TW200835796A - Vapor-deposition apparatus - Google Patents
Vapor-deposition apparatus Download PDFInfo
- Publication number
- TW200835796A TW200835796A TW096136640A TW96136640A TW200835796A TW 200835796 A TW200835796 A TW 200835796A TW 096136640 A TW096136640 A TW 096136640A TW 96136640 A TW96136640 A TW 96136640A TW 200835796 A TW200835796 A TW 200835796A
- Authority
- TW
- Taiwan
- Prior art keywords
- vapor
- vapor deposition
- film forming
- chamber
- forming material
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K41/00—Spindle sealings
- F16K41/10—Spindle sealings with diaphragm, e.g. shaped as bellows or tube
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006269085A JP5173175B2 (ja) | 2006-09-29 | 2006-09-29 | 蒸着装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200835796A true TW200835796A (en) | 2008-09-01 |
Family
ID=39268526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096136640A TW200835796A (en) | 2006-09-29 | 2007-09-29 | Vapor-deposition apparatus |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20100071623A1 (https=) |
| JP (1) | JP5173175B2 (https=) |
| KR (1) | KR101075130B1 (https=) |
| DE (1) | DE112007002217T5 (https=) |
| TW (1) | TW200835796A (https=) |
| WO (1) | WO2008041671A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103805947A (zh) * | 2012-11-09 | 2014-05-21 | 东京毅力科创株式会社 | 成膜装置 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5020650B2 (ja) * | 2007-02-01 | 2012-09-05 | 東京エレクトロン株式会社 | 蒸着装置、蒸着方法および蒸着装置の製造方法 |
| JP4847496B2 (ja) * | 2008-07-29 | 2011-12-28 | 東京エレクトロン株式会社 | 蒸着源ユニット、蒸着方法、蒸着源ユニットの制御装置および成膜装置 |
| EP2168644B1 (en) * | 2008-09-29 | 2014-11-05 | Applied Materials, Inc. | Evaporator for organic materials and method for evaporating organic materials |
| DE112009002374T5 (de) * | 2008-09-30 | 2012-11-29 | Tokyo Electron Ltd. | Abscheidevorrichtung, Abscheideverfahren sowie Speichermedium mit hierin gespeichertem Programm |
| DE102010041380A1 (de) | 2009-09-25 | 2011-04-28 | Von Ardenne Anlagentechnik Gmbh | Verdampfereinrichtung für eine Beschichtungsanlage |
| JP5452178B2 (ja) * | 2009-11-12 | 2014-03-26 | 株式会社日立ハイテクノロジーズ | 真空蒸着装置、真空蒸着方法、および、有機el表示装置の製造方法 |
| JP5473675B2 (ja) * | 2010-03-01 | 2014-04-16 | 株式会社アルバック | 薄膜形成装置 |
| US20160281212A1 (en) | 2015-03-24 | 2016-09-29 | Siva Power, Inc. | Thermal management of evaporation sources |
| US10593967B2 (en) * | 2016-06-30 | 2020-03-17 | Honeywell International Inc. | Modulated thermal conductance thermal enclosure |
| KR102609612B1 (ko) * | 2018-07-30 | 2023-12-05 | 삼성디스플레이 주식회사 | 표시 장치의 제조장치 및 표시 장치의 제조방법 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3671484D1 (de) * | 1985-08-01 | 1990-06-28 | American Cyanamid Co | Sprudelzylindervorrichtung. |
| JP3734239B2 (ja) | 1999-04-02 | 2006-01-11 | キヤノン株式会社 | 有機膜真空蒸着用マスク再生方法及び装置 |
| JP2002322556A (ja) | 2001-02-21 | 2002-11-08 | Semiconductor Energy Lab Co Ltd | 成膜方法及び成膜装置 |
| JP3705237B2 (ja) * | 2001-09-05 | 2005-10-12 | ソニー株式会社 | 有機電界発光素子を用いた表示装置の製造システムおよび製造方法 |
| JP2004059992A (ja) * | 2002-07-29 | 2004-02-26 | Sony Corp | 有機薄膜形成装置 |
| JP4013859B2 (ja) * | 2003-07-17 | 2007-11-28 | 富士電機ホールディングス株式会社 | 有機薄膜の製造装置 |
| JP2005203248A (ja) * | 2004-01-16 | 2005-07-28 | Sony Corp | 蒸着方法及び蒸着装置 |
| US7364772B2 (en) | 2004-03-22 | 2008-04-29 | Eastman Kodak Company | Method for coating an organic layer onto a substrate in a vacuum chamber |
| JP2006104497A (ja) * | 2004-10-01 | 2006-04-20 | Hitachi Zosen Corp | 蒸着装置 |
| JP4535908B2 (ja) * | 2005-03-14 | 2010-09-01 | 日立造船株式会社 | 蒸着装置 |
-
2006
- 2006-09-29 JP JP2006269085A patent/JP5173175B2/ja not_active Expired - Fee Related
-
2007
- 2007-09-29 TW TW096136640A patent/TW200835796A/zh unknown
- 2007-10-01 WO PCT/JP2007/069187 patent/WO2008041671A1/ja not_active Ceased
- 2007-10-01 KR KR1020097005687A patent/KR101075130B1/ko not_active Expired - Fee Related
- 2007-10-01 DE DE112007002217T patent/DE112007002217T5/de not_active Withdrawn
- 2007-10-01 US US12/441,934 patent/US20100071623A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103805947A (zh) * | 2012-11-09 | 2014-05-21 | 东京毅力科创株式会社 | 成膜装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100071623A1 (en) | 2010-03-25 |
| JP5173175B2 (ja) | 2013-03-27 |
| DE112007002217T5 (de) | 2009-09-10 |
| KR20090045356A (ko) | 2009-05-07 |
| JP2008088489A (ja) | 2008-04-17 |
| WO2008041671A1 (fr) | 2008-04-10 |
| KR101075130B1 (ko) | 2011-10-19 |
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