TW200849435A - Wire clamp for a wire bonder - Google Patents
Wire clamp for a wire bonder Download PDFInfo
- Publication number
- TW200849435A TW200849435A TW097121357A TW97121357A TW200849435A TW 200849435 A TW200849435 A TW 200849435A TW 097121357 A TW097121357 A TW 097121357A TW 97121357 A TW97121357 A TW 97121357A TW 200849435 A TW200849435 A TW 200849435A
- Authority
- TW
- Taiwan
- Prior art keywords
- arm
- clamp
- bending element
- wire
- piezoelectric bending
- Prior art date
Links
- 238000005452 bending Methods 0.000 claims abstract description 30
- 239000013013 elastic material Substances 0.000 claims description 7
- 238000013016 damping Methods 0.000 description 3
- 241000309551 Arthraxon hispidus Species 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000013017 mechanical damping Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Description
200849435 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種打線機之線夾。 【先前技術】 打線機係用於在半導體晶片與基板之間形成線連接之 機器。打線機包含一結合頭,其具有在水平xy平面中移動 之平台,在此平台上安裝有一可繞一水平軸心旋轉的搖 桿。一超音波換能器被固緊到搖桿上,在其一端夾持一毛 細管。搖桿包含一大致平行於超音波換能器而移動的臂, 在其上固緊一線夾,此臂位於毛細管上方。毛細管用來將 線固緊到半導體晶片之一連接點且固緊到基板之一連接 點,並且引導在此二連接點之間的線。線捲繞在一線軸上 且藉由一饋線裝置而被進給到毛細管,線移動穿過線夾及 毛細管之一縱向鑽孔。 此線夾在先前技術中已周知。從U S 4 6 5 3 6 8 1得知一線 夾,其由線性馬達所致動,被固定到臂上遠離毛細管之端 部。線性馬達有多項缺點:其有大的移動質量,因而產生 大量廢熱,且很慢。從US 5 43 5 4 77及US 5 746422得知一線 夾,其具有一由串聯的多個之獨立壓電元件構成之馬達(多 層堆疊壓電馬達),及多個薄膜層。薄膜層之結構複雜。除 此之外,此一馬達之有限服務壽命是很不利。從US 5 90 1 8 96 得知一線夾,其由一壓電彎曲元件所致動,而直接作用在 線夾之夾鉗口。壓電彎曲元件係很重的元件,在此案中造 成搖桿之慣性力矩大幅地增加。 200849435 【發明內容】 本發明之一目的在發展一種線夾,其可使結合頭之搖 桿的慣性力矩變成儘可能地小。 一打線機之線夾包括一第1臂,及安裝在第1臂上使 得其可繞一預定軸心旋轉之一第2臂。第1臂及第2臂在 遠離軸心的一端具有夾鉗口。線夾另包括一壓電彎曲元 件,用於打開及關閉線夾。壓電彎曲元件之一端鎖固到可 f、 動臂,且壓電彎曲元件之對向端係鎖固到第1臂之扣件。 扣件之位置較佳爲可調整,使得假定在線夾之打開狀態的 夾鉗口之間的間隔可被設定。較佳爲設置一^機械或電氣阻 尼器用以抑制或至少降低線夾在關閉時之振動。 【實施方式】 第1圖是顯示依本發明之線夾1在打開狀態下的頂視 圖。線夾1包括:一第1臂2,固鎖到打線機之結合頭的 搖桿;及一第2臂3,可相對於第1臂2移動。第2臂3 ί ^ 安裝於第1臂2上,使得其可繞垂直於圖面之平面之軸心 4旋轉。一夾紺口 5或6被固鎖到臂2及3在遠離軸心4 的一端。一扣件7配置在第1臂2對向於具夾鉗口 5之端 部。扣件7較佳爲包含塑膠。線夾1之操作係使用一壓電 彎曲元件8而進行,其一端固鎖於第2可移動臂3,且其 另一方面端抵住於扣件7中。 扣件7固鎖到第1臂2,使得其可朝箭號η所示之方 向位移。一簡單方案顯示於第1圖。一具有兩臂12及13 200849435 的角件被固鎖到第1臂2。由如橡膠之彈性材料製成的零 • 件1 4被膠合到臂1 3。扣件7位於線夾1之第1臂2與彈 性材料製成的零件14之間。安裝在一導入第!臂2之螺紋 的一螺絲1 5將扣件7壓抵於彈性材料製成的零件丨4。扣 件7被挾持於螺絲1 5與彈性材料製成的零件1 4之間。藉 由轉動螺絲1 5,扣件7之位置可朝方向1 1位移且因而可 調整在打開狀態的兩夾鉗口 5或6之間的距離。 第2圖係示意顯示打線機之結合頭17之側視圖。結合
I 頭17包括一可在一水平面移動之平台18,一搖桿20在平 台1 8上可繞一水平移動之旋轉軸心1 9旋轉,且在平台1 8 上裝設有使搖桿20可繞旋轉軸心1 9旋轉的馬達2 1。一超 音波換能器2 2被固鎖到搖桿2 0。 超音波換能器22包括一角狀件23及至少一壓電驅動 器25,用於將超音波換能器22激發爲超音波振盪,角狀 件23之一端挾持有一毛細管24。在第2圖中,具有夾鉗 口 6之線夾1之第2臂3、壓電彎曲元件8、及角件之臂1 3 爲可見。第1臂2位於第2臂3之後面且爲了圖面清楚而 省略。 以此線夾之方案提供下列優點: -壓電彎曲元件8位於靠近線夾1遠離夾鉗口 5或6 的一端,且因而相當靠近搖桿2 0之旋轉軸心1 9。 本發明之線夾1對搖桿2 0之慣性力矩之貢獻遠小於 U S 5 9 0 1 8 9 6之解決方案,因而使搖桿2 〇在較小的承 200849435 載力下有較大的加速度。 -由特殊材料製成的夾鉗口 5或6能以習知方式固鎖 到臂2及3。尤其,夾鉗口 5或6之任何一個均須 不直接固鎖到壓電彎曲元件8,此事很難。 -壓電彎曲元件8之服務壽命遠大於「多層堆疊壓電」 馬達。 -打開或關閉線夾1所需時間一般係小於1 ms (微秒)。 線夾1之壓電彎曲元件8具有三個電極。在操作時, 一恆定電壓v!或V2被施加到兩個外部電極,例如ν1=ον 且V2 = 45 0V。一可變電壓V3被施加到中間電極,V3係在電 壓¥!與V2之間。若電壓V3大於1/2(V2- V〇,壓電彎曲元 件8即彎曲到一側,使得線夾1被關閉。若電壓V 3小於 1/2(V2- Vi ),壓電彎曲元件8彎曲到另一側,使得線夾1 被打開。壓電彎曲元件8之曲率不爲人眼察知。兩夾鉗口 5或6(第1圖)在線上產生的力係正比於Vs-mas-VO。因 爲壓電彎曲元件8在操作時彎曲到一側或另一側,故壓電 彎曲元件8在扣件7的承載點會移動,雖然僅移動微米大 小之距離。 爲了抑制線夾1之可動臂3在關閉時的非所欲振盪或 至少降低到可接受的量,較佳爲設置機械或電氣阻尼。爲 達成機械阻尼,一由彈性材料如魯巴索伯(Rub asorb)製成的 阻尼元件,即一零件16(第1圖)被挾持於壓電彎曲元件8 與第1臂2之間,較佳爲在壓電振盪的波腹區域中。替 200849435 代地,可爲壓電彎曲元件8之電氣阻尼,其中控制壓電增 曲兀件8之電氣電路藉由測量施加到壓電彎曲元件8的電 壓及/或流經壓電彎曲元件8的電流而辨識振盪的傾向,以 主動地將其等衰減。 雖然本發明之實施例及應用已經顯示且已說明,但裹 熟於此技術者當了解,採取此說明書之優點後,在不違離 本發明在此之槪念,可能有比上述之更多的修正變化^ 案。因而,本發明在隨附之申請專利範圍及其均等案之精 神以外並不受限。 【圖式簡單說明】 附圖加入本說明書中且構成本說明書之一部分,其{系 顯示本發明之一或多個實施例,且與詳細說明一起用來解 釋本發明實施之原理。圖面係示意圖,並無真正的比例。 圖中: 第1圖是顯示依本發明之線夾在打開狀態的頂視圖。 第2圖係顯示裝設有依本發明之線夾的打線機之結合 頭的搖桿之側視圖。 【主要元件符號說明】 1 線夾 2 第1臂 3 第2臂 4 軸心 5,6 夾鉗口 200849435 7 扣件 8 壓電彎曲元件 9 壓電彎曲元件之端部 10 壓電彎曲元件之端部 11 箭號 12, 13角件之臂 14 零件 15 螺絲 16 彈性材料製成之零件 17 結合頭 18 平台 19 軸心 20 搖桿 2 1 馬達 22 超音波換能器 2 3 角狀件 2 4 毛細管 25 壓電驅動器 •10-
Claims (1)
- 200849435 十、申請專利範圍: • 1 · 一種打線機之線夾,包括: 一第1臂(2), 一第2臂(3),安裝在第i—(2)上使得其可繞一預定軸 心(4)旋轉’第1臂(2 )及第2臂(3 )在遠離該軸心(4)的一 端具有夾鉗口(5或6), 一扣件(7),配置在第1臂(2)上,及 一壓電彎曲元件(8 ),用於打開及關閉線夾(1 ),壓電彎 ' 曲元件(8)之一端鎖固到第2臂(3),且壓電彎曲元件(8) 之對向端係抵住於該扣件(7)。 2.如申請專利範圍第1項之線夾,其中扣件(7)之位置爲可 調整。 3 .如申請專利範圍第1或2項之線夾’其又包括一彈性材 料製成的零件(16) ’該零件Ο6)挟持在壓電彎曲元件(8) 與第1臂(2)之間。 -11 -
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH00946/07A CH698828B1 (de) | 2007-06-11 | 2007-06-11 | Drahtklammer für einen Wire Bonder. |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200849435A true TW200849435A (en) | 2008-12-16 |
Family
ID=40094937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097121357A TW200849435A (en) | 2007-06-11 | 2008-06-09 | Wire clamp for a wire bonder |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080302857A1 (zh) |
CH (1) | CH698828B1 (zh) |
TW (1) | TW200849435A (zh) |
WO (1) | WO2008151952A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7549569B2 (en) * | 2006-06-29 | 2009-06-23 | Asm Technology Singapore Pte Ltd. | Wire clamp gap control mechanism and method |
JP5930423B2 (ja) | 2014-05-09 | 2016-06-08 | 株式会社カイジョー | ボンディング装置 |
TWI643276B (zh) * | 2016-08-23 | 2018-12-01 | 日商新川股份有限公司 | 夾線裝置的校準方法以及打線裝置 |
US11420287B2 (en) * | 2019-09-29 | 2022-08-23 | Ningbo Shangjin Automation Technology Co., Ltd. | Wire clamping system for fully automatic wire bonding machine |
KR20220007247A (ko) * | 2020-07-10 | 2022-01-18 | 삼성전자주식회사 | 와이어 본딩 장치 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57159034A (en) * | 1981-03-27 | 1982-10-01 | Hitachi Ltd | Wire clamping device |
DE3447657A1 (de) * | 1984-12-28 | 1986-07-10 | Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München | Drahtklemmvorrichtung |
US4653681A (en) * | 1985-05-16 | 1987-03-31 | Kulicke And Soffa Industries, Inc. | Voice coil actuated fine wire clamp |
US5314175A (en) * | 1990-02-27 | 1994-05-24 | Matsushita Electric Industrial Co., Ltd. | Wire clamping device and wire clamping method |
JP3005783B2 (ja) * | 1993-03-09 | 2000-02-07 | 株式会社新川 | ワイヤクランパ |
JP3005784B2 (ja) * | 1993-03-09 | 2000-02-07 | 株式会社新川 | ワイヤクランパ |
JP3079503B2 (ja) * | 1995-09-13 | 2000-08-21 | 株式会社新川 | クランプ装置 |
JPH1092863A (ja) * | 1996-09-13 | 1998-04-10 | Tosok Corp | ボンディング装置用ワイヤクランパ |
US5901896A (en) * | 1997-06-26 | 1999-05-11 | Kulicke And Soffa Investments, Inc | Balanced low mass miniature wire clamp |
DE29810973U1 (de) * | 1998-06-19 | 1999-11-11 | Hesse & Knipps GmbH, 33100 Paderborn | Drahtklammer |
US6513696B1 (en) * | 2000-08-28 | 2003-02-04 | Asm Assembly Automation Ltd. | Wedge bonding head |
US6899262B2 (en) * | 2003-05-19 | 2005-05-31 | Asm Technology Singapore Pte Ltd | Clamping device |
-
2007
- 2007-06-11 CH CH00946/07A patent/CH698828B1/de not_active IP Right Cessation
-
2008
- 2008-06-02 WO PCT/EP2008/056731 patent/WO2008151952A1/de active Application Filing
- 2008-06-05 US US12/133,446 patent/US20080302857A1/en not_active Abandoned
- 2008-06-09 TW TW097121357A patent/TW200849435A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20080302857A1 (en) | 2008-12-11 |
WO2008151952A1 (de) | 2008-12-18 |
CH698828B1 (de) | 2009-11-13 |
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