TW200849435A - Wire clamp for a wire bonder - Google Patents

Wire clamp for a wire bonder Download PDF

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Publication number
TW200849435A
TW200849435A TW097121357A TW97121357A TW200849435A TW 200849435 A TW200849435 A TW 200849435A TW 097121357 A TW097121357 A TW 097121357A TW 97121357 A TW97121357 A TW 97121357A TW 200849435 A TW200849435 A TW 200849435A
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TW
Taiwan
Prior art keywords
arm
clamp
bending element
wire
piezoelectric bending
Prior art date
Application number
TW097121357A
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English (en)
Inventor
Armin Felber
Original Assignee
Oerlikon Assembly Equipment Ag Steinhausen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Assembly Equipment Ag Steinhausen filed Critical Oerlikon Assembly Equipment Ag Steinhausen
Publication of TW200849435A publication Critical patent/TW200849435A/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004Wire welding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67138Apparatus for wiring semiconductor or solid state device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
    • H01L2224/85205Ultrasonic bonding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01068Erbium [Er]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Description

200849435 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種打線機之線夾。 【先前技術】 打線機係用於在半導體晶片與基板之間形成線連接之 機器。打線機包含一結合頭,其具有在水平xy平面中移動 之平台,在此平台上安裝有一可繞一水平軸心旋轉的搖 桿。一超音波換能器被固緊到搖桿上,在其一端夾持一毛 細管。搖桿包含一大致平行於超音波換能器而移動的臂, 在其上固緊一線夾,此臂位於毛細管上方。毛細管用來將 線固緊到半導體晶片之一連接點且固緊到基板之一連接 點,並且引導在此二連接點之間的線。線捲繞在一線軸上 且藉由一饋線裝置而被進給到毛細管,線移動穿過線夾及 毛細管之一縱向鑽孔。 此線夾在先前技術中已周知。從U S 4 6 5 3 6 8 1得知一線 夾,其由線性馬達所致動,被固定到臂上遠離毛細管之端 部。線性馬達有多項缺點:其有大的移動質量,因而產生 大量廢熱,且很慢。從US 5 43 5 4 77及US 5 746422得知一線 夾,其具有一由串聯的多個之獨立壓電元件構成之馬達(多 層堆疊壓電馬達),及多個薄膜層。薄膜層之結構複雜。除 此之外,此一馬達之有限服務壽命是很不利。從US 5 90 1 8 96 得知一線夾,其由一壓電彎曲元件所致動,而直接作用在 線夾之夾鉗口。壓電彎曲元件係很重的元件,在此案中造 成搖桿之慣性力矩大幅地增加。 200849435 【發明內容】 本發明之一目的在發展一種線夾,其可使結合頭之搖 桿的慣性力矩變成儘可能地小。 一打線機之線夾包括一第1臂,及安裝在第1臂上使 得其可繞一預定軸心旋轉之一第2臂。第1臂及第2臂在 遠離軸心的一端具有夾鉗口。線夾另包括一壓電彎曲元 件,用於打開及關閉線夾。壓電彎曲元件之一端鎖固到可 f、 動臂,且壓電彎曲元件之對向端係鎖固到第1臂之扣件。 扣件之位置較佳爲可調整,使得假定在線夾之打開狀態的 夾鉗口之間的間隔可被設定。較佳爲設置一^機械或電氣阻 尼器用以抑制或至少降低線夾在關閉時之振動。 【實施方式】 第1圖是顯示依本發明之線夾1在打開狀態下的頂視 圖。線夾1包括:一第1臂2,固鎖到打線機之結合頭的 搖桿;及一第2臂3,可相對於第1臂2移動。第2臂3 ί ^ 安裝於第1臂2上,使得其可繞垂直於圖面之平面之軸心 4旋轉。一夾紺口 5或6被固鎖到臂2及3在遠離軸心4 的一端。一扣件7配置在第1臂2對向於具夾鉗口 5之端 部。扣件7較佳爲包含塑膠。線夾1之操作係使用一壓電 彎曲元件8而進行,其一端固鎖於第2可移動臂3,且其 另一方面端抵住於扣件7中。 扣件7固鎖到第1臂2,使得其可朝箭號η所示之方 向位移。一簡單方案顯示於第1圖。一具有兩臂12及13 200849435 的角件被固鎖到第1臂2。由如橡膠之彈性材料製成的零 • 件1 4被膠合到臂1 3。扣件7位於線夾1之第1臂2與彈 性材料製成的零件14之間。安裝在一導入第!臂2之螺紋 的一螺絲1 5將扣件7壓抵於彈性材料製成的零件丨4。扣 件7被挾持於螺絲1 5與彈性材料製成的零件1 4之間。藉 由轉動螺絲1 5,扣件7之位置可朝方向1 1位移且因而可 調整在打開狀態的兩夾鉗口 5或6之間的距離。 第2圖係示意顯示打線機之結合頭17之側視圖。結合
I 頭17包括一可在一水平面移動之平台18,一搖桿20在平 台1 8上可繞一水平移動之旋轉軸心1 9旋轉,且在平台1 8 上裝設有使搖桿20可繞旋轉軸心1 9旋轉的馬達2 1。一超 音波換能器2 2被固鎖到搖桿2 0。 超音波換能器22包括一角狀件23及至少一壓電驅動 器25,用於將超音波換能器22激發爲超音波振盪,角狀 件23之一端挾持有一毛細管24。在第2圖中,具有夾鉗 口 6之線夾1之第2臂3、壓電彎曲元件8、及角件之臂1 3 爲可見。第1臂2位於第2臂3之後面且爲了圖面清楚而 省略。 以此線夾之方案提供下列優點: -壓電彎曲元件8位於靠近線夾1遠離夾鉗口 5或6 的一端,且因而相當靠近搖桿2 0之旋轉軸心1 9。 本發明之線夾1對搖桿2 0之慣性力矩之貢獻遠小於 U S 5 9 0 1 8 9 6之解決方案,因而使搖桿2 〇在較小的承 200849435 載力下有較大的加速度。 -由特殊材料製成的夾鉗口 5或6能以習知方式固鎖 到臂2及3。尤其,夾鉗口 5或6之任何一個均須 不直接固鎖到壓電彎曲元件8,此事很難。 -壓電彎曲元件8之服務壽命遠大於「多層堆疊壓電」 馬達。 -打開或關閉線夾1所需時間一般係小於1 ms (微秒)。 線夾1之壓電彎曲元件8具有三個電極。在操作時, 一恆定電壓v!或V2被施加到兩個外部電極,例如ν1=ον 且V2 = 45 0V。一可變電壓V3被施加到中間電極,V3係在電 壓¥!與V2之間。若電壓V3大於1/2(V2- V〇,壓電彎曲元 件8即彎曲到一側,使得線夾1被關閉。若電壓V 3小於 1/2(V2- Vi ),壓電彎曲元件8彎曲到另一側,使得線夾1 被打開。壓電彎曲元件8之曲率不爲人眼察知。兩夾鉗口 5或6(第1圖)在線上產生的力係正比於Vs-mas-VO。因 爲壓電彎曲元件8在操作時彎曲到一側或另一側,故壓電 彎曲元件8在扣件7的承載點會移動,雖然僅移動微米大 小之距離。 爲了抑制線夾1之可動臂3在關閉時的非所欲振盪或 至少降低到可接受的量,較佳爲設置機械或電氣阻尼。爲 達成機械阻尼,一由彈性材料如魯巴索伯(Rub asorb)製成的 阻尼元件,即一零件16(第1圖)被挾持於壓電彎曲元件8 與第1臂2之間,較佳爲在壓電振盪的波腹區域中。替 200849435 代地,可爲壓電彎曲元件8之電氣阻尼,其中控制壓電增 曲兀件8之電氣電路藉由測量施加到壓電彎曲元件8的電 壓及/或流經壓電彎曲元件8的電流而辨識振盪的傾向,以 主動地將其等衰減。 雖然本發明之實施例及應用已經顯示且已說明,但裹 熟於此技術者當了解,採取此說明書之優點後,在不違離 本發明在此之槪念,可能有比上述之更多的修正變化^ 案。因而,本發明在隨附之申請專利範圍及其均等案之精 神以外並不受限。 【圖式簡單說明】 附圖加入本說明書中且構成本說明書之一部分,其{系 顯示本發明之一或多個實施例,且與詳細說明一起用來解 釋本發明實施之原理。圖面係示意圖,並無真正的比例。 圖中: 第1圖是顯示依本發明之線夾在打開狀態的頂視圖。 第2圖係顯示裝設有依本發明之線夾的打線機之結合 頭的搖桿之側視圖。 【主要元件符號說明】 1 線夾 2 第1臂 3 第2臂 4 軸心 5,6 夾鉗口 200849435 7 扣件 8 壓電彎曲元件 9 壓電彎曲元件之端部 10 壓電彎曲元件之端部 11 箭號 12, 13角件之臂 14 零件 15 螺絲 16 彈性材料製成之零件 17 結合頭 18 平台 19 軸心 20 搖桿 2 1 馬達 22 超音波換能器 2 3 角狀件 2 4 毛細管 25 壓電驅動器 •10-

Claims (1)

  1. 200849435 十、申請專利範圍: • 1 · 一種打線機之線夾,包括: 一第1臂(2), 一第2臂(3),安裝在第i—(2)上使得其可繞一預定軸 心(4)旋轉’第1臂(2 )及第2臂(3 )在遠離該軸心(4)的一 端具有夾鉗口(5或6), 一扣件(7),配置在第1臂(2)上,及 一壓電彎曲元件(8 ),用於打開及關閉線夾(1 ),壓電彎 ' 曲元件(8)之一端鎖固到第2臂(3),且壓電彎曲元件(8) 之對向端係抵住於該扣件(7)。 2.如申請專利範圍第1項之線夾,其中扣件(7)之位置爲可 調整。 3 .如申請專利範圍第1或2項之線夾’其又包括一彈性材 料製成的零件(16) ’該零件Ο6)挟持在壓電彎曲元件(8) 與第1臂(2)之間。 -11 -
TW097121357A 2007-06-11 2008-06-09 Wire clamp for a wire bonder TW200849435A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH00946/07A CH698828B1 (de) 2007-06-11 2007-06-11 Drahtklammer für einen Wire Bonder.

Publications (1)

Publication Number Publication Date
TW200849435A true TW200849435A (en) 2008-12-16

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ID=40094937

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097121357A TW200849435A (en) 2007-06-11 2008-06-09 Wire clamp for a wire bonder

Country Status (4)

Country Link
US (1) US20080302857A1 (zh)
CH (1) CH698828B1 (zh)
TW (1) TW200849435A (zh)
WO (1) WO2008151952A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7549569B2 (en) * 2006-06-29 2009-06-23 Asm Technology Singapore Pte Ltd. Wire clamp gap control mechanism and method
JP5930423B2 (ja) 2014-05-09 2016-06-08 株式会社カイジョー ボンディング装置
TWI643276B (zh) * 2016-08-23 2018-12-01 日商新川股份有限公司 夾線裝置的校準方法以及打線裝置
US11420287B2 (en) * 2019-09-29 2022-08-23 Ningbo Shangjin Automation Technology Co., Ltd. Wire clamping system for fully automatic wire bonding machine
KR20220007247A (ko) * 2020-07-10 2022-01-18 삼성전자주식회사 와이어 본딩 장치

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JPS57159034A (en) * 1981-03-27 1982-10-01 Hitachi Ltd Wire clamping device
DE3447657A1 (de) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München Drahtklemmvorrichtung
US4653681A (en) * 1985-05-16 1987-03-31 Kulicke And Soffa Industries, Inc. Voice coil actuated fine wire clamp
US5314175A (en) * 1990-02-27 1994-05-24 Matsushita Electric Industrial Co., Ltd. Wire clamping device and wire clamping method
JP3005783B2 (ja) * 1993-03-09 2000-02-07 株式会社新川 ワイヤクランパ
JP3005784B2 (ja) * 1993-03-09 2000-02-07 株式会社新川 ワイヤクランパ
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JPH1092863A (ja) * 1996-09-13 1998-04-10 Tosok Corp ボンディング装置用ワイヤクランパ
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US6899262B2 (en) * 2003-05-19 2005-05-31 Asm Technology Singapore Pte Ltd Clamping device

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Publication number Publication date
US20080302857A1 (en) 2008-12-11
WO2008151952A1 (de) 2008-12-18
CH698828B1 (de) 2009-11-13

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