TW200900483A - Adhesive for connecting circuit - Google Patents

Adhesive for connecting circuit Download PDF

Info

Publication number
TW200900483A
TW200900483A TW97108489A TW97108489A TW200900483A TW 200900483 A TW200900483 A TW 200900483A TW 97108489 A TW97108489 A TW 97108489A TW 97108489 A TW97108489 A TW 97108489A TW 200900483 A TW200900483 A TW 200900483A
Authority
TW
Taiwan
Prior art keywords
film
resin
circuit
binder
heat
Prior art date
Application number
TW97108489A
Other languages
English (en)
Chinese (zh)
Other versions
TWI448532B (https=
Inventor
Sachihisa Hirosawa
Itsuo Watanabe
Yasushi Goto
Tsumasu Takeda
Masanori Fujii
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to TW97108489A priority Critical patent/TW200900483A/zh
Publication of TW200900483A publication Critical patent/TW200900483A/zh
Application granted granted Critical
Publication of TWI448532B publication Critical patent/TWI448532B/zh

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
TW97108489A 2001-11-14 2001-11-14 Adhesive for connecting circuit TW200900483A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97108489A TW200900483A (en) 2001-11-14 2001-11-14 Adhesive for connecting circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97108489A TW200900483A (en) 2001-11-14 2001-11-14 Adhesive for connecting circuit

Publications (2)

Publication Number Publication Date
TW200900483A true TW200900483A (en) 2009-01-01
TWI448532B TWI448532B (https=) 2014-08-11

Family

ID=44721360

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97108489A TW200900483A (en) 2001-11-14 2001-11-14 Adhesive for connecting circuit

Country Status (1)

Country Link
TW (1) TW200900483A (https=)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1150032A (ja) * 1997-08-04 1999-02-23 Hitachi Chem Co Ltd 回路用接続部材及び回路板
JP4045620B2 (ja) * 1997-10-08 2008-02-13 日立化成工業株式会社 回路接続用フィルム状接着剤

Also Published As

Publication number Publication date
TWI448532B (https=) 2014-08-11

Similar Documents

Publication Publication Date Title
TW200910488A (en) Anisotropic electroconductive film, and process for producing connection structure using the same
JP2009194359A (ja) 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JPH10298526A (ja) 回路接続用組成物及びこれを用いたフィルム
TWI236121B (en) Insulated conductive ball for anisotropic conductive connection, method of preparing the same, and product using the same
JP4433564B2 (ja) 回路接続用接着剤
TW200829675A (en) Adhesive for electric circuit connection
JPWO2001059007A1 (ja) 樹脂組成物、これを用いた回路部材接続用接着剤及び回路板
JP2011068772A (ja) エポキシ樹脂組成物、および、それによる接着フィルム
CN103748167B (zh) 热阳离子聚合性组合物、各向异性导电粘接膜、连接结构体及其制造方法
TW200900483A (en) Adhesive for connecting circuit
JP2003147287A (ja) 回路接続用接着フィルム
CN1246411C (zh) 电路连接用粘结剂
TWI316532B (https=)
CN1532256B (zh) 电路连接用粘结剂
TWI316534B (https=)
CN100509981C (zh) 电路连接用粘结剂
JP2006028521A (ja) 回路接続用接着剤
TWI316537B (https=)
TWI316533B (https=)
JP4032974B2 (ja) 回路接続用接着フィルムの接続方法及び回路接続用接着フィルム
JP4626495B2 (ja) 回路接続用接着剤
TWI316535B (https=)
JP5177439B2 (ja) 絶縁被覆導電粒子
CN100509984C (zh) 电路连接用薄膜状粘结剂
TWI316536B (https=)

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent