CN105161460B - Spherical splitting device - Google Patents
Spherical splitting device Download PDFInfo
- Publication number
- CN105161460B CN105161460B CN201510566683.1A CN201510566683A CN105161460B CN 105161460 B CN105161460 B CN 105161460B CN 201510566683 A CN201510566683 A CN 201510566683A CN 105161460 B CN105161460 B CN 105161460B
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- Prior art keywords
- splitting
- spherical
- knife
- concave surface
- platform
- Prior art date
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- 239000013078 crystal Substances 0.000 claims abstract description 24
- 238000010521 absorption reaction Methods 0.000 claims description 15
- 230000007423 decrease Effects 0.000 description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- -1 Polyethylene terephthalate Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 210000004209 hair Anatomy 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention provides a kind of spherical splitting device, including：Mechanical arm, with the concave surface splitting that the mechanical arm is coaxially disposed by platform, spherical splitting knife and rotary shaft；The concave surface splitting is concave upright concaver by platform, and the concave surface is used to place wafer COW；The spherical splitting knife is arranged on surface of the concave surface splitting by platform, and the spherical outer surface of the spherical splitting knife is provided with splitting tooth；The rotary shaft is fixed on the axle center of the spherical splitting knife, for driving the spherical splitting knife to be rotated around the axle center；The mechanical arm is fixed on the top of the spherical splitting knife, for driving the spherical splitting knife to move up and down.Spherical splitting device provided by the invention, can be simultaneously completely separable by the not distinct crystal grain in multirow X-direction and Y-direction, improves sliver efficiency.
Description
Technical field
The present invention relates to light emitting diode (Light Emitting Diode, abbreviation LED) manufacturing field, more particularly to one
The spherical splitting device of kind.
Background technology
In the manufacturing process of LED chip, wafer (chip on wafer, abbreviation COW) is carried out usually using laser
Cutting, specifically, using laser from COW Sapphire Substrate one side certain depth position crystal grain and crystal grain Cutting Road it
Between carry out laser dotting.Laser cutting can make have slight crack between crystal grain, still, can not make completely separable between crystal grain.This
When, it is necessary to using breaking machine that crystal grain is completely separable, the effect of breaking machine is exactly to utilize the splitting device in breaking machine to COW
Apply certain pressure between Cutting Road so that crystal grain is completely separable.
In the prior art, vibrations are tapped between crystal grain and the Cutting Road of crystal grain usually using cuboid formula sliver cutter
Separate crystal grain.Fig. 1 is the structural representation of splitting device of the prior art, as shown in figure 1, cuboid cleaves knife 102
It is fixed on by screw 103 in fixed plate 101, fixed plate 101 can be moved up and down, and then cuboid can be driven to cleave knife
102 move up and down, and cleave and be located at by platform 105 and plummer 104 in same level, cleave by platform 105 by preceding splitting platform with after
Cleave platform two parts to form, the preceding splitting platform side relative with rear splitting platform forms the broad-adjustable groove of a strip, rectangular
Body splitting knife 102 is directed at the center of the groove when moving up and down.During sliver, COW is placed on splitting by platform 105,
Adjust the width of groove so that the center of Cutting Road between COW two row crystal grain just alignment indentation, cleaved by cuboid
Cutting Road between the two row crystal grain moved up and down to COW of knife 102 applies pressure, and then to a line in X-direction or Y-direction
Crystal grain is cleaved, if the splitting dynamics of cuboid splitting knife 102 is inadequate, can be increased cuboid by hammer 106 and be cleaved
The splitting dynamics of knife 102.
Due to splitting device of the prior art, its cuboid splitting knife can only once be cleaved along straight line, such as
A line crystal grain in X-direction or Y-direction is cleaved, moreover, needing that crystal grain first is adjusted into horizontal level before splitting, thus is being incited somebody to action
, it is necessary to by multiple cleaving process when crystal grain is completely separable, elapsed time is longer, reduces sliver efficiency.
The content of the invention
The present invention provides a kind of spherical splitting device, can while will be not distinct in multirow X-direction and Y-direction
Crystal grain is completely separable, improves sliver efficiency.
Spherical splitting device provided by the invention, including：Mechanical arm, the concave surface splitting being coaxially disposed with the mechanical arm by
Platform, spherical splitting knife and rotary shaft；
The concave surface splitting is concave upright concaver by platform, and the concave surface is used to place wafer COW；
The spherical splitting knife is arranged on surface of the concave surface splitting by platform, the spherical appearance of the spherical splitting knife
Face is provided with splitting tooth；
The rotary shaft is fixed on the axle center of the spherical splitting knife, for driving the spherical splitting knife around the axle center
Rotation；
The mechanical arm is fixed on the top of the spherical splitting knife, for driving the spherical splitting knife to move up and down.
The invention provides a kind of spherical splitting device, including：Mechanical arm, the concave surface being coaxially disposed with the mechanical arm are split
Split by platform, spherical splitting knife and rotary shaft, wherein, concave surface splitting is concave upright concaver by platform, and concave surface is used to place
COW, spherical splitting knife are arranged on surface of the concave surface splitting by platform, and the spherical outer surface of spherical splitting knife is provided with splitting tooth,
Rotary shaft is fixed on the axle center of spherical splitting knife, and for driving spherical splitting knife to be rotated around axle center, mechanical arm is fixed on spherical split
The top of knife is split, for driving spherical splitting knife to move up and down.Spherical splitting device provided by the invention, concave surface splitting by platform and
Spherical splitting knife cooperates, can be simultaneously by multirow X-direction and Y by the splitting tooth set on spherical splitting knife outer surface
Not distinct crystal grain on direction is completely separable, improves sliver efficiency.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are this hairs
Some bright embodiments, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of splitting device of the prior art；
Fig. 2 is the structural representation for the spherical splitting device that the embodiment of the present invention one provides.
Description of reference numerals：
11：Concave surface is cleaved by platform； 13：Spherical splitting knife；
15：Rotary shaft； 17：Mechanical arm；
19：Cleave tooth； 101：Fixed plate；
102：Cuboid cleaves knife； 103：Screw；
104：Plummer； 105：Splitting is by platform；
106：Hammer.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
Fig. 2 is the structural representation for the spherical splitting device that the embodiment of the present invention one provides.As shown in Fig. 2 the present embodiment
The spherical splitting device provided, can include：
Mechanical arm 17, with the concave surface splitting that mechanical arm 17 is coaxially disposed by platform 11, spherical splitting knife 13 and rotary shaft 15.
Wherein, concave surface splitting is concave upright concaver by platform 11, and concave surface is used to place COW.
Spherical splitting knife 13 is arranged on surface of the concave surface splitting by platform 11, and the spherical outer surface of spherical splitting knife 13 is set
There is splitting tooth 19.
Rotary shaft 15 is fixed on the axle center of spherical splitting knife 13, for driving spherical splitting knife 13 to be rotated around axle center.
Mechanical arm 17 is fixed on the top of spherical splitting knife 13, for driving spherical splitting knife 13 to move up and down.
The spherical splitting device that the present embodiment provides, operation principle are as follows：
Polyethylene terephthalate (polyethylene terephthalate, abbreviation PET) is sticked at the COW back sides
Diaphragm, removed from collapsing on film ring, be placed on concave surface splitting by platform 11, mechanical arm 17 drives spherical splitting knife 13 to decline, and makes
Spherical chopper 13 enters concave surface and cleaved by inside platform 11, contacted until spherical chopper 13 cleaves in concave surface by platform 11 with COW,
Spherical chopper 13 is set with certain rotating speed and rotates certain number of turns progress sliver, after the completion of sliver, mechanical arm 17 drives ball
Shape splitting knife 13 rises to original position, then from concave surface, splitting is taken out in by platform 11 by COW.
The spherical splitting device that the present embodiment provides, concave surface splitting are cooperated by platform 11 and spherical splitting knife 13, passed through
The splitting tooth 19 set on spherical splitting knife 13 outer surface, during spherical splitting knife 13 rotates, applied to COW whole surfaces
Add uniform pressure, the not distinct crystal grain in multirow X-direction and Y-direction is opened by complete parttion simultaneously, improve and split
Piece efficiency.Moreover, the spherical splitting device that the present embodiment provides, due to being not to be cleaved line by line along crystal grain Cutting Road, will not go out
Chipping caused by crystal grain unbalance stress or double born of the same parents' phenomenons in existing cleaving process, improve sliver quality.
Optionally, concave surface splitting is provided with vacuum absorption device (not shown) by the bottom of platform 11, and vacuum absorption device is used
Adsorbed in by COW in the concave surface for cleaving by platform 11 in concave surface.By such setting, COW is placed on concave surface splitting by platform 11
After interior, open vacuum absorption device and adsorb COW on the concave surface inwall for cleaving by platform 11 in concave surface so that COW is close smooth
Cleave with concave surface and contacted by the inwall of platform 11, stability is enhanced during sliver, further increases sliver effect.Splitting
After the completion of piece, vacuum absorption device is closed, splitting is taken out in by platform 11 from concave surface by COW.
Optionally, it is the cylinder teeth for being evenly distributed on spherical splitting knife 13 outer surface to cleave tooth 19.
Optionally, concave surface splitting is hollow hemisphere body of the radius more than 20 millimeters by platform 11.
Optionally, the angularity of concaver and the size of required splitting crystal grain match.
A kind of spherical splitting device is present embodiments provided, including：Mechanical arm, cleaved with the concave surface that mechanical arm is coaxially disposed
By platform, spherical splitting knife and rotary shaft, wherein, concave surface splitting is concave upright concaver by platform, and concave surface is used to place COW,
Spherical splitting knife is arranged on surface of the concave surface splitting by platform, and the spherical outer surface of spherical splitting knife is provided with splitting tooth, rotated
Axle is fixed on the axle center of spherical splitting knife, and for driving spherical splitting knife to be rotated around axle center, mechanical arm is fixed on spherical splitting knife
Top, for drive it is spherical splitting knife move up and down.The spherical splitting device that the present embodiment provides, concave surface are cleaved by platform and ball
Shape splitting knife cooperates, can be simultaneously by multirow X-direction and Y side by the splitting tooth set on spherical splitting knife outer surface
Upward not distinct crystal grain is completely separable, improves sliver efficiency.
Below by taking a kind of The concrete specification as an example, the course of work for the spherical splitting device that the present embodiment provides is described in detail：
COW thickness is 120um, and chip die size is 305umx152um, and the rotating speed for setting spherical splitting knife 13 is 12r/
Min, turnning circle 3r, the initial position co-ordinates of mechanical arm 17 are 0, and down position coordinate is 70.25um.
PET protection film is sticked at the COW back sides, removed from collapsing on film ring, is placed on concave surface splitting by platform 11, the back side or
Face-up, vacuum absorption device is opened.Mechanical arm 17 controls spherical splitting knife 13 to decline, and decrease speed can be set to 30mm/s,
Drop to behind setting position and start sliver, after the completion of sliver, mechanical arm 17 controls spherical splitting knife 13 to rise, and the rate of climb can be set
For 20mm/s, vacuum absorption device is closed, then takes out COW, sliver is completed.
Below by taking another The concrete specification as an example, the worked of the spherical splitting device that the present embodiment provides is described in detail
Journey.
COW thickness is 120um, and chip die size is 500umx225um, and the rotating speed for setting spherical splitting knife 13 is 8r/
Min, turnning circle 4r, the initial position co-ordinates of mechanical arm 17 are 0, and down position coordinate is 70.20um.
PET protection film is sticked at the COW back sides, removed from collapsing on film ring, is placed on concave surface splitting by platform 11, the back side or
Face-up, vacuum absorption device is opened.Mechanical arm 17 controls spherical splitting knife 13 to decline, and decrease speed can be set to 35mm/s,
Drop to behind setting position and start sliver, after the completion of sliver, mechanical arm 17 controls spherical splitting knife 13 to rise, and the rate of climb can be set
For 20mm/s, vacuum absorption device is closed, then takes out COW, sliver is completed.
Below by taking another The concrete specification as an example, the worked of the spherical splitting device that the present embodiment provides is described in detail
Journey.
COW thickness is 85um, and chip die size is 225umx125um, and the rotating speed for setting spherical splitting knife 13 is 15r/
Min, turnning circle 8r, the initial position co-ordinates of mechanical arm 17 are 0, and down position coordinate is 70.62um.
PET protection film is sticked at the COW back sides, removed from collapsing on film ring, is placed on concave surface splitting by platform 11, the back side or
Face-up, vacuum absorption device is opened.Mechanical arm 17 controls spherical splitting knife 13 to decline, and decrease speed can be set to 25mm/s,
Drop to behind setting position and start sliver, after the completion of sliver, mechanical arm 17 controls spherical splitting knife 13 to rise, and the rate of climb can be set
For 30mm/s, vacuum absorption device is closed, then takes out COW, sliver is completed.
Below by taking another The concrete specification as an example, the worked of the spherical splitting device that the present embodiment provides is described in detail
Journey.
COW thickness is 150um, and chip die size is 600umx325um, and the rotating speed for setting spherical splitting knife 13 is 10r/
Min, turnning circle 3r, the initial position co-ordinates of mechanical arm 17 are 0, and down position coordinate is 69.70um.
PET protection film is sticked at the COW back sides, removed from collapsing on film ring, is placed on concave surface splitting by platform 11, the back side or
Face-up, vacuum absorption device is opened.Mechanical arm 17 controls spherical splitting knife 13 to decline, and decrease speed can be set to 35mm/s,
Drop to behind setting position and start sliver, after the completion of sliver, mechanical arm 17 controls spherical splitting knife 13 to rise, and the rate of climb can be set
For 20mm/s, vacuum absorption device is closed, then takes out COW, sliver is completed.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, either which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (4)
- A kind of 1. spherical splitting device, it is characterised in that including：Mechanical arm, cleaved with the concave surface that the mechanical arm is coaxially disposed By platform, spherical splitting knife and rotary shaft；The concave surface splitting is concave upright concaver by platform, and the concave surface is used to place wafer COW；The spherical splitting knife is arranged on surface of the concave surface splitting by platform, and the spherical outer surface of the spherical splitting knife is set It is equipped with splitting tooth；The rotary shaft is fixed on the axle center of the spherical splitting knife, for driving the spherical splitting knife to be revolved around the axle center Turn；The mechanical arm is fixed on the top of the spherical splitting knife, for driving the spherical splitting knife to move up and down；The concave surface splitting is provided with vacuum absorption device by the bottom of platform, and the vacuum absorption device is used for the wafer COW absorption is in the concave surface that the concave surface cleaves by platform.
- 2. spherical splitting device according to claim 1, it is characterised in that the angularity of the concaver and required splitting The size of crystal grain matches.
- 3. spherical splitting device according to claim 1, it is characterised in that the splitting tooth is to be evenly distributed on the ball The cylinder teeth of shape splitting knife outer surface.
- 4. spherical splitting device according to claim 1, it is characterised in that the concave surface splitting is that radius is more than 20 by platform The hollow hemisphere body of millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510566683.1A CN105161460B (en) | 2015-09-08 | 2015-09-08 | Spherical splitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510566683.1A CN105161460B (en) | 2015-09-08 | 2015-09-08 | Spherical splitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105161460A CN105161460A (en) | 2015-12-16 |
| CN105161460B true CN105161460B (en) | 2017-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510566683.1A Active CN105161460B (en) | 2015-09-08 | 2015-09-08 | Spherical splitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105161460B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109227693B (en) * | 2018-08-31 | 2024-03-22 | 合肥泰沃达智能装备有限公司 | Light guide plate cuts auxiliary mechanism |
| CN114803452B (en) * | 2022-04-29 | 2024-04-09 | 河北圣昊光电科技有限公司 | Synchronous transmission assembly and splitting machine with same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192460A (en) * | 2012-01-05 | 2013-07-10 | 威控自动化机械股份有限公司 | Cutting device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01225508A (en) * | 1988-03-03 | 1989-09-08 | Nec Corp | Semiconductor wafter breaking device |
| JP2004209675A (en) * | 2002-12-26 | 2004-07-29 | Kashifuji:Kk | Pressure-cutting apparatus and pressure-cutting method |
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2015
- 2015-09-08 CN CN201510566683.1A patent/CN105161460B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192460A (en) * | 2012-01-05 | 2013-07-10 | 威控自动化机械股份有限公司 | Cutting device and method |
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| Publication number | Publication date |
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| CN105161460A (en) | 2015-12-16 |
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