TW200901341A - Compression molding method and device for electronic component - Google Patents
Compression molding method and device for electronic component Download PDFInfo
- Publication number
- TW200901341A TW200901341A TW097116617A TW97116617A TW200901341A TW 200901341 A TW200901341 A TW 200901341A TW 097116617 A TW097116617 A TW 097116617A TW 97116617 A TW97116617 A TW 97116617A TW 200901341 A TW200901341 A TW 200901341A
- Authority
- TW
- Taiwan
- Prior art keywords
- hole
- mold
- resin
- electronic component
- compression molding
- Prior art date
Links
- 238000000748 compression moulding Methods 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000003825 pressing Methods 0.000 claims abstract description 154
- 239000011347 resin Substances 0.000 claims abstract description 153
- 229920005989 resin Polymers 0.000 claims abstract description 153
- 239000000463 material Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims description 61
- 238000007789 sealing Methods 0.000 claims description 12
- 238000009434 installation Methods 0.000 claims description 6
- 238000007598 dipping method Methods 0.000 claims description 4
- 239000012776 electronic material Substances 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims 1
- 239000004519 grease Substances 0.000 claims 1
- 238000005086 pumping Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 238000002791 soaking Methods 0.000 abstract 1
- 230000006835 compression Effects 0.000 description 20
- 238000007906 compression Methods 0.000 description 20
- 238000012986 modification Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 238000000465 moulding Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- WJRFOSBCACMRMM-UHFFFAOYSA-N 9H-fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1.C1=CC=C2CC3=CC=CC=C3C2=C1 WJRFOSBCACMRMM-UHFFFAOYSA-N 0.000 description 1
- 210000003423 ankle Anatomy 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007723 die pressing method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013601 eggs Nutrition 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007141640A JP2008296382A (ja) | 2007-05-29 | 2007-05-29 | 電子部品の圧縮成形方法及び金型 |
| JP2008038892A JP5128309B2 (ja) | 2008-02-20 | 2008-02-20 | 電子部品の圧縮成形方法及び金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200901341A true TW200901341A (en) | 2009-01-01 |
| TWI376753B TWI376753B (ko) | 2012-11-11 |
Family
ID=40366480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097116617A TW200901341A (en) | 2007-05-29 | 2008-05-06 | Compression molding method and device for electronic component |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20080104966A (ko) |
| TW (1) | TW200901341A (ko) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI573199B (zh) * | 2013-06-20 | 2017-03-01 | Towa Corp | Electronic component compression resin sealing method and compression resin sealing device |
| TWI645520B (zh) * | 2015-03-23 | 2018-12-21 | 日商Ｔｏｗａ股份有限公司 | 樹脂密封裝置以及樹脂密封方法 |
| CN115738897A (zh) * | 2022-11-03 | 2023-03-07 | 巨玻固能(苏州)薄膜材料有限公司 | 制粒设备 |
-
2008
- 2008-05-06 TW TW097116617A patent/TW200901341A/zh unknown
- 2008-05-22 KR KR1020080047460A patent/KR20080104966A/ko active IP Right Grant
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI573199B (zh) * | 2013-06-20 | 2017-03-01 | Towa Corp | Electronic component compression resin sealing method and compression resin sealing device |
| TWI645520B (zh) * | 2015-03-23 | 2018-12-21 | 日商Ｔｏｗａ股份有限公司 | 樹脂密封裝置以及樹脂密封方法 |
| US10170346B2 (en) | 2015-03-23 | 2019-01-01 | Towa Corporation | Resin sealing apparatus and resin sealing method |
| CN115738897A (zh) * | 2022-11-03 | 2023-03-07 | 巨玻固能(苏州)薄膜材料有限公司 | 制粒设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI376753B (ko) | 2012-11-11 |
| KR20080104966A (ko) | 2008-12-03 |
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