TW200845834A - ARC recovery without over-voltage for plasma chamber power supplies using a shunt switch - Google Patents

ARC recovery without over-voltage for plasma chamber power supplies using a shunt switch Download PDF

Info

Publication number
TW200845834A
TW200845834A TW097105285A TW97105285A TW200845834A TW 200845834 A TW200845834 A TW 200845834A TW 097105285 A TW097105285 A TW 097105285A TW 97105285 A TW97105285 A TW 97105285A TW 200845834 A TW200845834 A TW 200845834A
Authority
TW
Taiwan
Prior art keywords
power supply
pulse wave
supply unit
shunt switch
parameter value
Prior art date
Application number
TW097105285A
Other languages
English (en)
Chinese (zh)
Inventor
Milan Ilic
Vladislav V Shilo
Robert Huff
Original Assignee
Advanced Energy Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Energy Ind Inc filed Critical Advanced Energy Ind Inc
Publication of TW200845834A publication Critical patent/TW200845834A/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H3/00Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
    • H02H3/08Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess current
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/12Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32174Circuits specially adapted for controlling the RF discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma Technology (AREA)
TW097105285A 2007-02-22 2008-02-15 ARC recovery without over-voltage for plasma chamber power supplies using a shunt switch TW200845834A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/677,786 US8217299B2 (en) 2007-02-22 2007-02-22 Arc recovery without over-voltage for plasma chamber power supplies using a shunt switch

Publications (1)

Publication Number Publication Date
TW200845834A true TW200845834A (en) 2008-11-16

Family

ID=39710440

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097105285A TW200845834A (en) 2007-02-22 2008-02-15 ARC recovery without over-voltage for plasma chamber power supplies using a shunt switch

Country Status (7)

Country Link
US (1) US8217299B2 (enExample)
EP (1) EP2113085B8 (enExample)
JP (1) JP2010519708A (enExample)
KR (1) KR101274514B1 (enExample)
CN (1) CN101641604A (enExample)
TW (1) TW200845834A (enExample)
WO (1) WO2008103600A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576017B (zh) * 2014-08-25 2017-03-21 京三製作所股份有限公司 再生循環器、高頻電源裝置及高頻電力之再生方法

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7817382B2 (en) * 2008-01-02 2010-10-19 Honeywell International, Inc. Hybrid high voltage DC contactor with arc energy diversion
KR101606734B1 (ko) * 2008-07-07 2016-03-28 램 리써치 코포레이션 플라즈마 프로세싱 챔버에서 인시츄 아킹 이벤트들을 검출하기 위한 패시브 용량성-커플링된 정전식 (cce) 프로브 장치
US8044594B2 (en) 2008-07-31 2011-10-25 Advanced Energy Industries, Inc. Power supply ignition system and method
US20110236591A1 (en) * 2008-11-28 2011-09-29 General Plasma Inc. Bipolar rectifier power supply
US8395078B2 (en) * 2008-12-05 2013-03-12 Advanced Energy Industries, Inc Arc recovery with over-voltage protection for plasma-chamber power supplies
US8815329B2 (en) * 2008-12-05 2014-08-26 Advanced Energy Industries, Inc. Delivered energy compensation during plasma processing
EP2648209B1 (en) 2009-02-17 2018-01-03 Solvix GmbH A power supply device for plasma processing
DE102010031568B4 (de) 2010-07-20 2014-12-11 TRUMPF Hüttinger GmbH + Co. KG Arclöschanordnung und Verfahren zum Löschen von Arcs
US8552665B2 (en) * 2010-08-20 2013-10-08 Advanced Energy Industries, Inc. Proactive arc management of a plasma load
KR101303040B1 (ko) * 2012-02-28 2013-09-03 주식회사 뉴파워 프라즈마 플라즈마 챔버의 아크 검출 방법 및 장치
US9287098B2 (en) 2012-11-01 2016-03-15 Advanced Energy Industries, Inc. Charge removal from electrodes in unipolar sputtering system
US9129776B2 (en) * 2012-11-01 2015-09-08 Advanced Energy Industries, Inc. Differing boost voltages applied to two or more anodeless electrodes for plasma processing
US9226380B2 (en) 2012-11-01 2015-12-29 Advanced Energy Industries, Inc. Adjustable non-dissipative voltage boosting snubber network
US20140217832A1 (en) * 2013-02-06 2014-08-07 Astec International Limited Disconnect switches in dc power systems
US10510575B2 (en) 2017-09-20 2019-12-17 Applied Materials, Inc. Substrate support with multiple embedded electrodes
US10555412B2 (en) 2018-05-10 2020-02-04 Applied Materials, Inc. Method of controlling ion energy distribution using a pulse generator with a current-return output stage
US11476145B2 (en) 2018-11-20 2022-10-18 Applied Materials, Inc. Automatic ESC bias compensation when using pulsed DC bias
KR20250100790A (ko) 2019-01-22 2025-07-03 어플라이드 머티어리얼스, 인코포레이티드 펄스 전압 파형을 제어하기 위한 피드백 루프
US11508554B2 (en) 2019-01-24 2022-11-22 Applied Materials, Inc. High voltage filter assembly
US11462388B2 (en) 2020-07-31 2022-10-04 Applied Materials, Inc. Plasma processing assembly using pulsed-voltage and radio-frequency power
US11901157B2 (en) 2020-11-16 2024-02-13 Applied Materials, Inc. Apparatus and methods for controlling ion energy distribution
US11798790B2 (en) 2020-11-16 2023-10-24 Applied Materials, Inc. Apparatus and methods for controlling ion energy distribution
US20220324049A1 (en) * 2021-04-13 2022-10-13 Esab Ab Overvoltage protection for current braking switch
US11495470B1 (en) 2021-04-16 2022-11-08 Applied Materials, Inc. Method of enhancing etching selectivity using a pulsed plasma
US11791138B2 (en) 2021-05-12 2023-10-17 Applied Materials, Inc. Automatic electrostatic chuck bias compensation during plasma processing
US11948780B2 (en) 2021-05-12 2024-04-02 Applied Materials, Inc. Automatic electrostatic chuck bias compensation during plasma processing
US11967483B2 (en) 2021-06-02 2024-04-23 Applied Materials, Inc. Plasma excitation with ion energy control
US12148595B2 (en) 2021-06-09 2024-11-19 Applied Materials, Inc. Plasma uniformity control in pulsed DC plasma chamber
US20220399185A1 (en) 2021-06-09 2022-12-15 Applied Materials, Inc. Plasma chamber and chamber component cleaning methods
US11810760B2 (en) 2021-06-16 2023-11-07 Applied Materials, Inc. Apparatus and method of ion current compensation
US11569066B2 (en) 2021-06-23 2023-01-31 Applied Materials, Inc. Pulsed voltage source for plasma processing applications
US11476090B1 (en) 2021-08-24 2022-10-18 Applied Materials, Inc. Voltage pulse time-domain multiplexing
US12106938B2 (en) 2021-09-14 2024-10-01 Applied Materials, Inc. Distortion current mitigation in a radio frequency plasma processing chamber
US11694876B2 (en) 2021-12-08 2023-07-04 Applied Materials, Inc. Apparatus and method for delivering a plurality of waveform signals during plasma processing
US11972924B2 (en) 2022-06-08 2024-04-30 Applied Materials, Inc. Pulsed voltage source for plasma processing applications
US12315732B2 (en) 2022-06-10 2025-05-27 Applied Materials, Inc. Method and apparatus for etching a semiconductor substrate in a plasma etch chamber
US12272524B2 (en) 2022-09-19 2025-04-08 Applied Materials, Inc. Wideband variable impedance load for high volume manufacturing qualification and on-site diagnostics
US12111341B2 (en) 2022-10-05 2024-10-08 Applied Materials, Inc. In-situ electric field detection method and apparatus
WO2025136657A1 (en) * 2023-12-19 2025-06-26 Advanced Energy Industries, Inc. Capacitance sensing systems and methods

Family Cites Families (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3867669A (en) 1974-01-11 1975-02-18 Yakov Lvovich Krasik Power source with a sparkproof output
DE3010099A1 (de) 1980-02-25 1981-09-03 BBC AG Brown, Boveri & Cie., Baden, Aargau Elektronische schutzschaltung
US4459629A (en) 1981-11-23 1984-07-10 General Electric Company Electric circuit breaker utilizing semiconductor diodes for facilitating interruption
BG41745A1 (en) 1984-12-29 1987-08-14 Minchev Device for discontinuing of arc dicharges in gas dicharge vessel
US4740858A (en) 1985-08-06 1988-04-26 Mitsubishi Denki Kabushiki Kaisha Zero-current arc-suppression dc circuit breaker
US4871421A (en) 1988-09-15 1989-10-03 Lam Research Corporation Split-phase driver for plasma etch system
US4936960A (en) 1989-01-03 1990-06-26 Advanced Energy Industries, Inc. Method and apparatus for recovery from low impedance condition during cathodic arc processes
EP0383962A1 (de) 1989-02-20 1990-08-29 Hauzer Holding B.V. Hochspannungsgleichrichter und zugeordnete Steuerelektronik
US5241152A (en) 1990-03-23 1993-08-31 Anderson Glen L Circuit for detecting and diverting an electrical arc in a glow discharge apparatus
DE9109503U1 (de) * 1991-07-31 1991-10-17 Magtron Magneto Elektronische Geraete Gmbh, 7583 Ottersweier Schaltungsanordnung für ein Stromversorgungsgerät für Geräte und Anlagen der Plasma- und Oberflächentechnik
US5281321A (en) 1991-08-20 1994-01-25 Leybold Aktiengesellschaft Device for the suppression of arcs
DE4127504A1 (de) 1991-08-20 1993-02-25 Leybold Ag Einrichtung zur unterdrueckung von lichtboegen
US5349166A (en) 1991-10-31 1994-09-20 Engineering & Research Associates, Inc. RF generator for plastic tubing sealers
US5525199A (en) 1991-11-13 1996-06-11 Optical Corporation Of America Low pressure reactive magnetron sputtering apparatus and method
US5415757A (en) 1991-11-26 1995-05-16 Leybold Aktiengesellschaft Apparatus for coating a substrate with electrically nonconductive coatings
DE4202425C2 (de) 1992-01-29 1997-07-17 Leybold Ag Verfahren und Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten
CH689767A5 (de) 1992-03-24 1999-10-15 Balzers Hochvakuum Verfahren zur Werkstueckbehandlung in einer Vakuumatmosphaere und Vakuumbehandlungsanlage.
US5418707A (en) 1992-04-13 1995-05-23 The United States Of America As Represented By The United States Department Of Energy High voltage dc-dc converter with dynamic voltage regulation and decoupling during load-generated arcs
US5307004A (en) 1992-07-06 1994-04-26 Carsten Bruce W Soft switching boost and buck regulators
JP3631246B2 (ja) 1992-09-30 2005-03-23 アドバンスド エナージィ インダストリーズ,インコーポレイテッド 形状的に精密な薄膜フィルムコーティングシステム
DE4233720C2 (de) 1992-10-07 2001-05-17 Leybold Ag Einrichtung für die Verhinderung von Überschlägen in Vakuum-Zerstäubungsanlagen
US5718813A (en) 1992-12-30 1998-02-17 Advanced Energy Industries, Inc. Enhanced reactive DC sputtering system
US6217717B1 (en) 1992-12-30 2001-04-17 Advanced Energy Industries, Inc. Periodically clearing thin film plasma processing system
US5427669A (en) 1992-12-30 1995-06-27 Advanced Energy Industries, Inc. Thin film DC plasma processing system
US5698082A (en) 1993-08-04 1997-12-16 Balzers Und Leybold Method and apparatus for coating substrates in a vacuum chamber, with a system for the detection and suppression of undesirable arcing
US6258219B1 (en) 1993-09-09 2001-07-10 Applied Materials, Inc. Two-step deposition process for preventing arcs
US5573596A (en) 1994-01-28 1996-11-12 Applied Materials, Inc. Arc suppression in a plasma processing system
US5651865A (en) 1994-06-17 1997-07-29 Eni Preferential sputtering of insulators from conductive targets
DE4438463C1 (de) 1994-10-27 1996-02-15 Fraunhofer Ges Forschung Verfahren und Schaltung zur bipolaren pulsförmigen Energieeinspeisung in Niederdruckplasmen
DE4441206C2 (de) 1994-11-19 1996-09-26 Leybold Ag Einrichtung für die Unterdrückung von Überschlägen in Kathoden-Zerstäubungseinrichtungen
US5535906A (en) 1995-01-30 1996-07-16 Advanced Energy Industries, Inc. Multi-phase DC plasma processing system
US5584972A (en) 1995-02-01 1996-12-17 Sony Corporation Plasma noise and arcing suppressor apparatus and method for sputter deposition
CA2218279A1 (en) 1995-04-25 1996-10-31 The Boc Group, Inc. Sputtering system using cylindrical rotating magnetron electrically powered using alternating current
US5576939A (en) 1995-05-05 1996-11-19 Drummond; Geoffrey N. Enhanced thin film DC plasma power supply
US5616224A (en) 1995-05-09 1997-04-01 Deposition Sciences, Inc. Apparatus for reducing the intensity and frequency of arcs which occur during a sputtering process
US6636545B2 (en) 1996-09-26 2003-10-21 Alexander V. Krasnov Supersonic and subsonic laser with radio frequency excitation
US5584974A (en) 1995-10-20 1996-12-17 Eni Arc control and switching element protection for pulsed dc cathode sputtering power supply
US5917286A (en) * 1996-05-08 1999-06-29 Advanced Energy Industries, Inc. Pulsed direct current power supply configurations for generating plasmas
US5682067A (en) 1996-06-21 1997-10-28 Sierra Applied Sciences, Inc. Circuit for reversing polarity on electrodes
US5882492A (en) 1996-06-21 1999-03-16 Sierra Applied Sciences, Inc. A.C. plasma processing system
NL1004215C2 (nl) 1996-10-07 1998-04-10 Avot Beheer Bv Afschermhouder voor een pot- of bakvormige houder.
JP3070004B2 (ja) 1996-11-19 2000-07-24 株式会社ランドマークテクノロジー プラズマ・プロセス監視装置
DE69841671D1 (de) 1997-02-20 2010-07-01 Shibaura Mechatronics Corp Stromversorgungseinheit für sputtervorrichtung
US6174450B1 (en) 1997-04-16 2001-01-16 Lam Research Corporation Methods and apparatus for controlling ion energy and plasma density in a plasma processing system
US5945786A (en) * 1997-06-02 1999-08-31 High End Systems, Inc. Discharge lamp igniter with reduced noise output
JP4120974B2 (ja) 1997-06-17 2008-07-16 キヤノンアネルバ株式会社 薄膜作製方法および薄膜作製装置
US6332961B1 (en) 1997-09-17 2001-12-25 Tokyo Electron Limited Device and method for detecting and preventing arcing in RF plasma systems
US6633017B1 (en) * 1997-10-14 2003-10-14 Advanced Energy Industries, Inc. System for plasma ignition by fast voltage rise
US5971591A (en) * 1997-10-20 1999-10-26 Eni Technologies, Inc. Process detection system for plasma process
US5889391A (en) 1997-11-07 1999-03-30 Sierra Applied Sciences, Inc. Power supply having combined regulator and pulsing circuits
US6162332A (en) 1998-05-07 2000-12-19 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for preventing arcing in sputter chamber
DE19937859C2 (de) 1999-08-13 2003-06-18 Huettinger Elektronik Gmbh Elektrische Versorgungseinheit für Plasmaanlagen
DE19949394A1 (de) 1999-10-13 2001-04-19 Balzers Process Systems Gmbh Elektrische Versorgungseinheit und Verfahren zur Reduktion der Funkenbildung beim Sputtern
US6552295B2 (en) 1999-12-20 2003-04-22 Research Triangle Institute Plasma furnace disposal of hazardous wastes
US7030335B2 (en) 2000-03-17 2006-04-18 Applied Materials, Inc. Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
US7220937B2 (en) 2000-03-17 2007-05-22 Applied Materials, Inc. Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination
US6894245B2 (en) 2000-03-17 2005-05-17 Applied Materials, Inc. Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
DE10015244C2 (de) 2000-03-28 2002-09-19 Fraunhofer Ges Forschung Verfahren und Schaltungsanordnung zur pulsförmigen Energieeinspeisung in Magnetronentladungen
TW505939B (en) 2000-03-28 2002-10-11 Kumamoto Technopolis Foundatio Apparatus for detecting plasma anomalous discharge and method of detecting the same
US6472822B1 (en) * 2000-04-28 2002-10-29 Applied Materials, Inc. Pulsed RF power delivery for plasma processing
US6447655B2 (en) 2000-05-30 2002-09-10 Alexander D. Lantsman DC plasma power supply for a sputter deposition
US6592710B1 (en) 2001-04-12 2003-07-15 Lam Research Corporation Apparatus for controlling the voltage applied to an electrostatic shield used in a plasma generator
US6577479B1 (en) 2000-08-28 2003-06-10 The Regents Of The University Of California Arc suppression circuit
US6447719B1 (en) 2000-10-02 2002-09-10 Johnson & Johnson Power system for sterilization systems employing low frequency plasma
US6524455B1 (en) 2000-10-04 2003-02-25 Eni Technology, Inc. Sputtering apparatus using passive arc control system and method
SE525231C2 (sv) 2001-06-14 2005-01-11 Chemfilt R & D Ab Förfarande och anordning för att alstra plasma
EP1434336A4 (en) 2001-09-28 2008-10-08 Shibaura Mechatronics Corp POWER SUPPLY FOR SPUTTER
JP2003225768A (ja) * 2002-01-30 2003-08-12 Komatsu Sanki Kk プラズマ切断機のメインアーク着火装置及びメインアーク着火制御方法
US6736944B2 (en) 2002-04-12 2004-05-18 Schneider Automation Inc. Apparatus and method for arc detection
US6708645B1 (en) 2002-04-12 2004-03-23 Compuvac Systems, Inc. Arc resistant high voltage feedthru fitting for a vacuum deposition chamber
US7086347B2 (en) 2002-05-06 2006-08-08 Lam Research Corporation Apparatus and methods for minimizing arcing in a plasma processing chamber
US7247221B2 (en) 2002-05-17 2007-07-24 Applied Films Corporation System and apparatus for control of sputter deposition process
US6808607B2 (en) 2002-09-25 2004-10-26 Advanced Energy Industries, Inc. High peak power plasma pulsed supply with arc handling
US7026174B2 (en) 2002-09-30 2006-04-11 Lam Research Corporation Method for reducing wafer arcing
TWI240601B (en) * 2002-11-26 2005-09-21 Tokyo Electron Ltd Plasma processing system and method
JP4447469B2 (ja) 2002-12-27 2010-04-07 株式会社日立国際電気 プラズマ発生装置、オゾン発生装置、基板処理装置、及び半導体デバイスの製造方法
CA2418836A1 (en) 2003-02-12 2004-08-12 Resorption Canada Ltd. Multiple plasma generator hazardous waste processing system
US6876205B2 (en) * 2003-06-06 2005-04-05 Advanced Energy Industries, Inc. Stored energy arc detection and arc reduction circuit
KR100807724B1 (ko) 2003-08-07 2008-02-28 가부시키가이샤 히다치 고쿠사이 덴키 기판처리장치 및 기판처리방법
US6967305B2 (en) * 2003-08-18 2005-11-22 Mks Instruments, Inc. Control of plasma transitions in sputter processing systems
US7095179B2 (en) 2004-02-22 2006-08-22 Zond, Inc. Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities
US6943317B1 (en) * 2004-07-02 2005-09-13 Advanced Energy Industries, Inc. Apparatus and method for fast arc extinction with early shunting of arc current in plasma
US7081598B2 (en) 2004-08-24 2006-07-25 Advanced Energy Industries, Inc. DC-DC converter with over-voltage protection circuit
US7292045B2 (en) 2004-09-04 2007-11-06 Applied Materials, Inc. Detection and suppression of electrical arcing
EP2477207A3 (en) 2004-09-24 2014-09-03 Zond, Inc. Apparatus for generating high-current electrical discharges
US7262606B2 (en) 2005-03-26 2007-08-28 Huettinger Elektronik Gmbh + Co. Kg Method of arc detection
US7305311B2 (en) 2005-04-22 2007-12-04 Advanced Energy Industries, Inc. Arc detection and handling in radio frequency power applications
US7265619B2 (en) 2005-07-06 2007-09-04 Raytheon Company Two stage microwave Class E power amplifier
US20070042131A1 (en) 2005-08-22 2007-02-22 Applied Materials, Inc., A Delaware Corporation Non-intrusive plasma monitoring system for arc detection and prevention for blanket CVD films
US7651492B2 (en) 2006-04-24 2010-01-26 Covidien Ag Arc based adaptive control system for an electrosurgical unit
US7514935B2 (en) 2006-09-13 2009-04-07 Advanced Energy Industries, Inc. System and method for managing power supplied to a plasma chamber
US7795817B2 (en) * 2006-11-24 2010-09-14 Huettinger Elektronik Gmbh + Co. Kg Controlled plasma power supply
EP1995818A1 (en) 2007-05-12 2008-11-26 Huettinger Electronic Sp. z o. o Circuit and method for reducing electrical energy stored in a lead inductance for fast extinction of plasma arcs
US8044594B2 (en) 2008-07-31 2011-10-25 Advanced Energy Industries, Inc. Power supply ignition system and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576017B (zh) * 2014-08-25 2017-03-21 京三製作所股份有限公司 再生循環器、高頻電源裝置及高頻電力之再生方法
US10355607B2 (en) 2014-08-25 2019-07-16 Kyosan Electric Mfg. Co., Ltd. Regeneration circulator, high-frequency power supply device, and high-frequency power regeneration method

Also Published As

Publication number Publication date
EP2113085B1 (en) 2019-06-12
US20080203070A1 (en) 2008-08-28
CN101641604A (zh) 2010-02-03
EP2113085A1 (en) 2009-11-04
WO2008103600A1 (en) 2008-08-28
EP2113085B8 (en) 2019-07-24
KR20090121301A (ko) 2009-11-25
US8217299B2 (en) 2012-07-10
KR101274514B1 (ko) 2013-06-13
JP2010519708A (ja) 2010-06-03
EP2113085A4 (en) 2015-05-06

Similar Documents

Publication Publication Date Title
TW200845834A (en) ARC recovery without over-voltage for plasma chamber power supplies using a shunt switch
KR101412736B1 (ko) 플라즈마 아크의 신속한 소멸을 위하여 도선 인덕턴스에 저장된 전기 에너지를 감소시키는 회로 및 방법
US9397503B2 (en) Providing power in an electronic device
JPH05506327A (ja) アーク転流器
JP3587891B2 (ja) 回路遮断器のトリップ装置
US10177554B2 (en) Inrush current limitation circuit and method
CN104467445B (zh) 具有动态相位触发的多相降压转换器
JPS609337A (ja) バッテリー保全装置およびバッテリー保全を自動制御する方法
SE516507C2 (sv) Uppladdningsbart batteri med inbyggd säkerhetskrets för en portabel elektrisk apparat
Yu et al. System implementation and testing of the STRETCH meat grinder with ICCOS
CN105762768B (zh) 电池保护装置与其操作方法
JP5904517B2 (ja) 盗電検査装置及び方法、コンピュータプログラム並びに記録媒体
CN109412568A (zh) 一种开关机复位电路
WO2016044726A1 (en) Systems and methods for limiting inrush current in charging devices
Fridman et al. A 0.5-MJ 18-kV module of capacitive energy storage
EP2015437A2 (fr) Circuit de commande d'un commutateur alternatif
CN205092650U (zh) 通断检测电路及压力锅
RU2558693C2 (ru) Способ генерации энергии и индуктивный генератор для его осуществления
US10497404B2 (en) Clamping circuit
JP7351052B2 (ja) 漏電遮断器回路
JP2013171605A (ja) 磁気記録データ破壊装置
JP2012142279A (ja) プラズマ銃電極間のエレクトロマイグレーションを防止するためのシステム、方法、および装置
RU2476979C1 (ru) Конвертер постоянного напряжения
CN115395614A (zh) 一种电子设备
CN107228618B (zh) 用于电感式位移传感器特别是用于触摸板的检测器电路