TW200901341A - Compression molding method and device for electronic component - Google Patents

Compression molding method and device for electronic component Download PDF

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Publication number
TW200901341A
TW200901341A TW097116617A TW97116617A TW200901341A TW 200901341 A TW200901341 A TW 200901341A TW 097116617 A TW097116617 A TW 097116617A TW 97116617 A TW97116617 A TW 97116617A TW 200901341 A TW200901341 A TW 200901341A
Authority
TW
Taiwan
Prior art keywords
hole
mold
resin
electronic component
compression molding
Prior art date
Application number
TW097116617A
Other languages
English (en)
Chinese (zh)
Other versions
TWI376753B (https=
Inventor
Shinji Takase
Takashi Tamura
Takeaki Taka
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007141640A external-priority patent/JP2008296382A/ja
Priority claimed from JP2008038892A external-priority patent/JP5128309B2/ja
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200901341A publication Critical patent/TW200901341A/zh
Application granted granted Critical
Publication of TWI376753B publication Critical patent/TWI376753B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW097116617A 2007-05-29 2008-05-06 Compression molding method and device for electronic component TW200901341A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007141640A JP2008296382A (ja) 2007-05-29 2007-05-29 電子部品の圧縮成形方法及び金型
JP2008038892A JP5128309B2 (ja) 2008-02-20 2008-02-20 電子部品の圧縮成形方法及び金型

Publications (2)

Publication Number Publication Date
TW200901341A true TW200901341A (en) 2009-01-01
TWI376753B TWI376753B (https=) 2012-11-11

Family

ID=40366480

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097116617A TW200901341A (en) 2007-05-29 2008-05-06 Compression molding method and device for electronic component

Country Status (2)

Country Link
KR (1) KR20080104966A (https=)
TW (1) TW200901341A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573199B (zh) * 2013-06-20 2017-03-01 東和股份有限公司 Electronic component compression resin sealing method and compression resin sealing device
TWI645520B (zh) * 2015-03-23 2018-12-21 日商Ｔｏｗａ股份有限公司 樹脂密封裝置以及樹脂密封方法
CN115738897A (zh) * 2022-11-03 2023-03-07 巨玻固能(苏州)薄膜材料有限公司 制粒设备

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573199B (zh) * 2013-06-20 2017-03-01 東和股份有限公司 Electronic component compression resin sealing method and compression resin sealing device
TWI645520B (zh) * 2015-03-23 2018-12-21 日商Ｔｏｗａ股份有限公司 樹脂密封裝置以及樹脂密封方法
US10170346B2 (en) 2015-03-23 2019-01-01 Towa Corporation Resin sealing apparatus and resin sealing method
CN115738897A (zh) * 2022-11-03 2023-03-07 巨玻固能(苏州)薄膜材料有限公司 制粒设备

Also Published As

Publication number Publication date
KR20080104966A (ko) 2008-12-03
TWI376753B (https=) 2012-11-11

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