TW200845834A - ARC recovery without over-voltage for plasma chamber power supplies using a shunt switch - Google Patents
ARC recovery without over-voltage for plasma chamber power supplies using a shunt switch Download PDFInfo
- Publication number
- TW200845834A TW200845834A TW097105285A TW97105285A TW200845834A TW 200845834 A TW200845834 A TW 200845834A TW 097105285 A TW097105285 A TW 097105285A TW 97105285 A TW97105285 A TW 97105285A TW 200845834 A TW200845834 A TW 200845834A
- Authority
- TW
- Taiwan
- Prior art keywords
- power supply
- pulse wave
- supply unit
- shunt switch
- parameter value
- Prior art date
Links
- 238000011084 recovery Methods 0.000 title claims 2
- 238000000034 method Methods 0.000 claims abstract description 21
- 230000001960 triggered effect Effects 0.000 claims description 9
- 239000002002 slurry Substances 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 3
- 210000000078 claw Anatomy 0.000 claims description 2
- 230000008569 process Effects 0.000 claims description 2
- 206010011469 Crying Diseases 0.000 claims 1
- 210000002784 stomach Anatomy 0.000 claims 1
- 230000008030 elimination Effects 0.000 description 21
- 238000003379 elimination reaction Methods 0.000 description 21
- 238000010586 diagram Methods 0.000 description 16
- 239000003990 capacitor Substances 0.000 description 8
- 230000005611 electricity Effects 0.000 description 7
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- 230000006378 damage Effects 0.000 description 3
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- 238000013461 design Methods 0.000 description 3
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- 230000009467 reduction Effects 0.000 description 3
- 241000270666 Testudines Species 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000004146 energy storage Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241000219112 Cucumis Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- 206010033799 Paralysis Diseases 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
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- 239000011248 coating agent Substances 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
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- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
- H02H3/08—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess current
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/677,786 US8217299B2 (en) | 2007-02-22 | 2007-02-22 | Arc recovery without over-voltage for plasma chamber power supplies using a shunt switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200845834A true TW200845834A (en) | 2008-11-16 |
Family
ID=39710440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097105285A TW200845834A (en) | 2007-02-22 | 2008-02-15 | ARC recovery without over-voltage for plasma chamber power supplies using a shunt switch |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8217299B2 (enExample) |
| EP (1) | EP2113085B8 (enExample) |
| JP (1) | JP2010519708A (enExample) |
| KR (1) | KR101274514B1 (enExample) |
| CN (1) | CN101641604A (enExample) |
| TW (1) | TW200845834A (enExample) |
| WO (1) | WO2008103600A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI576017B (zh) * | 2014-08-25 | 2017-03-21 | 京三製作所股份有限公司 | 再生循環器、高頻電源裝置及高頻電力之再生方法 |
Families Citing this family (39)
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| US8815329B2 (en) * | 2008-12-05 | 2014-08-26 | Advanced Energy Industries, Inc. | Delivered energy compensation during plasma processing |
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| US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
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| US11791138B2 (en) | 2021-05-12 | 2023-10-17 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
| US11948780B2 (en) | 2021-05-12 | 2024-04-02 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
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-
2007
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2008
- 2008-02-15 CN CN200880009384A patent/CN101641604A/zh active Pending
- 2008-02-15 KR KR1020097018460A patent/KR101274514B1/ko not_active Expired - Fee Related
- 2008-02-15 EP EP08729944.2A patent/EP2113085B8/en active Active
- 2008-02-15 TW TW097105285A patent/TW200845834A/zh unknown
- 2008-02-15 JP JP2009550968A patent/JP2010519708A/ja not_active Withdrawn
- 2008-02-15 WO PCT/US2008/054056 patent/WO2008103600A1/en not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI576017B (zh) * | 2014-08-25 | 2017-03-21 | 京三製作所股份有限公司 | 再生循環器、高頻電源裝置及高頻電力之再生方法 |
| US10355607B2 (en) | 2014-08-25 | 2019-07-16 | Kyosan Electric Mfg. Co., Ltd. | Regeneration circulator, high-frequency power supply device, and high-frequency power regeneration method |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2113085B1 (en) | 2019-06-12 |
| US20080203070A1 (en) | 2008-08-28 |
| CN101641604A (zh) | 2010-02-03 |
| EP2113085A1 (en) | 2009-11-04 |
| WO2008103600A1 (en) | 2008-08-28 |
| EP2113085B8 (en) | 2019-07-24 |
| KR20090121301A (ko) | 2009-11-25 |
| US8217299B2 (en) | 2012-07-10 |
| KR101274514B1 (ko) | 2013-06-13 |
| JP2010519708A (ja) | 2010-06-03 |
| EP2113085A4 (en) | 2015-05-06 |
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