TWI316534B - - Google Patents

Download PDF

Info

Publication number
TWI316534B
TWI316534B TW93112033A TW93112033A TWI316534B TW I316534 B TWI316534 B TW I316534B TW 93112033 A TW93112033 A TW 93112033A TW 93112033 A TW93112033 A TW 93112033A TW I316534 B TWI316534 B TW I316534B
Authority
TW
Taiwan
Prior art keywords
group
resin
circuit
film
bonding agent
Prior art date
Application number
TW93112033A
Other languages
English (en)
Chinese (zh)
Other versions
TW200426201A (en
Inventor
Yukihisa Hirosawa
Itsuo Watanabe
Gotou Yasushi
Jun Taketatsu
Masaki Fujii
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to TW93112033A priority Critical patent/TW200426201A/zh
Publication of TW200426201A publication Critical patent/TW200426201A/zh
Application granted granted Critical
Publication of TWI316534B publication Critical patent/TWI316534B/zh

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
TW93112033A 2001-11-14 2001-11-14 Circuit connection adhesive TW200426201A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93112033A TW200426201A (en) 2001-11-14 2001-11-14 Circuit connection adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93112033A TW200426201A (en) 2001-11-14 2001-11-14 Circuit connection adhesive

Publications (2)

Publication Number Publication Date
TW200426201A TW200426201A (en) 2004-12-01
TWI316534B true TWI316534B (https=) 2009-11-01

Family

ID=45073248

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93112033A TW200426201A (en) 2001-11-14 2001-11-14 Circuit connection adhesive

Country Status (1)

Country Link
TW (1) TW200426201A (https=)

Also Published As

Publication number Publication date
TW200426201A (en) 2004-12-01

Similar Documents

Publication Publication Date Title
JP2009194359A (ja) 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JP2009147231A (ja) 実装方法、半導体チップ、及び半導体ウエハ
CN102460669A (zh) 绝缘性树脂薄膜、及使用它的接合体及其制造方法
JP4433564B2 (ja) 回路接続用接着剤
TW200829675A (en) Adhesive for electric circuit connection
TWI316534B (https=)
CN100513507C (zh) 电路连接用粘结剂
JP2003147287A (ja) 回路接続用接着フィルム
TWI316537B (https=)
JP4012206B2 (ja) Loc用両面テープ及びその製造方法
TWI316535B (https=)
JP4032974B2 (ja) 回路接続用接着フィルムの接続方法及び回路接続用接着フィルム
CN1532256B (zh) 电路连接用粘结剂
TWI298742B (https=)
TWI316532B (https=)
TWI316536B (https=)
CN100509981C (zh) 电路连接用粘结剂
JP2006028521A (ja) 回路接続用接着剤
JP4626495B2 (ja) 回路接続用接着剤
CN100509984C (zh) 电路连接用薄膜状粘结剂
TWI316533B (https=)
TW200900483A (en) Adhesive for connecting circuit
CN100509983C (zh) 电路连接用粘结剂
CN100509982C (zh) 电路连接用粘结剂
TW200900478A (en) Adhesive for connecting circuit

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent