the bearing mechanism comprises a first bearing member and a second bearing member relative to the first bearing member, the first bearing member and the second bearing member are used for bearing the semiconductor element, the hobbing cutter mechanism comprises a hobbing cutter member capable of performing rolling splitting along a cutting part of the semiconductor element, and the hobbing cutter member is provided with a sharp edge splitting part, wherein the hobbing cutter member is driven by the hobbing cutter mechanism to enable the axis of the hobbing cutter member to translate along a direction to be cut of the semiconductor element, and the sharp edge splitting part of the hobbing cutter member performs rolling splitting on the cutting part.
Description
Technical field
The present invention relates to a kind of design of semiconductor element splitting separator, particularly relate to a kind of cutter sweep and the method that promote wafer cutting yield.
Background technology
Along with the progress in epoch, for the product consumption of IC and the lifting day by day of quality, promote the flourish of electronic industry.And the development evolution of electronic manufacturing technology, under the requirement of integrated circuit (IC) wafer " light, thin, short, little, high function ", also the structure packing technique of electronic industry is made constantly to weed out the old and bring forth the new, wherein wafer cutting and separating technology is along with the difference of material and thinning, for obtaining high yield and maintaining due productivity effect, thus the control ability of cutting splitting mechanism is real is one of key successful factors of quality.
Again, light emitting diode (LED) upstream is first from the substrate of single-chip as growth, recycles various building crystal to grow methods and makes wafer of heap of stone, and gives middle reaches these wafers of heap of stone and make electrode, after carrying out platform etching, wafer is built in cutting, finally again wafer of heap of stone is broken down into single crystal grain.
The cutting splitting of crystal grain is semiconductor or the very important processing procedure of photoelectricity industry always, after complicated processing procedure gone through by crystal grain, if high yield cannot be maintained in the stage of die separation or affects the original characteristic of crystal grain because of die separation method, or the speed of cutting causes high cost excessively slowly, can cause quite serious impact to the production of whole crystal grain.
In transparency carrier crystal grain cutting processing procedure, after generally utilizing laser or diamond cutter cutting cut, carry out splitting, to be separated crystal grain.The splitting processing mode so at present used is often because device substrate size becomes large because of, the possibility that after causing cutting, splitting yield is significantly decayed.
The splitting device known at present, it is precalculated position wafer to be cleaved is positioned over below high speed wafer splitting device, servo motor driven screw rod is made to rotate again, and then drive chopper seat to decline, and in time dropping to desired height position, splitting actuator broadsword v.broadsword is made to impose active force, chopper is made to impact the precalculated position of wafer and be split disconnected, after wafer splitting, reversely rotate by servo motor driven screw rod again, to drive chopper seat to rise, afterwards, make wafer lateral displacement, then the cleavage operations of another split-position of subsequent wafer.Along with science and technology and the progress of technology, crystallite dimension is done less and less, and wafer does more large, and from 2 inch, 4 inch more and then rise to 6 inch, splitting degree of difficulty also becomes with wafer size and increases greatly wafer, and yield also declines thereupon.
Summary of the invention
The present invention for solve technical problem
Though aforementioned wafer splitting machine can reach the object performing wafer splitting operation, but, the wafer splitting device of aforementioned wafer splitting machine utilizes servo motor driven screw rod to drive chopper seat " lifting " and drives splitting actuator broadsword v.broadsword to impose an active force, when implementing, the execution speed of its wafer splitting is slow, so that the shortcoming having operating efficiency not good.In addition, utilize this kind of cutting mode be easily produce that fracture is discontinuous at the cut surface of wafer, the problem such as burr or peeling conditions, especially, when the blade passivation of splitting cutter, produce likely causing the cut surface of wafer and break and damage, cause damage.
Edge this, namely object of the present invention is to provide a kind of cutter sweep and method, in order to improve the shortcoming that existing wafer splitting operation has.
The technological means that the present invention deals with problems
The technological means that the present invention adopts for the problem solving prior art is a kind of cutter sweep, and in order to cut semiconductor element, it includes a bearing mechanism, a hob cutter mechanism and an image and inspects mechanism.Bearing mechanism includes one first bearing component and relative to the second bearing component of the first bearing component, and the first bearing component and the second bearing component are in order to bearing semiconductor element.Hob cutter mechanism includes one can carry out along a cutting part of semiconductor element the hobboing cutter component that cuts, and hobboing cutter component has a sharp edge splitting portion, wherein hob cutter mechanism and/or bearing mechanism are relative displacement through driving, carry out roll extrusion splitting to make the cutting part of sharp edge splitting portion to semiconductor element of hobboing cutter component.Mechanism inspected by image, along with the hobboing cutter component of this hob cutter mechanism moves and displacement, the image that mechanism inspected by this image is inspected direction and is moved along with a translation direction of this hobboing cutter component, it is the cutting part corresponding to this semiconductor element that the image that mechanism inspected by this image is inspected, to inspect the image state of cutting part after bearing roll extrusion splitting of this semiconductor element.
In one embodiment of this invention, hob cutter mechanism also includes the drive member of a connection hobboing cutter component, and hobboing cutter component drives the axle center of hobboing cutter component via drive member and is cut direction translation along one of semiconductor element.
In one embodiment of this invention, bearing mechanism also includes the drive member of a connection first bearing component and the second bearing component, and the first bearing component and the second bearing component drive via drive member and make one of semiconductor element cut direction along the axle center translation of hobboing cutter component.
In one embodiment of this invention, bearing mechanism is a bearing board, and be have the interstice coverage that corresponds to the cutting part of semiconductor element between the first bearing component and the second bearing component.
Moreover, the technological means that the present invention adopts for the problem solving prior art is a kind of cutting method, cut semiconductor element, this cutting method include first semiconductor element bearing is fixed on a bearing mechanism one first bearing component and one relative on the second bearing component of the first bearing component; Then, a hobboing cutter component of a hob cutter mechanism is corresponded to a cutting part of semiconductor element; Then, hob cutter mechanism and/or bearing mechanism are relative displacement through driving, carry out roll extrusion splitting to make one of the hobboing cutter component cutting part of sharp edge splitting portion to semiconductor element.
In one embodiment of this invention, hob cutter mechanism also includes the drive member of a connection hobboing cutter component, and hobboing cutter component drives the axle center of hobboing cutter component via drive member and is cut direction translation along one of semiconductor element.
In one embodiment of this invention, also including one along with the hobboing cutter component of hob cutter mechanism moves and mechanism inspected by the image of displacement, direction inspected by the image that mechanism inspected by image is move along with a translation direction of hobboing cutter component, and the image that mechanism inspected by image to inspect be the cutting part corresponding to semiconductor element, to inspect the image state of cutting part after bearing roll extrusion splitting of semiconductor element.
In one embodiment of this invention, bearing mechanism is a bearing board, and be have the interstice coverage that corresponds to the cutting part of semiconductor element between the first bearing component and the second bearing component.
In one embodiment of this invention, bearing mechanism also includes the drive member of a connection first bearing component and the second bearing component, and the first bearing component and the second bearing component drive via drive member and make one of semiconductor element cut direction along the axle center translation of hobboing cutter component.
The present invention contrasts effect of prior art
Via the technology used in the present invention means, the hobboing cutter component of hob cutter mechanism adopts to move via contact wafer and with the mode splitting semiconductor crystal wafer of hob cutter mechanism relative to the semiconductor crystal wafer in bearing mechanism, the roll extrusion splitting mode that wherein hobboing cutter component of the present invention is produced on a semiconductor wafer belongs to point contact type splitting, to not affect to some extent wafer splitting is stressed because wafer size size changes, and the mode of roll extrusion splitting of the present invention is than the skew that more can reduce because splitting action causes tradition splitting cutting from top to bottom, reduce because of the smile phenomenon of cutting sth. askew with collapse angle and produce, and then the yield promoted on this processing procedure, again, hobboing cutter component of the present invention effectively can control the splitting degree of depth on a semiconductor wafer and stressed and make it keep even in the cutting operation of each time because moving with parallel direction, do not have the discontinuous and cut surface of fracture to produce burr or the situation such as to peel off, therefore effectively can promote cut precision and the stability of semiconductor crystal wafer.
In addition, image of the present invention is inspected mechanism and can be moved and displacement along with the hobboing cutter component of hob cutter mechanism, and the image state of cutting part after bearing roll extrusion splitting of semiconductor element is inspected by interstice coverage, to judge the whether successful splitting of cutting part and there is flaw, and then improve its yield rate in production capacity.
Specific embodiment of the present invention, is further described by following embodiment and appended accompanying drawing.
Accompanying drawing explanation
Fig. 1 is the element schematic of cutter sweep of the present invention.
Fig. 2 is the element schematic at another visual angle of cutter sweep of the present invention.
The schematic diagram of the semiconductor element that Fig. 3 cuts for the present invention.
Fig. 4 is the flow chart of cutting method of the present invention.
Fig. 5 is the element schematic of another embodiment of cutter sweep of the present invention.
Fig. 6 is the flow chart of another embodiment of cutting method of the present invention.
Main element symbol description
100,100a cutter sweep
1,1a bearing mechanism
11,11a first bearing component
12,12a second bearing component
13a drive member
2,2a hob cutter mechanism
21,21a hobboing cutter component
211,211a point edge splitting portion
22 drive member
Mechanism inspected by 3 images
31 image acquisition lens
C semiconductor element
C1 cutting part
Direction inspected by D1 image
D2 translation direction
D3 is cut direction
G interstice coverage
R1 direction of rotation
Detailed description of the invention
Consult shown in Fig. 1 to Fig. 3, Fig. 1 is the element schematic showing cutter sweep of the present invention, and Fig. 2 is the element schematic at another visual angle showing cutter sweep of the present invention, and Fig. 3 is the schematic diagram of the semiconductor element that display the present invention cuts.
Cutter sweep 100 of the present invention is in order to wafer splitting is separated into default shape in the back-end process of semiconductor crystal wafer, and wherein cutter sweep 100 includes bearing mechanism 1, hob cutter mechanism 2 and mechanism 3 inspected by an image.As shown in the figure, bearing mechanism 1 is a bearing board, comprising having one first bearing component 11 and relative to the second bearing component 12 of the first bearing component 11, first bearing component 11 and the second bearing component 12 fix semiconductor element C in order to bearing, and be that there is the interstice coverage G that corresponds to a cutting part C1 of semiconductor element C between the first bearing component 11 and the second bearing component 12, in the present embodiment, semiconductor element C is a blue-ray LED wafer, meaning i.e. a blue-ray LED photoelectric cell, those of ordinary skill in this field any all can learn that it simply comprises a P-type layer, one N-type layer and be coated with a fractal film, and the opposed surface of its relative fractal film has the delineation trace of diamond cutter or laser.
Hob cutter mechanism 2 includes the drive member 22 of a hobboing cutter component 21 and driving hobboing cutter component 21 translation, hobboing cutter component 21 has a sharp edge splitting portion 211 as shown in the figure, its function is to carry out roll extrusion splitting along a cutting part C1 of semiconductor element C when operated, and the drive member 22 connecting hobboing cutter component 21 drives hobboing cutter component 21 translation, in the present embodiment, the sharp edge splitting portion 211 of hobboing cutter component 21 is not limited with the shape shown in Fig. 1, the shape in its sharp edge splitting portion 211 also can according to different needed for actual processing procedure, at this, only with a most preferred embodiment performance.
Image is inspected mechanism 3 and is included an image acquisition lens 31, its underlying space being arranged on the interstice coverage G between the first bearing component 11 and the second bearing component 12 as shown in the figure, in the present invention, make image inspect mechanism 3 and image acquisition lens 31 can move and displacement along with the hobboing cutter component 21 of hob cutter mechanism 2 by the annexation of mechanism configuration, the image that the image acquisition lens 31 of mechanism 3 inspected by image is inspected direction D1 and is moved along with a translation direction D2 of hobboing cutter component 21, and its image to inspect be correspond to the cutting part C1 of semiconductor element C, to inspect the image state of cutting part C1 after bearing roll extrusion splitting of semiconductor element C.
In the present invention, being arranged by the semiconductor element C (blue-ray LED wafer) being provided with a plurality of score line in FEOL is fixed in bearing mechanism 1, wherein being covered with that face of fractal film is that bearing is on the first bearing component 11 and the second bearing component 12, and cutting part C1 is corresponding interstice coverage G between the first bearing component 11 and the second bearing component 12, hobboing cutter component 21 moves (such as via the driving of the drive member 22 of hob cutter mechanism 2 with constant speed translation, each second 250mm), and the axle center of hobboing cutter component 21 is a cut direction D3 along semiconductor element C and translation and maintains same direction to move, and the sharp edge splitting portion 211 of hobboing cutter component 21 will produce constant speed rotation because of contact wafer cutting part C1 and carry out roll extrusion splitting.In addition, the present invention adopts the mode splitting semiconductor element C of contact wafer constant speed rotation roll extrusion splitting, the roll extrusion splitting mode of hobboing cutter component 21 performed by semiconductor element C belongs to point contact type splitting, to not affect to some extent wafer splitting is stressed because of the change of wafer size size, and the skew that the mode comparison of single-pathway circumgyration incision of the present invention tradition splitting cutting from top to bottom can also be reduced because splitting action causes, reduce because of the smile phenomenon of cutting sth. askew with collapse angle and produce, and then the yield promoted on this processing procedure, again, hobboing cutter component 21 effectively can control the splitting degree of depth on semiconductor element C and stressed and make it keep even in the cutting operation of each time because moving with parallel direction, do not have the discontinuous and cut surface of fracture to produce burr or the situation such as to peel off, therefore effectively promote cut precision and the stability of semiconductor element C.
In addition, mechanism 3 inspected by image and image acquisition lens 31 can move and displacement along with the hobboing cutter component 21 of hob cutter mechanism 2, and the image state of cutting part C1 after bearing roll extrusion splitting of semiconductor element C is inspected by interstice coverage G, to judge the whether successful splitting of cutting part C1 or there is flaw, and then improve its yield rate in production capacity.
Consult shown in Fig. 4, it is the flow chart showing cutting method of the present invention.Cutting method of the present invention includes the first bearing component 11 of first semiconductor element C (semiconductor crystal wafer) bearing being fixed on bearing mechanism 1 and relative on the second bearing component 12 of the first bearing component 11 (step S1); Then, the hobboing cutter component 21 of hob cutter mechanism 2 is corresponded to the cutting part C1 (step S2) of semiconductor element C; Then, the drive member 22 of hob cutter mechanism 2 drives the axle center of hobboing cutter component 21 to be cut direction D3 along semiconductor element C and translation, and sharp 211 couples of cutting part C1 in edge splitting portion of hobboing cutter component 21 carry out roll extrusion splitting (step S3).And the image that the image acquisition lens 31 of mechanism 3 inspected by image is inspected direction D1 and is moved along with the translation direction D2 of hobboing cutter component 21, and its image to inspect be correspond to the cutting part C1 of semiconductor element C, to inspect the image state of cutting part C1 after bearing roll extrusion of semiconductor element C.
Consult Fig. 5, it is the element schematic of another embodiment showing cutter sweep of the present invention.The element of the cutter sweep 100a of this embodiment is similar to the above embodiments, therefore identical element is indicate with identical element number, as a means of correspondence.Its difference is that cutter sweep 100a includes a bearing mechanism 1a, a hob cutter mechanism 2a and an image equally and inspects mechanism 3.As shown in the figure, bearing mechanism 1a is for one can the bearing board of the movement through driving, it includes one first bearing component 11a, drives the first bearing component 11a and the second bearing component 12a movement drive member 13a relative to the second bearing component 12a and of the first bearing component 11a, first bearing component 11a and the second bearing component 12a can fix semiconductor element C in order to bearing equally, and is have the interstice coverage G that corresponds to a cutting part C1 of semiconductor element C between the first bearing component 11a and the second bearing component 12a.
Hob cutter mechanism 2a includes a hobboing cutter component 21a, hobboing cutter component 21a has a sharp edge splitting portion 211a as shown in the figure, hob cutter mechanism 2a arranges to be fixed on above relatively-movable bearing mechanism 1a, and the function of hobboing cutter component 21a is to carry out splitting along a cutting part C1 of semiconductor element C equally.In the present embodiment, the sharp edge splitting portion 211a of hobboing cutter component 21a is not limited with the shape shown in Fig. 5, and the shape of its sharp edge splitting portion 211a also according to different needed for actual processing procedure, at this, only can show with a most preferred embodiment.
In the present embodiment, first bearing component 11a and the second bearing component 12a moves with constant speed translation via the driving of drive member 13a, and a cutting part C1 of semiconductor element C is axle center along hobboing cutter component 21a and translation maintain same direction and move, and the sharp edge splitting portion 211a of hobboing cutter component 21a will carry out splitting because of contact wafer cutting part C1, because its splitting principle and start are almost similar with above-described embodiment, therefore do not add to repeat at this.
Consult shown in Fig. 6, it is the flow chart of another embodiment showing cutting method of the present invention.The cutting method of the present embodiment includes the first bearing component 11a of first semiconductor element C (semiconductor crystal wafer) bearing being fixed on bearing mechanism 1a and relative to (step S1 ') on the second bearing component 12a of the first bearing component 11a; Then, the hobboing cutter component 21a of hob cutter mechanism 2a is corresponded to the cutting part C1 (step S2 ') of semiconductor element C; Then, the drive member 13a of bearing mechanism 1a drives the first bearing component 11a and the second bearing component 12a to move, and making the axle center translation of cut direction D3 along hobboing cutter component 21a of semiconductor element C, the sharp edge splitting portion 211a of hobboing cutter component 21a carries out roll extrusion splitting (step S3 ') to cutting part C1.
From above embodiment, the value in cutter sweep provided by the present invention and the true tool industry of method, therefore the present invention had accorded with the important document of patent already.Only above describing is only preferred embodiment of the present invention and illustrates, all those skilled in the art are when doing other all improvement according to above-mentioned explanation, only these change and still belong in the spiritual and the scope of the claims that defines of invention of the present invention.
Claims (8)
1. a cutter sweep, in order to cut semiconductor element, this cutter sweep comprises:
One bearing mechanism, include one first bearing component and relative to the second bearing component of this first bearing component, this first bearing component and this second bearing component are in order to this semiconductor element of bearing;
One hob cutter mechanism, including one can carry out along a cutting part of this semiconductor element the hobboing cutter component that cuts, and this hobboing cutter component has a sharp edge splitting portion,
Mechanism inspected by one image, and along with the hobboing cutter component of this hob cutter mechanism moves and displacement, the image that mechanism inspected by this image is inspected direction and moved along with a translation direction of this hobboing cutter component,
Wherein this hob cutter mechanism and/or this bearing mechanism relative displacement through driving, roll extrusion splitting is carried out to make the cutting part of sharp edge splitting portion to this semiconductor element of this hobboing cutter component, and the image that mechanism inspected by this image to inspect be the cutting part corresponding to this semiconductor element, to inspect the image state of cutting part after bearing roll extrusion splitting of this semiconductor element.
2. cutter sweep according to claim 1, wherein this hob cutter mechanism also includes the drive member of this hobboing cutter component of a connection, and this hobboing cutter component drives the axle center of this hobboing cutter component via this drive member and is cut direction translation along one of this semiconductor element.
3. cutter sweep according to claim 1, wherein this bearing mechanism also includes the drive member of this first bearing component of a connection and this second bearing component, and this first bearing component and this second bearing component drive via this drive member and make one of this semiconductor element cut direction along the axle center translation of this hobboing cutter component.
4. cutter sweep according to claim 1, wherein this bearing mechanism is a bearing board, and has the interstice coverage that corresponds to the cutting part of this semiconductor element between this first bearing component and this second bearing component.
5. a cutting method, in order to cut semiconductor element, this cutting method includes the following step:
A this semiconductor element bearing is fixed on the one first bearing component and of a bearing mechanism relative on the second bearing component of this first bearing component by ();
B one hobboing cutter component of one hob cutter mechanism is corresponded to a cutting part of this semiconductor element by ();
(c) this hob cutter mechanism and/or this bearing mechanism relative displacement through driving, roll extrusion splitting is carried out to make one of this hobboing cutter component cutting part of sharp edge splitting portion to this semiconductor element, wherein in step (c), also including one along with the hobboing cutter component of this hob cutter mechanism moves and mechanism inspected by the image of displacement, the image that mechanism inspected by this image is inspected direction and is moved along with a translation direction of this hobboing cutter component, and the cutting part corresponding to this semiconductor element inspected by the image that mechanism inspected by this image, to inspect the image state of cutting part after bearing roll extrusion splitting of this semiconductor element.
6. cutting method according to claim 5, wherein in step (b), this hob cutter mechanism also includes the drive member of this hobboing cutter component of a connection, and this hobboing cutter component drives the axle center of this hobboing cutter component via this drive member and is cut direction translation along one of this semiconductor element.
7. cutting method according to claim 5, wherein in step (a), this bearing mechanism is a bearing board, and has the interstice coverage that corresponds to the cutting part of this semiconductor element between this first bearing component and this second bearing component.
8. cutting method according to claim 5, wherein in step (b), this bearing mechanism also includes the drive member of this first bearing component of a connection and this second bearing component, and this first bearing component and this second bearing component drive via this drive member and make one of this semiconductor element cut direction along the axle center translation of this hobboing cutter component.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101100495A TWI455200B (en) | 2012-01-05 | 2012-01-05 | Cutting device and method |
| TW101100495 | 2012-01-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103192460A CN103192460A (en) | 2013-07-10 |
| CN103192460B true CN103192460B (en) | 2015-07-15 |
Family
ID=48715365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210018819.1A Expired - Fee Related CN103192460B (en) | 2012-01-05 | 2012-01-20 | Cutting device and method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2013140921A (en) |
| CN (1) | CN103192460B (en) |
| TW (1) | TWI455200B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6111827B2 (en) * | 2013-04-30 | 2017-04-12 | 三星ダイヤモンド工業株式会社 | Break jig |
| JP6520466B2 (en) * | 2015-06-29 | 2019-05-29 | 三星ダイヤモンド工業株式会社 | Break device |
| CN105161460B (en) * | 2015-09-08 | 2017-12-26 | 圆融光电科技股份有限公司 | Spherical splitting device |
| CN105382946A (en) * | 2015-12-17 | 2016-03-09 | 哈尔滨新力光电技术有限公司 | Automatic efficient splintering machine and method for sapphire LED bar |
| CN107584684A (en) * | 2017-10-17 | 2018-01-16 | 马鞍山荣泰科技有限公司 | A kind of automatic pinrshape of roll-turning quartz crystal oscillator |
| CN114770781B (en) * | 2022-06-22 | 2022-10-14 | 成都泰美克晶体技术有限公司 | SC wafer chord-changing positioning device and using method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1758993A (en) * | 2003-01-29 | 2006-04-12 | 三星宝石工业株式会社 | Substrate dividing apparatus and method for dividing substrate |
| TW200903610A (en) * | 2007-07-05 | 2009-01-16 | Both Wing Co Ltd | Pressing board mechanism for wafer cleavage |
| CN101388326A (en) * | 2007-09-14 | 2009-03-18 | 株式会社迪思科 | Method of manufacturing device |
| TW200929346A (en) * | 2007-12-26 | 2009-07-01 | Rayao Opto Technologies Co Ltd | Semiconductor device dicing method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5231662A (en) * | 1976-06-21 | 1977-03-10 | Matsushita Electronics Corp | Cleavage method of crystal thin plate |
| CN101232982B (en) * | 2005-05-30 | 2012-03-21 | 三星钻石工业株式会社 | Device and method for cutting off substrate of fragile material |
| JP2007194469A (en) * | 2006-01-20 | 2007-08-02 | Renesas Technology Corp | Method for manufacturing semiconductor device |
| CN101663246B (en) * | 2007-03-30 | 2012-03-28 | Thk株式会社 | Scribing device and scribing method |
-
2012
- 2012-01-05 TW TW101100495A patent/TWI455200B/en not_active IP Right Cessation
- 2012-01-20 CN CN201210018819.1A patent/CN103192460B/en not_active Expired - Fee Related
- 2012-01-23 JP JP2012010727A patent/JP2013140921A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1758993A (en) * | 2003-01-29 | 2006-04-12 | 三星宝石工业株式会社 | Substrate dividing apparatus and method for dividing substrate |
| TW200903610A (en) * | 2007-07-05 | 2009-01-16 | Both Wing Co Ltd | Pressing board mechanism for wafer cleavage |
| CN101388326A (en) * | 2007-09-14 | 2009-03-18 | 株式会社迪思科 | Method of manufacturing device |
| TW200929346A (en) * | 2007-12-26 | 2009-07-01 | Rayao Opto Technologies Co Ltd | Semiconductor device dicing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI455200B (en) | 2014-10-01 |
| TW201330075A (en) | 2013-07-16 |
| JP2013140921A (en) | 2013-07-18 |
| CN103192460A (en) | 2013-07-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103192460B (en) | Cutting device and method | |
| US7281334B2 (en) | Mechanical scribing apparatus with controlling force of a scribing cutter | |
| US20180108568A1 (en) | Laser lift-off method of wafer | |
| CN105365060B (en) | Method and apparatus for dividing brittle material substrate | |
| KR20120108724A (en) | Method and apparatus for producing solar cell | |
| CN102376643B (en) | Cutting process | |
| US20130344684A1 (en) | Methods and systems for using subsurface laser engraving (ssle) to create one or more wafers from a material | |
| KR20060133385A (en) | System for cutting liquid crystal display panel and method of fabricating liquid crystal display device using thereof | |
| CN105215556A (en) | The new technology that laser cuts film is carried out to the various films that crystal column surface pastes | |
| KR20140009033A (en) | Tape expanding apparatus | |
| CN102496602B (en) | Chip cutting method | |
| CN103887238A (en) | Cutting and classifying method for wafer after BGA package is completed | |
| CN103956337A (en) | Semiconductor wafer cutting method | |
| CN101733849A (en) | Method for cutting silicon rod | |
| CN203774284U (en) | Dicing saw for semiconductor packaging | |
| CN105870276A (en) | ITO (Indium Tin Oxide)-structure LED (Light Emitting Diode) chip and cutting method thereof | |
| KR20160003583A (en) | Scribing apparatus and scribing method for tempered glass substrate | |
| CN103367535B (en) | Groove machining tool, method and the grooving apparatus of thin film solar cell | |
| CN109449195A (en) | A kind of display panel motherboard and preparation method thereof | |
| DE102022208279A1 (en) | wafer processing methods | |
| CN204088353U (en) | Light-emitting diode sliver apparatus | |
| JP3553675B2 (en) | Method of cutting plate-like work and method of manufacturing semiconductor device | |
| CN106098821B (en) | The processing method of the processing unit (plant) and thin-film solar cells of thin-film solar cells | |
| CN102593270B (en) | LED die and manufacturing method thereof | |
| JP6589362B2 (en) | Thin-film solar cell processing apparatus and thin-film solar cell processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: YOUNG TEK ELECTRONICS CORP. Free format text: FORMER OWNER: WECON AUTOMATIZATION MACHINERY CO., LTD. Effective date: 20150826 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150826 Address after: Science and Technology Industrial Park, Hsinchu, China Science and technology road, No. 4, building 5, Taiwan Patentee after: Jiuyuan Electronic Co., Ltd. Address before: Taiwan, China Hsinchu Po Pu Pu Pu Road, Lane 99, No. 127 Patentee before: Wecon Automatic Machinery Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150715 Termination date: 20160120 |
|
| EXPY | Termination of patent right or utility model |